CN209767913U - Shielding device - Google Patents
Shielding device Download PDFInfo
- Publication number
- CN209767913U CN209767913U CN201920050988.0U CN201920050988U CN209767913U CN 209767913 U CN209767913 U CN 209767913U CN 201920050988 U CN201920050988 U CN 201920050988U CN 209767913 U CN209767913 U CN 209767913U
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- contact end
- component
- shielding
- radiated
- circuit board
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a shielding device, which comprises a radiating fin, a circuit board, a component to be radiated and a shielding frame, wherein the component to be radiated and the shielding frame are arranged on the circuit board, the shielding frame surrounds the outer side of the component to be radiated, the upper part of the shielding frame comprises a contact end face, and the inner side of the contact end face is provided with an opening; the component to be radiated is exposed out of the opening on the projection perpendicular to the direction of the circuit board; the radiating fin covers the contact end face, the radiating fin covers the opening, and the component to be radiated and the bottom of the radiating fin conduct heat through a heat conducting medium. Through the application of the utility model, the total number of devices is reduced, the installation process is simplified, and the assembly cost is reduced; the total number of devices is reduced, and the material cost of the product is reduced; the heat dissipation path of the component is shortened, and the heat dissipation efficiency is improved.
Description
Technical Field
the utility model relates to a shielding device
Background
Some components on the current circuit board need to be electromagnetically shielded. The conventional shielding apparatus is shown in fig. 1. The shielding device comprises a radiating fin 1, a circuit board 2, a component 3 to be radiated, a shielding frame 4, a heat conducting pad 5, a shielding cover 6 and a heat conducting pad 7.
The shielding frame 4 is fixed on the circuit board 2, and the shielding cover 6 covers the shielding frame 4 to realize electromagnetic shielding. Wherein, wait that heat dissipation component 3 realizes heat conduction through heat conduction pad 5 and shield cover 6. The shield is then thermally conductive to the heat sink 1 via the thermal pad 7.
It is clear that in the prior art the structure of the shield is very complex and not conducive to assembly. Meanwhile, heat can be conducted to the radiating fins through multiple times of heat conduction, and the radiating performance is reduced.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is that the structure of shielding is very complicated among the prior art in order to overcome, is unfavorable for the equipment, simultaneously owing to need just can be with heat conduction to the fin on many times heat conduction, has reduced the defect of heat dispersion, provides a shield assembly.
The utility model discloses an above-mentioned technical problem is solved through following technical scheme:
a shielding device comprises a heat sink, a circuit board, a component to be radiated and a shielding frame, wherein the component to be radiated is arranged on the circuit board,
the shielding frame surrounds the outer side of the component to be radiated, the upper part of the shielding frame comprises a contact end face, and the inner side of the contact end face is provided with an opening;
The component to be radiated is exposed out of the opening on the projection perpendicular to the direction of the circuit board;
The radiating fin covers the contact end face, the radiating fin covers the opening, and the component to be radiated and the bottom of the radiating fin conduct heat through a heat conducting medium.
In the scheme, the bottom of the radiating fin and the shielding frame form an electromagnetic shielding structure, so that redundant structures are saved, and the installation steps are simplified.
Meanwhile, due to the arrangement of the holes, the radiating fins can conduct heat directly with the components to be radiated, and radiating efficiency is greatly improved.
preferably, the contact end face is provided with a spring piece, wherein when not pressed, the spring piece is higher than the contact end face.
The radiating fin can extrude with the shell fragment under the pressfitting formula, makes the contact of radiating fin and shielding frame more abundant through the setting in the shell fragment from this, plays abundant electromagnetic shield effect.
Preferably, after being pressed, the elastic sheet is flush with the contact end face. From this setting, the shell fragment can guarantee after pushing down that the bottom surface of fin can with contact terminal surface parallel and level, reduce the joint clearance of fin and shielding frame from this.
Preferably, the elastic sheet is arranged along the periphery of the contact end face. Therefore, the periphery of the shielding frame can be ensured to be in contact with the bottom of the radiating fin, electromagnetic leakage is reduced, and the shielding effect is improved.
Preferably, the elastic sheet is formed by opening and tilting the edge of the contact end face. The elastic sheet can be formed by simply tilting the material of the edge, and the method is favorable for processing the shielding frame.
Preferably, the elastic sheet is arranged on the inner side edge of the contact end face. The elastic sheet is easier to be arranged on the inner side edge of the contact end face, and the problem of a gap caused by the outer side of the shielding frame is solved.
Preferably, an operation area and a connecting strip are arranged above the shielding device, the operation area is connected with the contact end face through the connecting strip, and the opening is divided into at least two parts by the connecting strip. The operation area is favorable for grabbing clamping tools such as an automatic sucker.
Preferably, the connection bar and the operation area are staggered from the component to be cooled on a projection perpendicular to the direction of the circuit board. The connecting strips and the operation area are staggered in space, and heat conduction of the component to be cooled and the radiating fins is not interfered.
Preferably, the heat sink is fixed to the circuit board by a threaded fastener.
Preferably, the heat conducting medium is a heat conducting pad.
The utility model discloses an actively advance the effect and lie in: through the application of the utility model, the total number of devices is reduced, the installation process is simplified, and the assembly cost is reduced; the total number of devices is reduced, and the material cost of the product is reduced; the heat dissipation path of the component is shortened, and the heat dissipation efficiency is improved.
Drawings
Fig. 1 is a schematic diagram of an exploded structure of a shielding apparatus of the prior art.
Fig. 2 is an exploded schematic view of a shielding device according to a preferred embodiment of the present invention.
Fig. 3 is a schematic top view of the shielding frame and the circuit board according to the preferred embodiment of the present invention.
Fig. 4 is a schematic perspective view of a shielding frame according to a preferred embodiment of the present invention.
Fig. 5 is a schematic side view of a shielding frame according to a preferred embodiment of the present invention.
Detailed Description
the present invention is further illustrated by way of the following examples, which are not intended to limit the scope of the invention.
As shown in fig. 2 to 5, the embodiment discloses a shielding device, which includes a heat sink 1, a circuit board 2, a component 3 to be cooled mounted on the circuit board 2, and a shielding frame 4, and is characterized in that, as shown in fig. 2, the shielding frame 4 surrounds the outer side of the component 3 to be cooled, the upper portion of the shielding frame 4 includes a contact end surface 42, and the inner side of the contact end surface 42 is provided with an opening 41;
The component 3 to be radiated is exposed out of the opening 41 on the projection perpendicular to the direction of the circuit board 2;
the heat sink 1 covers the contact end face 42, the heat sink 1 covers the opening 41, and the component 3 to be heat-dissipated and the bottom of the heat sink 1 conduct heat through the heat conducting medium 5.
The heat conducting medium 5 is preferably a heat conducting mat.
In the embodiment, the bottom of the heat sink 1 and the shielding frame 4 form an electromagnetic shielding structure, so that redundant structures are omitted, and the installation steps are simplified.
Meanwhile, due to the arrangement of the open holes 41, the radiating fins 1 can directly conduct heat with the component 3 to be radiated, and the radiating efficiency is greatly improved.
As shown in fig. 3 and 4, the elastic pieces 43 are arranged along the periphery of the contact end face 42. Therefore, the periphery of the shielding frame 4 can be ensured to be in contact with the bottom of the radiating fin 1, electromagnetic leakage is reduced, and the shielding effect is improved.
The elastic piece 43 of the present embodiment is formed by opening and tilting the edge of the contact end face 42. The spring plate 43 can be formed by simply tilting the material of the edge, which facilitates the processing of the shield frame 4. Of course, in other embodiments, other methods may be used to form the spring.
Preferably, the elastic piece 43 is opened at the inner edge of the contact end face 42. It is easier to provide the spring plate 43 at the inner edge of the contact end face 42. Compared with the opening at other positions of the shield frame 4, no gap is caused outside the shield frame 4.
As shown in fig. 4 and 5, the contact end face 42 is provided with a spring piece 43, wherein the spring piece 43 is higher than the contact end face 42 when not pressed.
The heat dissipation sheet 1 can be extruded with the elastic sheet 43 under the downward pressing mode, so that the heat dissipation sheet 1 is more fully contacted with the shielding frame 4 through the arrangement in the elastic sheet 43, and a sufficient electromagnetic shielding effect is achieved.
The spring plate 43 is flush with the contact end face 42 after being pressed. With the arrangement, the elastic sheet 43 can ensure that the bottom surface of the radiating fin 1 can be flush with the contact end surface 42 after being pressed down, so that the connection gap between the radiating fin 1 and the shielding frame 4 is reduced.
As shown in fig. 3 and 4, an operation area 44 and a connection strip 45 are provided above the shielding device, the operation area 44 is connected to the contact end face 42 by the connection strip 45, and the connection strip 45 divides the opening 41 into at least two parts. The operating area 44 facilitates gripping by clamping tools such as automated suction cups.
As shown in fig. 3, the connection bars 45 and the operation areas 44 are offset from the component 3 to be heat-dissipated in a projection perpendicular to the direction of the circuit board 2. The connecting strips 45 and the operating area 44 are spatially offset so as not to interfere with the heat conduction between the component to be cooled and the heat sink 1.
As shown in fig. 2, the heat sink 1 of the present embodiment is connected and fixed to a chip nut 21 on the circuit board 2 by a threaded fastener 6. Naturally, any other connection method may be adopted to connect and fix the heat conducting sheet 1 and the circuit board 2.
The utility model discloses an actively advance the effect and lie in: through the application of the utility model, the total number of devices is reduced, the installation process is simplified, and the assembly cost is reduced; the total number of devices is reduced, and the material cost of the product is reduced; the heat dissipation path of the component is shortened, and the heat dissipation efficiency is improved.
Although specific embodiments of the present invention have been described above, it will be understood by those skilled in the art that this is by way of example only and that the scope of the invention is defined by the appended claims. Various changes and modifications to these embodiments may be made by those skilled in the art without departing from the spirit and the principles of the present invention, and these changes and modifications are all within the scope of the present invention.
Claims (10)
1. A shielding device comprises a heat sink, a circuit board, a component to be radiated and a shielding frame, wherein the component to be radiated is arranged on the circuit board,
The shielding frame surrounds the outer side of the component to be radiated, the upper part of the shielding frame comprises a contact end face, and the inner side of the contact end face is provided with an opening;
The component to be radiated is exposed out of the opening on the projection perpendicular to the direction of the circuit board;
the radiating fin covers the contact end face, the radiating fin covers the opening, and the component to be radiated and the bottom of the radiating fin conduct heat through a heat conducting medium.
2. The shielding device of claim 1, wherein said contact end surface has a spring disposed thereon, wherein said spring is raised above said contact end surface when not compressed.
3. The shielding device of claim 2, wherein said spring is flush with said contact end surface when compressed.
4. The shielding apparatus of claim 2, wherein said spring is disposed along a periphery of said contact end surface.
5. The shielding device of claim 2, wherein the spring is formed by opening and tilting an edge of the contact end face.
6. The shielding apparatus of claim 5, wherein said spring is disposed at an inner edge of said contact end.
7. A shielding device according to any one of claims 1-6, characterized in that an operating area is arranged above the shielding device, said operating area being connected to said contact surface by means of a connecting strip, said connecting strip dividing said opening into at least two parts.
8. The shielding device of claim 7, wherein the connecting strips and the operating area are offset from the component to be heat dissipated in a projection perpendicular to the direction of the circuit board.
9. the shielding device of any one of claims 1-6, wherein said heat sink is secured to said circuit board by a threaded fastener.
10. the shielding device of any one of claims 1-6, wherein said thermally conductive medium is a thermally conductive pad.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920050988.0U CN209767913U (en) | 2019-01-11 | 2019-01-11 | Shielding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920050988.0U CN209767913U (en) | 2019-01-11 | 2019-01-11 | Shielding device |
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CN209767913U true CN209767913U (en) | 2019-12-10 |
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CN201920050988.0U Active CN209767913U (en) | 2019-01-11 | 2019-01-11 | Shielding device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109526137A (en) * | 2019-01-11 | 2019-03-26 | 上海剑桥科技股份有限公司 | Screening arrangement |
CN112888237A (en) * | 2021-01-21 | 2021-06-01 | 重庆蓝岸通讯技术有限公司 | Multipurpose radiating, shielding and anti-static structure for electronic product device |
-
2019
- 2019-01-11 CN CN201920050988.0U patent/CN209767913U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109526137A (en) * | 2019-01-11 | 2019-03-26 | 上海剑桥科技股份有限公司 | Screening arrangement |
CN112888237A (en) * | 2021-01-21 | 2021-06-01 | 重庆蓝岸通讯技术有限公司 | Multipurpose radiating, shielding and anti-static structure for electronic product device |
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Effective date of registration: 20211012 Address after: Room 501, building 8, 2388 Chenhang Road, Minhang District, Shanghai 201100 Patentee after: CIG SHANGHAI Co.,Ltd. Address before: 201114 Room 501, building 8, 2388 Chenhang Road, Minhang District, Shanghai Patentee before: CIG SHANGHAI Co.,Ltd. Patentee before: CIG ZHEJIANG Co.,Ltd. |