CN209767783U - A communication circuit and earphone for earphone - Google Patents

Abstract

the utility model provides a communication circuit and earphone for earphone. The communication circuit includes: an earplug, wherein an earplug micro control unit is arranged in the earplug; the main control unit is arranged on the main board structure; the single bus unit is respectively connected with the earplugs and the mainboard structure and comprises an energy storage circuit, the main control unit controls the charging circuit to charge and store energy for the energy storage circuit, and the energy storage circuit supplies power to the earplugs when the main control unit is controlled to communicate with the earplug micro control unit; the single bus unit is connected with a grounding end to serve as a shielding layer of the single bus unit. The utility model discloses in just can realize the function of power supply and communication with a line to reduce the figure of connecting wire between earplug and the mainboard structure, can also reduce external radio frequency interference.

Description

A communication circuit and earphone for earphone

Technical Field

The utility model relates to an earphone field, more specifically relates to a communication circuit and earphone for earphone.

Background

The bluetooth audio transmission technology has appeared for many years, and with the development of mobile smart devices, the technology has been more fully applied in the field of mobile communication, represented by neck ring earphones, and is widely used. The neck ring earphone is wirelessly connected through Bluetooth, a connecting wire is removed, the size is small, the carrying and the use are convenient, and the neck ring earphone is popular for many people and promotes the further development of the neck ring earphone on the structure and the effect.

More and more sensors are applied to intelligent wearing equipment at the present stage, more and more sensors of various types are applied to the Bluetooth headset, and various physiological parameters of a human body and external environment changes can be monitored when the Bluetooth headset is used or worn. For a neck loop headset, some sensors (e.g., infrared distance sensors, acceleration sensors, bone sensors, etc.) need to be placed inside the ear plug. However, these sensors placed in the ear plugs need to communicate with the motherboard, and corresponding circuitry needs to be added. For the head and neck type earphone, the fewer the wires from the earplugs to the main board, the better, the beauty can be increased, and the stethoscope effect can be reduced.

In addition, the bluetooth signal is interfered, thereby affecting the communication quality. In single bus applications, more interference signals will affect the power supply of bluetooth through the single bus and ultimately affect the RF performance of bluetooth.

The earphone has the disadvantages and is a problem which needs to be solved urgently at present.

SUMMERY OF THE UTILITY MODEL

the utility model discloses a solve the problem of present earphone comfort level, provide a communication circuit for earphone, communication circuit includes:

An earplug, wherein an earplug micro control unit is arranged in the earplug;

The main control unit is arranged on the main board structure;

The single bus unit, the single bus unit respectively with the earplug with mainboard structural connection, the single bus unit includes tank circuit, wherein the main control unit control charging circuit is right the tank circuit energy storage that charges to when control the main control unit with the little the control unit of earplug communicates, make tank circuit does the earplug supplies power.

Optionally, the charging circuit further includes a power supply and a power supply switch, and the main control unit controls the power supply switch to be turned on and charges and stores energy in the energy storage circuit through the power supply.

Optionally, the tank circuit further comprises a diode and a capacitor connected in series with each other.

Optionally, the communication circuit further includes a logic switch, and the logic switch is connected to the main control unit and the earplug micro control unit to serve as a switch for the main control unit to communicate with the earplug micro control unit in a single bus manner.

Optionally, the earphone further comprises a plurality of sensors, wherein the earplug micro-control unit is in communication connection with the plurality of sensors to transmit the instruction of the main control unit to the plurality of sensors and/or transmit the data of the plurality of sensors to the main control unit.

Optionally, the single bus unit connects the main board unit and the earplugs to a ground terminal.

Optionally, the main board structure is further provided with a main control power supply for supplying power to the main control unit.

the invention further provides an earphone, which comprises the communication circuit, and the earphone further comprises:

An annular support structure comprising a built-in cavity, the motherboard structure disposed within the built-in cavity;

the earplugs are arranged at two ends of the annular supporting structure.

optionally, the annular support structure is U-shaped.

Optionally, the earphone further comprises an earphone cord leading out from the annular support structure for connecting the ear plug and a microphone connected to the earphone cord.

According to the utility model discloses a communication circuit and earphone for earphone, communication circuit is provided with earplug and mainboard structure, and supply power and communication through the unibus unit between earplug and the mainboard structure, just can realize the function of power supply and communication with a line to reduce the figure of connecting wire between earplug and the mainboard structure.

Drawings

the above and other objects, features and advantages of the present invention will become more apparent by describing in more detail embodiments of the present invention with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description, serve to explain the invention and not to limit the invention. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 is a schematic structural diagram of a communication circuit for a headset according to an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of an earphone according to an embodiment of the present invention.

description of the reference numerals

10. Mainboard structure

20. Earplug

30. Single bus unit

40. Annular supporting structure

101. Master control unit

102. Charging circuit

103. Master control power supply

104. Earplug micro control unit

105. Sensor with a sensor element

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present invention.

In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent that the practice of the invention is not limited to the specific details known to those skilled in the art. The following detailed description of the preferred embodiments of the invention, however, is not intended to limit the invention to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.

It is to be understood that the terms "a," "an," and "the" as used herein are intended to describe specific embodiments only and are not to be taken as limiting the invention, which is intended to include the plural forms as well, unless the context clearly indicates otherwise. When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms "upper", "lower", "front", "rear", "left", "right" and the like as used herein are for illustrative purposes only and are not limiting.

Ordinal words such as "first" and "second" are referred to in this application as labels only, and do not have any other meanings, such as a particular order, etc. Also, for example, the term "first component" does not itself imply the presence of "second component", and the term "second component" does not itself imply the presence of "first component".

In the following, specific embodiments of the present invention will be described in more detail with reference to the accompanying drawings, which illustrate representative embodiments of the invention and do not limit the invention.

Example one

The utility model provides a communication circuit for earphone, as shown in fig. 1, communication circuit includes:

An ear bud 20 having an ear bud micro control unit 104 disposed therein;

The charging system comprises a main board structure 10, wherein a main control unit 101 and a charging circuit are arranged on the main board structure;

The single bus unit 30 is respectively connected with the earplugs and the main board structure, and comprises an energy storage circuit, wherein the main control unit controls the charging circuit to charge and store energy for the energy storage circuit, and controls the energy storage circuit to supply power for the earplugs when controlling the main control unit to communicate with the earplug micro control unit;

The single bus unit 30 is connected to a ground terminal to serve as a shielding layer of the single bus unit.

In an embodiment of the present invention, in order to reduce the connecting wires between the main board structure 10 and the earplugs 20 and improve the communication performance between the main board structure 10 and the earplugs 20, the earplugs are powered and communicated through the single bus unit 30.

In addition, the single bus unit is connected with a grounding end in the communication circuit to be used as a shielding layer of the single bus unit and used for reducing external radio frequency interference.

the main Control Unit 101 is a main Micro-programmed Control Unit (MCU) for controlling the earplugs to perform charging and communication, and is further configured to perform other controls on the earplugs.

The main board structure 10 is further configured to integrate various functional chips and functional devices on the main board, such as a transceiver module of an earphone.

alternatively, the main Board structure 10 may be a Printed Circuit Board (PCB) substrate, a ceramic substrate, a Pre-injection molding (Pre-mold) substrate, or the like.

The PCB is manufactured by processing different components and various complex process technologies, and the like, wherein the structure of the PCB circuit board has a single-layer structure, a double-layer structure and a multi-layer structure, and the manufacturing modes of different hierarchical structures are different.

Alternatively, the printed circuit board is primarily comprised of pads, vias, mounting holes, wires, components, connectors, fills, electrical boundaries, and the like.

further, common board Layer structures of printed circuit boards include three types, namely a Single Layer board (Single Layer PCB), a Double Layer board (Double Layer PCB) and a Multi Layer board (Multi Layer PCB), and the specific structures are as follows:

(1) Single-layer board: i.e. a circuit board with only one side copper-clad and the other side not copper-clad. Typically, the components are placed on the side that is not copper-clad, the copper-clad side being used primarily for wiring and soldering.

(2) Double-layer plate: i.e., a circuit board with both sides copper-clad, is commonly referred to as a Top Layer (Top Layer) on one side and a Bottom Layer (Bottom Layer) on the other side. The top layer is generally used as the surface for placing components, and the bottom layer is used as the surface for welding components.

(3) Multilayer board: that is, a circuit board including a plurality of working layers includes a plurality of intermediate layers in addition to a top layer and a bottom layer, and the intermediate layers can be used as a conductive layer, a signal layer, a power layer, a ground layer, etc. The layers are insulated from each other and the connections between the layers are usually made by vias.

The printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk-screen layer, an internal layer, and so on, which are not described herein again.

In order to better supply power to the main control unit 101, a main control power supply 103V-MCU is further disposed on the main board structure 10 for supplying power to the main control unit, wherein the main control power supply 103V-MCU may be a common power supply.

In addition, a charging circuit 102 is further disposed on the main board structure 10 for supplying power to the ear plugs through the single bus unit 30, and specifically, the charging circuit 102 charges the energy storage circuit through the single bus unit 30.

The charging circuit 102 includes a power supply and a power supply switch, and the main control unit controls the power supply switch to charge and store energy for the energy storage circuit through the power supply.

The power supply switch may be a MOS transistor, for example, in the embodiment of the present invention, the power supply switch is a PMOS transistor.

Optionally, the communication circuit further includes a logic switch, and the logic switch is connected to the main control unit and the earplug micro control unit to serve as a switch for the main control unit to communicate with the earplug micro control unit in a single bus manner.

The logic switch may be a MOS transistor, for example, in the embodiment of the present invention, the logic switch is an NMOS.

In this embodiment of the invention, the single bus unit 30 is time-multiplexed and executes different instructions at different times, for example during a first time period for charging the headset, for example for charging the tank circuit, and during a second time period, the single bus unit 30 is used for communicating with the ear plug, while the single bus unit 30 is used for powering the ear plug.

it should be noted that, in the embodiment of the present invention, the earphone includes two earplugs, which are left and right earplugs, the inner structures of the left and right earplugs are arranged in a mirror image manner, and the operation principle is the same, so that only one of the earplugs is taken as an example for the following description of the earplugs.

Alternatively, in an embodiment of the invention, as shown in fig. 1, in the ear plug, the energy storage circuit comprises a diode D1 and a capacitor C1 connected in series with each other. When the earphone works, the main MCU controls the power supply switch PMOS to electrify the earphone element, the C1 is an energy storage capacitor, and after the earphone is electrified for a period of time, the C1 capacitor is saturated and the power supply switch PMOS is disconnected; the earpiece micro control unit is communicated in a single bus by means of a logic switch NMOS, while the capacitor C1 powers the earpiece element.

Optionally, in an embodiment of the present invention, the earplug micro control unit selects a low power consumption MCU to reduce power consumption of the earplug.

Optionally, the headset comprises a plurality of sensors 105, wherein the earplug micro-control unit is in communication with the plurality of sensors 105 to transmit instructions of the main control unit to the plurality of sensors and/or transmit data of the plurality of sensors to the main control unit.

specifically, in an embodiment of the present invention, each earplug includes at least one sensor disposed in parallel, wherein the type and structure of each sensor may be selected according to actual needs, but is not limited thereto.

When the earphone works, the main MCU communicates with the low-power-consumption MCU through the logic switch NMOS in a single-bus mode, the C1 supplies power to the earphone element at the moment, and the low-power-consumption MCU forwards a command of the main MCU to each sensor and can also transmit data of each sensor to the main MCU.

In the embodiment of the present invention, in order to achieve a better communication effect, the single bus unit 30 connects the main board unit and the earplugs to a ground terminal to serve as a shielding layer of the single bus unit.

According to the utility model discloses a communication circuit and earphone for earphone, communication circuit is provided with earplug and mainboard structure, and supply power and communication through the unibus unit between earplug and the mainboard structure, just can realize the function of power supply and communication with a line to reduce the figure of connecting wire between earplug and the mainboard structure.

Example two

The utility model also provides an earphone, as shown in fig. 2, the earphone includes at least:

The communication circuit of embodiment one;

An annular support structure 40 comprising an internal cavity within which the motherboard structure 10 is disposed;

The earplugs 20 are disposed at both ends of the annular support structure 40.

the specific structure of the communication circuit can refer to the first embodiment, and is not described herein again.

The earphone in the present invention may be various types of earphones such as a neck ring earphone or a headset, but is not limited to a specific earphone, and the neck ring earphone is described below as an example.

Other configurations of the neck loop headset are further described below. Wherein in the embodiment of the present invention, the neck ring earphone refers to an earphone that is used to communicate or play music by sleeving the neck ring earphone on the forehead of the wearer. Wherein the neck ring earphone comprises a ring-shaped supporting structure with an opening and sleeved on the forehead of the wearer, and the ring-shaped supporting structure is provided with a ring-shaped structure with an opening and sleeved on the forehead of the wearer, such as a U-shaped structure. Of course the circuit can also be applied to other headsets without conflicting with the headset.

Alternatively, in the embodiment of the present invention, the neck-loop headset may be a true Wireless headset (TWS), an Active Noise Cancellation (ANC) headset, a smart headset, or the like.

For example, the neck loop headset may be one of an in-ear TWS headset, a rod TWS headset.

In another embodiment of the present invention, a neck ring bluetooth headset includes a headphone (not shown) having an open annular support structure and a headphone cord connection extending from the annular support structure. Set up the outward microphone of orientation in annular bearing structure middle part, the person wears the neck ring bluetooth headset in the neck, gathers the sound signal that the person talks through the microphone.

In an embodiment of the present invention, the ring-shaped supporting structure 40 may be a hollow shell, wherein the hollow portion forms a receiving cavity, for example, receiving the main plate structure 10.

the plastic material that can be selected for the housing of the annular supporting structure 40 is Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) copolymer and mixture, and it should be noted that the material of the housing is not limited to a certain one, and the housing materials commonly used in the art can be applied to the embodiments of the present invention, and are not listed here.

Alternatively, the shell needs to have some strength to ensure it has a shape that matches the wearer's neck.

Illustratively, the thickness of the shell is 0.5-4mm, and for the shell of the injection molding plastic part, the wall thickness of the shell is related to factors such as the size, the structure, the plastic raw material, the position of a mold gate, the injection molding process and the like of the part, and the approximate range is 0.5-4 mm; the thin part is poor in strength and difficult to be injection molded; too thick, causes material waste, long forming period, easy shrinkage and poor surface quality.

for the neck ring earphone, in case of using PC material, the wall thickness of the front surface of the casing is selected to be in the range of 1.0-1.2mm, the thickness of 1.0mm is currently commonly used (if the product is larger, 1.2mm should be selected), and the neck ring earphone is connected with the neck ring earphone,

The main board structure is disposed in the housing of the ring-shaped supporting structure 40, and the main board has a first surface and a second surface disposed opposite to each other, so as to integrate various functional chips and functional devices on the main board.

the main board structure is provided with a transceiver module, for example, in an embodiment, the transceiver module is disposed in the accommodating space on the side of the first surface of the main board and electrically connected to the first surface of the main board for receiving and transmitting data.

Among them, the transceiver module is an element for transmitting or receiving electromagnetic waves, such as an antenna, in a transmission and reception system. The transceiver module is used for converting high-frequency electromagnetic energy in the transmission line into free-space electromagnetic wave or vice versa.

The Antenna types include Stamping Metal Antenna, Chip Antenna, and Printed Antenna. Wherein, the patch antenna mainly has: ceramic antennas (e.g., B-flipper antennas), integrated antennas, and the like. The stamping antenna mainly comprises: beryllium copper (phosphor bronze) stamped antennas, wire antennas, and the like.

In an embodiment of the present invention, the two ends of the neck ring earphone are respectively an earplug and/or a microphone.

The microphone is an element that receives and processes sound during a call. The microphone is connected out of the mainboard through the connecting structure. For example, the microphone is electrically connected to one end of the connection structure, and the other end of the connection structure is electrically connected to the second surface of the main board.

The microphone is connected in the following ways:

1. A Flexible Printed Circuit (FPC) type which can be directly connected with a PCB in a soldering connection way; or may be connected through a 4 pin FPC connector. When the FPC is connected, the mutual position of the FPC connecting end and the PCB is required to be noticed, and the FBC cannot be distorted and deformed too much. When the FPC welding mode is adopted, components cannot be arranged within 3mm around a welding point.

2. And the lead type (wire) can be directly welded with the PCB.

3. Pin (Pin) Pin style, through PCB holes, hand soldered.

4. The conductive rubber sleeve type is characterized in that the conductive rubber sleeve is in compression joint with the PCB, the compression amount of the conductive rubber sleeve and the PCB is required to be noticed when the conductive rubber sleeve is connected in a conductive rubber sleeve mode, and the height space is required to be 85% -90% in a natural state.

The silica gel cover of the earplug can be made of conventional materials, and is not limited herein. The earplug comprises an earplug shell and an earplug cover, wherein the earplug shell is assembled with the lower shell through screws or glue, and the earplug cover is connected with the earplug shell through buckles or glue.

The earphone receiving cavity is generally composed of an earplug and an earplug cover, and a receiver is arranged in the earphone receiving cavity.

It should be noted that, in the embodiment of the present invention, the neck ring earphones include two left and right earphones disposed at two ends of the annular supporting structure, wherein the left and right earphones are designed according to the mirror image principle.

In addition, the neck ring earphone further comprises a touch module arranged in the accommodating space on one side of the main board and used for triggering the control signal.

The touch module is used as an input device of the electronic product and used for sending instructions to the electronic product so as to enable the electronic product to execute corresponding actions.

The touch module may use a touch screen (touchscreen) or a touch pad (touchpad). For example, in an example of the present invention, the touch module is a touch pad, and the touch pad is made into an array of rows and columns by using a printed circuit board; the printing plate and the surface plastic film are bonded by strong double sides, and the induction detection principle is capacitance sensing. A special ic board under the touchpad surface constantly measures and reports this trajectory to ascertain the motion and position of the finger.

For example, when the electronic product to be turned on and off is a neck ring earphone, at least one of the following functions may be implemented when the touch module is touched: turning on and off, turning on, turning off, playing, pausing, volume adjusting and the like are not listed.

According to the utility model discloses earphone, earphone includes communication circuit, communication circuit is provided with earplug and mainboard structure, and supply power and communication through the unibus unit between earplug and the mainboard structure, just can realize the function of power supply and communication with a line to reduce the figure of connecting wire between earplug and the mainboard structure. In addition, the earphone connects the single bus unit with a ground terminal to serve as a shielding layer of the single bus unit, so as to reduce external radio frequency interference.

The terms are used as they are commonly understood by those skilled in the art of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms such as "part," "member," and the like, when used herein, can refer to either a single part or a combination of parts. Terms such as "mounted," "disposed," and the like, as used herein, may refer to one component as being directly attached to another component or one component as being attached to another component through intervening components. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.

The present invention has been described in terms of the above embodiments, but it is to be understood that the above embodiments are for purposes of illustration and description only and are not intended to limit the invention to the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many more modifications and variations are possible in light of the teaching of the present invention and are within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (10)

1. A communication circuit for a headset, the communication circuit comprising:

An earplug, wherein an earplug micro control unit is arranged in the earplug;

the main control unit is arranged on the main board structure;

The single bus unit, the single bus unit respectively with the earplug with mainboard structural connection, the single bus unit includes tank circuit, wherein the main control unit control charging circuit is right the tank circuit energy storage that charges to when control the main control unit with the little the control unit of earplug communicates, make tank circuit does the earplug supplies power.

2. The communication circuit for the earphone according to claim 1, wherein the charging circuit further comprises a power supply and a power supply switch, and the main control unit controls the power supply switch to be turned on and charges and stores energy in the energy storage circuit through the power supply.

3. The communication circuit for a headset of claim 2, wherein the tank circuit further comprises a diode and a capacitor in series with each other.

4. The communication circuit for a headset of claim 1, further comprising a logic switch connected to the master control unit and the earpiece micro control unit to act as a switch for the master control unit to communicate with the earpiece micro control unit in a single bus.

5. The communications circuit for a headset of claim 1, further comprising a plurality of sensors, wherein the headset micro-control unit is communicatively coupled to the plurality of sensors to transmit instructions from the master control unit to the plurality of sensors and/or to transmit data from the plurality of sensors to the master control unit.

6. The communication circuit for the earphone of claim 1, wherein the single bus unit connects the main control unit and the earphone to ground.

7. The communication circuit for a headset of claim 1, wherein the main board structure is further provided with a main control power supply for supplying power to the main control unit.

8. A headset, characterized in that the headset comprises a communication circuit according to one of claims 1 to 7, the headset further comprising:

An annular support structure comprising a built-in cavity, the motherboard structure disposed within the built-in cavity;

The earplugs are arranged at two ends of the annular supporting structure.

9. The headset of claim 8, wherein the annular support structure is U-shaped.

10. the headset of claim 8, further comprising a headset cord leading from the annular support structure for connection to the ear bud and a microphone connected to the headset cord.