CN209726139U - A kind of aluminum substrate for circular panel light - Google Patents
A kind of aluminum substrate for circular panel light Download PDFInfo
- Publication number
- CN209726139U CN209726139U CN201920270912.9U CN201920270912U CN209726139U CN 209726139 U CN209726139 U CN 209726139U CN 201920270912 U CN201920270912 U CN 201920270912U CN 209726139 U CN209726139 U CN 209726139U
- Authority
- CN
- China
- Prior art keywords
- aluminum substrate
- panel light
- blind rivet
- heat release
- release hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 69
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 238000009434 installation Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 239000011889 copper foil Substances 0.000 claims description 11
- 229910002804 graphite Inorganic materials 0.000 claims description 9
- 239000010439 graphite Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 8
- 239000004411 aluminium Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000001737 promoting effect Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000008859 change Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- PZZOEXPDTYIBPI-UHFFFAOYSA-N 2-[[2-(4-hydroxyphenyl)ethylamino]methyl]-3,4-dihydro-2H-naphthalen-1-one Chemical compound C1=CC(O)=CC=C1CCNCC1C(=O)C2=CC=CC=C2CC1 PZZOEXPDTYIBPI-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model relates to panel light technical fields, in particular a kind of aluminum substrate for circular panel light, including panel light lamp housing and heat release hole, the one side of the panel light lamp housing is equipped with heat release hole, the panel light lamp housing is connected with threading installation lid close to one end screw of heat release hole, the side of the panel light lamp housing, which is integrally formed, is equipped with blind rivet mounting blocks, blind rivet is socketed on the outer wall of the blind rivet mounting blocks, the blind rivet is socketed on the outer wall far from blind rivet mounting blocks and is bonded with spring clip, bottom case is socketed on the inner wall of the panel light lamp housing, the bottom case is connected with aluminum substrate fixed frame far from the inner bottom surface screwing of heat release hole, fixing screws are socketed on the aluminum substrate fixed frame, the aluminum substrate fixed frame is connected with aluminum substrate assembly by fixing screws, aluminum substrate assembly in the utility model has good heat dissipation and thermal conductivity Can, it substantially prolongs the service life of panel light and improves safe coefficient, there is certain promotional value.
Description
Technical field
The utility model relates to panel light technical field, specially a kind of aluminum substrate for circular panel light.
Background technique
Aluminum substrate is a kind of metal-based copper-clad plate with good heat radiating function, and general single sided board is by three-decker institute group
At, it is circuit layer (copper foil), insulating layer and metal-based layer respectively, is common in LED illumination product, there are a tow sides, white one
Face is welding LED pin, and another side is presented aluminium true qualities, contacts after generally smearing thermally conductive solidifying slurry with thermal conduction portions.At present also
There is ceramic substrate etc..
As the application surface of ultra-high brightness LED constantly expands, LED chip input power is constantly being improved, but LED light
Photoelectric transformation efficiency is very poor, and only 10%~20% electric energy is converted into luminous energy output, remaining is converted to thermal energy, when more of use
LED is assembled into a mould group, and very poor transfer efficiency will bring serious heat dissipation problem, and heat makes the temperature of great power LED
Degree rises, and so as to cause operating voltage reduction, light intensity decreasing, optical wavelength is elongated, in the serious curtailment service life of LED, accelerates its light
It declines, it is therefore desirable to which a kind of aluminum substrate for circular panel light makes improvement to the above problem.
Utility model content
The purpose of this utility model is to provide a kind of aluminum substrates for circular panel light, to solve above-mentioned background technique
The problem of middle proposition.
To achieve the above object, the utility model provides the following technical solutions:
A kind of aluminum substrate for circular panel light, including panel light lamp housing and heat release hole, the one of the panel light lamp housing
Face is equipped with heat release hole, and the panel light lamp housing is connected with threading installation lid, the panel light lamp close to one end screw of heat release hole
The side of shell, which is integrally formed, is equipped with blind rivet mounting blocks, is socketed with blind rivet on the outer wall of the blind rivet mounting blocks, the blind rivet is separate
Spring clip is socketed and be bonded on the outer wall of blind rivet mounting blocks, and bottom case, the bottom are socketed on the inner wall of the panel light lamp housing
Shell is connected with aluminum substrate fixed frame far from the inner bottom surface screwing of heat release hole, is socketed with fixed spiral shell on the aluminum substrate fixed frame
Nail, the aluminum substrate fixed frame are connected with aluminum substrate assembly by fixing screws, and the aluminum substrate assembly includes aluminum substrate, institute
The inside for stating aluminum substrate is inlaid with graphite particle filler material, and the aluminum substrate is fixedly connected with diamond-like far from one end of heat release hole
Stone film, the DLC film are fixedly connected with copper foil far from one end of aluminum substrate, and the copper foil is thin far from diamond-like
Film is fixedly connected with solder on one side, and the solder is fixedly connected with LED chip far from copper foil on one side, and the aluminum substrate is separate
DLC film is welded with cooling fin on one side, and the aluminum substrate assembly is connected to pressing ring far from one end gear of threading installation lid,
The pressing ring has snapped connection lampshade far from one end of threading installation lid.
Preferably, the LED chip is equipped with multiple groups.
Preferably, the threading installation, which covers, also is provided with heat release hole, and the heat release hole is equipped with multiple groups.
Preferably, the blind rivet mounting blocks, blind rivet and spring clip are symmetrically arranged with two groups.
Preferably, the aluminum substrate assembly is connected with power supply line.
Preferably, the graphite particle filler material is equipped with multiple groups.
Compared with prior art, the utility model has the beneficial effects that
1, in the utility model, the DLC film by setting be by size more than ten Nano grades diamond knot
A kind of material of structure and graphite-structure mixing phase composition, characteristic shows as the thermal conductivity of superelevation, and (800W/m.K's or more is thermally conductive
Coefficient, greater than 100~500W/m.K of pyroconductivity of any metal) and excellent insulation performance (greater than the 10 of 1.0*10
Power Ω/cm), its super-high heat-conductive performance is formed by the insulating layer with nanometer construction, and the capacity of heat transmission is much higher than metal
The material conducts heat rate of aluminium base, thus make the conducting path of heat from unidirectionally down, change into towards diffusion plus it is unidirectional down, to solve
The thermally conductive problem of aluminum-based circuit board.
2, in the utility model, the graphite particle filler material thermal coefficient by setting is twice of aluminium sheet, be different from copper,
The thermal uniformity of product is effectively ensured in such a way that level is thermally conductive in the heat-conducting mode of the metal ball bodies such as aluminium.
Detailed description of the invention
Fig. 1 is the utility model entirety schematic three dimensional views;
Fig. 2 is the utility model entirety perspective view of the explosion;
Fig. 3 is the utility model aluminum substrate assembly diagram.
In figure: 1- panel light lamp housing, 2- heat release hole, 3- threading installation lid, 4- blind rivet mounting blocks, 5- blind rivet, 6- spring clip,
7- aluminum substrate fixed frame, 8- fixing screws, 9- aluminum substrate assembly, 10- bottom case, 11- pressing ring, 12- lampshade, 13- aluminum substrate, 14-
DLC film, 15- copper foil, 16- solder, 17-LED chip, 18- cooling fin, 19- graphite particle filler material.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment, based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution:
A kind of aluminum substrate for circular panel light, including panel light lamp housing 1 and heat release hole 2, the one side of panel light lamp housing 1
Equipped with heat release hole 2, panel light lamp housing 1 is connected with threading installation lid 3, the side of panel light lamp housing 1 close to one end screw of heat release hole 2
Face, which is integrally formed, is equipped with blind rivet mounting blocks 4, is socketed with blind rivet 5 on the outer wall of blind rivet mounting blocks 4, blind rivet 5 is far from blind rivet mounting blocks 4
Outer wall on be socketed and be bonded with spring clip 6, bottom case 10 is socketed on the inner wall of panel light lamp housing 1, bottom case 10 is far from heat release hole 2
Inner bottom surface screwing be connected with aluminum substrate fixed frame 7, fixing screws 8, aluminum substrate fixed frame are socketed on aluminum substrate fixed frame 7
7 are connected with aluminum substrate assembly 9 by fixing screws 8, and aluminum substrate assembly 9 includes aluminum substrate 13, and the inside of aluminum substrate 13 is inlayed
There is graphite particle filler material 19, aluminum substrate 13 is fixedly connected with DLC film 14, diamond-like far from one end of heat release hole 2
Film 14 is fixedly connected with copper foil 15 far from one end of aluminum substrate 13, and one side of the copper foil 15 far from DLC film 14 is fixed to be connected
It is connected to solder 16, solder 16 is fixedly connected with LED chip 17 far from copper foil 15 on one side, and aluminum substrate 13 is far from DLC film
14 are welded with cooling fin 18 on one side, and aluminum substrate assembly 9 is connected to pressing ring 11 far from one end gear of threading installation lid 3, pressing ring 11 is remote
One end from threading installation lid 3 has snapped connection lampshade 12, and LED chip 17 is equipped with multiple groups, also is provided with radiating on threading installation lid 3
Hole 2, heat release hole 2 are equipped with multiple groups, and blind rivet mounting blocks 4, blind rivet 5 and spring clip 6 are symmetrically arranged with two groups, and aluminum substrate assembly 9 connects
There is power supply line, graphite particle filler material 19 is equipped with multiple groups.
Utility model works process: the DLC film 14 by setting be by size more than ten Nano grades gold
A kind of material of hard rock structure and graphite-structure mixing phase composition, characteristic show as the thermal conductivity (800W/m.K or more of superelevation
Thermal coefficient, greater than 100~500W/m.K of pyroconductivity of any metal) and excellent insulation performance (be greater than 1.0*
10 10 power Ω/cm), its super-high heat-conductive performance is formed by the insulating layer with nanometer construction, and the capacity of heat transmission is significantly high
In the material conducts heat rate of metal aluminium base, thus make the conducting path of heat from unidirectionally down, change into towards diffusion plus it is unidirectional down,
To solve the thermally conductive problem of aluminum-based circuit board;19 thermal coefficient of graphite particle filler material by setting is twice of aluminium sheet, no
It is same as the heat-conducting mode of the metal ball bodies such as copper, aluminium, in such a way that level is thermally conductive, the thermal uniformity of product is effectively ensured.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of aluminum substrate for circular panel light, including panel light lamp housing (1) and heat release hole (2), it is characterised in that: described
The one side of panel light lamp housing (1) is equipped with heat release hole (2), and one end screw of the panel light lamp housing (1) close to heat release hole (2) connects
There is threading installation lid (3), the side of the panel light lamp housing (1), which is integrally formed, is equipped with blind rivet mounting blocks (4), the blind rivet installation
It is socketed on the outer wall of block (4) blind rivet (5), is socketed on the outer wall of the blind rivet (5) separate blind rivet mounting blocks (4) and is bonded with bullet
Spring presss from both sides (6), is socketed with bottom case (10) on the inner wall of the panel light lamp housing (1), and the bottom case (10) is interior far from heat release hole (2)
Bottom surface screwing is connected with aluminum substrate fixed frame (7), is socketed with fixing screws (8), the aluminium on the aluminum substrate fixed frame (7)
Substrate fixed frame (7) is connected with aluminum substrate assembly (9) by fixing screws (8), and the aluminum substrate assembly (9) includes aluminum substrate
(13), the inside of the aluminum substrate (13) is inlaid with graphite particle filler material (19), and the aluminum substrate (13) is far from heat release hole (2)
One end be fixedly connected with DLC film (14), the DLC film (14) is fixed far from the one end of aluminum substrate (13)
It is connected with copper foil (15), the copper foil (15) is fixedly connected with solder (16) on one side far from DLC film (14), described
Solder (16) is fixedly connected with LED chip (17) on one side far from copper foil (15), and the aluminum substrate (13) is thin far from diamond-like
Film (14) is welded with cooling fin (18) on one side, and the aluminum substrate assembly (9) is connected to pressure far from one end gear of threading installation lid (3)
It encloses (11), the pressing ring (11) has snapped connection lampshade (12) far from one end of threading installation lid (3).
2. a kind of aluminum substrate for circular panel light according to claim 1, it is characterised in that: the LED chip
(17) multiple groups are equipped with.
3. a kind of aluminum substrate for circular panel light according to claim 1, it is characterised in that: the threading installation lid
(3) it also is provided on heat release hole (2), the heat release hole (2) is equipped with multiple groups.
4. a kind of aluminum substrate for circular panel light according to claim 1, it is characterised in that: the blind rivet mounting blocks
(4), blind rivet (5) and spring clip (6) are symmetrically arranged with two groups.
5. a kind of aluminum substrate for circular panel light according to claim 1, it is characterised in that: the aluminum substrate assembly
(9) it is connected with power supply line.
6. a kind of aluminum substrate for circular panel light according to claim 1, it is characterised in that: the graphite particle is filled out
Charge (19) is equipped with multiple groups.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920270912.9U CN209726139U (en) | 2019-03-04 | 2019-03-04 | A kind of aluminum substrate for circular panel light |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201920270912.9U CN209726139U (en) | 2019-03-04 | 2019-03-04 | A kind of aluminum substrate for circular panel light |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209726139U true CN209726139U (en) | 2019-12-03 |
Family
ID=68684890
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201920270912.9U Expired - Fee Related CN209726139U (en) | 2019-03-04 | 2019-03-04 | A kind of aluminum substrate for circular panel light |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209726139U (en) |
-
2019
- 2019-03-04 CN CN201920270912.9U patent/CN209726139U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20191203 Termination date: 20210304 |
|
CF01 | Termination of patent right due to non-payment of annual fee |