CN209592083U - Display panel and display device - Google Patents

Abstract

The utility model relates to the technical field of semiconductors and discloses a display panel and a display device. The display panel comprises: a driving backplane; a plurality of array electrodes arranged on the driving backplane and electrically connected to the driving backplane; Chip, each light-emitting chip is arranged above each array electrode and electrically connected to each array electrode; connecting electrodes, connecting electrodes are arranged on the driving backplane and electrically connected with the driving backplane; insulating filling layer, insulating filling layer filling Between the array electrode on the edge of the driving backplane adjacent to the connecting electrode and the connecting electrode, the thickness of the insulating filling layer decreases from the array electrode on the edge of the driving backplane to the direction of the connecting electrode; the common electrode covers the light-emitting chip The surface, the surface of the insulating filling layer and the surface of the connecting electrode, the common electrode is electrically connected with the light-emitting chip and the connecting electrode, which reduces the manufacturing cost of the display panel and the loss of electrical signals.

Description

Display panel and display device

technical field

The utility model relates to the technical field of semiconductors, in particular to a display panel and a display device.

Background technique

With the increasing progress of light-emitting diode (LED) chip process technology, it is possible to use LED as a pixel LED display technology. At present, the development of Micro-LED display panels is mostly based on flip-chip LED chips. When the P/N electrodes on the same side of the chip are soldered to the driver panel, there are high requirements and difficulties in terms of welding accuracy and avoiding short circuits. , and its large chip size also limits its application in the development of high-resolution display screens. Vertical LED chips with P/N electrodes on different sides have greater advantages and application prospects in the development of high-resolution Micro-LED display panels due to their smaller chip size and lower alignment accuracy requirements.

The inventors have found that there are at least the following problems in the prior art: the common electrode and the connection electrode of the driving backplane in the current vertical chip-based Micro-LED display panel are usually connected through a separately prepared conductive connection part, and the manufacturing process cost is relatively high.

Utility model content

The purpose of the utility model is to provide a display panel and a display device, which reduces the manufacturing cost of the display panel.

In order to solve the above technical problems, the embodiment of the present utility model provides a display panel, including: a driving backplane; a plurality of array electrodes, the array electrodes are arranged on the driving backplane and electrically connected with the driving backplane; a plurality of light-emitting chips , each light-emitting chip is arranged above each array electrode and is electrically connected to each array electrode; connecting electrodes, the connecting electrodes are arranged on the driving backplane and electrically connected to the driving backplane, and the connecting electrodes are arranged on the periphery of multiple array electrodes The insulating filling layer is filled between the array electrodes on the edge of the driving backplane adjacent to the connecting electrodes and the connecting electrodes, and the thickness of the insulating filling layer decreases from the array electrodes on the edge of the driving backplane to the direction of the connecting electrodes; The common electrode covers the surface of the light-emitting chip, the surface of the insulating filling layer and the surface of the connection electrode, and the common electrode is electrically connected with the light-emitting chip and the connection electrode.

The embodiment of the present invention further provides a display device, comprising: the above-mentioned display panel, a thin film encapsulation layer disposed above the display panel, and a light-transmitting layer disposed above the thin film encapsulation layer.

Compared with the prior art, the embodiment of the present utility model provides a display panel, including: a driving backplane; a plurality of array electrodes, the array electrodes are arranged on the driving backplane and electrically connected to the driving backplane; Chip, each light-emitting chip is arranged above each array electrode and is electrically connected to each array electrode; connecting electrodes, the connecting electrodes are arranged on the driving backplane and electrically connected to the driving backplane, and the connecting electrodes are arranged on multiple array electrodes Periphery; insulating filling layer, the insulating filling layer is filled between the array electrodes on the edge of the driving backplane adjacent to the connecting electrodes and the connecting electrodes, and the thickness of the insulating filling layer decreases from the array electrodes on the edge of the driving backplane to the direction of the connecting electrodes ; The common electrode covers the surface of the light-emitting chip, the surface of the insulating filling layer and the surface of the connecting electrode, and the common electrode is electrically connected to the light-emitting chip and the connecting electrode. By forming an insulating filling layer whose height decreases from the array electrode located at the edge of the drive backplane to the direction of the connection electrode between the connection electrode of the drive backplane and the array electrode adjacent to the connection electrode and located at the edge of the drive backplane, the thickness of the layer decreases gradually. The insulating filling layer acts as a transition between the height difference between the light-emitting chip and the connecting electrode, supports the common electrode so that the common electrode can cover the surface of the light-emitting chip and the surface of the connecting electrode, and avoids the common electrode being difficult to cover the two surfaces due to the height difference The problem is to realize the electrical connection between the common electrode, the light-emitting chip, and the connection electrodes, so that no separate conductive connection parts need to be formed on the connection electrodes, which reduces the manufacturing cost of the display panel and reduces the loss of electrical signals.

In addition, the thickness of the insulating filling layer decreases stepwise. In this solution, the thickness of the insulating filling layer decreases stepwise, and the insulating filling layer can be filled step by step when preparing the insulating filling layer, which improves the convenience of the preparation process of the insulating filling layer.

In addition, the lowest end of the insulating filling layer is level with the upper surface of the connecting electrode; or the lowest end of the insulating filling layer is lower than the upper surface of the connecting electrode. In this solution, the insulating filling layer is level with the upper surface of the connecting electrode, and there is no height difference, which improves the convenience of preparing the common electrode covering the connection between the lowest end of the insulating filling layer and the upper surface of the connecting electrode.

In addition, it also includes: a dam surrounding a plurality of array electrodes, the connecting electrodes are located on the periphery of the dam, and the common electrode covers the dam. In this scheme, dams are arranged on the periphery of the array electrodes to prevent the connecting electrodes from being covered by insulating materials and increase the preparation time and cost of the display panel; and the dams limit the peripheral area of the gap insulating layer and the insulating filling layer, especially for the gap insulating layer For insulating materials that are liquid during the process, it can also block the spread of liquid insulating materials.

In addition, the lowest end of the insulating filling layer is level with the upper surface of the dam; or the lowest end of the insulating filling layer is lower than the upper surface of the dam.

In addition, the connection electrodes are in the shape of a fence surrounding the embankment.

In addition, the thickness of each stepped layer of the stepwise decreasing insulating filling layer is the same. In this solution, the thickness of each stepped layer of the stepwise decreasing insulating filling layer is the same, which unifies the preparation method of each stepping layer, thereby providing convenience for the preparation of the insulating filling layer.

In addition, the light-emitting chip includes: a P-type semiconductor layer disposed above the array electrode, a light-emitting layer disposed above the P-type semiconductor layer, and an N-type semiconductor layer disposed above the light-emitting layer.

In addition, an electrical connection layer is provided between the array electrode and the light-emitting chip. In this solution, an electrical connection layer is provided between the array electrodes and the light-emitting chips, so that the light-emitting chips of the integrated Micro-LED array are connected correspondingly to the array electrodes on the driving backplane.

Description of drawings

FIG. 1 is a schematic structural view of a display panel according to a first embodiment of the present invention;

2 is a schematic structural view of a display panel according to a second embodiment of the present invention;

FIG. 3 is a schematic structural diagram of a display device according to a third embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present utility model clearer, various implementation modes of the present utility model will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that in each implementation manner of the present utility model, many technical details are proposed in order to enable readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

The first embodiment of the present utility model relates to a display panel, as shown in FIG. 1 , including: a driving backplane 1; a plurality of array electrodes 11, the array electrodes 11 are arranged on the driving backplane 1 and electrically Connection; a plurality of light-emitting chips 2, each light-emitting chip 2 is arranged above each array electrode 11 and is electrically connected with each array electrode 11; connecting electrodes 12, connecting electrodes 12 are arranged on the driving backplane 1 and connected to the driving backplane The board 1 is electrically connected, and the connecting electrodes 12 are arranged on the periphery of a plurality of array electrodes 11; the insulating filling layer 31, and the insulating filling layer 31 is filled between the array electrodes 110 and the connecting electrodes 12 adjacent to the connecting electrodes 12 and located at the edge of the driving backplane , the thickness of the insulating filling layer 31 gradually decreases from the array electrode 110 at the edge of the driving backplane to the direction of the connecting electrode 12; the common electrode 4, the common electrode 4 covers the surface of the light-emitting chip 2, the surface of the insulating filling layer 31 and the surface of the connecting electrode 12, the common The electrode 4 is electrically connected to the light emitting chip 2 and the connection electrode 12 .

Specifically, a plurality of array electrodes 11 are provided on the driving backplane 1, and each array electrode 11 is electrically connected to a light-emitting chip 2, and a corresponding light-emitting chip 2 is electrically connected above each array electrode 11. There is a connection electrode 12 electrically connected to the drive backplane 1, the connection electrode 12 is arranged on the periphery of a plurality of array electrodes 11, the connection electrode 12 is connected to the drive backplane 1 and the common electrode 4; the common electrode 4 covers the surface of the light-emitting chip 2, and The surface of the connection electrode 12 is electrically connected to the light-emitting chip 2 and the connection electrode 12 . Drive the backplane 1 to supply power to the common electrode 4 through the connecting electrodes 12, and provide conduction signals to the light-emitting chips 2 corresponding to the array electrodes 11 through different array electrodes 11, thereby lighting up the light-emitting chips 2 electrically connected to the array electrodes 11 . It is worth noting that in this embodiment, the driving backplane 1 can drive the light-emitting chip 2 to emit light in an active or passive manner.

It should be noted that, generally speaking, the connection electrodes 12 and the array electrodes 11 have the same thickness, and the connection electrodes 12 and the array electrodes 11 can be prepared on the driving backplane 1 at the same time. Since the light-emitting chip 2 is formed on the array electrode 11, the thickness of the formed light-emitting chip 2 leads to a height difference between the surface of the light-emitting chip 2 and the surface of the connecting electrode 12, which makes it difficult for the common electrode 4 to cover the surface of the light-emitting chip 2 and connect the electrodes. electrode 12 surface. In the prior art, a conductive connection portion is usually formed between the connection electrode 12 and the light-emitting chip 2 to reduce the height difference between the connection electrode 12 and the light-emitting chip 2 , but the manufacturing cost of this structure is relatively high.

In this embodiment, between the connecting electrodes 12 of the driving backplane 1 and the array electrodes 110 adjacent to the connecting electrodes 12 and located at the edge of the driving backplane, a height from the array electrode 110 at the edge of the driving backplane to the direction of the connecting electrodes 12 is formed. Decreasing insulating filling layer 31, the insulating filling layer 31 with decreasing thickness acts as a transition between the height difference between the light-emitting chip 2 and the connection electrode 12, supports the common electrode 4 so that the common electrode 4 can cover the surface of the light-emitting chip 2 and the connection electrode 12 surface, to avoid the problem that the common electrode 4 is difficult to cover the two surfaces due to the height difference, and realize the electrical connection between the common electrode 4 and the light-emitting chip 2 and the connection electrode 12, so that there is no need to form a separate conductive connection on the connection electrode 12 part, reducing the manufacturing cost of the display panel.

It is worth noting that the thickness of the common electrode 4 is 0.01-5 microns, and its material is a conductive transparent material, which can be indium tin oxide (ITO) material, metal alloy material (for example: Ag/Mg), metal nanowire (for example: Ag nanowires), metal grids, graphene, etc. Preparation methods may include: physical vapor deposition PVD, wet film formation, vacuum evaporation, etc.

In addition, in this embodiment, the lowest end of the insulating filling layer 31 can be lower or higher than the upper surface of the connecting electrode 12 by a preset distance, so as to avoid the height difference between the lowest end of the insulating filling layer 31 and the upper surface of the connecting electrode 12 If it is too large, it is not conducive to the preparation of the common electrode 4 covering the connection between the lowest end of the insulating filling layer 31 and the upper surface of the connecting electrode 12 . Preferably, the lowest end of the insulating filling layer 31 is flush with the upper surface of the connecting electrode 12 , thereby improving the convenience of preparing the common electrode 4 covering the connection between the lowest end of the insulating filling layer 31 and the upper surface of the connecting electrode 12 . Here, the preset distance may be -3-3 microns.

It should be noted that, when preparing the insulating filling layer 31, an insulating material can be filled between each array electrode 11 to form a gap insulating layer 32 at the same time, so as to support the common electrode 4 and ensure that the common electrode 4 is not easy to break, thereby avoiding the common electrode 4. After the electrode 4 is broken, it is connected to the array electrode 11 and short-circuited. Preferably, the upper surface of the gap insulating layer 32 filled between each array electrode 11 is lower than the upper surface of the light-emitting chip 2, or is flush with the upper surface of the light-emitting chip 2, so as to prevent the upper surface of the light-emitting chip 2 from being covered by insulating materials, and The manufacturing time and manufacturing cost of the display panel are increased.

In addition, in this embodiment, the height of the insulating filling layer 31 can be reduced stepwise, and the thickness of the insulating filling layer 31 can be gradually decreasing in a stepwise manner. When the insulating filling layer 31 is prepared, it can be filled step by step, which improves the strength of the insulating filling layer 31. Ease of preparation. Preferably, the thickness of each stepped layer of the stepwise decreasing insulating filling layer 31 is the same, which unifies the preparation method of each stepping layer, thereby facilitating the preparation of the insulating filling layer 31 . Of course, in practical applications, the thickness of each stepped layer may be different, and each stepped layer with different thickness may be prepared according to actual requirements.

Achievably, the shape of the connection electrode 12 can be the same as that of the array electrode 11, and the connection electrode 12 can also be arranged on one side of the array electrode 11 in a strip shape; . Compared with the other two shapes, when the connection electrode 12 is arranged in a fence shape, the connection area between the common electrode 4 and the connection electrode 12 is larger and the resistance is smaller.

In addition, the light-emitting chip 2 includes: a P-type semiconductor layer 21 disposed on the array electrode 11 , a light-emitting layer 22 disposed above the P-type semiconductor layer 21 , and an N-type semiconductor layer 23 disposed above the light-emitting layer 22 . Wherein, the P-type semiconductor layer 21 can be a group III-V compound (such as GaN or GaAs, etc.) doped with a positive divalent such as Mg, Zn, etc., and the N-type semiconductor layer 23 can be a group III-V group doped with a fourth group such as Si. compound (such as GaN or GaAs, etc.), the material of the light-emitting layer 22 can be a semiconductor material composed of elements such as Group III B, Al, Ga, In, etc. and Group V N, P, As, Te, etc.

This is only for illustration. In actual production, the P-type semiconductor layer 21 and the N-type semiconductor layer 23 doped with other materials can be selected according to actual needs.

It is worth noting that, in the Micro-LED display panel based on vertical chips, an electrical connection layer can be provided between the array electrodes 11 and the light-emitting chips 2, so that the light-emitting chips 2 and the driving backplane 1 of the Micro-LED array transferred as a whole The array electrodes 11 above are connected correspondingly. Micro-LED arrays are usually thin-film LED chips after laser lift off the sapphire substrate, and metals such as In/In, In/Au, Sn/Au, Sn/Cu can be used for the electrical connection layer.

Compared with the prior art, this embodiment provides a display panel in which a highly self-contained structure is formed between the connecting electrode 12 of the driving backplane 1 and the array electrode 110 adjacent to the connecting electrode 12 and located at the edge of the driving backplane. The array electrode 110 located on the edge of the driving backplane is gradually decreasing in the direction of the connecting electrode 12. The insulating filling layer 31 is used as a transition between the height difference between the light-emitting chip 2 and the connecting electrode 12, and supports the common electrode 4. Allowing the common electrode 4 to cover the surface of the light-emitting chip 2 and the surface of the connecting electrode 12 avoids the problem that the common electrode 4 is difficult to cover the two surfaces due to the height difference, and realizes the electrical connection between the common electrode 4 and the light-emitting chip 2 and the connecting electrode 12. connection, so that there is no need to form a separate conductive connection part on the connection electrode 12, which reduces the manufacturing cost of the display panel.

The second embodiment of the present invention relates to a display panel. As shown in FIG. 2 , the second embodiment is substantially the same as the first embodiment, the main difference is that it also includes: a bank 5 surrounding a plurality of array electrodes 11, the connecting electrodes 12 are located on the periphery of the bank 5, and the common electrode 4 covers the bank 5.

Achievably, the connection electrode 12 can also be arranged inside the dam 5. When forming the gap insulation layer 32 and the insulation filling layer 31, it is necessary to use a mask to avoid the material covering of the connection electrode 12; or when forming the gap insulation layer 32 and the insulation filling layer After layer 31, the insulating material covering the connecting electrodes 12 needs to be etched away, which increases the manufacturing time and cost of the display panel. However, in this embodiment, dams 5 are arranged on the periphery of the array electrodes 11 to prevent the connecting electrodes 12 from being covered by insulating materials and increase the manufacturing time and cost of the display panel; and the dams 5 limit the peripheral areas of the gap insulating layer 32 and the insulating filling layer 31 , especially for the insulating material that is liquid during the process of preparing the gap insulating layer 32, it can also prevent the spreading of the liquid insulating material.

It is worth noting that the insulation material of the gap insulating layer 32 and the insulating filling layer 31 is the same, which is convenient for forming the gap insulating layer 32 and the insulating filling layer 31 at the same time. The insulating material is a dry etching or photosensitive patternable material. Preferably, the insulating material can be a photosensitive patternable material, which can have a certain degree of fluidity during the preparation of the gap insulating layer 32 and the insulating filling layer 31, and then be cured by a process, which is conducive to the formation of a decreasingly height insulating filling layer 31. For example: the insulating material may be a mixture of UV sensitizer and polymethyl methacrylate.

When preparing the gap insulating layer 32 between the array electrodes 11 and the insulating filling layer 31 between the array electrode 110 and the connecting electrode 12 at the edge of the driving backplane in the dam 5, preferably, the insulating filling layer 31 and the gap insulating Layer 32 is produced by an inkjet printing process. In the area inside the dam, avoid the position of the light-emitting chip 2, and spray the filling layer material through the printing nozzles arranged in an array. After spraying, the backplane 1 is driven to stand for a period of time to make the ink level. After leveling, it is treated with ultraviolet light. The ink completes the curing process. Preferably, the height of the cured gap insulating layer 32 is lower than the upper surface of the light-emitting chip 2, or flush with the upper surface of the light-emitting chip 2, so as to prevent the upper surface of the light-emitting chip 2 from being covered by insulating materials, thereby increasing the preparation time and length of the display panel. cost.

The lowest end of the insulating filling layer 31 can be lower than or higher than the upper surface of the embankment 5 by a predetermined distance, thereby avoiding an excessive height difference between the lowest end of the insulating filling layer 31 and the upper surface of the embankment 5, which is not conducive to covering the insulating filling layer 31 Preparation of the common electrode 4 at the junction of the lowest end and the upper surface of the embankment 5 . Preferably, the lowest end of the insulating filling layer 31 is flush with the upper surface of the connection bank 5 , thereby improving the convenience of preparing the common electrode 4 covering the connection between the lowest end of the insulating filling layer 31 and the upper surface of the connecting electrode 12 . Here, the preset distance may be -3-3 microns.

In this embodiment, the material of the embankment can be selected from commonly used photoresist. First, a layer of photoresist is coated on the surface of the driving panel, and the required pattern of the embankment area is prepared through an exposure and development process. The thickness of the dam area can be 1 micron to 10 microns, because the thickness of the connecting electrode 12 is generally small, the thickness of the dam 5 and the thickness of the connecting electrode 12 are quite different, and an insulating material can also be filled between the dam 5 and the connecting electrode 12 , so as to support the common electrode 4 between the embankment 5 and the connecting electrode 12 so as not to break easily.

Achievably, the shape of the connection electrode 12 located at the periphery of the dam 5 can be the same as the shape of the array electrode 11, and the connection electrode 12 can also be arranged on one side of the periphery of the dam 5 in a strip shape; the connection electrode 12 can also be in the shape of a fence, Surrounding dikes 5 are set. Compared with the other two shapes, when the connecting electrode 12 is arranged in a fence shape, surrounding the dam 5, the contact area between the common electrode 4 and the connecting electrode 12 is larger, and the resistance between the common electrode 4 and the connecting electrode 12 is smaller when transmitting electrical signals .

This embodiment provides a display panel, in which dams 5 are arranged around the array electrodes 11 to prevent the connecting electrodes 12 from being covered by insulating materials and increase the manufacturing time and cost of the display panel; and the dams 5 limit the gap insulating layer 32 and insulating filling The peripheral area of the layer 31, especially for insulating materials that are liquid during the preparation of the gap insulating layer 32, also acts as a barrier to the spreading of the liquid insulating material.

The third embodiment of the present utility model relates to a display device, as shown in FIG. 3 , comprising: a display panel 31 according to any one of the above-mentioned embodiments, a thin film encapsulation layer 32 disposed above the display panel 31 , and a film encapsulation layer 32 disposed on the film encapsulation layer. Light-transmitting layer 35 above layer 32 . Optionally, a touch screen 33 and a polarizer 34 disposed above the touch screen 33 may also be provided on the thin film encapsulation layer 32 .

Those of ordinary skill in the art can understand that the above-mentioned embodiments are specific examples for realizing the utility model, and in practical applications, various changes can be made to it in form and details without departing from the utility model spirit and scope.

Claims (10)

1. A display panel, characterized in that, comprising: drive backplane; A plurality of array electrodes, the array electrodes are arranged on the driving backplane and electrically connected with the driving backplane; a plurality of light-emitting chips, each of the light-emitting chips is arranged above each of the array electrodes and is electrically connected to each of the array electrodes; Connecting electrodes, the connecting electrodes are arranged on the driving backplane and electrically connected to the driving backplane, the connecting electrodes are arranged on the periphery of the plurality of array electrodes; An insulating filling layer, the insulating filling layer is filled between the array electrode adjacent to the connecting electrode and located at the edge of the driving backplane and the connecting electrode, the thickness of the insulating filling layer is from the edge of the driving backplane The array electrodes decrease in the direction of the connecting electrodes; The common electrode covers the surface of the light-emitting chip, the surface of the insulating filling layer and the surface of the connection electrode, and the common electrode is electrically connected to the light-emitting chip and the connection electrode. 2 . The display panel according to claim 1 , wherein the thickness of the insulating filling layer decreases stepwise. 3. The display panel according to claim 1, wherein the lowest end of the insulating filling layer is flat with the upper surface of the connecting electrode; or the lowest end of the insulating filling layer is lower than the upper surface of the connecting electrode. upper surface. 4 . The display panel according to claim 1 , further comprising: a bank surrounding the plurality of array electrodes, the connecting electrode is located on the periphery of the bank, and the common electrode covers the bank. 5. The display panel according to claim 4, wherein the lowest end of the insulating filling layer is level with the upper surface of the dam; or the lowest end of the insulating filling layer is lower than the upper surface of the dam . 6 . The display panel according to claim 4 , wherein the connecting electrodes are in the shape of a fence surrounding the dam. 7 . 7 . The display panel according to claim 2 , wherein the thickness of each stepped layer of the insulating filling layer decreasing in steps is the same. 8. The display panel according to claim 1, wherein the light-emitting chip comprises: a P-type semiconductor layer disposed above the array electrode, a light-emitting layer disposed above the P-type semiconductor layer, and a light-emitting layer disposed above the array electrode. an N-type semiconductor layer above the light-emitting layer. 9. The display panel according to claim 1, wherein an electrical connection layer is provided between the array electrode and the light emitting chip. 10. A display device, characterized in that it comprises: the display panel according to any one of claims 1 to 9, a thin film encapsulation layer disposed above the display panel, and a thin film encapsulation layer disposed on the thin film encapsulation layer Translucent layer above.