CN209544342U - A kind of electrostatic protection array chip encapsulating structure applied to CAN transceiver - Google Patents

Abstract

An electrostatic protection array chip packaging structure applied to CAN transceivers, the utility model relates to the technical field of electrostatic protection array chips; the left and right sides of the first metal lead frame are provided with the second metal lead frame, the first metal lead frame The No. 1 ESD protection chip is fixed side by side on the upper surface, and the No. 2 ESD protection chip is fixed on the upper surface of the No. 2 metal lead frame. The No. 1 ESD protection chip on the left is electrically connected to the No. 2 ESD protection chip on the left through metal wires. The No. 1 ESD protection chip on the right is electrically connected to the No. 2 ESD protection chip on the right through metal wires. The volume and cost of the device are effectively reduced, and at the same time, the CAN transceiver can be protected from electromagnetic interference and electrostatic discharge, and the practicability is stronger.

Description

An ESD Protection Array Chip Packaging Structure Applied to CAN Transceivers

technical field

The utility model relates to the technical field of electrostatic protection array chips, in particular to an electrostatic protection array chip packaging structure applied to a CAN transceiver.

Background technique

CAN bus has many characteristics such as high communication rate, reliability, convenient connection and high cost performance, and is widely used in automotive electronic components, industrial automation, machine tool or elevator control, medical equipment and other fields. The above application environment is quite harsh. As the only interface between expensive node devices and the CAN bus, the CAN transceiver must have strict standards such as anti-electromagnetic interference and electrostatic discharge, and the smaller the size, the better; add a small electrostatic protection chip to the CAN transceiver It can play the role of anti-electromagnetic interference, electrostatic discharge, etc., and will not increase the complexity of the CAN transceiver circuit, nor will it increase the cost.

To sum up, it is necessary to propose a new packaging structure for ESD protection array chips applied to CAN transceivers.

Contents of the invention

The purpose of the utility model is to aim at the defects and deficiencies of the prior art, to provide a simple structure, reasonable design, easy to use electrostatic protection array chip packaging structure applied to CAN transceivers, effectively reducing the volume and cost of the device, while It can protect the CAN transceiver from electromagnetic interference and electrostatic discharge, and has stronger practicability.

In order to achieve the above purpose, the technical solution adopted by the utility model is: it includes epoxy resin plastic packaging, No. 1 metal lead frame, No. 2 metal lead frame, No. 1 static protection chip, No. 2 static protection chip, metal wire; ring Oxygen resin plastic packaging package is set outside the whole body composed of No. 1 metal lead frame, No. 2 metal lead frame, No. 1 ESD protection chip, No. 2 ESD protection chip and metal wires. The pins of the metal lead frame are exposed outside the epoxy resin plastic package; the left and right sides of the No. 1 metal lead frame are equipped with the No. 2 metal lead frame, and the upper surface of the No. 1 metal lead frame is fixed side by side with a No. 2 electrostatic protection device. Chip, No. 2 electrostatic protection chip is fixed on the upper surface of the No. 2 metal lead frame. The No. 1 electrostatic protection chip on the left is electrically connected to the No. 2 electrostatic protection chip on the left through a metal wire, and the No. 1 electrostatic protection chip on the right passes through The metal wire is electrically connected to the No. 2 electrostatic protection chip on the right.

Further, a metal ball is fixed on the upper surface of the No. 2 ESD protection chip, and the metal wire is electrically connected to the No. 2 ESD protection chip through the metal ball.

Further, the epoxy resin plastic package is composed of a package bottom case and a package top case, the upper cover of the package bottom case is provided with a package top case, and the welding ends of the No. 1 metal lead frame and the No. 2 metal lead frame are fixed on the top surface of the package bottom case.

Further, the metal wire is an alloy wire.

Further, the metal ball is an alloy wire ball.

After adopting the above structure, the beneficial effect of the utility model is: a kind of electrostatic protection array chip packaging structure applied to the CAN transceiver described in the utility model effectively reduces the volume and cost of the device, and can protect the CAN transceiver from The damage caused by electromagnetic interference and electrostatic discharge has stronger practicability. The utility model has the advantages of simple structure, reasonable setting and low manufacturing cost.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1 is the structural representation of the utility model.

Fig. 2 is a plan view of the utility model.

Explanation of reference signs:

Epoxy resin plastic package 1, No. 1 metal lead frame 2, No. 2 metal lead frame 3, No. 1 electrostatic protection chip 4, No. 2 electrostatic protection chip 5, metal ball 6, metal wire 7.

Detailed ways

Below in conjunction with accompanying drawing, the utility model is further described.

Referring to Fig. 1 and Fig. 2, the technical solution adopted in this specific embodiment is: it includes epoxy resin plastic package 1, No. 1 metal lead frame 2, No. 2 metal lead frame 3, No. 1 electrostatic protection chip 4, No. 2 static electricity protection chip 5, metal wire 7; Epoxy resin plastic encapsulation 1 is wrapped in by No. On the outside of the whole formed by the protective chip 5, the metal ball 6 and the metal wire 7, the exposed pins of the No. 1 metal lead frame 2 and the exposed pins of the No. 2 metal lead frame 3 are all arranged on the outside of the epoxy resin plastic package 1 ( The above-mentioned epoxy resin plastic package 1 has a minimum molding size of 2.9 mm x 2.4 mm wide x 1.0 mm high, which are the internal No. 1 metal lead frame 2, No. 2 metal lead frame 3, No. 1 electrostatic protection chip 4, and No. 2 The electrostatic protection chip 5 and the metal wire 7 provide manufacturing and insulating layers to protect it from mechanical damage and from environmental influences such as temperature, moisture, and pollutants); the left and right sides of the No. 1 metal lead frame 2 are A No. 2 metal lead frame 3 is provided, and a No. 2 electrostatic protection chip 4 is welded and fixed side by side on the upper surface pad of the No. 1 metal lead frame 2, and a No. 2 electrostatic protection chip 4 is welded and fixed on the upper surface of the No. 2 metal lead frame 3. The protection chip 5, the front window of No. 2 electrostatic protection chip 5 is welded with metal ball 6 by alloy wire, and the front window of No. 1 electrostatic protection chip 4 on the left is connected with the metal wire 7 and the metal ball 6 on the left. Electrically connected (that is, electrically connected to the No. 2 ESD protection chip 5 on the left side through the metal ball 6), and the front window of the No. 1 ESD protection chip 4 on the right side is electrically connected to the metal ball 6 on the right side through the metal wire 7 ( That is, it is electrically connected to the No. 2 electrostatic protection chip 5 on the right side through the metal ball 6); the above-mentioned metal wire 7 is an alloy wire with a soft material, which is easy to weld and will not damage the No. 1 electrostatic protection chip 4 and the No. 2 electrostatic protection chip due to excessive welding pressure. The surface layer of the No. 1 electrostatic protection chip 5; two No. 2 electrostatic protection chips 5 are respectively connected in series with the No. 1 electrostatic protection chip 4 on the left and right sides to form two bidirectional electrostatic protection circuits.

After adopting the above structure, the beneficial effect of this specific embodiment is: a kind of electrostatic protection array chip packaging structure applied to CAN transceiver described in this specific embodiment, four electrostatic protection chips are sealed into a small package shape, Effectively reduces the volume and cost of the device, and protects the CAN transceiver from electromagnetic interference and electrostatic discharge damage, and will not increase the complexity of the CAN transceiver circuit, nor will it increase the cost. The utility model The utility model has the advantages of simple structure, reasonable setting, low production cost and the like.

The above is only used to illustrate the technical solution of the utility model without limitation, other modifications or equivalent replacements made by those skilled in the art to the technical solution of the utility model, as long as they do not depart from the spirit and scope of the technical solution of the utility model , should be covered in the scope of the claims of the present utility model.

Claims (4)

1. a kind of electrostatic protection array chip encapsulating structure applied to CAN transceiver, it is characterised in that: it includes epoxy resin Plastic Package (1), No.1 metal lead wire frame (2), No. two metal lead wire frames (3), No.1 electrostatic protection chip (4), No. two Electrostatic protection chip (5), plain conductor (7)；Epoxy resin plastics encapsulation (1) is packaged in by No.1 metal lead wire frame (2), two Number metal lead wire frame (3), No.1 electrostatic protection chip (4), No. two electrostatic protection chips (5) and plain conductor (7) are constituted Whole outside, wherein No.1 metal lead wire frame (2) and the pin of No. two metal lead wire frames (3), which reveal, is located at epoxy resin The outside of Plastic Package (1)；No. two metal lead wire frames (3), No.1 are equipped at left and right sides of No.1 metal lead wire frame (2) Upper surface of metal lead wire frame (2) or so is fixed with No.1 electrostatic protection chip (4), No. two metal lead wire frames (3) side by side Upper surface be fixed with No. two electrostatic protection chips (5), the No.1 electrostatic protection chip (4) in left side by plain conductor (7) with No. two electrostatic protection chips (5) in left side are electrically connected, and the No.1 electrostatic protection chip (4) on right side passes through plain conductor (7) and right No. two electrostatic protection chips (5) of side are electrically connected.

2. a kind of electrostatic protection array chip encapsulating structure applied to CAN transceiver according to claim 1, feature Be: the upper surface of No. two electrostatic protection chips (5) is fixed with metal ball (6), and plain conductor (7) passes through metal ball (6) it is electrically connected with No. two electrostatic protection chips (5).

3. a kind of electrostatic protection array chip encapsulating structure applied to CAN transceiver according to claim 1, feature Be: the plain conductor (7) is alloy wire.

4. a kind of electrostatic protection array chip encapsulating structure applied to CAN transceiver according to claim 2, feature Be: the metal ball (6) is alloy thread ball.