[go: up one dir, main page]

CN209487491U - A kind of IGBT mould group with radiator structure - Google Patents

A kind of IGBT mould group with radiator structure Download PDF

Info

Publication number
CN209487491U
CN209487491U CN201822101214.4U CN201822101214U CN209487491U CN 209487491 U CN209487491 U CN 209487491U CN 201822101214 U CN201822101214 U CN 201822101214U CN 209487491 U CN209487491 U CN 209487491U
Authority
CN
China
Prior art keywords
igbt
radiator
mould group
spring
protection casing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201822101214.4U
Other languages
Chinese (zh)
Inventor
刘顺炮
张宋平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Game Energy Technology Co Ltd
Original Assignee
Suzhou Game Energy Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Game Energy Technology Co Ltd filed Critical Suzhou Game Energy Technology Co Ltd
Priority to CN201822101214.4U priority Critical patent/CN209487491U/en
Application granted granted Critical
Publication of CN209487491U publication Critical patent/CN209487491U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The IGBT mould group with radiator structure that this application discloses a kind of, including a radiator and several IGBT, it further include the plastic protection casing being detachably fixed with the radiator, that side of the plastic protection casing towards the radiator is formed with several IGBT mounting grooves, each IGBT is arranged in correspondingly respectively in each IGBT mounting groove, and it is arranged with and is clipped between the plastic protection casing and the IGBT in each IGBT mounting groove, and the spring towards radiator direction elastic force is applied to the IGBT, each IGBT the spring elastic force effect under with the radiator abutting contact.The application can guarantee IGBT mould group radiating efficiency still with higher after being used for a long time.

Description

A kind of IGBT mould group with radiator structure
Technical field
The IGBT mould group with radiator structure that this application involves a kind of.
Background technique
In the prior art, some IGBT mould groups with radiator, each IGBT monomer are usually directly pressed by pressing plate On the surface of radiator, so that realizes IGBT and radiator thermally contacts connection, the heat of IGBT at work is taken away by radiator Amount, prevents IGBT high temperature.Each IGBT monomer of this IGBT mould group is to contact firmly with radiator, and after long-time service, IGBT is mono- Body and radiator are easy to loosen, and cause the heat of IGBT monomer that cannot quickly be transferred to radiator.
In addition, will not protect to the pin of IGBT in existing IGBT mould group, the pin of IGBT is very in use It is easy to draw vibration and be subjected to displacement.
Summary of the invention
The purpose of the application is: in view of the deficiencies of the prior art, the application proposes a kind of IGBT mould group with radiator structure, To guarantee IGBT mould group radiating efficiency still with higher after being used for a long time.
The technical solution of the application is:
A kind of IGBT mould group with radiator structure, including a radiator and several IGBT further include and the heat dissipation The plastic protection casing that device is detachably fixed, that side of the plastic protection casing towards the radiator are formed with several IGBT peace Tankage, each IGBT are arranged in correspondingly respectively in each IGBT mounting groove, and each IGBT peace It is arranged in tankage and is clipped between the plastic protection casing and the IGBT and the IGBT is applied towards the radiator The spring of direction elastic force, each IGBT the spring elastic force effect under with the radiator abutting contact.
The application further includes following preferred embodiment based on the above technical solution:
The pin location hole protruded into the IGBT mounting groove is also provided on the plastic protection casing, the IGBT's Pin is inserted in the pin location hole.
The spring is multi-layer corrugated spring.
The slot bottom of the IGBT mounting groove is formed with spring positioning slot, and one end of the multi-layer corrugated spring inserts in the spring In locating slot.
The radiator is cold forging radiator.
The side of the radiator is provided with several thermal columns.
The plastic protection casing is connect with the radiator by screw locking.
The plastic protection casing is snapped connection with the radiator.
The application has the advantage that compared to traditional technology
1, the elastic force that the application applies IGBT2 by spring contacts IGBT with radiator resilient abutment, is used for a long time It still is able to guarantee that IGBT is contacted with the good of radiator, makes IGBT mould group radiating efficiency with higher always.
2, the pin location hole being arranged on plastic protection casing, guarantee mould group is in the case where external vibration, the pin of IGBT Non-displacement.
3, the slot bottom of IGBT mounting groove is formed with spring positioning slot, and one end of multi-layer corrugated spring inserts in spring positioning slot, Guarantee that the position of multi-layer corrugated spring is accurate.
4, radiator is using cold forging radiator made of cold-forging technique, and side is provided with numerous thermal columns, is had excellent Good heat dissipation performance.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to required use in embodiment description Attached drawing be briefly described, the drawings in the following description are only some examples of the present application, skill common for this field For art personnel, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the decomposition texture schematic diagram of IGBT mould group in the embodiment of the present application;
Fig. 2 is the partial sectional view of IGBT mould group in the embodiment of the present application;
Fig. 3 is the structural schematic diagram of radiator in the embodiment of the present application;
Wherein: 1- radiator, 101- thermal column, 2-IGBT, 3- plastic protection casing, 301-IGBT mounting groove, 302- pin Location hole, 303- spring positioning slot, 4- spring, 5- screw.
Specific embodiment
Above scheme is described further below in conjunction with specific embodiment.It should be understood that these embodiments are for illustrating The application and be not limited to limitation scope of the present application.Implementation condition used in the examples can be done according to the condition of specific producer Further adjustment, the implementation condition being not specified is usually the condition in routine experiment.
Fig. 1 to Fig. 3 shows a this preferred embodiment with radiator structure IGBT mould group of the application, and traditional IGBT mould group is identical to be, which also includes a radiator 1 and multiple IGBT2 (IGBT monomer).
The key improvements of the present embodiment are that the mould group is also configured with one and protects with the plastics that radiator 1 is detachably fixed Protective case 3, that side of the plastic protection casing 3 towards radiator 1 are formed with multiple IGBT mounting grooves 301, above-mentioned each IGBT2 difference It is arranged in these IGBT mounting grooves 301 correspondingly, and is arranged in each IGBT mounting groove 301 and is clipped in plastics Spring 4 between protective shell 3 and IGBT2, aforementioned spring 4 are applied with the elastic force towards 1 direction of radiator to IGBT2, and IGBT2 exists The elastic force of spring 4 acts on lower and 1 abutting contact of radiator.
In addition, the pin location hole 302 protruded into IGBT mounting groove 301 is also provided on plastic protection casing 3, IGBT2's Pin is inserted in pin location hole 302, and for so certifiable mould group in the case where external vibration, the pin of IGBT2 is without position It moves.
In the present embodiment, above-mentioned spring 4 is multi-layer corrugated spring.And the slot bottom of IGBT mounting groove 301 is formed with spring Locating slot, one end of multi-layer corrugated spring insert in spring positioning slot 303, and the position to guarantee multi-layer corrugated spring is accurate.
In this implementation, above-mentioned radiator 1 is using cold forging radiator made of cold-forging technique, the side setting of radiator 1 There are numerous thermal columns 101.
Plastic protection casing 3 is specially that screw locking is connect with the detachable connection method of radiator 1, both certainly can also be with Using other connection types, for example snap connection.
Above-described embodiment is only the technical concepts and features for illustrating the application, and its object is to allow people that can understand this Shen Content please is simultaneously implemented accordingly, and the protection scope of the application can not be limited with this.It is all according to the application main technical schemes The equivalent transformation or modification that Spirit Essence is done should all be covered within the scope of protection of this application.

Claims (8)

1. a kind of IGBT mould group with radiator structure, including a radiator (1) and several IGBT (2), which is characterized in that also Including the plastic protection casing (3) being detachably fixed with the radiator (1), the plastic protection casing (3) is towards the radiator (1) that side is formed with several IGBT mounting grooves (301), and each IGBT (2) is arranged in each correspondingly respectively In the IGBT mounting groove (301), and it is arranged in each IGBT mounting groove (301) and is clipped in the plastic protection casing (3) apply the spring (4) towards the radiator (1) direction elastic force between the IGBT (2) and to the IGBT (2), respectively A IGBT (2) is the elastic force effect of the spring (4) is lower and the radiator (1) abutting contact.
2. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that on the plastic protection casing (3) It is also provided with the pin location hole (302) protruded into the IGBT mounting groove (301), the pin of the IGBT (2) is inserted in institute It states in pin location hole (302).
3. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the spring (4) is multilayer wave Shape spring.
4. the IGBT mould group according to claim 3 with radiator structure, which is characterized in that the IGBT mounting groove (301) Slot bottom be formed with spring positioning slot (303), one end of the multi-layer corrugated spring inserts in the spring positioning slot.
5. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the radiator (1) is cold forging Radiator.
6. the IGBT mould group according to claim 5 with radiator structure, which is characterized in that the side of the radiator (1) It is provided with several thermal columns (101).
7. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the plastic protection casing (3) with The radiator (1) passes through screw (5) locking connection.
8. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the plastic protection casing (3) with The radiator (1) snaps connection.
CN201822101214.4U 2018-12-14 2018-12-14 A kind of IGBT mould group with radiator structure Active CN209487491U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201822101214.4U CN209487491U (en) 2018-12-14 2018-12-14 A kind of IGBT mould group with radiator structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201822101214.4U CN209487491U (en) 2018-12-14 2018-12-14 A kind of IGBT mould group with radiator structure

Publications (1)

Publication Number Publication Date
CN209487491U true CN209487491U (en) 2019-10-11

Family

ID=68127534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201822101214.4U Active CN209487491U (en) 2018-12-14 2018-12-14 A kind of IGBT mould group with radiator structure

Country Status (1)

Country Link
CN (1) CN209487491U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112423530A (en) * 2020-11-02 2021-02-26 珠海格力电器股份有限公司 Fixing device of switch tube and switch tube assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112423530A (en) * 2020-11-02 2021-02-26 珠海格力电器股份有限公司 Fixing device of switch tube and switch tube assembly

Similar Documents

Publication Publication Date Title
US9696506B2 (en) Connector housing assembly and connector having the same
US7885075B2 (en) Heat dissipation device
US7562696B2 (en) Juxtaposing structure for heated ends of heat pipes
US7375964B2 (en) Memory module assembly including a clamp for mounting heat sinks thereon
US7277291B2 (en) Thermal transfer device
US7203066B2 (en) Heat sink assembly incorporating spring clip
US20070195489A1 (en) Memory module assembly including a clip for mounting a heat sink thereon
US8270164B2 (en) Liquid cooling system and electronic device incorporating the same
WO2014132399A1 (en) Heat dissipating structure
TW201302041A (en) Clip
CN208271079U (en) A kind of M.2 SSD PCIE adapter with radiator structure
CN105873415A (en) Base and heat pipe combination of radiator
TWM594287U (en) Electrical connector
CN105446437A (en) Disk array cooling device
US12147084B2 (en) Cooling device, a receptacle assembly, a system and a printed board assembly
CN209487491U (en) A kind of IGBT mould group with radiator structure
US7251134B2 (en) Extended fin array
US20090151896A1 (en) Heat dissipation device
US20050072555A1 (en) Heat sink fastening device
US7292443B1 (en) Heat sink mounting assembly
CN103906411A (en) Heat dissipation device and pressing member
JP7275505B2 (en) semiconductor equipment
CN103176571A (en) Storer radiation device
CN101453864A (en) Fixing member
CN217064413U (en) Heat conduction structure, heat dissipation module and signal transmission system

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant