CN209487491U - A kind of IGBT mould group with radiator structure - Google Patents
A kind of IGBT mould group with radiator structure Download PDFInfo
- Publication number
- CN209487491U CN209487491U CN201822101214.4U CN201822101214U CN209487491U CN 209487491 U CN209487491 U CN 209487491U CN 201822101214 U CN201822101214 U CN 201822101214U CN 209487491 U CN209487491 U CN 209487491U
- Authority
- CN
- China
- Prior art keywords
- igbt
- radiator
- mould group
- spring
- protection casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920003023 plastic Polymers 0.000 claims abstract description 22
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 230000000694 effects Effects 0.000 claims abstract description 3
- 238000010273 cold forging Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The IGBT mould group with radiator structure that this application discloses a kind of, including a radiator and several IGBT, it further include the plastic protection casing being detachably fixed with the radiator, that side of the plastic protection casing towards the radiator is formed with several IGBT mounting grooves, each IGBT is arranged in correspondingly respectively in each IGBT mounting groove, and it is arranged with and is clipped between the plastic protection casing and the IGBT in each IGBT mounting groove, and the spring towards radiator direction elastic force is applied to the IGBT, each IGBT the spring elastic force effect under with the radiator abutting contact.The application can guarantee IGBT mould group radiating efficiency still with higher after being used for a long time.
Description
Technical field
The IGBT mould group with radiator structure that this application involves a kind of.
Background technique
In the prior art, some IGBT mould groups with radiator, each IGBT monomer are usually directly pressed by pressing plate
On the surface of radiator, so that realizes IGBT and radiator thermally contacts connection, the heat of IGBT at work is taken away by radiator
Amount, prevents IGBT high temperature.Each IGBT monomer of this IGBT mould group is to contact firmly with radiator, and after long-time service, IGBT is mono-
Body and radiator are easy to loosen, and cause the heat of IGBT monomer that cannot quickly be transferred to radiator.
In addition, will not protect to the pin of IGBT in existing IGBT mould group, the pin of IGBT is very in use
It is easy to draw vibration and be subjected to displacement.
Summary of the invention
The purpose of the application is: in view of the deficiencies of the prior art, the application proposes a kind of IGBT mould group with radiator structure,
To guarantee IGBT mould group radiating efficiency still with higher after being used for a long time.
The technical solution of the application is:
A kind of IGBT mould group with radiator structure, including a radiator and several IGBT further include and the heat dissipation
The plastic protection casing that device is detachably fixed, that side of the plastic protection casing towards the radiator are formed with several IGBT peace
Tankage, each IGBT are arranged in correspondingly respectively in each IGBT mounting groove, and each IGBT peace
It is arranged in tankage and is clipped between the plastic protection casing and the IGBT and the IGBT is applied towards the radiator
The spring of direction elastic force, each IGBT the spring elastic force effect under with the radiator abutting contact.
The application further includes following preferred embodiment based on the above technical solution:
The pin location hole protruded into the IGBT mounting groove is also provided on the plastic protection casing, the IGBT's
Pin is inserted in the pin location hole.
The spring is multi-layer corrugated spring.
The slot bottom of the IGBT mounting groove is formed with spring positioning slot, and one end of the multi-layer corrugated spring inserts in the spring
In locating slot.
The radiator is cold forging radiator.
The side of the radiator is provided with several thermal columns.
The plastic protection casing is connect with the radiator by screw locking.
The plastic protection casing is snapped connection with the radiator.
The application has the advantage that compared to traditional technology
1, the elastic force that the application applies IGBT2 by spring contacts IGBT with radiator resilient abutment, is used for a long time
It still is able to guarantee that IGBT is contacted with the good of radiator, makes IGBT mould group radiating efficiency with higher always.
2, the pin location hole being arranged on plastic protection casing, guarantee mould group is in the case where external vibration, the pin of IGBT
Non-displacement.
3, the slot bottom of IGBT mounting groove is formed with spring positioning slot, and one end of multi-layer corrugated spring inserts in spring positioning slot,
Guarantee that the position of multi-layer corrugated spring is accurate.
4, radiator is using cold forging radiator made of cold-forging technique, and side is provided with numerous thermal columns, is had excellent
Good heat dissipation performance.
Detailed description of the invention
Technical solution in ord to more clearly illustrate embodiments of the present application, below will be to required use in embodiment description
Attached drawing be briefly described, the drawings in the following description are only some examples of the present application, skill common for this field
For art personnel, without creative efforts, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the decomposition texture schematic diagram of IGBT mould group in the embodiment of the present application;
Fig. 2 is the partial sectional view of IGBT mould group in the embodiment of the present application;
Fig. 3 is the structural schematic diagram of radiator in the embodiment of the present application;
Wherein: 1- radiator, 101- thermal column, 2-IGBT, 3- plastic protection casing, 301-IGBT mounting groove, 302- pin
Location hole, 303- spring positioning slot, 4- spring, 5- screw.
Specific embodiment
Above scheme is described further below in conjunction with specific embodiment.It should be understood that these embodiments are for illustrating
The application and be not limited to limitation scope of the present application.Implementation condition used in the examples can be done according to the condition of specific producer
Further adjustment, the implementation condition being not specified is usually the condition in routine experiment.
Fig. 1 to Fig. 3 shows a this preferred embodiment with radiator structure IGBT mould group of the application, and traditional
IGBT mould group is identical to be, which also includes a radiator 1 and multiple IGBT2 (IGBT monomer).
The key improvements of the present embodiment are that the mould group is also configured with one and protects with the plastics that radiator 1 is detachably fixed
Protective case 3, that side of the plastic protection casing 3 towards radiator 1 are formed with multiple IGBT mounting grooves 301, above-mentioned each IGBT2 difference
It is arranged in these IGBT mounting grooves 301 correspondingly, and is arranged in each IGBT mounting groove 301 and is clipped in plastics
Spring 4 between protective shell 3 and IGBT2, aforementioned spring 4 are applied with the elastic force towards 1 direction of radiator to IGBT2, and IGBT2 exists
The elastic force of spring 4 acts on lower and 1 abutting contact of radiator.
In addition, the pin location hole 302 protruded into IGBT mounting groove 301 is also provided on plastic protection casing 3, IGBT2's
Pin is inserted in pin location hole 302, and for so certifiable mould group in the case where external vibration, the pin of IGBT2 is without position
It moves.
In the present embodiment, above-mentioned spring 4 is multi-layer corrugated spring.And the slot bottom of IGBT mounting groove 301 is formed with spring
Locating slot, one end of multi-layer corrugated spring insert in spring positioning slot 303, and the position to guarantee multi-layer corrugated spring is accurate.
In this implementation, above-mentioned radiator 1 is using cold forging radiator made of cold-forging technique, the side setting of radiator 1
There are numerous thermal columns 101.
Plastic protection casing 3 is specially that screw locking is connect with the detachable connection method of radiator 1, both certainly can also be with
Using other connection types, for example snap connection.
Above-described embodiment is only the technical concepts and features for illustrating the application, and its object is to allow people that can understand this Shen
Content please is simultaneously implemented accordingly, and the protection scope of the application can not be limited with this.It is all according to the application main technical schemes
The equivalent transformation or modification that Spirit Essence is done should all be covered within the scope of protection of this application.
Claims (8)
1. a kind of IGBT mould group with radiator structure, including a radiator (1) and several IGBT (2), which is characterized in that also
Including the plastic protection casing (3) being detachably fixed with the radiator (1), the plastic protection casing (3) is towards the radiator
(1) that side is formed with several IGBT mounting grooves (301), and each IGBT (2) is arranged in each correspondingly respectively
In the IGBT mounting groove (301), and it is arranged in each IGBT mounting groove (301) and is clipped in the plastic protection casing
(3) apply the spring (4) towards the radiator (1) direction elastic force between the IGBT (2) and to the IGBT (2), respectively
A IGBT (2) is the elastic force effect of the spring (4) is lower and the radiator (1) abutting contact.
2. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that on the plastic protection casing (3)
It is also provided with the pin location hole (302) protruded into the IGBT mounting groove (301), the pin of the IGBT (2) is inserted in institute
It states in pin location hole (302).
3. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the spring (4) is multilayer wave
Shape spring.
4. the IGBT mould group according to claim 3 with radiator structure, which is characterized in that the IGBT mounting groove (301)
Slot bottom be formed with spring positioning slot (303), one end of the multi-layer corrugated spring inserts in the spring positioning slot.
5. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the radiator (1) is cold forging
Radiator.
6. the IGBT mould group according to claim 5 with radiator structure, which is characterized in that the side of the radiator (1)
It is provided with several thermal columns (101).
7. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the plastic protection casing (3) with
The radiator (1) passes through screw (5) locking connection.
8. the IGBT mould group according to claim 1 with radiator structure, which is characterized in that the plastic protection casing (3) with
The radiator (1) snaps connection.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822101214.4U CN209487491U (en) | 2018-12-14 | 2018-12-14 | A kind of IGBT mould group with radiator structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201822101214.4U CN209487491U (en) | 2018-12-14 | 2018-12-14 | A kind of IGBT mould group with radiator structure |
Publications (1)
Publication Number | Publication Date |
---|---|
CN209487491U true CN209487491U (en) | 2019-10-11 |
Family
ID=68127534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201822101214.4U Active CN209487491U (en) | 2018-12-14 | 2018-12-14 | A kind of IGBT mould group with radiator structure |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN209487491U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112423530A (en) * | 2020-11-02 | 2021-02-26 | 珠海格力电器股份有限公司 | Fixing device of switch tube and switch tube assembly |
-
2018
- 2018-12-14 CN CN201822101214.4U patent/CN209487491U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112423530A (en) * | 2020-11-02 | 2021-02-26 | 珠海格力电器股份有限公司 | Fixing device of switch tube and switch tube assembly |
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