CN209448994U - power module - Google Patents

Abstract

The application relates to a power module, which comprises a circuit board, at least one first heating component and at least one second heating component. The circuit board comprises a first side and a second side which are opposite to each other, and is provided with at least one first plane and at least one second plane which are arranged on the first side, and the at least one first plane and the at least one second plane have a first height difference. The at least one first heating element and the at least one second heating element are respectively arranged on the at least one first plane and the at least one second plane, and the at least one first heating element and the at least one second heating element are respectively provided with a first contact surface and a second contact surface. The at least one first contact surface and the at least one second contact surface are located on a first common plane of the power module.

Description

power module

technical field

The application relates to a power module, in particular to a power module with an optimized circuit board.

Background technique

Onboard high-power DC/DC power modules are widely used in fields such as telephone communications, data centers, and supercomputers. However, with the rapid development of fixed network and mobile communications, the requirements for the output power and efficiency of onboard high-power DC/DC power supply modules are getting higher and higher. On the other hand, with the trend of miniaturization of communication products, it is necessary to increase the efficiency of the power module used and reduce the volume at the same time, so as to increase the power density. Therefore, the heat dissipation problem of the onboard high-power DC/DC power module under high power density is becoming more and more serious, and its design for heat dissipation is also becoming more and more complicated.

The traditional board-mounted high-power DC/DC power supply module is welded together with the system board through pins, and at least one heating component in the module power supply is arranged on the circuit board of the power module, and the heat of the heating component can be passed through, for example, a heat sink sheet to conduct heat. However, when two heating components of different heights are arranged on the circuit board, in order to allow the heat sink to dissipate heat corresponding to the two heating components of different heights, the bottom surface of the heat sink needs to be made according to the height of the two heating components. Bump treatment. This will result in a longer design cycle for the heat sink and increase the complexity of the manufacturing process.

Therefore, how to develop a power module to solve the problems faced by the prior art is an urgent task in this field.

Utility model content

The purpose of the utility model is to provide a power module. By optimizing the circuit board to carry heat-generating components of different heights, a uniform co-plane is formed to facilitate the assembly and fixation of a heat sink, which reduces the design complexity of the heat sink, solves the heat dissipation assembly structure of DC/DC power modules, and at the same time enhances its heat dissipation and increase overall power density.

Another object of the present invention is to provide a power module. By flattening multiple contact surfaces of the power module on a common plane, the process of assembling and fixing the power module to the heat sink and system board is simplified, thereby achieving the goals of saving labor, reducing production costs and improving the reliability of the assembled structure.

Another object of the present utility model is to provide a power module. By flattening the multiple contact surfaces of the power module and the metal contact surfaces of the metal devices on the same plane, in addition to simplifying the process of assembling and fixing the power module to the heat sink and the system board, It also helps to increase the compressive capacity and support capacity of the power module. Effectively reduce the size of the heat dissipation device in the overall assembly structure, enhance its heat dissipation capability, and then achieve the purpose of improving the overall power density. In addition, through the encapsulation of the plastic sealing layer, the tolerance of the total height of the power module in mass production can be further effectively reduced, and the convenience of assembling the power module can be enhanced.

To achieve the aforementioned purpose, the utility model provides a power supply module, which includes a circuit board, at least one first heating component and at least one second heating component. The circuit board includes a first side and a second side opposite to each other, and has at least one first plane and at least one second plane, both of which are arranged on the first side, and at least the first plane and at least one second plane have a first A height difference. At least one first heating component and at least one second heating component are respectively arranged on at least one first plane and at least one second plane, and at least one first heating component and at least one second heating component have a first The contact surface and a second contact surface. Wherein at least one first contact surface and at least one second contact surface are located on a first co-plane of the power module.

In one embodiment, the power module further includes a heat sink, which has a heat dissipation surface and is constructed on the first common plane, and the heat dissipation surface is bonded to at least one first contact surface and at least one second contact surface.

In one embodiment, at least one first heating component and at least one second heating component are selected from the group consisting of a magnetic component, a switch component, a transformer and combinations thereof.

In one embodiment, the distance between the at least one first plane and the first co-plane is greater than the distance between the at least one second plane and the first co-plane, and the magnetic component is disposed on the at least one first plane.

In one embodiment, the circuit board includes at least one conductive portion disposed between at least one first plane and the first heating element, wherein the distance between the at least one first plane and the first co-plane is greater than that of the at least one second plane. The distance of the plane from the first co-plane.

In one embodiment, at least one conducting portion includes a conductive glue or a solder.

In one embodiment, the power module includes a metal device disposed on the first side and electrically connected to the circuit board, wherein the metal device has a first metal contact surface located on a first co-plane of the power module.

In one embodiment, the metal device further includes a second metal contact surface located on a side wall of the power module.

In one embodiment, the power module further includes a plastic sealing layer, which is disposed on the first side of the circuit board, covers at least one first heating element, at least one second heating element and the metal device, and exposes at least one first heating element. One or more of a contact surface, at least one second contact surface, a first metal contact surface, and a second metal contact surface.

In one embodiment, the plastic encapsulation layer is polished to form a first coplanar surface, and one or more of at least one first contact surface, at least one second contact surface, first metal contact surface, and second metal contact surface are exposed. indivual.

In one embodiment, the power module further includes at least one lead member disposed on the second side of the circuit board, wherein the at least one lead member is selected from the group consisting of a pin, a copper block pin, and a copper block .

In one embodiment, the circuit board is a multi-layer circuit board having multiple intermediate layers, and at least one first plane is disposed on at least one of the multiple intermediate layers.

To achieve the aforementioned purpose, the utility model also provides a power module, which includes a circuit board, at least one first heating component, at least a second heating component, at least one third heating component and at least one fourth heating component . The circuit board includes a first side and a second side. The first side and the second side are opposite to each other. Wherein the circuit board has at least one first plane, at least one second plane, at least one third plane and at least one fourth plane, wherein at least one first plane and at least one second plane are both arranged on the first side, and at least one The first plane and at least one second plane have a first height difference, wherein at least one third plane and at least one fourth plane are both disposed on the second side, and at least one third plane and at least one fourth plane have a first height difference Two height differences. At least one first heating component and at least one second heating component are respectively arranged on at least one first plane and at least one second plane, and at least one first heating component and at least one second heating component have at least one A first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are located on a first co-plane of the power module. At least one third heating component and at least one fourth heating component are respectively arranged on at least one third plane and at least one fourth plane, and at least one third heating component and at least one fourth heating component have at least A third contact surface and at least one fourth contact surface, wherein the at least one third contact surface and the at least one fourth contact surface are a second coplanar surface of the power module.

In one embodiment, the power module further includes at least one heat sink, which has a heat dissipation surface and is constructed on the first co-plane or the second co-plane, and the heat dissipation surface is bonded to at least one first contact surface and at least one first contact surface. The two contact surfaces are attached to at least one third contact surface and at least one fourth contact surface.

In one embodiment, the first co-plane or the second plane is attached to a system board.

In one embodiment, the distance between at least one first plane and the first co-plane is greater than the distance between at least one second plane and the first co-plane, and the distance between at least one third plane and the second co-plane is greater than at least one fourth plane Distance from the second co-planar, the circuit board includes at least two openings, running through between the first plane and the third plane, wherein the first heating element and the second heating element respectively include a first magnetic core and a first The two magnetic cores are connected to each other through at least two openings.

In one embodiment, at least one first heating component and at least one second heating component are selected from the group consisting of a magnetic component, a switch component, a transformer or a combination thereof, and the at least one third heating component And at least one fourth heating element is selected from the group consisting of a magnetic component, a switch component or a combination thereof.

In one embodiment, the power module includes at least one metal device, which is arranged on the first side or/and the second side, and is electrically connected to the circuit board, wherein at least one metal device has a first metal contact surface, located on the power module The first co-planar or/and the second co-planar.

In one embodiment, the at least one metal device further includes a second metal contact surface located on a side wall of the power module.

In one embodiment, the at least one metal device further includes a third metal contact surface located on the other sidewall of the power module.

In one embodiment, the power module further includes a plastic sealing layer, which is arranged on the first side or/and the second side of the circuit board, covering at least one metal device, at least one first heating element and at least one second heating element Components or/and at least one third heating component and at least one fourth heating component, and expose at least one first contact surface, at least one second contact surface, at least one third contact surface, at least one fourth contact surface , one or more of the second metal contact surface and the third metal contact surface.

In one embodiment, the plastic sealing layer is polished to form the first coplanar surface and/or the second coplanar surface, and expose at least one first contact surface, at least one second contact surface, at least one third contact surface, at least one One or more of the fourth contact surface, the second metal contact surface and the third metal contact surface.

In one embodiment, the power module further includes a plastic sealing layer, which is arranged on the first side or/and the second side of the circuit board, covering at least one first heating element and at least one second heating element or/and At least one third heating component and at least one fourth heating component, and expose one or more of at least one first contact surface, at least one second contact surface, at least one third contact surface, at least one fourth contact surface indivual.

In one embodiment, the plastic sealing layer is polished to form the first coplanar surface and/or the second coplanar surface, and expose at least one first contact surface, at least one second contact surface, at least one third contact surface, at least one One or more of the fourth contact surfaces.

In one embodiment, the circuit board is a multi-layer circuit board, which has a plurality of intermediate layers, and at least one first plane and at least one third plane are disposed on at least one of the plurality of intermediate layers.

Description of drawings

FIG. 1 is an exploded view showing the structure of the power module and its applicable heat sink and system board according to the first preferred embodiment of the present invention.

FIG. 2 is a cross-sectional structural view of the power module and its applicable heat sink and system board according to the first preferred embodiment of the present invention.

FIG. 3 is a three-dimensional structure diagram of a power module showing a first preferred embodiment of the present invention.

FIG. 4 is an exploded view showing the structure of the power module and its applicable heat sink and system board according to the second preferred embodiment of the present invention.

FIG. 5 is a cross-sectional structure diagram of a power module and its applicable heat sink and system board according to a second preferred embodiment of the present invention.

FIG. 6 is a cross-sectional structure diagram of a power module and its applicable heat sink and system board according to a third preferred embodiment of the present invention.

7 is an exploded view showing the structure of the power module and its applicable heat sink and system board according to the fourth preferred embodiment of the present invention.

FIG. 8 is an exploded view showing the structure of the power module and its applicable heat sink and system board in another perspective according to the fourth preferred embodiment of the present invention.

FIG. 9 is a cross-sectional structure diagram of a power module and its applicable heat sink and system board according to a fourth preferred embodiment of the present invention.

FIG. 10 is a three-dimensional structure diagram of a power module showing a fourth preferred embodiment of the present invention.

FIG. 11 is a three-dimensional structural view showing the power module of the fourth preferred embodiment of the present invention from another perspective.

Fig. 12 is an exploded view showing the structure of the power module according to the fifth preferred embodiment of the present invention.

FIG. 13 is a cross-sectional view of a power module showing a fifth preferred embodiment of the present invention.

FIG. 14 is a cross-sectional view of a power module showing a sixth preferred embodiment of the present invention.

Explanation of reference signs:

1, 1a, 1b, 1c, 1d, 1e: power module

10: circuit board

11: First side

111: First plane

112: second plane

12: Second side

13: Leading part

14: blind hole

15: opening

16, 17: side wall

121: Third Plane

122: Fourth Plane

20: The first heating element

21: First contact surface

30: Second heating element

31: Second contact surface

41, 42, 43: Leading parts

50: The third heating element

51: The fourth contact surface

60: The fourth heating element

61: The fourth contact surface

70, 75: metal parts

71, 76: first metal contact surface

77: Second metal contact surface

78: The third metal contact surface

79: Plastic layer

8: heat sink

80: Plastic layer

81: cooling surface

9: System board

91: surface

H1: first height difference

H2: second height difference

S1: first coplanar

S2: second coplanar

Detailed ways

Some typical embodiments embodying the features and advantages of the utility model will be described in detail in the description of the following paragraphs. It should be understood that the utility model can have various changes in different schemes without departing from the scope of the utility model, and the description and drawings therein are used as illustrations in essence, rather than for limiting the utility model. utility model.

FIG. 1 is an exploded view showing the structure of the power module and its applicable heat sink and system board according to the first preferred embodiment of the present invention. FIG. 2 is a cross-sectional structural view of the power module and its applicable heat sink and system board according to the first preferred embodiment of the present invention. Fig. 3 is a three-dimensional structure diagram showing the power module in the first preferred embodiment of the present invention. First of all, as shown in Fig. 1, Fig. 2 and Fig. 3, the power module 1 of the present utility model (hereinafter referred to as the power module) can be, for example, a DC/DC power module, including a circuit board 10 and at least one first heating element 20 and at least one second heating element 30 . The circuit board 10 includes a first side 11 and a second side 12 , the first side 11 and the second side 12 are opposite to each other. The circuit board 10 further has at least one first plane 111 and at least one second plane 112 , both of which are disposed on the first side 11 , and at least the first plane 111 and the second plane 112 have at least a first height difference H1 . In this embodiment, the at least one first heating component 20 and the at least one second heating component 30 can be, for example, a magnetic component and a switch component, respectively. Wherein the first heating element 20 can also be, for example, a thicker magnetic assembly, which is arranged on the first plane 111, and the second heating element 30 can be, for example, a thinner switch assembly, which is arranged on the second plane 111. Plane 112. In other words, the thickness of the first heating element 20 is greater than the thickness of the second heating element 30 . Of course, the utility model is not limited thereto. In this embodiment, the first heating element 20 has a first contact surface 21 , and the second heating element 30 has a second contact surface 31 . After the first heating element 20 is attached to the first plane 111 and the second heating element 30 is attached to the second plane 112, the first contact surface 21 and the second contact surface 31 are also structured as a power module 1 A first co-plane S1 is the hatched area as shown in FIG. 3 . In this way, the first co-plane S1 of the power module 1 is conducive to assembly and fixing to a heat sink 8, so that the first contact surface 21 of the first heating component 20 and the second contact surface 31 of the second heating component 30 are fully in contact with each other. Closed to the heat dissipation surface 81 of the heat dissipation fin 8 to achieve the best heat dissipation effect. On the other hand, the first co-plane S1 is a uniform plane, which is suitable for the heat dissipation surface 81 with a planar design, which can effectively reduce the design complexity of the heat sink 8 required by the power module 1, and solve the problem of, for example, the DC/DC power module. The heat dissipation assembly structure also enhances its heat dissipation capability and improves the overall power density. Of course, the method of attaching the heat sink 8 to the first co-plane S1 of the power module 1 is not limited, and it can also be bonded by a high heat transfer medium material such as a heat conduction sheet, heat conduction glue or heat conduction paste, and the present invention is not limited thereto. , and will not go into details.

In this embodiment, the power module 1 further includes at least one conductive member 41 , which is, for example, two sets of pins, disposed on the second side 12 of the power module 1 . The power module 1 can be connected to a system board 9 by means of, for example, but not limited to, soldering, through a conductor such as two sets of pins. In other embodiments, the power module 1 can also be connected to the system board 9 through copper pins or copper blocks, and the present invention is not limited thereto.

FIG. 4 is an exploded view showing the structure of the power module and its applicable heat sink and system board according to the second preferred embodiment of the present invention. FIG. 5 is a cross-sectional structure diagram of a power module and its applicable heat sink and system board according to a second preferred embodiment of the present invention. In this embodiment, the power module 1a is similar to the power module 1 shown in FIG. 1 to FIG. 3 , and the same component numbers represent the same components, structures and functions, which will not be repeated here. Different from the power module 1 shown in FIGS. 1 to 3 , the circuit board 10 of the power module 1a of this embodiment further includes at least one conducting portion 13 , which is arranged between the first plane 111 and the first heating element 20 . Wherein the conducting portion 13 may be, for example but not limited to, a pin connected by conductive glue or solder, and the first heating element 20 disposed on the first plane 111 may also be, for example, a switch assembly, a transformer, an inductor Components, etc., which need to be directly electrically connected to the circuit board 10 . Of course, the number, position, type, shape and size of the connecting portion 13 can be adjusted/changed according to actual application requirements, so that the soldering pins of the first heating element 20 on the first plane 111 can be directly connected to each other with the shortest distance. connected to the circuit board 10, but the utility model is not limited thereto. In this embodiment, the circuit board 10 can be, for example, a printed circuit board with multi-layer circuits, which includes, for example, N circuit layers. The second plane 112 can be, for example, the outermost layer of the circuit board 10 , and the first plane 111 can be arranged on the uppermost layer of the circuit board 10 from one layer down to the N−1 layer depending on actual application requirements. It should be noted that the first plane 111 can be recessed in any middle layer of the circuit board 10 according to actual application requirements, so as to form a first height difference H1 with the second plane 112, so as to set a thicker first plane 111. Heating components 20. In this embodiment, the size of the first plane 111 is at least greater than or equal to the size of the first heating element 20 . Of course, the area, shape and size of the first plane 111 can be adjusted/changed according to the area, shape and size of the first heating element 20 that needs to be actually accommodated, and the present invention is not limited thereto, and will not be repeated here. .

On the other hand, in this example, the power module 1 a is also surface-mount-soldered to the system board 9 through a set of at least two copper blocks 42 , for example. One end of the lead member 42 is elongated and can be inserted into the blind hole 14 on the second side 12 of the circuit board 10 and fixed by welding. The other end of the lead 42 can be soldered to the surface of the system board 9 . FIG. 6 is a cross-sectional structure diagram of a power module and its applicable heat sink and system board according to a third preferred embodiment of the present invention. In this embodiment, the power module 1b is also surface-mount-soldered to the system board 9 through a set of at least two copper blocks 43 , for example. The lead 43 can be, for example, a copper block, and two ends thereof are connected to the second side 12 of the circuit board 10 and the surface of the system board 9 by surface mount soldering, respectively. It should be emphasized that the way the power modules 1 and 1a of the present invention are fixed on the system board 9 can be adjusted/changed depending on actual application requirements, and the present invention is not limited thereto, and will not be repeated here.

7 is an exploded view showing the structure of the power module and its applicable heat sink and system board according to the fourth preferred embodiment of the present invention. FIG. 8 is an exploded view showing the structure of the power module and its applicable heat sink and system board in another perspective according to the fourth preferred embodiment of the present invention. FIG. 9 is a cross-sectional structure diagram of a power module and its applicable heat sink and system board according to a fourth preferred embodiment of the present invention. FIG. 10 is a three-dimensional structure diagram of a power module showing a fourth preferred embodiment of the present invention. FIG. 11 is a three-dimensional structural view showing the power module of the fourth preferred embodiment of the present invention from another perspective. In this embodiment, the power module 1c is similar to the power module 1 shown in FIG. 1 to FIG. 3 , and the same component numbers represent the same components, structures and functions, which will not be repeated here. The power module 1c different from that shown in FIGS. Heating components 60. The circuit board 10 includes a first side 11 and a second side 12 . The first side 11 and the second side 12 are opposite to each other. The circuit board 10 has at least one first plane 111 , at least one second plane 112 , at least one third plane 121 and at least one fourth plane 122 . Wherein at least one first plane 111 and at least one second plane 112 are both disposed on the first side 11 , and at least the first plane 111 and the second plane 112 have at least one first height difference H1. Moreover, at least one third plane 121 and at least one fourth plane 122 are both disposed on the second side 12 , and at least the third plane 121 and the fourth plane 122 have at least one second height difference H2. The first height difference H1 and the second height difference H2 are not limited to be the same height difference. In addition, the first plane 111 and the third plane 121 can be aligned up and down to overlap each other, interlaced without overlapping, or randomly arranged, and the present invention is not limited thereto. In this example, at least one first heating element 20 and at least one second heating element 30 are respectively arranged on the first plane 111 and the second plane 112, and at least one first heating element 20 and at least one second The heating components 30 respectively have at least one first contact surface 21 and at least one second contact surface 31, wherein the at least one first contact surface 21 and at least one second contact surface 31 also constitute a first coplanar surface of the power module 1c S1, that is, the hatched area as shown in Figure 10. On the other hand, at least one third heating component 50 and at least one fourth heating component 60 are arranged on the third plane 121 and the fourth plane 122 respectively, and at least one third heating component 50 and at least one fourth heating component The components 60 respectively have at least one third contact surface 51 and at least one fourth contact surface 61, wherein the at least one third contact surface 51 and at least one fourth contact surface 61 also constitute a second co-plane S2 of the power module 1c , that is, the hatched area as shown in Figure 11. Thereby, the first side 11 and the second side 12 of the power module 1c respectively have a first co-plane S1 and a second co-plane S2, which can be connected between the first contact surface 21 of the first heating element 20 and the second heating element. The second contact surface 31 of the device 30 is fully attached to the heat dissipation surface 81 of the heat sink 8 to achieve the best heat dissipation effect, and at the same time, the third contact surface 51 of the third heating element 50 and the fourth The contact surface 61 can also be adhered to the surface 91 of the system board 9 to reduce the difficulty of the overall system design. In other words, when the power module 1c of the present invention is applied to, for example, a DC/DC power module, in addition to enabling the power module 1c to be assembled between the heat sink 8 and the system board 9, it can also realize the heat dissipation function and effectively improve the overall power density. . In other embodiments, the first co-plane S1 and the second co-plane S2 of the power module 1 c can also be respectively assembled to two sets of heat sinks 8 or two sets of system boards 9 . It is worth noting that the type or quantity of the first co-plane S1 and the second co-plane S2 of the power module 1c connected to the heat sink 8 or the system board 9 does not limit the essential technical features of the present invention, and will not be repeated here.

Fig. 12 is an exploded view showing the structure of the power module according to the fifth preferred embodiment of the present invention. FIG. 13 is a cross-sectional view of a power module showing a fifth preferred embodiment of the present invention. In this embodiment, the power module 1d is similar to the power module 1c shown in FIG. 7 to FIG. 11 , and the same component numbers represent the same components, structures and functions, which will not be repeated here. In this embodiment, at least one first plane 111 and at least one second plane 112 are both disposed on the first side 11 , and at least the first plane 111 and the second plane 112 have at least one first height difference H1. Moreover, at least one third plane 121 and at least one fourth plane 122 are both disposed on the second side 12 , and at least the third plane 121 and the fourth plane 122 have at least one second height difference H2. Different from the power module 1c shown in FIG. 7 to FIG. 11, in this embodiment, the power module 1d further includes at least two openings 15, which are arranged on the circuit board 10 and pass through between the first plane 111 and the third plane 121. Between them, the first heating element 20 and the third heating element 50 respectively include a first magnetic core and a second magnetic core, which are connected to each other through the at least two openings 15, and fasten on the circuit board 10 such as a plane A transformer is constructed after the winding (not shown). The second heating element 30 on the first side 11 can be, for example, a single-side cooling MOSFET or a double-side cooling MOSFET, which is attached to the second plane 112 of the circuit board 10 . Although the first heating component 20 such as the first magnetic core has different thicknesses from the second heating component 30 such as MOSFET, the first contact of the first heating component 20 can be made The surface 21 and the second contact surface 31 of the second heating element 30 are structured as a first co-plane S1. At this time, the heat generated by the second heating component 30 such as MOSFET can not only dissipate through the circuit board 10 , but also can be quickly conducted out through the heat dissipation surface 81 of the heat dissipation fin 8 .

On the other hand, in this embodiment, the power module 1d further includes a metal device 70 , such as a metal copper strip, which is disposed on the second plane 112 of the first side 11 . Wherein the thickness of the metal device 70 is the same as that of the second heating element 30 such as a switching device, that is, the metal device 70 also includes a first metal contact surface 71, which is also constructed on the first coplanar surface of the first side 11 S1. The metal device 70 can be fixed on the second plane 112 of the circuit board 10 by surface mount welding or adhesive. A first metal contact surface 71 of the metal device 70 is located in a first co-plane S1 with the first contact surface 21 and the second contact surface 31 . In this embodiment, when the heat sink 8 is bonded to the first co-plane S1, the good heat dissipation properties of the metal device 70 will further help to increase the heat dissipation capability of the power module 1d. In addition, adding a metal device 70 such as a metal copper strip can also increase the compression resistance and supporting capacity of the power module 1d.

In addition, in this embodiment, a metal device 75 such as a lead frame can also be disposed on the second side 12 of the circuit board 10 . The metal device 75 has a first metal contact surface 76, which is in contact with the third contact surface 51 of the third heating element 50 such as the second magnetic core and the fourth contact of the fourth heating element 60 such as other switch components. The surfaces 61 are co-structured on the second co-plane S2. In this embodiment, for example, the metal device 75 also has a second metal contact surface 77 and a third metal contact surface 78, which are respectively constructed on the side wall 16 and the other side wall 17 of the power module 1d, and can be further electroplated and tinned , for electrical connection. The good structural properties of the metal device 75 and the flat structure on the second co-plane S2 will further help to improve the integration of the power module 1d connected to the system board 9 and help simplify the connection procedure. In addition, adding a metal device 75 such as a lead frame can also increase the compression resistance and supporting capacity of the power module 1d.

FIG. 14 is a cross-sectional view of a power module showing a sixth preferred embodiment of the present invention. In this embodiment, the power module 1e is similar to the power module 1d shown in FIG. 12 to FIG. 13 , and the same component numbers represent the same components, structures and functions, which will not be repeated here. In one embodiment, the power module 1e further includes at least one plastic sealing layer 79, which is disposed on the first side 11 of the circuit board 10, covering the at least one first heating element 20, at least one second heating element 30, At least one metal device 70 , and one or more of at least one first contact surface 21 , at least one second contact surface 31 , and at least one first metal contact surface 71 are exposed. In another embodiment, the power module 1e further includes another plastic sealing layer 80 disposed on the second side 12 of the circuit board 10 to cover the at least one third heating element 50 and the at least one fourth heating element 60 With at least one metal device 75, and expose at least one fourth contact surface 61 and the first metal contact surface 76/second metal contact surface 77/third metal contact surface 78, or expose at least the third contact surface 51, at least one first metal contact surface Four contact surfaces 61 and the first metal contact surface 76 /second metal contact surface 77 /first metal contact surface 78 . It is worth noting that the plastic sealing layers 79 and 80 can use EMC-Epoxy Molding Compound (EMC-Epoxy Molding Compound) to package the power module 1e as a whole, and at least one first contact surface 21, at least one second contact surface 31 and The first metal contact surface 71 is structured as a flat first co-plane S1, at least one third contact surface 51, at least one fourth contact surface 61 and the first metal contact surface 76 are structured as a flat second co-plane S2 , realizing a flat structure of the power module 11e is beneficial to reducing design complexity of the heat sink 8 and the system board 9 and improving power density. In one embodiment, the first co-planar S1 and the second co-planar S2 can also be formed after being encapsulated in EMC-Epoxy Molding Compound (EMC-Epoxy Molding Compound) by means of, for example, grinding, by grinding the plastic encapsulation layer 79 to form the first coplanar, exposing one or more of at least one first contact surface 21 and the first metal contact surface 71 . Alternatively, the second coplanar surface is formed by grinding the plastic sealing layer 80, exposing at least one fourth contact surface 61 and the first metal contact surface 76/second metal contact surface 77, or exposing at least the third contact surface 51 and at least one fourth contact surface. Surface 61 and first metal contact surface 76/second metal contact surface 77/third metal contact surface 78. In the above polishing process, you can choose to only polish the first co-plane of the plastic seal layer 79, or you can choose to polish only the second co-plane of the plastic seal layer 80, and then polish the first co-plane and the second co-plane together to expose the above-mentioned the contact surface. In other embodiments, the plastic encapsulation layer 79 may only be formed on the first side 11 or the second side 12 of the circuit board 10 . For example, the plastic encapsulation layer 79 may only be formed on the second side 12 of the circuit board 10 of the power module 1 a in FIG. 5 , selectively exposing the conductive elements 42 , and the present invention is not limited thereto. It should be emphasized that the contact surfaces of some devices exposed by grinding the plastic sealing layer 79 and the plastic sealing layer 80 after plastic sealing will further effectively reduce the tolerance of the total height of the power module in mass production, and enhance the connection with the heat sink 8 or the system. The convenience of board 9 assembly.

Taking the power module 1e as an example, in large-scale production, when multiple power modules 1e need to be packaged at the same time, multiple independent power modules 1e can be placed in the plastic cavity and packaged independently to form the power module 1e. In another embodiment, printed circuit boards can be used to assemble corresponding heating components to form a plurality of connected power modules 1e, and the entire connected power modules 1e are placed in a plastic cavity for packaging , packaged and then divided into a plurality of independent power modules 1e by means of cutting. While cutting, the second metal contact surface 77 or the third metal contact surface 78 of the metal device 75 is exposed, which can also be exposed after grinding, and the two contact surfaces can be further electroplated with tin for electrical connection. . The utility model is not limited thereto.

In addition, when the power module 1e is packaged on the plastic sealing layer 79, in order to avoid the phenomenon of secondary remelting of the solder joints on the circuit board 10 during the packaging process, conductive adhesive can be used instead of solder to paste these discrete heating elements. The components are placed on the circuit board 10, and the conductive adhesive can be cured and formed after being baked at a certain temperature. Thereby, when the power module 1e is plastic-encapsulated, secondary remelting will not occur. In other embodiments, the heat-generating components separated on the circuit board 10 may include a pin coated with AgPdCu, so as to effectively prevent the pin from being easily oxidized after the conductive glue is applied. However, it does not limit the essential technical features of the present invention, so it will not be repeated here.

To sum up, the utility model provides a power module. By optimizing the circuit board to carry heat-generating components of different heights, a uniform co-plane is formed to facilitate the assembly and fixation of a heat sink, which reduces the design complexity of the heat sink, solves the heat dissipation assembly structure of DC/DC power modules, and at the same time enhances its heat dissipation and increase overall power density. By flattening multiple contact surfaces of the power module on a common plane, the process of assembling and fixing the power module to the heat sink and system board is simplified, thereby achieving the goals of saving labor, reducing production costs and improving the reliability of the assembled structure. In addition, by flattening the multiple contact surfaces of the power module and the metal contact surfaces of the metal devices on the same plane, in addition to simplifying the process of assembling and fixing the power module to the heat sink and system board, it also helps to increase the pressure resistance of the power module and support capacity. Effectively reduce the size of the heat dissipation device in the overall assembly structure, enhance its heat dissipation capability, and then achieve the purpose of improving the overall power density. In addition, through the encapsulation of the plastic sealing layer, the tolerance of the total height of the power module in mass production can be further effectively reduced, and the convenience of assembling the power module can be enhanced.

The utility model can be modified variously by those skilled in the art, but none of them departs from the scope of protection of the appended claims.

Claims (25)

1. A power module, characterized in that the power module comprises: A circuit board, including a first side and a second side, the first side and the second side are opposite to each other, wherein the circuit board has at least one first plane and at least one second plane, both of which are arranged on the first side, and the at least first plane and the at least one second plane have a first height difference; and At least one first heating element and at least one second heating element are respectively arranged on the at least one first plane and the at least one second plane, and the at least one first heating element and the at least one second heating element The devices respectively have at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are located on a first co-plane of the power module. 2. The power module according to claim 1, characterized in that, the power module further comprises: a heat sink having a heat dissipation surface constructed on the first common plane, and the heat dissipation surface is bonded to the at least one The first contact surface and the at least one second contact surface. 3. The power module according to claim 1, wherein the at least one first heating element and at least one second heating element are selected from a magnetic component, a switch component, a transformer and combinations thereof group. 4. The power module according to claim 3, wherein the distance between the at least one first plane and the first co-plane is greater than the distance between the at least one second plane and the first co-plane, and the magnetic component set on the at least one first plane. 5. The power module according to claim 3, wherein the circuit board comprises at least one conducting portion, and the at least one conducting portion is disposed between the at least one first plane and the first heating element, Wherein the distance between the at least one first plane and the first co-plane is greater than the distance between the at least one second plane and the first co-plane. 6 . The power module according to claim 5 , wherein the at least one conducting portion comprises a conductive glue or a solder. 7. The power module according to claim 3, further comprising: a metal device disposed on the first side and electrically connected to the circuit board, wherein the metal device has a first metal contact The surface is located on the first co-plane of the power module. 8. The power module according to claim 7, wherein the metal device further comprises a second metal contact surface located on a side wall of the power module. 9. The power module according to claim 8, further comprising: a plastic sealing layer, disposed on the first side of the circuit board, covering the at least one first heating element, the at least one The second heating element and the metal device expose one or more of the at least one first contact surface, the at least one second contact surface, the first metal contact surface, and the second metal contact surface. 10. The power module according to claim 9, wherein the plastic encapsulation layer forms the first coplanar surface by grinding, and exposes the at least one first contact surface, the at least one second contact surface, the first contact surface, and the at least one second contact surface. One or more of a metal contact surface and the second metal contact surface. 11. The power module according to claim 1, further comprising: at least one lead member disposed on the second side of the circuit board, wherein the at least one lead member is selected from a pin, A group consisting of a copper block pin and a copper block. 12. The power module according to claim 1, wherein the circuit board is a multilayer circuit board, the multilayer circuit board has a plurality of intermediate layers, and the at least one first plane is disposed on the plurality of intermediate layers at least one of the 13. A power module, characterized in that the power module comprises: A circuit board, including a first side and a second side, the first side and the second side are opposite to each other, wherein the circuit board has at least one first plane, at least one second plane, at least one third plane and at least one fourth plane, wherein both the at least one first plane and the at least one second plane are disposed on the first side, and the at least one first plane and the at least one second plane have at least one first height difference, Wherein the at least one third plane and the at least one fourth plane are both disposed on the second side, and the at least one third plane and the at least one fourth plane have a second height difference; At least one first heating element and at least one second heating element are respectively arranged on the at least one first plane and the at least one second plane, and the at least one first heating element and the at least one second heating element The devices respectively have at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are located on a first coplanar plane of the power module; and At least one third heating element and at least one fourth heating element are respectively arranged on the at least one third plane and the at least one fourth plane, and the at least one third heating element and the at least one fourth heating element The device has at least one third contact surface and at least one fourth contact surface respectively, wherein the at least one third contact surface and the at least one fourth contact surface are a second coplanar surface of the power module. 14. The power module according to claim 13, further comprising: at least one heat sink, having a heat dissipation surface, constructed on the first co-plane or the second co-plane, and the heat dissipation surface Attached to the at least one first contact surface and the at least one second contact surface or adhered to the at least one third contact surface and the at least one fourth contact surface. 15. The power module of claim 13, wherein the first co-plane or the second co-plane is attached to a system board. 16. The power module according to claim 13, wherein the distance between the at least one first plane and the first co-plane is greater than the distance between the at least one second plane and the first co-plane, and the at least one first plane The distance between the three planes and the second co-plane is greater than the distance between the at least one fourth plane and the second co-plane, the circuit board includes at least two openings, the at least two openings pass through the first plane and the third plane Among them, the first heating element and the second heating element respectively include a first magnetic core and a second magnetic core, which are connected to each other through the at least two openings. 17. The power module according to claim 13, wherein the at least one first heating element and at least one second heating element are selected from a magnetic component, a switch component, a transformer or a combination thereof In the group, the at least one third heating component and the at least one fourth heating component are selected from a group formed by a magnetic component, a switch component or a combination thereof. 18. The power module according to claim 13, further comprising: at least one metal device disposed on the first side or/and the second side and electrically connected to the circuit board, wherein the At least one metal device has a first metal contact surface located on the first co-plane or/and the second co-plane of the power module. 19. The power module according to claim 18, wherein the at least one metal device further comprises a second metal contact surface, and the second metal contact surface is located on a side wall of the power module. 20. The power module according to claim 19, wherein the at least one metal device further comprises a third metal contact surface, and the third metal contact surface is located on the other side wall of the power module. 21. The power module according to claim 20, further comprising: a plastic sealing layer disposed on the first side or/and the second side of the circuit board to cover the at least one metal device , the at least one first heating component and the at least one second heating component or/and the at least one third heating component and the at least one fourth heating component, and expose the at least one first contact surface, the One or more of at least one second contact surface, the at least one third contact surface, the at least one fourth contact surface, the second metal contact surface and the third metal contact surface. 22. The power module according to claim 21, wherein the plastic encapsulation layer forms the first coplanar surface and/or the second coplanar surface by grinding, and exposes the at least one first contact surface, the at least one One or more of a second contact surface, the at least one third contact surface, the at least one fourth contact surface, the second metal contact surface, and the third metal contact surface. 23. The power module according to claim 13, further comprising: a plastic sealing layer disposed on the first side or/and the second side of the circuit board, covering the at least one first The heating element and the at least one second heating element or/and the at least one third heating element and the at least one fourth heating element, exposing the at least one first contact surface and the at least one second contact surface , one or more of the at least one third contact surface, and the at least one fourth contact surface. 24. The power module according to claim 23, wherein the plastic encapsulation layer forms the first coplanar surface and/or the second coplanar surface by grinding, and exposes the at least one first contact surface, the at least one One or more of a second contact surface, the at least one third contact surface, and the at least one fourth contact surface. 25. The power module according to claim 13, wherein the circuit board is a multilayer circuit board, the multilayer circuit board has a plurality of intermediate layers, the at least one first plane and the at least one third plane disposed on at least one of the plurality of intermediate layers.