CN209161922U - A kind of red white glue band of diode of composite base material - Google Patents

Abstract

The utility model discloses a kind of red white glue bands of the diode of composite base material, belong to printing technology, including substrate layer, Micron Technology's paper and compound adhesive, substrate layer is polyester film, it is coated with primer on the downside of substrate layer and applies the face glue being located on the downside of primer, face glue is pressure sensitive adhesive, and substrate layer is 12.5 μm of -50 μm of polyester films, and Micron Technology's paper is 40g-100g/m²Red, white or other colors Micron Technology's paper, rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive or the laminated adhesive that compound adhesive is 5 μm -30 μm, the silane coupling agent that primer is 1 μm -5 μm, face glue are 20 μm of -30 μm of high-temperature resistant rubber type pressure sensitive adhesives or organic silicon type pressure sensitive adhesive.The utility model is combined into substrate using Hong Bai Micron Technology paper and polyester film, is then coated with high-temperature resistant rubber type or organic silicon type pressure sensitive adhesive, improves peeling force and high temperature resistance, and reduce consumptive material, saves cost.

Description

A kind of red white glue band of diode of composite base material

Technical field

The utility model relates to a kind of red white glue band, the red white glue band of especially a kind of diode of composite base material belongs to Tape technology field.

Background technique

Diode is as one of most common electronic component, its maximum characteristic is exactly unilateral conduction, and electric current may only It is flowed from a direction of diode, mainly plays pressure stabilizing rectified action, be widely used in various household electrical appliances, PC, communication, automobile electricity The various industries such as son, due to its unilateral conduction, so positive and negative anodes mark must define very much.

The diode of existing automatic braid all pastes diode positive and negative anodes with a kind of a kind of red and white tape respectively, Such adhesive tape is thus referred to as the red white glue band of diode, and existing diode is to use 85g/m with red white glue band²Red and white beauty Machine-glazed paper is substrate, backside coating non-silicon mould release, front surface coated high temperature resistant type rubber pressure sensitive or organic pressure-sensitive gel, due to Micron Technology Paper surface irregularity, face glue coating weight need to be in 50g/m²More than, and the back side must apply mould release, it is big to materials demand.

A kind of red white glue band of the diode of composite base material is needed now, can be improved peeling force and high temperature resistance, and It can reduce consumptive material, save cost.

Utility model content

The main purpose of the utility model is to provide for a kind of red white glue band of diode of composite base material, using red white Micron Technology's paper and polyester film are combined into substrate, are then coated with high-temperature resistant rubber type or organic silicon type pressure sensitive adhesive, improve peeling force and High temperature resistance, and consumptive material is reduced, save cost.

The purpose of this utility model can reach by using following technical solution:

The red white glue band of a kind of diode of composite base material, including substrate layer, the Micron Technology's paper being compounded on the substrate layer And the compound adhesive between Micron Technology's paper and the substrate layer is set, the substrate layer is polyester film, the substrate layer Downside be coated with primer and apply and be located at face glue on the downside of the primer, the face glue is pressure sensitive adhesive.

Preferably, the substrate layer be 12.5 μm of -50 μm of polyester films, the polyester film be polyacrylic film, Sealed polyethylene plastic or nylon plastic(s) film.

Preferably, Micron Technology's paper is 40g-100g/m²Red, white or other colors Micron Technology's paper.

Preferably, rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive or laminated adhesive that the compound adhesive is 5 μm -30 μm.

Preferably, the silane coupling agent that the primer is 1 μm -5 μm, the silane coupling agent are acrylic acid silane coupling agent or rubber-type primary coat Agent.

Preferably, the face glue is 20 μm of -30 μm of high-temperature resistant rubber type pressure sensitive adhesives or organic silicon type pressure sensitive adhesive, the face glue Peeling force >=8N/25mm.

Preferably, the surface of Micron Technology's paper has done the processing of painting fluorine or has applied silicon mould release on its surface layer.

The advantageous effects of the utility model:

1, the red white glue band of the diode of composite base material provided by the utility model, with existing single layer Micron Technology paper self-adhesive tape phase Than tensile strength is higher, it is ensured that adhesive tape will not be pulled off when working continuously, and due to being compounded with a strata ester film, tension is strong Du Genggao, and used Hong Bai Micron Technology paper grammes per square metre can reduce by 30% or more.

2, the red white glue band of the diode of composite base material provided by the utility model, with existing single layer Micron Technology paper self-adhesive tape phase Than, cost is lower, due to using Micron Technology's paper composite polyester film as substrate, face glue pressure sensitive adhesive be coated in polyester film it On, it is not in leakage, face glue coating weight can lack 30%-50%, and primer and polyester film bonding force are stronger.

3, the red white glue band of the diode of composite base material provided by the utility model, with existing single layer Micron Technology paper self-adhesive tape phase Than not having to carry out release processing at Micron Technology's paper back side, when adhesive tape uncoiling is not in fall glue phenomenon, and Hong Bai Micron Technology paper gram quantity can be with 30% or more is reduced,

4, the red white glue band of the diode of composite base material provided by the utility model, in summary several cost savings, multiple It is cost-saved by 20% or more to close the red white glue band of base diode white glue band redder than single layer Micron Technology paper.

5, the red white glue band of the diode of composite base material provided by the utility model, compound adhesive use rubber pressure sensitive glue, face Glue uses rubber pressure-sensitive adhesive, and overall cost is lower, and tensile capacity is high.

6, the red white glue band of the diode of composite base material provided by the utility model, compound adhesive use acrylate pressure sensitive adhesive, Face glue uses organic pressure-sensitive gel, and heatproof can reach 200 DEG C of half an hour, can be used for the higher diode braid of temperature.

Detailed description of the invention

Fig. 1 is the cross-sectional view according to the red white glue band of diode of the composite base material of the utility model；

Fig. 2 is the structural schematic diagram according to the red white glue band of diode of the composite base material of the utility model.

In figure: 1- Micron Technology paper, 2- compound adhesive, 3- substrate layer, 4- primer, the face 5- glue.

Specific embodiment

To make the more clear and clear the technical solution of the utility model of those skilled in the art, below with reference to embodiment and Figure of description is described in further detail the utility model, and however, the embodiments of the present invention are not limited thereto.

Embodiment 1:

As depicted in figs. 1 and 2, the diode of composite base material provided in this embodiment red white glue band, including substrate layer 3, the Micron Technology's paper 1 being compounded on substrate layer 3 and the compound adhesive 2 being arranged between Micron Technology's paper 1 and substrate layer 3, substrate layer 3 are poly- Ester, the downside of substrate layer 3 are coated with primer 4 and apply the face glue 5 for being located at 4 downside of primer, and face glue 5 is pressure sensitive adhesive, uses beauty 1 composite polyester film of machine-glazed paper is substrate, high-temperature resistant rubber type or organic silicon type pressure sensitive adhesive is coated, with existing single layer Micron Technology paper glue Band is compared, and tensile strength is higher, it is ensured that adhesive tape will not be pulled off when working continuously.

In the present embodiment, as depicted in figs. 1 and 2, substrate layer 3 is 12.5 μm of -50 μm of polyester films, and polyester film is poly- Acrylic plastic film, sealed polyethylene plastic or nylon plastic(s) film, due to being compounded with a strata ester film, tensile strength is more Height, and used Hong Bai Micron Technology paper grammes per square metre can reduce by 30% or more.

In the present embodiment, as depicted in figs. 1 and 2, Micron Technology's paper 1 is 40g-100g/m²Red, white or other face Micron Technology's paper of color pastes diode positive and negative anodes using red and white tape in the diode of automatic braid, convenient for distinguishing respectively.

In the present embodiment, as depicted in figs. 1 and 2, rubber pressure-sensitive adhesive, acrylic type of the compound adhesive 2 for 5 μm -30 μm Pressure sensitive adhesive or laminated adhesive.

In the present embodiment, as depicted in figs. 1 and 2, the silane coupling agent that primer 4 is 1 μm -5 μm, silane coupling agent are acrylic acid primary coat Agent or rubber-type silane coupling agent coat primer 4 on the inside of substrate layer 3 and avoid out in order to which glue-line ability is preferably combined with substrate Existing residue glue phenomenon.

In the present embodiment, as depicted in figs. 1 and 2, face glue 5 is 20 μm of -30 μm of high-temperature resistant rubber type pressure sensitive adhesives or organic Silicon type pressure sensitive adhesive, peeling force >=8N/25mm of face glue 5, pressure sensitive adhesive are coated on polyester film, are not in leakage, face 5 coating weight of glue can lack 30%-50%, and primer 4 and polyester film bonding force are stronger.

In the present embodiment, as depicted in figs. 1 and 2, the surface of Micron Technology's paper 1 has done the processing of painting fluorine or has applied silicon mould release in it On surface layer, keep apart face glue 5 with outermost Micron Technology's paper 1, adhesive tape uncoiling difficulty phenomenon is avoided the occurrence of, at 1 back side of Micron Technology's paper Without carrying out release processing, when adhesive tape uncoiling is not in fall glue phenomenon, and Hong Bai Micron Technology paper gram quantity can reduce by 30% or more.

Embodiment 2:

As depicted in figs. 1 and 2, the present embodiment 2 difference from example 1 is that: Micron Technology's paper 1 be 40g-100g/m² Red or white Micron Technology paper, compound adhesive 2 are 5 μm of -20 μm of rubber pressure sensitive glue, and substrate layer 3 is polyacrylic film, and primer 4 is Rubber-type silane coupling agent, face glue 5 are the rubber pressure-sensitive adhesive of 20 μm of -30 μ m-thick, this is the red white glue of rubber-type composite base material diode Band, advantage of lower cost, tensile capacity are stronger.

Embodiment 3:

As depicted in figs. 1 and 2, the present embodiment 3 and embodiment 1 and embodiment 2 the difference is that, Micron Technology's paper 1 is 40g-100g/m²Red or white Micron Technology paper, compound adhesive 2 are 5 μm of -20 μm of acrylate pressure sensitive adhesives, and substrate layer 3 is vinyon Film, primer 4 are acrylic acid silane coupling agent, and the organic silicon type pressure sensitive adhesive that face glue 5 is 20 μm -30 μm, this is organic silicon type composite base The red white diode adhesive tape of material, heatproof can reach 200 DEG C of half an hour, be mainly used for the higher diode braid of temperature.

To sum up, in the above-described embodiments, the red white glue band of diode for the composite base material that embodiment 1-3 is provided, with tradition The red white glue band of single layer Micron Technology paper compare, enhance tensile property, make its peeling force >=8N/25mm, provide heat resistance, answer With more extensively, solving current common leakage and fall two kinds of FAQs of glue, and reduce Micron Technology's paper and face glue pressure sensitive adhesive The investment of equal materials, considerably reduces consumptive material, reduces cost of manufacture.

The above, only the utility model further embodiment, but the protection scope of the utility model is not limited to In this, anyone skilled in the art is according to the present utility model in range disclosed in the utility model Technical solution and its design are subject to equivalent substitution or change, belong to the protection scope of the utility model.

Claims (7)

1. a kind of red white glue band of diode of composite base material, it is characterised in that: including substrate layer (3), be arranged in the substrate The compound adhesive (2) of Micron Technology's paper (1) and setting between Micron Technology's paper (1) and the substrate layer (3) on layer (3), it is described Substrate layer (3) is polyester film, and primer (4) is coated on the downside of the substrate layer (3) and painting is located on the downside of the primer (4) Face glue (5), the face glue (5) be pressure sensitive adhesive.

2. a kind of red white glue band of the diode of composite base material according to claim 1, it is characterised in that: the substrate layer It (3) is 12.5 μm of -50 μm of polyester films, the polyester film is polyacrylic film, sealed polyethylene plastic or nylon modeling Expect film.

3. a kind of red white glue band of the diode of composite base material according to claim 1, it is characterised in that: Micron Technology's paper It (1) is Micron Technology's paper of the red of 40g-100g/ ㎡ or white.

4. a kind of red white glue band of the diode of composite base material according to claim 1, it is characterised in that: the compound adhesive (2) rubber pressure-sensitive adhesive, acrylic type pressure sensitive adhesive or the laminated adhesive for being 5 μm -30 μm.

5. a kind of red white glue band of the diode of composite base material according to claim 1, it is characterised in that: the primer (4) silane coupling agent for being 1 μm -5 μm, the silane coupling agent are acrylic acid silane coupling agent or rubber-type silane coupling agent.

6. a kind of red white glue band of the diode of composite base material according to claim 1, it is characterised in that: the face glue (5) the high-temperature resistant rubber type pressure sensitive adhesive or organic silicon type pressure sensitive adhesive for being 20 μm -30 μm, peeling force >=8N/ of the face glue (5) 25mm。

7. a kind of red white glue band of the diode of composite base material according to claim 1, it is characterised in that: Micron Technology's paper (1) it has done the processing of painting fluorine or has applied silicon mould release on its surface layer in surface.