CN209085658U - Three shaft vibrations and temperature monitoring sensor - Google Patents
Three shaft vibrations and temperature monitoring sensor Download PDFInfo
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- CN209085658U CN209085658U CN201821491278.3U CN201821491278U CN209085658U CN 209085658 U CN209085658 U CN 209085658U CN 201821491278 U CN201821491278 U CN 201821491278U CN 209085658 U CN209085658 U CN 209085658U
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Abstract
This application discloses a kind of three shaft vibrations and temperature monitoring sensor, vibration chip circuit, the temperature-measuring modules and wireless communication module for measuring temperature of tri- direction vibration informations of XYZ by the way that microprocessor is arranged, for measuring vibration source；The microprocessor is electrically connected with the vibration chip circuit and temperature-measuring module respectively, for receiving the vibration signal of the vibration chip circuit acquisition and the temperature signal of temperature-measuring module acquisition；The microprocessor is also electrically connected with the wireless communication module, for the vibration signal and temperature signal to be sent out by the wireless communication module.Vibration frequency and temperature that the wiring around the slewing can measure the slewing are achieved the purpose that be not required to, to realize suitable on various slewings convenient installation and parameter monitoring, and using when can be fixed by the bracket on testee, have and simple technical effect be installed.
Description
Technical field
This application involves monitoring sensor technical fields, sense in particular to a kind of three shaft vibrations and temperature monitoring
Device.
Background technique
Such as the vibration, temperature measurement of engine, belt feeder, wind-driven generator etc exist not according to around slewing
Easily wiring the case where, relevant temperature or vibration information in above-mentioned apparatus can not be obtained in existing technology；It is therefore desirable to sense
Device can facilitate installation, wireless transmission, battery power supply, and sensor requirements low power dissipation design, data transmission is reliable, and ensures to monitor
Data can more completely restore the vibration temperature situation of monitoring point.The acquisition of multi-point temperature data can be supported in.It is existing
Wireless vibration sensor be difficult to meet.
There are problems that being not easy to be routed around slewing in the related technology, not yet proposes effective solution side at present
Case.
Utility model content
The main purpose of the application is to provide three shaft vibrations of one kind and temperature monitoring sensor, to solve in the related technology
There are problems that being not easy to be routed around slewing.
To achieve the goals above, according to the one aspect of the application, three shaft vibrations of one kind is provided and temperature monitoring passes
Sensor.
Include: microprocessor according to three shaft vibrations of the application and temperature monitoring sensor, the XYZ for measuring vibration source
Vibration chip circuit, the temperature-measuring module and wireless communication module for measuring temperature of three direction vibration informations；It is described
Microprocessor is electrically connected with the vibration chip circuit and temperature-measuring module respectively, is adopted for receiving the vibration chip circuit
The temperature signal of vibration signal and the temperature-measuring module acquisition of collection；The microprocessor is also electrically connected with the wireless communication module
It connects, for the vibration signal and temperature signal to be sent out by the wireless communication module.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, further includes: power module；The power supply mould
Block includes: the lithium battery and electric power management circuit being electrically connected to each other；The electric power management circuit also with the microprocessor, vibration
Chip circuit, temperature-measuring module and wireless communication module electrical connection.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, the vibration vibrated in chip circuit pass
Sensor uses 3-axis acceleration sensor.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, the microprocessor further include: analog-to-digital conversion
Module；The analog-to-digital conversion module is electrically connected with the vibration chip circuit and wireless communication module respectively.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, the vibration chip circuit further include: vibration
Signal filter circuit, the vibration signal filter circuit are set between the 3-axis acceleration sensor and the microprocessor,
The microprocessor is passed to voltage system after vibration signal amplification for detecting the vibration signal filter circuit.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, the temperature-measuring module use data temperature
Sensor is spent, the data temperature sensor is electrically connected by I2C bus with the microprocessor, the data temperature sensor
Support multichannel extension；The temperature-measuring module is additionally provided with strong magnet, for the temperature-measuring module to be adsorbed on measured object
Body surface face.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, the wireless communication module is using support
ZigBee communication agreement, the wireless communication module are electrically connected by SPI universal serial bus with the microprocessor.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, the microprocessor internal integrate 10 tunnels 12
Position analog-to-digital conversion module.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, putting in the vibration signal filter circuit
Big device uses the chip of model AD8629ARMZ.
Further, three shaft vibration as the aforementioned and temperature monitoring sensor, the microprocessor use model
The chip of STM32L432KBKCU6.
In the embodiment of the present application, the side of three shaft vibrations and temperature monitoring sensor that can be wirelessly communicated using one kind
Formula, by setting microprocessor, the vibration chip circuit of tri- direction vibration informations of XYZ for measuring vibration source, for surveying
The temperature-measuring module and wireless communication module of amount temperature；The microprocessor is surveyed with the vibration chip circuit and temperature respectively
Module electrical connection is measured, for receiving the vibration signal of the vibration chip circuit acquisition and the temperature letter of temperature-measuring module acquisition
Number；The microprocessor is also electrically connected with the wireless communication module, for the vibration signal and temperature signal to be passed through institute
Wireless communication module is stated to be sent out.Reach to be not required to be routed around the slewing and can measure the slewing
The purpose of vibration frequency and temperature, thus realize suitable on various slewings convenient installation and parameter monitoring, and
It can be fixed by the bracket on testee when use, have and simple technical effect is installed.
Detailed description of the invention
The attached drawing constituted part of this application is used to provide further understanding of the present application, so that the application's is other
Feature, objects and advantages become more apparent upon.The illustrative examples attached drawing and its explanation of the application is for explaining the application, not
Constitute the improper restriction to the application.In the accompanying drawings:
Fig. 1 is according to a kind of functional block diagram of embodiment of the application；
Fig. 2 is according to a kind of microprocessor of embodiment of the application and the electrical block diagram of peripheral circuit；
Fig. 3 is the electrical block diagram according to a kind of vibration chip circuit of embodiment of the application；And
Fig. 4 is according to a kind of electrical block diagram of the wireless communication module of embodiment of the application.
Specific embodiment
In order to make those skilled in the art more fully understand application scheme, below in conjunction in the embodiment of the present application
Attached drawing, the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described embodiment is only
The embodiment of the application a part, instead of all the embodiments.Based on the embodiment in the application, ordinary skill people
Member's every other embodiment obtained without making creative work, all should belong to the model of the application protection
It encloses.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so as to embodiments herein described herein.In addition, term " includes " and " tool
Have " and their any deformation, it is intended that cover it is non-exclusive include, for example, containing a series of steps or units
Process, method, system, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include without clear
Other step or units listing to Chu or intrinsic for these process, methods, product or equipment.
In this application, term " on ", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outside",
" in ", "vertical", "horizontal", " transverse direction ", the orientation or positional relationship of the instructions such as " longitudinal direction " be orientation based on the figure or
Positional relationship.These terms are not intended to limit indicated dress primarily to better describe the application and embodiment
Set, element or component must have particular orientation, or constructed and operated with particular orientation.
Also, above-mentioned part term is other than it can be used to indicate that orientation or positional relationship, it is also possible to for indicating it
His meaning, such as term " on " also are likely used for indicating certain relations of dependence or connection relationship in some cases.For ability
For the those of ordinary skill of domain, the concrete meaning of these terms in this application can be understood as the case may be.
In addition, term " installation ", " setting ", " being equipped with ", " connection ", " connected ", " socket " shall be understood in a broad sense.For example,
It may be a fixed connection, be detachably connected or monolithic construction；It can be mechanical connection, or electrical connection；It can be direct phase
It even, or indirectly connected through an intermediary, or is two connections internal between device, element or component.
For those of ordinary skills, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The application is described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
As shown in Figure 1, providing three shaft vibrations of one kind and temperature monitoring sensor, packet according to one embodiment of the application
It includes: microprocessor 1, the vibration chip circuit 2 of tri- direction vibration informations of XYZ for measuring vibration source, for measuring temperature
Temperature-measuring module 3 and wireless communication module 4；The microprocessor 1 is measured with the vibration chip circuit 2 and temperature respectively
Module 3 is electrically connected, for receiving the vibration signal that the vibration chip circuit 2 acquires and the temperature that temperature-measuring module 3 acquires
Signal；The microprocessor 1 is also electrically connected with the wireless communication module 4, for leading to the vibration signal and temperature signal
The wireless communication module 4 is crossed to be sent out.
The device working principle is as described below: in advance adsorbing the application device or is set up in vibration source device by branch
On, the vibration signal of the vibration source device is then acquired by the vibration chip circuit 2；And mould is measured by the temperature
Block 3 acquires the temperature signal of the vibration source device；It is transmitted to the microprocessor 1 after acquisition, in microprocessor 1 to described
Vibration signal or temperature signal are sent out by the wireless communication module 4 to logical with it after carrying out the processing such as analog-to-digital conversion
The server or intelligent terminal of letter.
It can be seen from the above description that the utility model realizes following technical effect: having reached and be not required to described
Wiring can measure the vibration frequency of the slewing and the purpose of temperature around slewing, be suitable for realize
The technical effect of convenient installation and parameter monitoring on various slewings.
In some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, further includes: power module 5；It is described
Power module 5 includes: the lithium battery and electric power management circuit being electrically connected to each other；The electric power management circuit also with the micro process
Device 1, vibration chip circuit 2, temperature-measuring module 3 and wireless communication module 4 are electrically connected.
Specifically, 5 one side of power module is powered to the microprocessor 1, and on the other hand, the micro process
Device 1 also obtains the information about power of rechargeable lithium battery described in the power module 5；And the information about power is passed through into the nothing
Line communication module 4 is sent out to the server or intelligent terminal communicated with.It is strong containing wireless communication signals in communication data
Degree, battery level information, facilitate on-site maintenance.
As shown in figure 3, in some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, the vibrating core
Vibrating sensor in piece circuit 2 uses 3-axis acceleration sensor.Vibration signal is measured after signal amplifies, with voltage side
Formula passes to microprocessor 1 and carries out Data collecting conversion processing；And it can not be known in advance using 3-axis acceleration sensor
Under the occasion of movement direction of object, acceleration signal is detected.3-axis acceleration sensor have the characteristics that it is small in size and light-weight, can
To measure steric acceleration, the kinetic property of object can be accurately reflected comprehensively.
In some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, the microprocessor 1 further include:
Analog-to-digital conversion module；The analog-to-digital conversion module is electrically connected with the vibration chip circuit 2 and wireless communication module 4 respectively.
The vibration signal that can thus the vibration chip circuit 2 be detected passes to micro process after signal amplifies with voltage system
Device 1 carries out Data collecting conversion processing.
In some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, the vibration chip circuit 2 also wrap
Include: vibration signal filter circuit, the vibration signal filter circuit are set to the 3-axis acceleration sensor and the micro process
Between device 1, passed to after the vibration signal amplification for detecting the vibration signal filter circuit with voltage system described micro-
Processor 1.The vibration signal that the vibration chip circuit 2 detects can thus be put through the vibration signal filter circuit signal
After big, microprocessor 1 is passed to voltage system, carries out Data collecting conversion processing.
In some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, the temperature-measuring module 3 use
Data temperature sensor, the data temperature sensor are electrically connected by I2C bus with the microprocessor 1, the data temperature
It spends sensor and supports multichannel extension；The temperature-measuring module 3 is additionally provided with strong magnet, for inhaling the temperature-measuring module 3
It is attached to testee surface.It can have the advantage that stability is good, bandwidth is high by the way of the connection of I2C bus communication；And it adopts
The temperature-measuring module 3 is adsorbed on testee surface with strong magnet, is easy to the installing and dismounting of device, it is convenient to operate.
As shown in figure 4, in some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, the channel radio
Module 4 is believed using ZigBee communication agreement is supported, the wireless communication module passes through SPI universal serial bus and the microprocessor 1
Electrical connection.It is had the advantages that using ZigBee communication agreement
Low-power consumption: since the transmission rate of ZigBee is low, transmission power is only 1mW, and uses suspend mode, power consumption
It is low, therefore the very power saving of ZigBee equipment；
At low cost: ZigBee module is at low cost；It is easier to the popularization and use of the application；
Time delay is short: communication delay and the time delay activated from dormant state are all very short, typical to search for equipment delay 30ms,
The time delay of suspend mode activation is 15ms, and the time delay of vehicular equipment channel access is 15ms；Therefore ZigBee technology is suitable for time delay
It is required that harsh wireless control (such as Industry Control occasion) application；
Network capacity is big: the Zigbee network of a hub-and-spoke configuration can at most accommodate 254 and set from equipment and a master
It is standby, most 100 ZigBee-networks can be existed simultaneously in a region, and network composition is flexibly, thus adapt to large quantities of
Measure the monitoring of device；
And stability is high, safe technical characterstic.
In some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor collect inside the microprocessor 1
At 12,10 tunnel analog-to-digital conversion module；It thus can be realized and support the extension of multi-temperature sensor, therefore the same micro process
Device 1 can connect multiple temperature-measuring modules 3, can monitor multiple vibration source devices to be monitored or the same vibration
Multiple temperature-measuring modules 3 are set in source device, and then keep the temperature information of measurement more complete.
In some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, the vibration signal filter circuit
In amplifier use model AD8629ARMZ chip.The chip of AD8629ARMZ, high, the low in energy consumption and valence with stability
The lower advantage of lattice, is beneficial to the popularization and use of product.
As shown in Fig. 2, in some embodiments, three shaft vibration as the aforementioned and temperature monitoring sensor, the micro process
Device 1 uses the chip of model STM32L432KBKCU6.The processing chip of STM32L432KBKCU6 model has processing energy
Power is strong, and the advantage that stability is high, low in energy consumption and lower price is beneficial to the popularization and use of product.
The foregoing is merely preferred embodiment of the present application, are not intended to limit this application, for the skill of this field
For art personnel, various changes and changes are possible in this application.Within the spirit and principles of this application, made any to repair
Change, equivalent replacement, improvement etc., should be included within the scope of protection of this application.
Claims (10)
1. a kind of three shaft vibrations and temperature monitoring sensor characterized by comprising microprocessor (1), for measuring vibration source
The vibration chip circuit (2) of tri- direction vibration informations of XYZ, the temperature-measuring module (3) for measuring temperature and channel radio
Believe module (4)；The microprocessor (1) is electrically connected with the vibration chip circuit (2) and temperature-measuring module (3) respectively, uses
In the temperature signal for the vibration signal and temperature-measuring module (3) acquisition for receiving vibration chip circuit (2) acquisition；It is described micro-
Processor (1) is also electrically connected with the wireless communication module (4), for the vibration signal and temperature signal to be passed through the nothing
Line communication module (4) is sent out.
2. three shaft vibration according to claim 1 and temperature monitoring sensor, which is characterized in that further include: power module
(5)；The power module (5) includes: the lithium battery and electric power management circuit being electrically connected to each other；The electric power management circuit also with
The microprocessor (1), vibration chip circuit (2), temperature-measuring module (3) and wireless communication module (4) electrical connection.
3. three shaft vibration according to claim 1 and temperature monitoring sensor, which is characterized in that the vibration chip circuit
(2) vibrating sensor in uses 3-axis acceleration sensor.
4. three shaft vibration according to claim 1 and temperature monitoring sensor, which is characterized in that the microprocessor (1)
Further include: analog-to-digital conversion module；The analog-to-digital conversion module respectively with the vibration chip circuit (2) and wireless communication module
(4) it is electrically connected.
5. three shaft vibration according to claim 3 and temperature monitoring sensor, which is characterized in that the vibration chip circuit
(2) further include: vibration signal filter circuit, the vibration signal filter circuit be set to the 3-axis acceleration sensor with it is described
Between microprocessor (1), transmitted after the vibration signal amplification for detecting the vibration signal filter circuit with voltage system
Give the microprocessor (1).
6. three shaft vibration according to claim 1 and temperature monitoring sensor, which is characterized in that the temperature-measuring module
(3) data temperature sensor is used, the data temperature sensor is electrically connected by I2C bus with the microprocessor (1), institute
It states data temperature sensor and supports multichannel extension；The temperature-measuring module (3) is additionally provided with strong magnet, for surveying the temperature
Amount module (3) is adsorbed on testee surface.
7. three shaft vibration according to claim 1 and temperature monitoring sensor, which is characterized in that the wireless communication module
(4) using ZigBee communication agreement is supported, the wireless communication module (4) passes through SPI universal serial bus and the microprocessor (1)
Electrical connection.
8. three shaft vibration according to claim 4 and temperature monitoring sensor, which is characterized in that the microprocessor (1)
It is internally integrated 12,10 tunnel analog-to-digital conversion module.
9. three shaft vibration according to claim 5 and temperature monitoring sensor, which is characterized in that the vibration signal filtering
Amplifier in circuit uses the chip of model AD8629ARMZ.
10. three shaft vibration according to claim 8 and temperature monitoring sensor, which is characterized in that the microprocessor (1)
Using the chip of model STM32L432KBKCU6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821491278.3U CN209085658U (en) | 2018-09-12 | 2018-09-12 | Three shaft vibrations and temperature monitoring sensor |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821491278.3U CN209085658U (en) | 2018-09-12 | 2018-09-12 | Three shaft vibrations and temperature monitoring sensor |
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| Publication Number | Publication Date |
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| CN209085658U true CN209085658U (en) | 2019-07-09 |
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| CN201821491278.3U Active CN209085658U (en) | 2018-09-12 | 2018-09-12 | Three shaft vibrations and temperature monitoring sensor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134890A1 (en) * | 2018-07-30 | 2020-07-02 | 杭州哲达科技股份有限公司 | Vibration and temperature sensor for monitoring data of safe and healthy operation of operating and rotating device |
-
2018
- 2018-09-12 CN CN201821491278.3U patent/CN209085658U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020134890A1 (en) * | 2018-07-30 | 2020-07-02 | 杭州哲达科技股份有限公司 | Vibration and temperature sensor for monitoring data of safe and healthy operation of operating and rotating device |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220105 Address after: 272000 4th floor, plant 2, information industry park, No. 8, Lianhua Road, high tech Zone, Jining City, Shandong Province Patentee after: Core future intelligent equipment (Shandong) Co.,Ltd. Address before: 610000 No. 8, 27th floor, building 4, oaks Plaza, No. 666, Jincheng Avenue, Chengdu high tech Zone, China (Sichuan) pilot Free Trade Zone, Chengdu, Sichuan Patentee before: CHENGDU ALPHA INTELLIGENT CONTROL TECHNOLOGY Co.,Ltd. |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240802 Address after: 250000, 13th Floor, Science and Technology Innovation Building, Building 2, Greenland New Metropolis, Second Ring South Road, Shizhong District, Jinan City, Shandong Province, China 1306-12 Patentee after: Zhongkexin Future New Infrastructure Industry Service (Shandong) Co.,Ltd. Country or region after: China Address before: 272000 4th floor, plant 2, information industry park, No. 8, Lianhua Road, high tech Zone, Jining City, Shandong Province Patentee before: Core future intelligent equipment (Shandong) Co.,Ltd. Country or region before: China |