CN209057287U - Image acquiring module and portable electronic device - Google Patents
Image acquiring module and portable electronic device Download PDFInfo
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- CN209057287U CN209057287U CN201821930065.6U CN201821930065U CN209057287U CN 209057287 U CN209057287 U CN 209057287U CN 201821930065 U CN201821930065 U CN 201821930065U CN 209057287 U CN209057287 U CN 209057287U
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Abstract
It includes circuit substrate, image sensing chip, filtering assembly and lens assembly that the utility model, which discloses a kind of image acquiring module and portable electronic device, image acquiring module,.Circuit substrate has upper surface, lower surface and through opening.Image sensing chip is arranged on the lower surface of circuit substrate and is located at through the lower section of opening.Filtering assembly is arranged on the upper surface of circuit substrate and is located at through the top of opening.Lens assembly includes supporting structure with lens construction.The lower surface of circuit substrate includes the first spot area, the second spot area and the first no-welding-spot region.The upper surface of image sensing chip includes image sensing region, the first conductive region, the second conductive region and the first non-conducting areas.First spot area and the second spot area are electrically connected in the first conductive region and the second conductive region, and the first no-welding-spot region corresponds to the first non-conducting areas.Whereby, image sensing chip width in the horizontal direction or size can be contracted by.
Description
Technical field
The utility model relates to a kind of image acquiring module and portable electronic devices, more particularly to one kind for reducing
The image acquiring module and portable electronic device of the width of image sensor.
Background technique
For the prior art, complementary metal oxide semiconductor (Complementary Metal-Oxide-
Semiconductor, CMOS) the special niche of image sensor is " low power consumption " and the characteristics of " small size ", therefore
CMOS image sensor is convenient for being integrated into the portable electronic product of specific demand, such as CMOS image sensor can be convenient for
Being integrated into has the smaller portable electronic product for integrating space, such as smartphone, tablet computer or laptop
Deng.
However, the width of conventional CMOS image sensor still can not effectively be shortened.Therefore how to be designed by structure
Improvement, to effectively shorten the width of conventional CMOS image sensor, it has also become this cause personage important class to be solved
Topic.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of image capturing mould in view of the deficiencies of the prior art
Block and portable electronic device, to solve missing present in the prior art.
In order to solve the above technical problems, wherein a technical solution is to provide a kind of shadow used by the utility model
As obtaining module comprising a circuit substrate, an image sensing chip, a filtering assembly and a lens assembly.Circuit substrate tool
There are a upper surface, a lower surface and the connection upper surface and running through for the lower surface to be open.Image sensing chip setting exists
On the lower surface of the circuit substrate and it is located at the lower section through opening.Table on this of the circuit substrate is arranged in filtering assembly
On face and it is located at the top through opening.Lens assembly includes that a supporting structure being arranged on the circuit substrate and one set
Set the lens construction on the supporting structure.Wherein, the lower surface of the circuit substrate include one it is neighbouring should be through the one the of opening
First spot area of a side, the second spot area of a neighbouring second side that should run through opening and one be passed through adjacent to this
Wear the first no-welding-spot region of a third side of opening.Wherein, the upper surface of the image sensing chip includes an image sensing
Region, one first conductive region, one second conductive region and one first non-conducting areas, first conductive region are connected to this
Between one first side of image sensing chip and a first side in the image sensing region, which is connected to
Between one second side of the image sensing chip and a second side in the image sensing region, which connects
It is connected between a third side of the image sensing chip and a third side in the image sensing region.Wherein, the image sense
First conduction region in the circuit substrate is electrically connected in first spot area and second spot area for surveying chip
Domain and second conductive region, the first no-welding-spot region of the image sensing chip correspond to the circuit substrate this is first non-
Conductive region.
In order to solve the above technical problems, an other technical solution used by the utility model is to provide one kind just
Portable electronic apparatus a comprising portable electronic module and an image acquiring module.Image acquiring module setting this just
It takes on formula electronic module, which includes a circuit substrate, an image sensing chip, a filtering assembly and a mirror
Head assembly.There is circuit substrate a upper surface, a lower surface and the connection upper surface and running through for the lower surface to be open.Shadow
As sensor chip is arranged on the lower surface of the circuit substrate and is located at the lower section through opening.Filtering assembly is arranged at this
On the upper surface of circuit substrate and it is located at the top through opening.Lens assembly includes one being arranged on the circuit substrate
Supporting structure and one lens construction on the supporting structure is set.Wherein, the lower surface of the circuit substrate includes one neighbouring
This runs through the first spot area of a first side of opening, a neighbouring second solder joint area that should run through the second side being open
First no-welding-spot region of domain and a neighbouring third side that should run through opening.Wherein, the upper table of the image sensing chip
Face includes an image sensing region, one first conductive region, one second conductive region and one first non-conducting areas, this first
Conductive region is connected between a first side of the image sensing chip and a first side in the image sensing region, this
Two conductive regions are connected between a second side of the image sensing chip and a second side in the image sensing region, should
First non-conducting areas be connected to the image sensing chip a third side and the image sensing region a third side it
Between.Wherein, first spot area Yu second spot area of the image sensing chip are electrically connected in the circuit base
The first no-welding-spot region of first conductive region and second conductive region of plate, the image sensing chip corresponds to the electricity
First non-conducting areas of base board.
In order to solve the above technical problems, other yet another aspect used by the utility model is to provide one kind
Image acquiring module a comprising circuit substrate, an image sensing chip, a filtering assembly and a lens assembly.Circuit base
There is plate a upper surface, a lower surface and the connection upper surface and running through for the lower surface to be open.Image sensing chip is set
It sets on the lower surface of the circuit substrate and is located at the lower section through opening.Being somebody's turn to do for the circuit substrate is arranged in filtering assembly
On upper surface and it is located at the top through opening.Lens assembly include a supporting structure being arranged on the circuit substrate and
One is arranged in the lens construction on the supporting structure.Wherein, the lower surface of the circuit substrate includes that neighbouring be somebody's turn to do runs through opening
First no-welding-spot region of the first spot area of one first side and a neighbouring second side that should run through opening.Its
In, the upper surface of the image sensing chip includes an image sensing region, one first conductive region and one first nonconductive regions
Domain, first conductive region are connected to a first side of the image sensing chip and a first side in the image sensing region
Between, which is connected to a second side and the one second of the image sensing region for the image sensing chip
Between side.Wherein, first spot area of the image sensing chip is by one first tin ball to be electrically connected at the circuit
First conductive region of substrate, the first no-welding-spot region of the image sensing chip is by one first adhesion to be connected to
First non-conducting areas of the circuit substrate.
A wherein beneficial effect of the utility model is, image acquiring module provided by the utility model and portable
Electronic device, can be by the way that " lower surface of the circuit substrate includes neighbouring first weldering that should run through the first side being open
Point region, one it is neighbouring should through the second spot area of a second side of opening and one are neighbouring should be through a third of opening
First no-welding-spot region of side ",
" upper surface of the image sensing chip includes an image sensing region, one first conductive region, one second conduction region
Domain and one first non-conducting areas, first conductive region are connected to a first side and image of the image sensing chip
Between one first side of sensing region, which is connected to a second side and shadow of the image sensing chip
As sensing region a second side between, first non-conducting areas be connected to a third side of the image sensing chip with
Between the one third side in the image sensing region " and " first conductive region of the image sensing chip second is led with this
First spot area and second spot area in the circuit substrate, the image sensing chip is electrically connected in electric region
First non-conducting areas correspond to the circuit substrate the first no-welding-spot region " technical solution, to reduce image sense
Survey chip width in the horizontal direction or size.
An other beneficial effect of the utility model is that image acquiring module provided by the utility model can lead to
Cross " lower surface of the circuit substrate include one it is neighbouring should be neighbouring through the first spot area of a first side of opening and one
This through opening a second side the first no-welding-spot region ", " upper surface of the image sensing chip include an image sensing
Region, one first conductive region and one first non-conducting areas, first conductive region are connected to the image sensing chip
Between one first side and a first side in the image sensing region, which is connected to the image sensing core
Between one second side of piece and a second side in the image sensing region " and " this of the image sensing chip first is led
Electric region is electrically connected at first spot area of the circuit substrate by one first tin ball, which is somebody's turn to do
First non-conducting areas is connected to the first no-welding-spot region of the circuit substrate by one first adhesion " technical side
Case, to reduce image sensing chip width in the horizontal direction or size.
For the enabled feature and technology contents for being further understood that the utility model, please refer to below in connection with the utility model
Detailed description and accompanying drawings, however provided attached drawing is merely provided for reference and description, is not used to add the utility model
With limitation.
Detailed description of the invention
Fig. 1 is the schematic top plan view of the image sensing chip of the image acquiring module of the utility model first embodiment.
Fig. 2 is the elevational schematic view of the circuit substrate of the image acquiring module of the utility model first embodiment.
Fig. 3 is the diagrammatic cross-section of the image acquiring module of the utility model first embodiment.
Fig. 4 is the schematic top plan view of the image sensing chip of the image acquiring module of the utility model second embodiment.
Fig. 5 is the elevational schematic view of the circuit substrate of the image acquiring module of the utility model second embodiment.
Fig. 6 is the first vertical view signal of the image sensing chip of the image acquiring module of the utility model 3rd embodiment
Figure.
Fig. 7 is the first elevational schematic view of the circuit substrate of the image acquiring module of the utility model 3rd embodiment.
Fig. 8 is the second vertical view signal of the image sensing chip of the image acquiring module of the utility model fourth embodiment
Figure.
Fig. 9 is the second elevational schematic view of the circuit substrate of the image acquiring module of the utility model fourth embodiment.
Figure 10 is the schematic diagram of the portable electronic device of the 5th embodiment of the utility model.
Specific embodiment
It is to illustrate disclosed in the utility model related " image acquiring module and just by particular specific embodiment below
The embodiment of portable electronic apparatus ", those skilled in the art can understand the utility model by content disclosed in this specification
The advantages of and effect.The utility model can be implemented or be applied by other different specific embodiments, in this specification
Every details may be based on different viewpoints and application, carry out various modifications and changes under the design for not departing from the utility model.
In addition, the attached drawing of the utility model is only simple schematically illustrate, not according to the description of actual size, state in advance.Reality below
The relevant technologies content of the utility model will be explained in further detail in the mode of applying, but disclosure of that is not to limit this reality
With novel protection scope.
Although it is to be understood that may be retouched herein using to the terms such as " first ", " second ", " third "
State various assemblies perhaps signal but these components or signal should not be limited by these terms.These terms mainly to
Distinguish a component and another component or a signal and another signal.In addition, term "or" used herein, should regard reality
Border situation, which may include, associated lists any of project or multiple combinations.
[first embodiment]
Referring to FIG. 1 to 3, the utility model first embodiment provides a kind of image acquiring module M comprising: one
Circuit substrate 1, an image sensing chip 2, a filtering assembly 3 and a lens assembly 4.
Firstly, circuit substrate 1 has a upper surface 11 and a lower surface 12.Also, circuit substrate 1 has one to connect upper table
Face 11 is with lower surface 12 through opening 13.Furthermore, it is understood that the lower surface 12 of circuit substrate 1 may include one neighbouring through opening
Second solder joint area of the neighbouring second side 132 through opening 13 of the first spot area 14, one of 13 first side 131
First no-welding-spot region 16 of domain 15 and a neighbouring third side 133 through opening 13.For example, circuit substrate 1
Can using PCB hardboard (such as BT, FR4, FR5 material), Rigid Flex or ceramic substrate, however the utility model not with
This citing is limited.
Furthermore image sensing chip 2 is electrically connected at circuit substrate 1, and image sensing chip 2 is arranged in circuit substrate
On 1 lower surface 12 and it is located at through the lower section of opening 13.Furthermore, it is understood that the upper surface 21 of image sensing chip 2 includes one
Image sensing region 22, one first conductive region 23, one second conductive region 24 and one first non-conducting areas 25, first leads
Electric region 23 be connected to a first side 201 of image sensing chip 2 and image sensing region 22 a first side 221 it
Between, the second conductive region 24 is connected to second side for a second side 202 and image sensing region 22 of image sensing chip 2
Between side 222, the first non-conducting areas 25 is connected to a third side 203 and image sensing region 22 for image sensing chip 2
A third side 223 between.And the image sensing region 22 of image sensing chip 2 can be held towards running through for circuit substrate 1
Mouth 13.For example, image sensing chip 2 can be a kind of complementary metal oxide semiconductor (CMOS) sensor or any tool
There is the sensor of image capturing function, however the utility model is not illustrated with this and is limited.
Therefore, image sensing chip 2 can be electrically connected by the first conductive region 23 and the second conductive region 24 in
The first spot area 14 and the second spot area 15 of circuit substrate 1, and the first non-conducting areas 25 of image sensing chip 2
The first no-welding-spot region 16 corresponding to circuit substrate 1.
Image acquiring module M may further comprise: a filtering assembly 3, be arranged on the upper surface 11 of circuit substrate 1 and
Positioned at the top through opening 13.For example, filtering assembly 3 can be set up directly on image sensing chip by colloid of adhering
(as shown in Figure 3) or filtering assembly 3 can be supportted high by multiple column (not shown) and be arranged in image sensing chip 2 on 2
Top.In addition, filtering assembly 3 can be coated glass, it is also possible to non-coated glass, however the utility model is not with this measure
Example is limited.
And image acquiring module M may further comprise: a lens assembly 4 comprising one is arranged on circuit substrate 1
Supporting structure 41 and one lens construction 42 on supporting structure 41 is set.For example, supporting structure 41 can be commonly
Pedestal or any kind of voice coil motor (Voice Coil Motor, VCM), and lens construction 42 can be by multiple
Eyeglass is formed, and lens construction 42 corresponds to image sensing region 22, and according to different use demands, lens construction 42 can
Fixedly can either be movably arranged as on not supporting structure 41, however the utility model is not illustrated with this and is limited.In addition,
The upper surface 101 of circuit substrate 1 can be arranged in supporting structure 41 by adhesion colloid (not shown), however the utility model is not
It is illustrated and is limited with this.
It is to sum up sayed, since the wherein two sides of circuit substrate 1 and image sensing chip 2 can be by being arranged the first spot area
14, the second spot area 15 and the first conductive region 23, one second conductive region 24, so that circuit substrate 1 and image sensing
Chip 2 is electrically connected, therefore, the width or ruler of the other two sides of circuit substrate 1 and image sensing chip 2 in the horizontal direction
It is very little to be contracted by.That is, since the other two sides of circuit substrate 1 and image sensing chip 2 can omit setting solder joint
Region and conductive region, so the width of circuit substrate 1 and image sensing chip 2 (X-direction) in the horizontal direction can be contracted
Subtract.Whereby, to reduce the size in the horizontal direction of image sensing chip 2.
More specifically, the first spot area 14 may include multiple first weld pads 141, and the second spot area 15 may include
Multiple second weld pads 151, the first conductive region 23 may include multiple first conductive parts 231, and the second conductive region 24 may include more
A second conductive part 241, multiple first conductive parts 231 are respectively by multiple first tin balls 51 to be electrically connected at multiple first welderings
Pad 141, multiple second conductive parts 241 are respectively by multiple second tin balls 52 to be electrically connected at multiple second weld pads 151.Its
In, the first spot area 14 is oppositely arranged with the second spot area 15, and the first no-welding-spot area 16 is arranged in the first spot area 14
Between the second spot area 15.For example, settable multiple first weld pads in the first spot area 14 of circuit substrate 1
141, settable multiple second weld pads 151 in the second spot area 15, relatively, the first conductive region of image sensing chip 2
Settable multiple first conductive parts 231 on 23, settable multiple second conductive parts 241 on the second conductive region 24.Therefore, image
Multiple first conductive parts 231 of sensor chip 2 are respectively by multiple first tin balls 51 to be electrically connected at multiple first weld pads
141, multiple second conductive parts 241 are respectively by multiple second tin balls 52 to be electrically connected at multiple second weld pads 151.
It is noted that the lower surface 12 of circuit substrate 1 includes a neighbouring four side 134 through opening 13
Second no-welding-spot region 17, the upper surface 21 of image sensing chip 2 include a four side for being connected to image sensing chip 2
The second non-conducting areas 26 between 204 and a four side 224 in image sensing region 22, the second of image sensing chip 2
Non-conducting areas 26 corresponds to the second no-welding-spot region 17 of circuit substrate 1.One first adhesion is set to the first no-welding-spot area
Between domain 16 and the first non-conducting areas 25, one second adhesion is set to the second no-welding-spot region 17 and the second non-conducting areas
Between 26.First spot area 14 is oppositely arranged with the second spot area 15, the first no-welding-spot region 16 and the second no-welding-spot area
Domain 17 is oppositely arranged, and the first no-welding-spot area 16 and the second no-welding-spot area 17 are all disposed within the first spot area 14 and the second solder joint area
Between domain 15.
For example, the second no-welding-spot region 17 of circuit substrate 1 is relative to the first no-welding-spot area 16, image sensing core
Second non-conducting areas 26 of piece 2 is relative to the first non-conducting areas 25, and the second nonconductive regions of image sensing chip 2
Domain 26 corresponds to the second no-welding-spot region 17 of circuit substrate 1.Therefore, the first non-conducting areas 25 of image sensing chip 2 can
The first no-welding-spot region 16 of circuit substrate 1 is connected to by the first adhesion (not shown), the second of image sensing chip 2 is non-
Conductive region 26 can be connected to the second no-welding-spot area 17 by the second adhesion (not shown), wherein the first adhesion and second
Adhesion can be the adhesion as made by epoxy or silicone, or be also possible to UV glue, hot-setting adhesive or AB glue.
However, above-mentioned lifted example only wherein a feasible embodiment and be not intended to limit the utility model.
[second embodiment]
Refering to shown in Fig. 4 and Fig. 5, the utility model second embodiment provides a kind of image acquiring module M comprising: one
Circuit substrate 1, an image sensing chip 2, a filtering assembly 3 and a lens assembly 4.By Fig. 4,5 can compared with Fig. 1,2
Know, the utility model second embodiment is with the maximum difference of first embodiment: the lower surface 12 of circuit substrate 1 includes one adjacent
The third spot area 18 of a nearly four side 134 through opening 13, the upper surface 21 of image sensing chip 2 include a connection
Third conduction region between a four side 204 of image sensing chip 2 and a four side 224 in image sensing region 22
The third conductive region 27 in domain 27, image sensing chip 2 is electrically connected at the third spot area 18 of circuit substrate 1.Third weldering
Point region 18 includes multiple third weld pads 181, and third conductive region 27 includes multiple third conductive parts 271, and multiple thirds are conductive
Portion 271 is respectively by multiple third tin balls to be electrically connected at multiple third weld pads 181.First spot area 14 and the second solder joint
Region 15 is oppositely arranged, and third spot area 18 is oppositely arranged with the first no-welding-spot region 16, third spot area 18 and first
No-welding-spot region 16 is all disposed between the first spot area 14 and the second spot area 15.
For example, the utility model can be according to different design requirements, in the neighbouring four side 134 through opening 13
Third spot area 18, and the four side of the four side 204 of image sensing chip 2 and image sensing region 22 are set
Third conductive region 27 is set between 224.More specifically, under the circuit substrate 1 of the image acquiring module M of the present embodiment
Surface 12 includes third spot area 18, settable multiple third weld pads 181 in third spot area 18, third spot area 18
It is oppositely arranged, and is arranged between the first spot area 14 and the second spot area 15 with the first no-welding-spot region 16.Image sense
The upper surface 21 for surveying chip 2 includes third conductive region 27, settable multiple third conductive parts 271 on third conductive region 27,
And third conductive region 27 is oppositely arranged with the first non-conducting areas 25, and is arranged conductive in the first conductive region 23 and second
Between region 24.Multiple third conductive parts 271 of image sensing chip 2 can respectively by multiple third tin balls (it is not shown, it is similar
The set-up mode of the first tin ball 51 and the second tin ball 52 shown in Fig. 3) to be electrically connected at multiple third weld pads 181.
However, above-mentioned lifted example only wherein a feasible embodiment and be not intended to limit the utility model.
[3rd embodiment]
Refering to shown in Fig. 6 to Fig. 9, the utility model 3rd embodiment provides a kind of image acquiring module M comprising: one
Circuit substrate 1, an image sensing chip 2, a filtering assembly 3 and a lens assembly 4.By Fig. 6,7 compared with Fig. 1,2, or
Person Fig. 8,9 and Fig. 1,2 are it is found that the utility model 3rd embodiment is with the maximum difference of first embodiment: circuit substrate 1
Lower surface 12 includes that the first spot area 14 and one of a neighbouring first side 131 through opening 13 is neighbouring through opening
First no-welding-spot region 16 of 13 second side 132.The upper surface 21 of image sensing chip 2 includes an image sensing region
22, one first conductive region 23 and one first non-conducting areas 25, the first conductive region 23 are connected to image sensing chip 2
Between one first side 201 and a first side 221 in image sensing region 22, the first non-conducting areas 25 is connected to image sense
It surveys between a second side 202 of chip 2 and a second side 222 in image sensing region 22.The first of image sensing chip 2
Conductive region 23 is electrically connected at the first spot area 14 of circuit substrate 1, image sensing chip 2 by one first tin ball 51
The first non-conducting areas 25 the first no-welding-spot region 16 of circuit substrate 1 is connected to by one first adhesion.
For example, the utility model can be according to different design requirements, in the neighbouring second side 132 through opening 13
First no-welding-spot region 16, and the second side of the second side 202 of image sensing chip 2 and image sensing region 22 are set
First non-conducting areas 25 is set between 222.More specifically, the first conductive region 23 of image sensing chip 2 passes through the
One tin ball 51 (can cooperate shown in Fig. 3) to be electrically connected at the first spot area 14 of circuit substrate 1, image sensing chip 2
First non-conducting areas 25 is connected to the first no-welding-spot region 16 of circuit substrate 1 by the first adhesion.
More specifically, cooperate Fig. 6 and Fig. 7 shown in, the image acquiring module M of the utility model 3rd embodiment its
In one variation aspect.Furthermore, it is understood that the image sensing chip 2 of the image acquiring module M of the 5th embodiment of the utility model can
It is designed as eccentric aspect.For example, the lower surface 12 of the circuit substrate 1 of image acquiring module M includes one neighbouring through opening
Second spot area 15 of a 13 third side 133, and the second spot area 15 is located at the first spot area 14 and first
Between no-welding-spot region 16.The upper surface 21 of image sensing chip 2 includes a third side for being connected to image sensing chip 2
The second conductive region 24 between 203 and a third side 223 in image sensing region 22, the second of image sensing chip 2 are led
Electric region 24 is electrically connected at the second spot area 15 of circuit substrate 1 by the second tin ball 52 (can cooperate shown in Fig. 3).
In addition, shown in cooperation Fig. 8 and Fig. 9, another variation state of the image acquiring module M of the utility model 3rd embodiment
Sample.Furthermore, it is understood that the lower surface 12 of circuit substrate 1 further may include a neighbouring third side 133 through opening 13
The second no-welding-spot region 17 and a neighbouring four side 134 through opening 13 third no-welding-spot region 19.Image
The upper surface 21 of sensor chip 2 includes one second non-conducting areas 26 and a third non-conducting areas 28, the second nonconductive regions
Domain 26 is connected between a third side 203 of image sensing chip 2 and a third side 223 in image sensing region 22, the
Three non-conducting areas 28 are connected to a four side of a four side 204 and image sensing region 22 of image sensing chip 2
Between 224.Second non-conducting areas 26 of image sensing chip 2 is connected to the of circuit substrate 1 by one second adhesion
Two no-welding-spot regions 17, the third non-conducting areas 28 of image sensing chip 2 is by a third adhesion to be connected to circuit base
The third no-welding-spot region 19 of plate 1.
However, above-mentioned lifted example only wherein a feasible embodiment and be not intended to limit the utility model.
[fourth embodiment]
As shown in fig.10, and cooperate Fig. 1 to Fig. 9, the utility model fourth embodiment provides a kind of portable electronic dress
Set Z comprising: an a portable electronic module P and image acquiring module M.Image acquiring module M is arranged in portable electronic
On module P, and image acquiring module P includes: a circuit substrate 1, an image sensing chip 2, a filtering assembly 3 and a mirror
Head assembly 4.For example, portable electronic module P can be mobile phone, laptop or tablet computer, however this reality
It is limited with novel do not illustrated with this；And any image acquiring module M of the first embodiment into 3rd embodiment can be by
It is mounted in portable electronic module P, so electronic module P can carry out image capturing by image acquiring module M.So
And above-mentioned lifted example only wherein a feasible embodiment and be not intended to limit the utility model.
[beneficial effect of embodiment]
A wherein beneficial effect of the utility model is, image acquiring module M provided by the utility model and portable
Formula electronic device Z, can be by the way that " lower surface 12 of circuit substrate 1 may include a neighbouring first side 131 through opening 13
The neighbouring second side 132 through opening 13 of the first spot area 14, one the second spot area 15 and one neighbouring pass through
Wear opening 13 a third side 133 the first no-welding-spot region 16 ", " upper surface 21 of image sensing chip 2 include an image
Sensing region 22, one first conductive region 23, one second conductive region 24 and one first non-conducting areas 25, the first conduction region
Domain 23 is connected between a first side 201 of image sensing chip 2 and a first side 221 in image sensing region 22, the
Two conductive regions 24 are connected to a second side 222 of a second side 202 and image sensing region 22 of image sensing chip 2
Between, the first non-conducting areas 25 is connected to the one the of a third side 203 of image sensing chip 2 and image sensing region 22
Between three sides 223 " and " the first conductive region 23 and the second conductive region 24 are electrically connected in circuit substrate 1
First non-conducting areas 25 of one spot area 14 and the second spot area 15, image sensing chip 2 corresponds to circuit substrate 1
The technical solution in the first no-welding-spot region 16 ", to reduce image sensing chip width in the horizontal direction or size.
An other beneficial effect of the utility model is that image acquiring module M provided by the utility model can lead to
Cross " lower surface 12 of circuit substrate 1 include a neighbouring first side 131 through opening 13 the first spot area 14 and
First no-welding-spot region 16 " of an one neighbouring second side 132 through opening 13 " is wrapped the upper surface 21 of image sensing chip 2
Include an image sensing region 22, one first conductive region 23 and one first non-conducting areas 25, the connection of the first conductive region 23
Between a first side 201 of image sensing chip 2 and a first side 221 in image sensing region 22, first is non-conductive
Region 25 is connected between a second side 202 of image sensing chip 2 and a second side 222 in image sensing region 22 "
And " the first conductive region 23 of image sensing chip 2 is by one first tin ball 51 to be electrically connected at the first of circuit substrate 1
Spot area 14, the first non-conducting areas 25 of image sensing chip 2 is by one first adhesion to be connected to circuit substrate 1
The technical solution in the first no-welding-spot region 16 ", to reduce image sensing chip width in the horizontal direction or size.
More specifically, the image acquiring module M and portable electronic device Z of the utility model are compared to existing skill
Art, since at least side of circuit substrate 1 and image sensing chip 2 can be conductive by the first spot area of setting 14 and first
Region 23, so that circuit substrate 1 and image sensing chip 2 are electrically connected, therefore, circuit substrate 1 and image sensing chip 2 are extremely
Few two sides width in the horizontal direction or size can be contracted by.That is, due to circuit substrate 1 and image sensing
At least side of chip 2 can omit setting spot area and conductive region, so circuit substrate 1 and image sensing chip 2 are in water
It square can be contracted by the width of (X-direction).Whereby, to reduce the size in the horizontal direction of image sensing chip 2.
Content disclosed above is only the preferred possible embodiments of the utility model, not thereby limits to the utility model
Claims protection scope, so all equivalence techniques for being done with the utility model specification and accompanying drawing content become
Change, is both contained in the protection scope of claims of the utility model.
Claims (10)
1. a kind of image acquiring module, which is characterized in that the image acquiring module includes:
One circuit substrate connects the upper surface with a upper surface, a lower surface and one and running through for the lower surface is open；
One image sensing chip is arranged on the lower surface of the circuit substrate and is located at the lower section through opening；
One filtering assembly is arranged on the upper surface of the circuit substrate and is located at the top through opening；And
One lens assembly a comprising supporting structure being arranged on the circuit substrate and one be arranged on the supporting structure
Lens construction；
Wherein, the lower surface of the circuit substrate includes the first spot area of a neighbouring first side that should run through opening, one
It is neighbouring should through the second spot area of a second side of opening and one are neighbouring should be through the of a third side of opening
One no-welding-spot region；
Wherein, the upper surface of the image sensing chip includes an image sensing region, one first conductive region, one second conduction region
Domain and one first non-conducting areas, first conductive region are connected to a first side and image of the image sensing chip
Between one first side of sensing region, which is connected to a second side and shadow of the image sensing chip
As sensing region a second side between, first non-conducting areas be connected to a third side of the image sensing chip with
Between the one third side in the image sensing region；
Wherein, first conductive region of the image sensing chip and second conductive region are electrically connected in the circuit base
First non-conducting areas of first spot area and second spot area of plate, the image sensing chip corresponds to the electricity
The first no-welding-spot region of base board.
2. image acquiring module according to claim 1, which is characterized in that first spot area includes multiple first welderings
Pad, which includes multiple second weld pads, which includes multiple first conductive parts, second conduction
Region includes multiple second conductive parts, and first conductive part passes through multiple first tin balls respectively to be electrically connected at described first
Weld pad, second conductive part pass through multiple second tin balls respectively to be electrically connected at second weld pad；Wherein, first weldering
Point region is oppositely arranged with second spot area, which is arranged in first spot area and second solder joint
Between region.
3. image acquiring module according to claim 1, which is characterized in that the lower surface of the circuit substrate includes one neighbouring
This runs through the second no-welding-spot region of a four side of opening, and the upper surface of the image sensing chip is connected to the shadow including one
As the second non-conducting areas between a four side of sensor chip and a four side in the image sensing region, the image
Second non-conducting areas of sensor chip corresponds to the second no-welding-spot region of the circuit substrate；Wherein, one first sticks together
Object is set between the first no-welding-spot region and first non-conducting areas, and one second adhesion is set to second no-welding-spot
Between region and second non-conducting areas；Wherein, which is oppositely arranged with second spot area, this first
No-welding-spot region is oppositely arranged with the second no-welding-spot region, and the first no-welding-spot area and the second no-welding-spot area are all disposed within this
Between first spot area and second spot area.
4. image acquiring module according to claim 1, which is characterized in that the lower surface of the circuit substrate includes one neighbouring
This runs through the third spot area of a four side of opening, and the upper surface of the image sensing chip is connected to the image including one
Third conductive region between one four side of sensor chip and a four side in the image sensing region, the image sensing
The third conductive region of chip is electrically connected at the third spot area of the circuit substrate；Wherein, the third spot area
Including multiple third weld pads, which includes multiple third conductive parts, and the third conductive part passes through multiple respectively
Third tin ball is to be electrically connected at the third weld pad；Wherein, which is oppositely arranged with second spot area,
The third spot area is oppositely arranged with the first no-welding-spot region, and the third spot area and the first no-welding-spot region are all set
It sets between first spot area and second spot area.
5. a kind of portable electronic device, which is characterized in that the portable electronic device includes:
One portable electronic module；And
One image acquiring module is arranged in the portable electronic module, which includes:
One circuit substrate connects the upper surface with a upper surface, a lower surface and one and running through for the lower surface is open；
One image sensing chip is arranged on the lower surface of the circuit substrate and is located at the lower section through opening；
One filtering assembly is arranged on the upper surface of the circuit substrate and is located at the top through opening；And
One lens assembly a comprising supporting structure being arranged on the circuit substrate and one be arranged on the supporting structure
Lens construction；
Wherein, the lower surface of the circuit substrate includes the first spot area of a neighbouring first side that should run through opening, one
It is neighbouring should through the second spot area of a second side of opening and one are neighbouring should be through the of a third side of opening
One no-welding-spot region；
Wherein, the upper surface of the image sensing chip includes an image sensing region, one first conductive region, one second conduction region
Domain and one first non-conducting areas, first conductive region are connected to a first side and image of the image sensing chip
Between one first side of sensing region, which is connected to a second side and shadow of the image sensing chip
As sensing region a second side between, first non-conducting areas be connected to a third side of the image sensing chip with
Between the one third side in the image sensing region；
Wherein, first conductive region of the image sensing chip and second conductive region are electrically connected in the circuit base
First non-conducting areas of first spot area and second spot area of plate, the image sensing chip corresponds to the electricity
The first no-welding-spot region of base board.
6. portable electronic device according to claim 5, which is characterized in that first spot area includes multiple first
Weld pad, second spot area include multiple second weld pads, which includes multiple first conductive parts, this second is led
Electric region includes multiple second conductive parts, and first conductive part passes through multiple first tin balls respectively to be electrically connected at described
One weld pad, second conductive part pass through multiple second tin balls respectively to be electrically connected at second weld pad；Wherein, this first
Spot area is oppositely arranged with second spot area, and the first no-welding-spot area setting is in first spot area and second weldering
Between point region.
7. portable electronic device according to claim 5, which is characterized in that the lower surface of the circuit substrate includes one adjacent
Closely this should be connected to including one through the second no-welding-spot region of a four side of opening, the upper surface of the image sensing chip
The second non-conducting areas between one four side of image sensing chip and a four side in the image sensing region, the shadow
As second non-conducting areas of sensor chip corresponds to the second no-welding-spot region of the circuit substrate；Wherein, one first is glutinous
Object be set between the first no-welding-spot region and first non-conducting areas, one second adhesion is set to second solderless
Between point region and second non-conducting areas；Wherein, which is oppositely arranged with second spot area, this
One no-welding-spot region is oppositely arranged with the second no-welding-spot region, which is all disposed with the second no-welding-spot area
Between first spot area and second spot area.
8. portable electronic device according to claim 5, which is characterized in that the lower surface of the circuit substrate includes one adjacent
Closely the shadow should be connected to including one through the third spot area of a four side of opening, the upper surface of the image sensing chip
As the third conductive region between a four side of sensor chip and a four side in the image sensing region, the image sense
The third conductive region for surveying chip is electrically connected at the third spot area of the circuit substrate；Wherein, the third solder joint area
Domain includes multiple third weld pads, which includes multiple third conductive parts, and the third conductive part passes through more respectively
A third tin ball is to be electrically connected at the third weld pad；Wherein, the second spot area is opposite sets with this for first spot area
It sets, which is oppositely arranged with the first no-welding-spot region, the third spot area and the first no-welding-spot region
It is all disposed between first spot area and second spot area.
9. a kind of image acquiring module, which is characterized in that the image acquiring module includes:
One circuit substrate connects the upper surface with a upper surface, a lower surface and one and running through for the lower surface is open；
One image sensing chip is arranged on the lower surface of the circuit substrate and is located at the lower section through opening；
One filtering assembly is arranged on the upper surface of the circuit substrate and is located at the top through opening；And
One lens assembly a comprising supporting structure being arranged on the circuit substrate and one be arranged on the supporting structure
Lens construction；
Wherein, the lower surface of the circuit substrate include one it is neighbouring should through a first side of opening the first spot area and
First no-welding-spot region of the one neighbouring second side that should run through opening；
Wherein, the upper surface of the image sensing chip includes that an image sensing region, one first conductive region and one first are non-
Conductive region, first conductive region be connected to the image sensing chip a first side and the image sensing region one the
Between a side, which is connected to a second side and the image sensing region for the image sensing chip
Between one second side；
Wherein, first conductive region of the image sensing chip is by one first tin ball to be electrically connected at the circuit substrate
First spot area, first non-conducting areas of the image sensing chip is by one first adhesion to be connected to the circuit
The first no-welding-spot region of substrate.
10. image acquiring module according to claim 9, which is characterized in that the lower surface of the circuit substrate includes one adjacent
Closely should through the second no-welding-spot region of a third side of opening and one are neighbouring should be through the of a four side of opening
Three no-welding-spot regions；Wherein, the upper surface of the image sensing chip includes that one second non-conducting areas and a third are non-conductive
Region, second non-conducting areas are connected to a third side of the image sensing chip and a third in the image sensing region
Between side, which is connected to a four side and the one of the image sensing region for the image sensing chip
Between four side；Wherein, second non-conducting areas of the image sensing chip is by one second adhesion to be connected to this
The second no-welding-spot region of circuit substrate, the third non-conducting areas of the image sensing chip by a third adhesion with
It is connected to the third no-welding-spot region of the circuit substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821930065.6U CN209057287U (en) | 2018-11-22 | 2018-11-22 | Image acquiring module and portable electronic device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821930065.6U CN209057287U (en) | 2018-11-22 | 2018-11-22 | Image acquiring module and portable electronic device |
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| Publication Number | Publication Date |
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| CN209057287U true CN209057287U (en) | 2019-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212202A (en) * | 2018-11-22 | 2020-05-29 | 纮华电子科技（上海）有限公司 | Image acquisition module and portable electronic device |
| TWI855465B (en) * | 2022-12-21 | 2024-09-11 | 海華科技股份有限公司 | Image sensor lens and sensing module with externally sealed type |
-
2018
- 2018-11-22 CN CN201821930065.6U patent/CN209057287U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111212202A (en) * | 2018-11-22 | 2020-05-29 | 纮华电子科技（上海）有限公司 | Image acquisition module and portable electronic device |
| TWI855465B (en) * | 2022-12-21 | 2024-09-11 | 海華科技股份有限公司 | Image sensor lens and sensing module with externally sealed type |
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