CN208987225U - 带有电气组件的电气模块 - Google Patents
带有电气组件的电气模块 Download PDFInfo
- Publication number
- CN208987225U CN208987225U CN201590001671.8U CN201590001671U CN208987225U CN 208987225 U CN208987225 U CN 208987225U CN 201590001671 U CN201590001671 U CN 201590001671U CN 208987225 U CN208987225 U CN 208987225U
- Authority
- CN
- China
- Prior art keywords
- module
- sealing
- sealing element
- housing
- recess portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007789 sealing Methods 0.000 claims abstract description 212
- 239000004020 conductor Substances 0.000 claims description 21
- 239000013618 particulate matter Substances 0.000 claims description 5
- 230000002035 prolonged effect Effects 0.000 claims 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 21
- 239000003546 flue gas Substances 0.000 description 21
- 238000004880 explosion Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000001816 cooling Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000006837 decompression Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000002360 explosive Substances 0.000 description 2
- 239000003517 fume Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 208000005189 Embolism Diseases 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
- H01L25/117—Stacked arrangements of devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (18)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2015/081016 WO2017108104A1 (de) | 2015-12-22 | 2015-12-22 | Elektrisches modul mit elektrischer komponente |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208987225U true CN208987225U (zh) | 2019-06-14 |
Family
ID=55168218
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201590001671.8U Active CN208987225U (zh) | 2015-12-22 | 2015-12-22 | 带有电气组件的电气模块 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP3366093B1 (zh) |
CN (1) | CN208987225U (zh) |
ES (1) | ES2837140T3 (zh) |
PL (1) | PL3366093T3 (zh) |
WO (1) | WO2017108104A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT521041B1 (de) | 2018-05-25 | 2019-10-15 | Miba Energy Holding Gmbh | Leistungsbaugruppe mit Schottwand |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9802761D0 (en) * | 1998-02-11 | 1998-04-08 | Raychem Sa Nv | Sealing arrangement |
JP3830919B2 (ja) * | 2003-06-12 | 2006-10-11 | 株式会社東芝 | 大型半導体モジュール |
DE102004062880A1 (de) * | 2004-12-27 | 2006-07-06 | Siemens Ag | Anzeigeinstrument und Verfahren zum Herstellen und zum Demontieren eines Anzeigeinstrumentes |
JP4867280B2 (ja) * | 2005-10-18 | 2012-02-01 | 株式会社ジェイテクト | コーティング剤塗布方法 |
PL2208225T3 (pl) * | 2007-11-13 | 2019-03-29 | Siemens Ag | Moduł półprzewodnikowy mocy |
WO2010102654A1 (de) * | 2009-03-13 | 2010-09-16 | Siemens Aktiengesellschaft | Leistungshalbleitermodul mit schichtweise aufgebauten isolierenden seitenwänden |
DE102011076039A1 (de) | 2011-05-18 | 2012-11-22 | Siemens Aktiengesellschaft | Umrichteranordnung |
DE102013102829B4 (de) * | 2013-03-20 | 2017-10-19 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Anordnung hiermit |
-
2015
- 2015-12-22 CN CN201590001671.8U patent/CN208987225U/zh active Active
- 2015-12-22 WO PCT/EP2015/081016 patent/WO2017108104A1/de active Application Filing
- 2015-12-22 PL PL15825604T patent/PL3366093T3/pl unknown
- 2015-12-22 EP EP15825604.0A patent/EP3366093B1/de active Active
- 2015-12-22 ES ES15825604T patent/ES2837140T3/es active Active
Also Published As
Publication number | Publication date |
---|---|
WO2017108104A1 (de) | 2017-06-29 |
EP3366093B1 (de) | 2020-09-16 |
ES2837140T3 (es) | 2021-06-29 |
EP3366093A1 (de) | 2018-08-29 |
PL3366093T3 (pl) | 2021-04-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20211216 Address after: Munich, Germany Patentee after: Siemens energy Global Ltd. Address before: Munich, Germany Patentee before: SIEMENS AG |
|
TR01 | Transfer of patent right | ||
CP03 | Change of name, title or address |
Address after: Munich, Germany Patentee after: Siemens Energy International Country or region after: Germany Address before: Munich, Germany Patentee before: Siemens energy Global Ltd. Country or region before: Germany |
|
CP03 | Change of name, title or address |