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CN208970496U - A kind of wafer installation clamp system - Google Patents

A kind of wafer installation clamp system Download PDF

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Publication number
CN208970496U
CN208970496U CN201821179834.3U CN201821179834U CN208970496U CN 208970496 U CN208970496 U CN 208970496U CN 201821179834 U CN201821179834 U CN 201821179834U CN 208970496 U CN208970496 U CN 208970496U
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CN
China
Prior art keywords
wafer
slide holder
briquetting
clamp system
lower pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201821179834.3U
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Chinese (zh)
Inventor
刘振辉
林生财
杨波
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silicon electric semiconductor equipment (Shenzhen) Co., Ltd
Original Assignee
SHENZHEN SIDEA SEMICONDUCTOR EQUIPMENT CO Ltd
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Priority to CN201821179834.3U priority Critical patent/CN208970496U/en
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Publication of CN208970496U publication Critical patent/CN208970496U/en
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)

Abstract

The utility model relates to wafer technical fields more particularly to a kind of wafer to install clamp system, and wherein drip irrigation device includes: the lower pressure ring for carrying wafer;Upper press ring match with the lower pressure ring, for compressing wafer edge;The slide holder of the T-shaped installation port in section is offered, the installation port and the lower pressure ring are mutually chimeric;And for compressing the upper press ring, compressing component with the fixation wafer on the slide holder.The utility model wafer installs clamp system, not only easy to accomplish, additionally it is possible to simplify process, to save a large amount of time and manpower.

Description

A kind of wafer installation clamp system
Technical field
The utility model relates to wafer technical fields more particularly to a kind of wafer to install clamp system.
Background technique
In wafer process of manufacture, it is often necessary to wafer is tested, there is a kind of wafer in practice, Tow sides are all the electrode points for needing to have an acupuncture treatment, and wafer tow sides require to guarantee have probe that can touch.
Currently, in test wafer piece needing that first wafer is fixed on bracket or plummer, phase can be generally used Wafer tentatively clamp lower then recycling screw for Boards wall together by symmetrical clamping plate, so that wafer be fixed Firmly.
But the process of above-mentioned fixed wafer is comparatively laborious, needs to spend very big time and manpower, it is therefore desirable to set The structure of one kind easily and effectively is counted to fix wafer.
Utility model content
In view of the deficienciess of the prior art, the purpose of this utility model is to provide a kind of wafers to install clamping machine Structure, it is not only easy to accomplish, additionally it is possible to simplify process, to save a large amount of time and manpower.
The above-mentioned purpose of the utility model has the technical scheme that
A kind of wafer installation clamp system characterized by comprising for carrying the lower pressure ring of wafer;With it is described Upper press ring that lower pressure ring matches, for compressing wafer edge;The slide holder of the T-shaped installation port in section is offered, The installation port and the lower pressure ring are mutually chimeric;And for compressing the upper press ring, with solid on the slide holder The fixed wafer compresses component.
Using the above scheme, when needing to carry out wafer installation clamping, wafer is placed in lower pressure ring first, Then the edge of wafer is compressed with upper press ring, it is then that preliminary clamping wafer and the installation port on slide holder is mutually embedding It closes, finally upper press ring is pressed against using compressing component, preferably to fix wafer, through the above scheme, is not only easy It realizes, additionally it is possible to simplify process, to save a large amount of time and manpower.
The utility model is further arranged: being mounted on the slide holder, extending direction and the slide holder loading end phase Vertical rotary shaft;Briquetting mutually being assembled with the rotary shaft end, for compressing the upper press ring;It is threaded in described Stop nut of the rotary shaft far from described briquetting one end;And for limiting the locating part of briquetting on the slide holder.
Using the above scheme, when wafer is put on slide holder, being used cooperatively for rotary shaft and briquetting can be compressed Upper press ring, so that wafer be made preferably to be fixed on slide holder;The setting of stop nut can limit rotary shaft, to subtract The situation of few any activity of rotary shaft;And the setting of locating part, briquetting can be further limited.
The utility model is further arranged: the locating part includes: to be vertically installed on the slide holder in hollow form Top pillar;The spring being mounted on inside the top pillar;And the elasticity that can be connected with the spring at the top of the top pillar is set Ball, the briquetting offer the groove to match with the elastic ball close to the end face of top pillar.
Using the above scheme, the setting of top pillar picks and places slide holder convenient for artificial;And the setting of elastic ball, it on the one hand can be with The frictional force between briquetting and slide holder is reduced, makes the contact surface between briquetting and elastic ball become to roll from sliding, another party What face can increase briquetting compresses power, contradicts the one end of briquetting far from top pillar closely on upper press ring, meanwhile, elastic ball Can be mutually chimeric with the groove on briquetting, limit can be played the role of to briquetting.
The utility model is further arranged: the lower pressure ring is equipped with multiple positioning pins with the touching of wafer side edge, The dowel hole to match with the positioning pin is offered on the upper press ring.
It using the above scheme,, can be to wafer side by the positioning pin of lower pressure ring when wafer is placed in lower pressure ring Edge is tentatively limited, meanwhile, the dowel hole of upper press ring and the positioning pin of lower pressure ring are mutually chimeric, can be further by wafer Piece is limited between upper press ring and lower pressure ring.
The utility model is further arranged: being fixed on the corresponding position of the slide holder loading end for limiting the pressure The spacer pin of block rotation.
Using the above scheme, the setting of spacer pin can limit briquetting, make a reservation for so that briquetting is quickly rotated to slide holder On position.
The utility model is further arranged: the briquetting is equipped with and the elastic ball phase close to the end face edge of the top pillar The inclined surface of contact.
Using the above scheme, inclined surface can reduce the frictional force between elastic ball so that elastic ball quickly with pressure Groove on block is mutually chimeric.
The utility model is further arranged: the slide holder loading end offers several ports for picking and placing lower pressure ring.
Using the above scheme, the setting of port can be convenient pressure ring under artificial pick and place, when so as to save more Between, and then improve working efficiency.
The utility model is further arranged: multiple mounting holes are offered on the slide holder.
Using the above scheme, the setting of mounting hole can be convenient the installation and removal of slide holder, at the same time it can also save Material cost.
In conclusion the utility model has the following beneficial effects:
1. by the way that lower pressure ring, upper press ring, slide holder is arranged and compresses component, the mutual cooperation of upper press ring and lower pressure ring, Wafer can be tentatively limited, and compresses component, then can further compress upper press ring, so that wafer is fixed more steady Gu this structure is not only easy to accomplish, additionally it is possible to simplify process, to save a large amount of time and manpower;
2. on the one hand the setting of elastic ball can reduce the frictional force between briquetting and slide holder, make briquetting and elastic ball Between contact surface become to roll from sliding, on the other hand can increase the bearing capacity of briquetting, contradict briquetting closely On upper press ring, and elastic ball can also play the role of limit to briquetting.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model embodiment 1;
Fig. 2 is the enlarged drawing in Fig. 1 at A;
Fig. 3 is the positional diagram of top pillar and rotary shaft in the utility model embodiment 1;
Fig. 4 is the positional diagram of positioning pin and dowel hole in the utility model embodiment 1;
Fig. 5 is the positional diagram of bracket, connecting rod and press block in the utility model embodiment 2.
Appended drawing reference: 1, lower pressure ring;11, positioning pin;2, upper press ring;21, dowel hole;3, slide holder;4, rotary shaft; 41, briquetting;42, stop nut;5, top pillar;51, spring;52, elastic ball;6, spacer pin;7, inclined surface;8, port;9, it installs Hole;10, bracket;101, connecting rod;102, press block.
Specific embodiment
The utility model is described in further detail below in conjunction with attached drawing.
This specific embodiment is only the explanation to the utility model, is not limitations of the present invention, ability Field technique personnel can according to need the modification made to the present embodiment and do not create contribution after reading this specification, but only It will be in the scope of the claims of the utility model all by the protection of Patent Law.
Embodiment 1: a kind of wafer installation clamp system, as shown in Figure 1, comprising: it is logical to offer the T-shaped installation in section The slide holder 3 of mouth, the lower pressure ring 1(for carrying wafer are as shown in Figure 4), and the upper press ring 2 to match with lower pressure ring 1, Upper press ring 2 can be used to compress wafer edge, and the installation port of slide holder 3 and lower pressure ring 1 are mutually chimeric, on slide holder 3 It is equipped with and compresses component, compressing component can be used to compress upper press ring 2, so that wafer is fixed on upper press ring 2 and lower pressure ring 1 Between.
As shown in figure 3, in the present embodiment, compress component include: be mounted on slide holder 3, extending direction and slide holder 3 The perpendicular rotary shaft 4 of loading end, and the briquetting 41 mutually assembled with 4 end of rotary shaft, briquetting 41 can be used to compress pressure Ring 2 is connected with stop nut 42 far from the threaded one end of briquetting 41 in rotary shaft 4, and stop nut 42 can be used to limit rotation Axis 4 loosens the case where sliding from slide holder 3 to reduce rotary shaft 4, installs finite place piece on slide holder 3, and locating part can be with For limiting briquetting 41, one end of upper press ring 2 is provided with arc angling in briquetting 41, when briquetting 41 compresses upper press ring 2, Arc angling will not block the end face of wafer, can keep more operating spaces here to the detection of wafer.
In the present embodiment, as shown in Fig. 2, locating part includes: the top pillar 5 being vertically installed on slide holder 3 in hollow form, And it is mounted on the spring 51 inside top pillar 5, the elastic ball 52 being connected with spring 51 is installed at the top of top pillar 5, in briquetting 41 open up the groove to match with elastic ball 52 close to the end face of top pillar 5, and the use of top pillar 5 can be in order to manually picking and placing slide holder 3, the setting of elastic ball 52 can form certain conflict power close to one end of top pillar 5 to briquetting 41, make briquetting 41 far from top pillar 5 one end can closely be contradicted in the upper surface of upper press ring 2.
As shown in figure 4, being fixed with multiple positioning pins 11 on lower pressure ring 1, positioning pin 11 can be with wafer side edge Touching, also offers the dowel hole 21 to match with positioning pin 11 on upper press ring 2, when wafer is placed in lower pressure ring 1, leads to The positioning pin 11 of pressure ring 1 is crossed down, wafer edge can tentatively be limited, meanwhile, the dowel hole 21 of upper press ring 2 is under The positioning pin 11 of pressure ring 1 is mutually chimeric, and further wafer can be limited between upper press ring 2 and lower pressure ring 1.
It is as shown in Figure 1 that spacer pin 6(is fixed on the corresponding position of 3 loading end of slide holder), spacer pin 6 can be used to limit Briquetting 41 processed, so that briquetting 41 is quickly rotated to the predetermined position of slide holder 3;In briquetting 41 close to the end face edge of top pillar 5 Equipped with inclined surface 7, inclined surface 7 and elastic ball 52(are as shown in Figure 2) it is in contact, inclined surface 7 can be reduced between elastic ball 52 Frictional force so that elastic ball 52 is quickly mutually chimeric with the groove on briquetting 41.
In addition, offering several ports 8 in 3 loading end of slide holder, port 8 can be used to pick and place lower pressure ring 1, meanwhile, Slide holder 3 offers multiple mounting holes 9, can be convenient the installation and removal of slide holder 3, at the same time it can also save material cost.
When needing to carry out wafer installation clamping, wafer is placed in lower pressure ring 1 first, passes through lower pressure ring 1 Positioning pin 11, wafer circumference is limited, then the positioning pin 11 of the dowel hole 21 on upper press ring 2 and lower pressure ring 1 It is mutually chimeric, further wafer can be limited between upper press ring 2 and lower pressure ring 1, the wafer that finally will tentatively clamp It being put on slide holder 3 by installing port, upper press ring 2 is pushed down in the rotation of briquetting 41 on slide holder 3, so that wafer is compressed, Such structure is not only easy to accomplish, additionally it is possible to simplify process, to save a large amount of time and manpower.
Embodiment 2: as shown in figure 5, difference from example 1 is that compress the difference of component, in the present embodiment, Compressing component includes: the bracket 10 being threaded on 3 loading end of slide holder, and, it is set in the connecting rod of 10 one end of bracket 101, connecting rod 101 is parallel to the loading end of slide holder 3, and bracket 10 is cylinder, and bracket 10 can rotate certain angle Degree, is arranged with spring in connecting rod 101, meanwhile, press block 102, press block 102 are fixed in the other end of connecting rod 101 It can be pressed on the upper surface of upper press ring 2, to wafer be fixed, on the side that press block 102 is connect with connecting rod 101 Through-hole is offered, through-hole matches with connecting rod 101, keeps press block 102 for linear motion along connecting rod 101, when supporting When briquetting 102 is mobile, deformation occurs for spring, generates certain pressure to wafer edge by press block 102, consolidates wafer It is fixed.

Claims (8)

1. a kind of wafer installs clamp system characterized by comprising for carrying the lower pressure ring (1) of wafer;
Upper press ring (2) match with the lower pressure ring (1), for compressing wafer edge;Offer the T-shaped peace in section The slide holder (3) of port is filled, the installation port is mutually chimeric with the lower pressure ring (1);And it is set to the slide holder (3) On for compressing the upper press ring (2), compressing component with the fixation wafer.
2. a kind of wafer according to claim 1 installs clamp system, which is characterized in that the component that compresses includes: It is mounted on the slide holder (3), extending direction and the perpendicular rotary shaft (4) of the slide holder (3) loading end;With the rotation Briquetting (41) that shaft (4) end is mutually assembled, for compressing the upper press ring (2);It is remote to be threaded in the rotary shaft (4) Stop nut (42) from the briquetting (41) one end;And it is set on the slide holder (3) for limiting the limit of briquetting (41) Position part.
3. a kind of wafer according to claim 2 installs clamp system, which is characterized in that the locating part includes: perpendicular Directly it is mounted on the top pillar (5) on the slide holder (3) in hollow form;It is mounted on the internal spring (51) of the top pillar (5);With And the elastic ball (52) that setting can be connected at the top of the top pillar (5) with the spring (51), the briquetting (41) is close to top The end face of column (5) offers the groove to match with the elastic ball (52).
4. a kind of wafer according to claim 1 installs clamp system, which is characterized in that set on the lower pressure ring (1) There are multiple positioning pins (11) with the touching of wafer side edge, is offered and the positioning pin (11) phase on the upper press ring (2) Matched dowel hole (21).
5. a kind of wafer according to claim 2 installs clamp system, which is characterized in that slide holder (3) carrying The spacer pin (6) for limiting the briquetting (41) rotation is fixed on the corresponding position in face.
6. a kind of wafer according to claim 3 installs clamp system, which is characterized in that the briquetting (41) is close to institute The end face edge for stating top pillar (5) is equipped with the inclined surface (7) being in contact with the elastic ball (52).
7. a kind of wafer according to claim 1 installs clamp system, which is characterized in that slide holder (3) carrying Face offers several ports (8) for picking and placing lower pressure ring (1).
8. a kind of wafer according to claim 1 installs clamp system, which is characterized in that opened on the slide holder (3) Equipped with multiple mounting holes (9).
CN201821179834.3U 2018-07-24 2018-07-24 A kind of wafer installation clamp system Active CN208970496U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821179834.3U CN208970496U (en) 2018-07-24 2018-07-24 A kind of wafer installation clamp system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821179834.3U CN208970496U (en) 2018-07-24 2018-07-24 A kind of wafer installation clamp system

Publications (1)

Publication Number Publication Date
CN208970496U true CN208970496U (en) 2019-06-11

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ID=66748970

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201821179834.3U Active CN208970496U (en) 2018-07-24 2018-07-24 A kind of wafer installation clamp system

Country Status (1)

Country Link
CN (1) CN208970496U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110646430A (en) * 2019-10-29 2020-01-03 太极半导体(苏州)有限公司 Wafer inspection tool
CN114540798A (en) * 2022-03-03 2022-05-27 江西汉可泛半导体技术有限公司 Anti-falling device for silicon wafer coating

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110646430A (en) * 2019-10-29 2020-01-03 太极半导体(苏州)有限公司 Wafer inspection tool
CN114540798A (en) * 2022-03-03 2022-05-27 江西汉可泛半导体技术有限公司 Anti-falling device for silicon wafer coating

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Address after: Longgang District of Shenzhen City, Guangdong province 518172 city street in the center city City Industrial Park Road No. 3 building E Tefalongfei business building two floor

Patentee after: Silicon electric semiconductor equipment (Shenzhen) Co., Ltd

Address before: Longgang District of Shenzhen City, Guangdong province 518172 city street in the center city City Industrial Park Road No. 3 building E Tefalongfei business building two floor

Patentee before: SHENZHEN SIDEA SEMICONDUCTOR EQUIPMENT Co.,Ltd.