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CN208938543U - Cover board and display device - Google Patents

Cover board and display device Download PDF

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Publication number
CN208938543U
CN208938543U CN201821347750.6U CN201821347750U CN208938543U CN 208938543 U CN208938543 U CN 208938543U CN 201821347750 U CN201821347750 U CN 201821347750U CN 208938543 U CN208938543 U CN 208938543U
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China
Prior art keywords
layer
ink layer
cover board
substrate
ink
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CN201821347750.6U
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Chinese (zh)
Inventor
时永祥
蔡宝鸣
李建伟
卜德军
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BOE Technology Group Co Ltd
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BOE Technology Group Co Ltd
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Priority to CN201821347750.6U priority Critical patent/CN208938543U/en
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Abstract

The utility model relates to a kind of cover board and display devices.Wherein, substrate, be provided with substrate side hardened layer, be arranged in substrate the other side ink layer and flexible layer;Wherein, the flexible layer is set among the ink layer or side of the ink layer far from substrate.Above-described embodiment; by being conducive to protect ink layer, can be avoided the generation due to the problem of bending leads to ink fault rupture among ink layer or ink layer far from the side of substrate is provided with flexible layer; the shading performance for guaranteeing ink layer, to improve the quality of cover board.

Description

Cover board and display device
Technical field
The utility model relates to field of display technology more particularly to cover board and display devices.
Background technique
The occupation rate of market of Flexible Displays product is increasing at present, and Flexible Displays product can realize different curlings Property and folding property.For the Flexible Displays product that can be crimped or fold, not only have to luminescent device itself higher resistance to Bending requires, and has very high bending resistance requirement for such as polaroid, OCA glue, cover board etc..
For Flexible Displays cover board, mainly adds the structure of hardened layer in industry using flexible base board at present, cover simultaneously Edges of boards edge will also print ink to form display window mouth region.However, inventor (s) has found that ink is easy to happen in bending process Fracture, to will affect the normal use of product.
Utility model content
The utility model provides cover board and display device, to solve deficiency in the related technology.
According to the utility model embodiment in a first aspect, providing a kind of cover board.The cover board includes substrate, is provided with base The hardened layer of plate side, be arranged in substrate the other side ink layer and flexible layer;Wherein, the flexible layer is set to described Among ink layer or side of the ink layer far from the substrate.
In some embodiments, the ink layer includes being set to the first ink layer of the substrate and being set to described the Second ink layer of one ink layer far from the substrate side;Wherein, the flexible layer is set to first ink layer and Between two ink layers, or, the flexible layer is set to the side of second ink layer far from the substrate.
In some embodiments, the ink layer is set to edge of the substrate far from the hardened layer side.
In some embodiments, the material of the flexible layer includes thermoplastic polyurethane, silicon rubber, poly terephthalic acid second At least one of diol ester, polyimides.
In some embodiments, the flexible layer 40 with a thickness of 1 μm~6 μm.
In some embodiments, first ink layer 31 with a thickness of 4 μm~6 μm;And/or second ink layer 31 with a thickness of 4 μm~6 μm.
In some embodiments, the substrate with a thickness of 50 μm~150 μm.
In some embodiments, the hardened layer with a thickness of 5 μm~15 μm.
In some embodiments, the substrate is flexible base board.
According to the second aspect of the utility model embodiment, a kind of display device is provided.The display device includes as above The panel that the cover board and the cover board are oppositely arranged and the adhesive layer being set between the cover board and panel, wherein The hardened layer of the cover board is arranged away from the panel.
According to above-described embodiment it is found that by among ink layer or ink layer far from substrate side be arranged it is flexible Layer is conducive to protect ink layer, can be avoided the generation due to the problem of bending leads to ink fault rupture, guarantee the screening of ink layer Optical property improves the quality of cover board.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not The utility model can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows and meets the utility model Embodiment, and be used to explain the principles of the present invention together with specification.
Fig. 1 is the structural schematic diagram according to a kind of cover board shown in the utility model embodiment;
Fig. 2 is the structural schematic diagram according to another cover board shown in the utility model embodiment;
Fig. 3 is the structural schematic diagram according to another cover board shown in the utility model embodiment;
Fig. 4 is the structural schematic diagram according to a kind of display device shown in the utility model embodiment;
Fig. 5 is the flow chart formed according to a kind of cover board shown in the utility model embodiment;
Fig. 6 is the flow chart formed according to another cover board shown in the utility model embodiment.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment Described in embodiment do not represent all embodiments consistent with the utility model.On the contrary, they be only with such as The example of the consistent device and method of some aspects be described in detail in the appended claims, the utility model.
Fig. 1 is the structural schematic diagram according to a kind of cover board 100 shown in the utility model embodiment.The cover board 100 can be used In the display device of the electronic equipments such as mobile phone, computer, TV.The cover board 100 includes substrate 10, is provided with the hard of 10 side of substrate Change layer 20 and the ink layer 30 of the other side of substrate 10 is set.Wherein, among ink layer 30 or ink layer 30 is far from base The side of plate 10 is provided with flexible layer 40, is conducive to protect ink layer 30, can be reduced or avoided due to bending and lead to ink The generation for the problem of layer 30 is broken guarantees the shading performance of ink layer 30, the quality of cover board 100 is improved, to improve whole production The yield of product.
In some embodiments, substrate 10 is flexible base board.For example, can be used polyimides flexible (Polyimide, ) etc. PI materials are fabricated.
Further, ink layer 30 is set to edge of the substrate 10 far from 20 side of hardened layer.For example, ink layer 30 Outer edge 301 can be flushed substantially with the outer edge 101 of substrate 10.Ink layer 30 is extended inwardly a pre-determined distance from outer edge 301.
Further, in some embodiments, ink layer 30 includes the first ink layer 31, Yi Jishe for being set to substrate 10 It is placed in second ink layer 32 of first ink layer 31 far from 10 side of substrate.And flexible layer 40 is set to the first ink layer 31 and Between two ink layers 32.So set, flexible layer 40 can act the first ink layer 31 and the second ink layer 32 that are located at two sides To good protective effect.
Further, the material of flexible layer 40 include thermoplastic polyurethane (Thermoplastic polyurethanes, TPU), silicon rubber, polyethylene terephthalate (Polyethylene terephthalate, PET), polyimides At least one of (Polyimide, PI) etc..For example, TPU.TPU and the combination of silicon rubber etc. for another example.
Further, in some embodiments, flexible layer 40 with a thickness of 1 μm~6 μm.Preferably, the thickness of flexible layer 40 Degree is 2 μm~3 μm, in the case where guaranteeing to meet to the first ink layer 31 and the protection of the second ink layer 32, is more conducively covered The bending of plate 100.
Further, in some embodiments, the edge of flexible layer 40 is substantially substantially flush with the edge of ink layer 30.Than Such as, the outer edge 401 of flexible layer 40 and the outer edge 301 of ink layer 30 can be substantially flush, and the inward flange 402 of flexible layer 40 It is substantially flush with the inward flange 302 of ink layer 30.Then in the junction of flexible layer 40 and ink layer 30,40 upper surface of flexible layer Area it is roughly the same with the area of 30 lower surface of ink layer.Certainly, the area of 40 upper surface of flexible layer is slightly larger than or is slightly less than The area of 30 lower surface of ink layer is also possible, and the application does not limit this, and can be configured according to specific application environment.
Further, in some embodiments, the first ink layer 31 with a thickness of 4 μm~6 μm.The thickness of second ink layer 32 Degree is 4 μm~6 μm.In further embodiments, the first ink layer 31 with a thickness of 4 μm~6 μm, and the thickness of the second ink layer 32 Degree without limitation, can be configured according to specific application environment.In yet other embodiments, the second ink layer 32 with a thickness of 4 μ M~6 μm, and the thickness of the first ink layer 31 is without limitation, can be configured according to specific application environment.
Further, in some embodiments, substrate 10 with a thickness of 50 μm~150 μm.Such as 60 μm, 70 μm, 80 μm, 90μm、100μm、110μm……。
Further, in some embodiments, hardened layer 20 with a thickness of 5 μm~15 μm.Such as 7 μm, 8 μm, 9 μm, 10 μ m,11μm,12μm…….The setting of the hardened layer 20 is conducive to protective substrate 10, and substrate 10 is avoided to be scratched or damage.
In above-described embodiment, the setting of flexible layer 40 can be reduced or avoided due to bending and ink layer 30 is caused to be broken The problem of generation, guarantee ink layer 30 shading performance, improve cover board 100 quality, to improve the yield of integral product. Further, ink layer 30 uses substantially 4 μm~6 μm of thickness of the first ink layer 31 and the second ink layer 32, relative to phase In the technology of pass frequently with ink layer for, thickness is relatively small, be conducive to the bending of cover board 100, and be conducive to improve oil The setting precision of layer of ink.In addition, the first ink layer 31 and the second ink layer 32 to be located to the two sides of flexible layer, so that single layer Ink layer relative in the related technology frequently with ink layer for thickness it is smaller, be more advantageous to the bending of cover board 100.
Fig. 2 is the structural schematic diagram according to another cover board 200 shown in the utility model embodiment.The cover board 200 can Display device for electronic equipments such as mobile phone, computer, TVs.Structure possessed by the cover board 200 of the present embodiment and aforementioned reality The structure for applying a cover board 100 is roughly the same.It is thus used in figure with the identical or essentially identical structure of preceding embodiment identical Label.The unique distinction of cover board 200 is introduced below.
In cover board 200, the second ink layer 32 is set to the side of the separate substrate 10 of the first ink layer 31.And flexible layer 40 The side (side i.e. far from substrate 10) far from the first ink layer 31 of second ink layer 32 is set.I.e. in cover board 200, the One ink layer 31 and the second ink layer 32 are set to together, so that ink layer 30 is formed, and flexible layer 40 is arranged in ink layer 30 Separate substrate 10 side.
In the present embodiment, the setting of flexible layer 40 in cover board 200 is equally beneficial for protection ink layer 30, advantageously reduces Or avoid the problem that the generation for causing ink layer 30 to be broken due to bending, guarantee the shading performance of ink layer 30, improves cover board 100 quality.
Fig. 3 is the structural schematic diagram according to another cover board 300 shown in the utility model embodiment.The cover board 300 can Display device for electronic equipments such as mobile phone, computer, TVs.Structure possessed by the cover board 300 of the present embodiment and aforementioned reality The structure for applying a cover board 200 is roughly the same.It is thus used in figure with the identical or essentially identical structure of preceding embodiment identical Label.Cover board 300 and cover board 200 are the difference is that the ink layer 30 of cover board 300 is one layer of structure.The ink layer 30 can lead to It crosses obtained by one-step print.Certainly, in some embodiments, the first ink layer 31 of the thickness of the ink layer 30 and cover board 200 and The sum of the thickness of second ink layer 32 is roughly equal.For example, the thickness of the ink layer 30 can be substantially 8 μm~12 μm.
In the present embodiment, the setting of flexible layer 40 in cover board 300 is equally beneficial for protection ink layer 30, advantageously reduces Or avoid the problem that the generation for causing ink layer 30 to be broken due to bending, guarantee the shading performance of ink layer 30, improves cover board 100 quality.
The application also provides a kind of manufacturing method of cover board 100, as shown in Figure 5.Substrate 10, and the one of substrate 10 are provided Side is provided with hardened layer 20.Specific manufacturing method includes the following steps S11, S13 and S15.
In step s 11, the first ink layer 31 is formed on the substrate 10.
Specifically, first ink layer 31 can be formed in the side of the separate hardened layer 20 of substrate 10 by way of printing. The thickness of first ink layer 31 can be controlled in 4 μm~6 μm.
In step s 13, flexible layer 40 is formed far from the side of substrate 10 in the first ink layer 31.
Specifically, the solution of flexible material or slurry can be coated on to the first side of the ink layer 31 far from substrate 10, shape At flexible material layer.And then curing process, such as heat cure processing are carried out to flexible material layer, to form flexible layer 40.Its In, flexible material includes thermoplastic polyurethane (Thermoplastic polyurethanes, TPU), silicon rubber, gathers to benzene two In formic acid glycol ester (Polyethylene terephthalate, PET), polyimides (Polyimide, PI) etc. at least It is a kind of.For example, TPU.TPU and the combination of silicon rubber etc. for another example.
In step S15, the second flexible layer 32 is formed in the side of the separate substrate 10 of flexible layer 40.
Specifically, equally the second flexible layer can be formed far from the side of substrate 10 in flexible layer 40 by way of printing 32。
It should be noted that above-mentioned steps S11 and S13 can be used in the manufacturing method of above-mentioned cover board 300, without step S15.Unlike, during manufacturing cover board 300, in step s 11, printed in the side of the separate hardened layer 20 of substrate 10 When ink layer 30, the thickness of printed ink layer 30 can be larger with respect to the thickness of the first ink layer 31.
The application also provides a kind of manufacturing method of cover board 200, as shown in Figure 6.Substrate 10, and the one of substrate 10 are provided Side is provided with hardened layer 20.Specific manufacturing method includes the following steps S21, S23 and S25.
In the step s 21, the first ink layer 31 is formed on the substrate 10.
The operation of step S21 is roughly the same with the operation of above-mentioned steps S11.Specifically refer to the phase in above-mentioned steps S11 Description is closed, is not repeated herein.
In step S23, the second flexible layer 32 is formed in the side of the separate substrate 10 of the first ink layer 31.
Specifically, the operation of step S23 can be realized by way of printing.
In step s 25, flexible layer 40 is formed far from the side of substrate 10 in the second ink layer 32.
The operation of step S25 is roughly the same with the operation of above-mentioned steps S13, specifically can refer to the phase in above-mentioned steps S13 Description is closed, is not repeated herein.
It should be noted that in the manufacturing method of above-mentioned cover board 100 (or 200 or 300), the hardened layer 20 on substrate 10 It can not preset.For example, can be arranged when forming ink layer 30 or flexible layer 40 or later.The application does not limit this It is fixed, it can be configured according to specific application environment.
In addition, the application also provides a kind of display device 1, as shown in Figure 4.The display device 1 includes above-mentioned cover board The panel 500 and be set to cover board 100 and panel that 100 (or 200 or 300) and cover board 100 (or 200 or 300) are oppositely arranged Adhesive layer 600 between 500, wherein the hardened layer 20 of cover board is arranged away from panel 500.For example, then being covered by taking cover board 100 as an example The hardened layer 20 of plate 100 is arranged away from panel 500, and the second ink layer 302 of cover board 100 is arranged towards panel 500.
In some embodiments, panel 500 can be understood as oled panel.
In the present invention, term " first ", " second " are used for description purposes only, and are not understood to indicate or imply Relative importance.Term " multiple ", " several " refer to two or more, unless otherwise restricted clearly.
Those skilled in the art will readily occur to the utility model after considering specification and practicing disclosure disclosed herein Other embodiments.The utility model is intended to cover any variations, uses, or adaptations of the utility model, these Variations, uses, or adaptations follow the general principle of the utility model and including undocumented skills of the utility model Common knowledge or conventional techniques in art field.The description and examples are only to be considered as illustrative, the utility model True scope and spirit are indicated by the following claims.
It should be understood that the utility model is not limited to the accurate knot for being described above and being shown in the accompanying drawings Structure, and various modifications and changes may be made without departing from the scope thereof.The scope of the utility model is only wanted by appended right It asks to limit.

Claims (10)

1. a kind of cover board characterized by comprising substrate is provided with the hardened layer of substrate side, the other side of substrate is arranged in Ink layer and flexible layer;Wherein, the flexible layer is set among the ink layer or the ink layer is far from the base The side of plate.
2. cover board as described in claim 1, which is characterized in that the ink layer includes the first ink for being set to the substrate Layer and be set to second ink layer of first ink layer far from the substrate side;Wherein, the flexible layer is set to institute It states between the first ink layer and the second ink layer, or, the flexible layer is set to second ink layer far from the substrate Side.
3. cover board as described in claim 1, which is characterized in that the ink layer is set to the substrate far from the hardened layer The edge of side.
4. cover board as described in claim 1, which is characterized in that the material of the flexible layer includes thermoplastic polyurethane, silicon rubber At least one of glue, polyethylene terephthalate, polyimides.
5. cover board as described in claim 1, which is characterized in that the flexible layer with a thickness of 1 μm~6 μm.
6. cover board as claimed in claim 2, which is characterized in that first ink layer with a thickness of 4 μm~6 μm;And/or Second ink layer with a thickness of 4 μm~6 μm.
7. cover board as described in claim 1, which is characterized in that the substrate with a thickness of 50 μm~150 μm.
8. cover board as described in claim 1, which is characterized in that the hardened layer with a thickness of 5 μm~15 μm.
9. cover board as described in claim 1, which is characterized in that the substrate is flexible base board.
10. a kind of display device characterized by comprising cover board as claimed in any one of claims 1-9 wherein and the lid The panel that plate is oppositely arranged and the adhesive layer being set between the cover board and panel, wherein the hardening of the cover board Layer is arranged away from the panel.
CN201821347750.6U 2018-08-20 2018-08-20 Cover board and display device Active CN208938543U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110473471A (en) * 2019-08-14 2019-11-19 新纶科技(常州)有限公司 A kind of flexible display screen cover board
CN111402730A (en) * 2020-03-25 2020-07-10 武汉华星光电半导体显示技术有限公司 Cover plate, manufacturing method thereof and display device
WO2021031537A1 (en) * 2019-08-22 2021-02-25 武汉华星光电半导体显示技术有限公司 Flexible cover panel, flexible display device, and method for manufacturing flexible cover panel

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110473471A (en) * 2019-08-14 2019-11-19 新纶科技(常州)有限公司 A kind of flexible display screen cover board
CN110473471B (en) * 2019-08-14 2021-11-23 新纶电子材料(常州)有限公司 Flexible display screen cover plate
WO2021031537A1 (en) * 2019-08-22 2021-02-25 武汉华星光电半导体显示技术有限公司 Flexible cover panel, flexible display device, and method for manufacturing flexible cover panel
CN111402730A (en) * 2020-03-25 2020-07-10 武汉华星光电半导体显示技术有限公司 Cover plate, manufacturing method thereof and display device
WO2021189535A1 (en) * 2020-03-25 2021-09-30 武汉华星光电半导体显示技术有限公司 Cover plate and manufacturing method therefor, and display apparatus
CN111402730B (en) * 2020-03-25 2021-11-23 武汉华星光电半导体显示技术有限公司 Cover plate, manufacturing method thereof and display device

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