CN208926382U

CN208926382U - percutaneous microneedle array patch

Info

Publication number: CN208926382U
Application number: CN201820441256.XU
Authority: CN
Inventors: 黄荣堂; 李冠廷; 钱大宏
Original assignee: Richhealth Technology Corp
Current assignee: Qian Dahong
Priority date: 2018-03-29
Filing date: 2018-03-29
Publication date: 2019-06-04
Anticipated expiration: 2028-03-29

Abstract

A transdermal microneedle array patch comprising: a lower cover; an upper cover; the substrate is arranged inside the upper cover; the first probe and the second probe are arranged between the lower cover and the upper cover and are electrically connected with the substrate, wherein the first probe and the second probe are disconnected; when the lower cover is combined with the upper cover to form the transdermal microneedle array patch, a passage is formed between the first probe and the second probe.

Description

Percutaneous microneedle array patch

Technical field

The utility model relates to a kind of percutaneous microneedle array patch, espespecially a kind of deserted percutaneous microneedle array patch.

Background technique

The tissue fluid of human body is mainly flowed in subcutaneous tissue.Due to tissue fluid amino acid rich in, fatty acid, sugar, Waste caused by salt, hormone, coenzyme and cell etc., therefore through the mode of each constituent concentration in analysis tissue fluid, can have Effect judges body physiological state.

In another example drug can also discharge for a long time and slowly in tissue fluid, and have dense when taking or injection drug The variation of degree, thus analyze tissue fluid drug concentration, also can effective monitoring drug effect.

Existing physiological detection equipment is mostly worn out in a manner of cuticula carrys out extracting interstitial fluid by acupuncture treatment and carries out analysis detection, Such as transcutaneous sensor etc., the low invasive puncture of this transcutaneous sensor can effectively mitigate the pain of user, and simultaneously may be used Acquire tissue fluid.

However, existing physiological detection equipment not can use for a long time, such as transcutaneous sensor mostly can only single detection, If that must replace a new transcutaneous sensor when must detect again, and the data detected all can directly spread out of to reader or It is mobile phone, transcutaneous sensor itself can't save data.Also, existing physiological detection equipment is in continuous detection a period of time When, detection can not be interrupted halfway, has the defect of waste systematic electricity, and frequently replacement transcutaneous sensor also has waste of resource Problem.

Utility model content

The main purpose of the utility model is to provide a kind of percutaneous microneedle array patches, comprising: lower cover；Upper cover；Substrate, Inside upper cover；And first probe and the second probe, it is set between lower cover and upper cover and is electrically connected substrate, wherein the It is open circuit between one probe and the second probe；Wherein, lower cover combination upper cover is when forming percutaneous microneedle array patch, the first probe and Access is formed between second probe.

By the separation of lower cover and upper cover and the design of detachable of the percutaneous microneedle array patch of the utility model, can distinguish Micropin group set is set to lower cover, signal processing unit and power supply unit and is set to upper cover, two spies are made after lower cover and top cover combination Access is formed between needle, and signal processing unit can be made to start, and then enables micropin group set obtain voltage appropriate to make subcutaneous group The ferment that knitting the determinand in liquid can close with micropin group collection is electrochemically reacted, and the electric signal reacted can be by signal Reason unit is read out and intercepts.User can replace the lower cover part comprising micropin group set easily, include without replacing The upper cover part of signal processing unit and power supply unit, and because needing to monitor for a long time, detection can be interrupted in midway, can avoid because replacing The signal processing unit changed in cover and the situation for causing data to be lost, can also be adjusted according to use demand using the time and Has the effect of saving systematic electricity.

Detailed description of the invention

Fig. 1 is the combination diagram of the percutaneous microneedle array patch of the utility model；

Fig. 2 is the diagrammatic cross-section of the percutaneous microneedle array patch of the utility model；

Fig. 3 is the diagrammatic cross-section of substrate in X-X line segment in Fig. 1；

Fig. 4 is the combination schematic front view of another embodiment of the percutaneous microneedle array patch of the utility model；

Fig. 5 is the combination diagrammatic rear view of the another embodiment of the percutaneous microneedle array patch of the utility model；

Fig. 6 is the schematic diagram that micropin group collection unifies embodiment in the percutaneous microneedle array patch of the utility model；

Fig. 7 is the schematic diagram of another embodiment of micropin group set in the percutaneous microneedle array patch of the utility model；

Fig. 8 is the diagrammatic cross-section of another embodiment of the percutaneous microneedle array patch of the utility model；And

Fig. 9 is the diagrammatic cross-section of substrate in Fig. 8.

Component label instructions

1: percutaneous microneedle array patch

11: lower cover

111: 312: the second thin slice of first surface

112: second surface 3121: the second is perforated

113: 3122: the second bur of sheet metal

12: upper cover 3123: barb

121: inner surface 3124: leading handle

122: signal processing unit 313: third thin slice

123: power supply unit 3131: third perforation

13: probe 3132: third bur

14: 314: the four thin slice of substrate

141: dielectric layer 3141: the four is perforated

142: 3142: the four bur of line layer

143: 32: the second micropin group of insulating layer

144: opening 321: thin slice

15: current path 3211: perforation

16: micropin group set 3212: bur

17: skin 3213: barb

18: electric contact 3214: leading handle

19: conductive column 33: third micropin group

20: flexible gasket 331: thin slice

21: opening 3311: perforation

31: the first micropin groups 3312: bur

311: the first thin slices 3313: barb

3111: the first perforation 3314: handle is led

3112: the first burs

Specific embodiment

The embodiments of the present invention is illustrated by particular specific embodiment below, and those skilled in the art Other advantages and effect of the utility model can be understood easily by content disclosed in the present specification, it also can be by other differences Specific embodiment implemented or applied.

Fig. 1, Fig. 2 and Fig. 3 are please referred to, the percutaneous microneedle array patch 1 of the utility model includes lower cover 11 and upper cover 12. Lower cover 11 has first surface 111 and the second surface 112 relative to first surface 111, and first surface 111 is equipped with a metal Piece 113.Substrate 14 is equipped with inside upper cover 12, substrate 14 has two probes 13 of the inner surface 121 for exposing to upper cover 12, wherein Off state is presented in two probes 13 each other.

In an embodiment, two probes 13 can not be located at simultaneously on substrate 14, and be provided between lower cover 11 and upper cover 12 And it is electrically connected substrate 14, such as a probe 13 can be set on substrate 14, and another probe 13 can be set on sheet metal 113, this Utility model is not limited thereto.

In an embodiment, as shown in Fig. 3, substrate 14 includes dielectric layer 141, and is formed on dielectric layer 141 Line layer 142.Dielectric layer 141, which has, penetrates through the opening 144 secondly surface, and two probes 13 are set in opening 144.It changes Yan Zhi, two probes 13 penetrate through dielectric layer 141 and are located therein, at this point, two probes 13 of perforation dielectric layer 141 expose to dielectric The one end on one of 141 surface of layer and line layer 142 be electrically connected, and two probes 13 for penetrating through dielectric layer 141 expose to dielectric The other end on another surface of layer 141 then exposes to the inner surface 121 of upper cover 12.Substrate 14 further includes insulating layer 143, insulating layer 143 are set on line layer 142, and insulating layer 143 is set to and is not provided on the dielectric layer 141 of line layer 142.

The percutaneous microneedle array patch 1 of the utility model further includes micropin group set 16, set on the second surface of lower cover 11 On 112.Micropin group set 16 can allow user to be covered on skin 17.

Signal processing unit 122 and power supply unit 123 are additionally provided with inside upper cover 12.Signal processing unit 122 penetrates route Layer 142 and be electrically connected with two probes 13, power supply unit 123 then gives signal processing unit 122 to supply working power.

When the combination of lower cover 11 upper cover 12 forms percutaneous microneedle array patch 1, the contact of sheet metal 113 of lower cover 11 is exposed to When two probe 13 of the inner surface 121 of lid 12, access is formed between two probes 13, that is, forms current path 15, and starts signal Processing unit 122.At this point, the electric signal of micropin group set 16 can effectively through conductive column 19 and with signal processing unit 122 Electric contact 18 is electrically connected, and obtains suitable electrochemical reaction voltage, to generate after being reacted with determinand in tissue fluid Current/voltage signal, current/voltage signal can be transmitted to signal processing unit 122, and signal processing unit 122 can produce accordingly Raw sensing signal is to carry out interception and analyze internal testing concentration.This sensing signal can be stored in the storage element in upper cover 12 In (not shown).

In an embodiment, two probes 13 can not also form access by sheet metal 113, such as two probes 13 can be When being squeezed by lower cover 11, two probes 13 are close to each other and are mutually connected into access.

When using the percutaneous microneedle array patch 1 of the utility model, user can will be equipped under micropin group set 16 Lid 11 is first covered on skin 17, and upper cover 12 is then incorporated into lower cover 11, two probes 13 is connected by sheet metal 113, in turn Start signal processing unit 122, each constituent concentration in the tissue fluid to measure subcutaneous tissue.Due between lower cover 11 and upper cover 12 To be detachable, when needing to replace micropin group set 16, user can first removal upper cover 12, replacement includes micropin group set 16 Lower cover 11, i.e., a new lower cover 11 comprising micropin group set 16 is covered on again on skin 17, at this time can will be same In 12 recombinant of upper cover to new lower cover 11, therefore user is not necessary to the upper cover 12 that replacement includes signal processing unit 122.It is removable The formula of unloading can be as shown in Figure 1, lower cover 11 can be combined easily with upper cover 12 by the structure of annular groove and corresponding annular tongue Together, and it can pass through trip and be fixed, and this class formation also can reversely allow user's delamination lower cover 11 and upper cover 12, the utility model is not limited thereto.In other words, due to the circuit in the micropin group set 16 of the utility model and upper cover 12 It can separate, and there is jettisonable characteristic and electricity-saving characteristic, user can facilitate after can only replacing micropin group set 16 merely It uses, is not necessary to all abandon entire circuit.Detected physiological signal can store up simultaneously when the utility model is using different lower covers 11 There are the situations that in same upper cover 12, can effectively avoid data loss.Further, since not needing replacement upper cover 12, also there is section The effect of resource-saving.

Fig. 4 and Fig. 5 is please referred to, micropin group set 16 included by the percutaneous microneedle array patch 1 of the utility model is led to It crosses conductive column 19 and is electrically connected with the electric contact 18 of signal processing unit 122 on substrate 14, in the present embodiment, signal processing Unit 122 and power supply unit 123 can be set on the same surface of substrate 14, and electric contact 18 can then be set to another table of substrate 14 On face.Between micropin group set 16 and substrate 14, more settable one flexible gasket 20.Flexible gasket 20 has an opening 21 pass through for the conductive column 19 of micropin group set 16.Since the percutaneous microneedle array patch 1 of the utility model includes flexible Property gasket 20, the muscle profile for operating Shi Keyu user is conformal and be in close contact.

In the present embodiment, micropin group set 16 further includes the first micropin group 31, the second micropin group 32 and third micropin group 33, wherein the first micropin group 31 is used as working electrode, and the second micropin group 32 is used as reference electrode, and 33 conduct of third micropin group Counterelectrode.Further referring to Fig. 6, to understand the detailed construction of micropin group set 16 in more detail.

In this present embodiment, the first micropin group 31 can be folded by the first thin slice 311, the second thin slice 312 and third thin slice 313 It sets.At least one first perforation 3111 is provided on first thin slice 311 and positioned at least the one of the first 3111 edges of perforation First bur 3112.It is provided at least one second perforation 3121 on second thin slice 312 and perforates 3121 edges extremely positioned at second Few one second bur 3122.It is provided at least third perforation 3131 on third thin slice 313 and is located at 3131 edges of third perforation An at least third bur 3132.Wherein, third thin slice 313 is set between the first thin slice 311 and the second thin slice 312, and first When thin slice 311, the second thin slice 312 and third thin slice 313 stack together, passed through with the second bur 3122 of the second thin slice 312 First perforation 3111, third of the third perforation 3131 of relative position and the first relative position on thin slice 311 on third thin slice 313 The mode that the third bur 3132 of thin slice 313 passes through the first perforation 3111 of relative position on the first thin slice 311, which is stacked, to be formed, and is made Obtaining the first bur 3112, the second bur 3122 and third bur 3132 is in triangular pyramidal after stacked.

In addition, on the edge of the second thin slice 312 settable barb 1323 and engage with the hole on a circuit board.It is real one It applies in example, it is settable on the edge of the second thin slice 312 to lead handle 3124 and insert on circuit boards and be electrically connected with conductive column 19.

Similarly, the second micropin group 32 has thin slice 321, and at least one perforation 3211 is provided on thin slice 321,3211 sides of perforating Edge is provided with bur 3212, and on the edge of thin slice 321 settable barb 3213 and engage with the hole on circuit board, and thin slice It is settable on 321 edge to lead handle 3214 and insert on circuit boards and be electrically connected with conductive column 19.

Similarly, third micropin group 33 has thin slice 331, is provided at least one perforation 3311 on thin slice 331, perforation 3311 it Edge is provided with bur 3312, and on the edge of thin slice 331 settable barb 3313 and engage with the hole on circuit board, and it is thin It is settable on the edge of piece 331 to lead handle 3314 and insert on circuit boards and be electrically connected with conductive column 19.

In one embodiment, first the 3111, second perforation 3121 of perforation and 3131 respective quantity of third perforation correspond to each other And be a plurality of, and a plurality of the 3111, second perforation 3121 of first perforation and third perforation 3131 can form array format, such as Shown in Fig. 6, the number of holes is 12 and forms 3 × 4 array format, but the utility model is not intended to limit the number of holes and institute The array format of formation.The quantity of another first bur 3112, the second bur 3122 and third bur 3132 corresponds respectively to first The 3111, second perforation 3121 of perforation and third perforation 3131.

In an embodiment, each bur of the first micropin group 31, the second micropin group 32 and third micropin group 33 can pass through Punching press or etch process and formed, and the material of these burs can be selected from stainless steel, nickel, nickel alloy, titanium, titanium alloy, nano-sized carbon Pipe, silicon materials or resin and its surface deposition have the metal, such as gold, palladium etc. of bio-compatibility.Resin may be, for example, poly- carbon Acid esters, polymethacrylic acid copolymer, ethylene/vinyl acetate copolymer, Teflon (polytetrafluoroethylene (PTFE)) or polyesters.Bur Height can be 300-600 microns, base widths can be 150-450 microns, the interval between the point of these burs can It is 500-3000 microns.

Fig. 7 is another embodiment of micropin group set 16 in the utility model, technology contents as described in this embodiment Part is identical to previous embodiment, repeats no more in this.In this present embodiment, the first micropin group 31 can be by the first thin slice 311, the second thin slice 312, third thin slice 313 and the 4th thin slice 314 are stacked together.At least one is provided on first thin slice 311 First perforation 3111 and positioned at first perforation 3111 edges at least one first bur 3112.It is provided on second thin slice 312 At least one second perforation 3121 and positioned at second perforation 3121 edges at least one second bur 3122.It is set on third thin slice 313 It is equipped at least third perforation 3131 and at least third bur 3132 positioned at 3131 edges of third perforation.4th thin slice 314 On be provided at least one the 4th perforation 3141 and positioned at the 4th perforation 3141 edges at least one the 4th bur 3142.Wherein, Three thin slices 313 and the 4th thin slice 314 are set between the first thin slice 311 and the second thin slice 312, and the first thin slice 311, the second thin slice 312, when third thin slice 313 and the 4th thin slice 314 stack together, the 4th is passed through with the second bur 3122 of the second thin slice 312 4th perforation 3141 of relative position, the third perforation 3131 of relative position and the first thin slice on third thin slice 313 on thin slice 314 The 4th bur 3142 of the first the 3111, the 4th thin slice 314 of perforation of relative position passes through opposite position on third thin slice 313 on 311 First perforation 3111 of the third perforation 3131 and the first relative position on thin slice 311 set, third thin slice 313 third bur 3132 modes for passing through the first perforation 3111 of relative position on the first thin slice 311, which are stacked, to be formed, so that the first bur 3112, Second bur 3122, third bur 3132 and the 4th bur 3142 are in quadrangle taper after stacked.

In one embodiment, first the 3111, second perforation 3121 of perforation, third perforation 3131 and the 4th perforation 3141 are respective Quantity system corresponds to each other and to be a plurality of, and a plurality of the 3111, second perforation 3121 of first perforation, third perforation 3131 and the Four perforation 3141 can form array format, and as shown in the figure 7, the number of holes is 12 and forms 3 × 4 array format, but The utility model is not intended to limit the number of holes and is formed by array format.Another first bur 3112, the second bur 3122, third The quantity of bur 3132 and the 4th bur 3142 corresponds respectively to the first perforation 3111, second perforation 3121, third perforation 3131 And the 4th perforation 3141.

The another embodiment of micropin group set 16 in the utility model, the first micropin group 31 can only by the first thin slice 311 and Second thin slice 312 is stacked together, and the utility model is not intended to limit number of sheets in the first micropin group 31.In the present embodiment The detailed technology content of one thin slice 311 and the second thin slice 312 is identical to previous embodiment, repeats no more in this.

In above-described embodiment, each bur 3112,3122,3132,3142 of the first micropin group 31 may include a point And a base portion, wherein the perforation on a thin slice is after the bur of the perforated edge of relative position on remaining thin slice passes through, each point End is not in sustained height.The height of its bur can be pre-designed according to the order that thin slice is stacked, so that wherein on a thin slice Perforation is after the bur of the perforated edge of relative position on remaining thin slice passes through, and each point is in sustained height.

Each bur surface of micropin group set 16 can be according to target point in the percutaneous microneedle array patch of the utility model Son is modified, wherein target molecule can be biomolecule, such as blood glucose, cortisol, fatty acid etc..Target molecule also may be used To be drug molecule, such as antibiotic.Therefore, it can be applied on the inner surface of each bur of the first micropin group 31 of micropin group set 16 There is sensing macromolecule, sensing macromolecule may be, for example, antibody, aptamer, recombination monomer, carbohydrate, glucose oxidase or hydroxybutyric acid Deoxygenase.And the drug of anti-skin allergy is coated on the outer surface of each bur.For example, fixed Portugal can be passed through when measuring blood glucose Grape carbohydrate oxidase is on the inner surface of each bur.And the connection type of general antibody or aptamer is to the as working electrode The metal layer of each bur of one micropin group 31, after application self-assembled monolayer (self-assemble monolayer, SAM) Bound antibody or aptamer then apply barrier molecule again, fill up the self-assembled monolayer for not connecting antibody or aptamer, to ensure it specially One property, will such as increase sensitivity, and carbon nanotubes can be further mixed in metal layer.

The 8th and 9 figures are please referred to, are another embodiment of the percutaneous microneedle array patch of the utility model.With above-mentioned reality It applies example to compare, only the setting position of probe 13 is different, remaining technology contents is all the same, repeats no more in this.It only states below not Same place.

In the present embodiment, two probes 13 are set on sheet metal 113, rather than are set on substrate 14.Inside upper cover 12 Substrate 14 then include dielectric layer 141 and the line layer being formed on dielectric layer 141 142, wherein line layer 142 presents disconnected Line state.

In an embodiment, two probes 13 can not be set on sheet metal 113 simultaneously, but be set on line layer 142 simultaneously, Or one probe 13 be set to line layer 142 on and another probe 13 be set to sheet metal 113.Two probes 13 are set to line layer simultaneously It when on 142, can be squeezed by lower cover 11 and phase close to each other is connected into access, therefore not need sheet metal 113, but the utility model is not As limit.

When the combination of lower cover 11 upper cover 12 forms percutaneous microneedle array patch 1, two probes 13 contact line layer 142, at this time line Access will be presented with sheet metal 113 by two probes 13 in road floor 142, that is, current path 15 is formed, to start signal processing Unit 122.

Above-mentioned implementation form be only be illustrated the utility model technical principle, feature and its effect, not to The implementable scope of the utility model is limited, anyone skilled in the art can be in the spirit and model without prejudice to the utility model Under farmland, above-mentioned implementation form is modified and changed.It is so any to be completed equivalent with the utility model institute's teachings Modification and change, still should be above-mentioned claim and are covered.And the rights protection scope of the utility model, it should be as above Listed by the claim stated.

Claims

1. A percutaneous microneedle array patch is characterized in that, comprising:

lower lid;

cover;

a base plate, disposed inside the upper cover; and

A first probe and a second probe are arranged between the lower cover and the upper cover and are electrically connected to the substrate, wherein there is an open circuit between the first probe and the second probe ;

Wherein, when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, a passage is formed between the first probe and the second probe.

2 . The percutaneous microneedle array patch according to claim 1 , wherein the lower cover has a first surface and a second surface opposite to the first surface, and all parts of the lower cover have a first surface and a second surface opposite to the first surface. 3 . The first surface is provided with a metal sheet, and when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the metal sheet of the lower cover contacts the first probe and the first probe. Two probes, so that a passage is formed between the first probe and the second probe, and the combination between the lower cover and the upper cover is detachable.

3 . The percutaneous microneedle array patch according to claim 2 , wherein the first probe and the second probe are simultaneously disposed on the substrate and exposed to the upper cover. 4 . surface, or one of the first probe and the second probe is disposed on the substrate and is exposed on the surface of the upper cover, and the first probe and the second probe The other one is arranged on the metal sheet of the lower cover.

4 . The percutaneous microneedle array patch according to claim 1 , wherein when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the first probe And the second probe is pressed by the lower cover to be close to each other to form a passage.

5 . The percutaneous microneedle array patch according to claim 1 , wherein the substrate further comprises a dielectric layer, a circuit layer formed on the dielectric layer, and a circuit layer disposed on the circuit. 6 . layer and the insulating layer on the dielectric layer without the circuit layer, and wherein the first probe and the second probe penetrate the dielectric layer, the first probe and the One end of the second probe is electrically connected to the circuit layer, and the other ends of the first probe and the second probe are exposed on the inner surface of the upper cover.

6 . The percutaneous microneedle array patch according to claim 5 , further comprising a microneedle group assembly, a signal processing unit and a power supply unit, the microneedle group assembly being installed on the lower cover and electrically powered. 7 . The substrate is electrically connected, and the signal processing unit is arranged inside the upper cover to activate the signal processing when a path is formed between the first probe and the second probe or the circuit layer. The unit is used to generate a sensing signal, and the power supply unit is arranged inside the upper cover to supply working power to the signal processing unit.

7. The percutaneous microneedle array patch according to claim 6, wherein the microneedle group set further comprises a first microneedle group, a second microneedle group and a third microneedle group, and The first microneedle group is used as a working electrode, the second microneedle group is used as a reference electrode, and the third microneedle group is used as a counter electrode.

8 . The percutaneous microneedle array patch according to claim 7 , wherein the first microneedle group is formed by stacking at least two sheets, and each of the at least two sheets is respectively provided with a At least one perforation and at least one protruding thorn located at the edge of the perforation, and wherein the protruding thorn of one of the at least two sheets passes through the perforation in the opposite position on the other of the at least two sheets and is connected to the at least two sheets The spurs of the other one are opposite to each other, and wherein the respective numbers of the spurs of each of the at least two sheets correspond to each other and are plural, and wherein the perforations of each of the at least two sheets are formed in an array form.

9 . The transdermal microneedle array patch according to claim 8 , wherein the at least two sheets comprise a first sheet, a second sheet and a third sheet, and the first sheet is provided with at least one a first perforation and at least one first spur on the edge of the first perforation, the second sheet is provided with at least one second perforation and at least one second spur on the edge of the second perforation, and the The third sheet is provided with at least one third perforation and at least one third spur located at the edge of the third perforation, and wherein the second spur and the third spur pass through relative positions on the first sheet The first perforation and the first spur are in the shape of a triangular cone, and wherein the respective numbers of the first perforation, the second perforation and the third perforation correspond to each other and are plural, and wherein , a plurality of the first through holes, the second through holes or the third through holes are formed in an array form.

10. The transdermal microneedle array patch according to claim 8, wherein the at least two sheets comprise a first sheet, a second sheet, a third sheet and a fourth sheet, the first sheet There is at least one first perforation and at least one first spur on the edge of the first perforation, and at least one second perforation and at least one second spur on the edge of the second perforation are provided on the second sheet , the third sheet is provided with at least one third perforation and at least one third spur located at the edge of the third perforation, and the fourth sheet is provided with at least one fourth perforation and is located in the fourth perforation At least one fourth spur on the edge, and wherein the second spur, the third spur and the fourth spur pass through the first through hole in the opposite position on the first sheet to connect with the first The spurs are in the shape of a quadrangular pyramid, and wherein, the first through holes, the second through holes, the third through holes and the fourth through holes correspond in number to each other and are plural, and wherein, a plurality of the first through holes The perforations, the second perforations, the third perforations, or the fourth perforations are formed in an array.

11 . The percutaneous microneedle array patch according to claim 8 , wherein each protruding thorn of the first microneedle group comprises a tip portion and a base portion, wherein the perforations on one sheet pass through the other parts. 12 . After the protruding stabs of the perforated edges at opposite positions on the sheet pass through, the tips are not at the same height or at the same height.

12. A percutaneous microneedle array patch, comprising:

lower lid;

cover;

a substrate, disposed inside the upper cover, comprising a dielectric layer and a circuit layer formed on the dielectric layer, wherein the circuit layer is an open circuit; and

a first probe and a second probe are arranged between the lower cover and the upper cover;

Wherein, when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the first probe and the second probe contact the circuit layer, so that the circuit layer forms a passage.

13. The percutaneous microneedle array patch according to claim 12, wherein the lower cover has a first surface and a second surface opposite to the first surface, wherein the lower cover has a first surface and a second surface opposite to the first surface. The first surface is provided with a metal sheet, and when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the metal sheet of the lower cover contacts the first probe and the The second probe makes the circuit layer form a via.

14. The percutaneous microneedle array patch according to claim 13, wherein the first probe and the second probe are simultaneously disposed on the circuit layer of the substrate, or At the same time, they are arranged on the metal sheet of the lower cover, or one is arranged on the circuit layer of the substrate and the other is arranged on the metal sheet of the lower cover.

15. The percutaneous microneedle array patch according to claim 12, wherein when the lower cover is combined with the upper cover to form the percutaneous microneedle array patch, the first probe And the second probe is pressed by the lower cover to be close to each other to form a passage.