CN208923074U - Transmit arm - Google Patents
Transmit arm Download PDFInfo
- Publication number
- CN208923074U CN208923074U CN201821748086.6U CN201821748086U CN208923074U CN 208923074 U CN208923074 U CN 208923074U CN 201821748086 U CN201821748086 U CN 201821748086U CN 208923074 U CN208923074 U CN 208923074U
- Authority
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- China
- Prior art keywords
- fluorine
- carrying portion
- wafer
- wafer carrying
- transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 112
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 112
- 239000011737 fluorine Substances 0.000 claims abstract description 112
- 230000005540 biological transmission Effects 0.000 claims abstract description 92
- 230000005484 gravity Effects 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 3
- 239000013078 crystal Substances 0.000 abstract description 10
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 4
- 238000013016 damping Methods 0.000 abstract description 4
- 230000035939 shock Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 173
- 238000010586 diagram Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229910010293 ceramic material Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920005560 fluorosilicone rubber Polymers 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of transmission arm, transmitting arm includes: transmission blade, and transmitting includes at least three fluorine-containing wafer carrying portions on blade, and fluorine-containing wafer carrying portion protrudes from transmission blade, and the upper surface in fluorine-containing wafer carrying portion is located at same level, to carry wafer.By carrying wafer with high temperature resistant, corrosion-resistant, elastic and soft fluorine-containing wafer carrying portion, the contact area and frictional force of fluorine-containing wafer carrying portion and crystal column surface can be increased；In related slide position wafer being sent in board, can also enhance the damping of shocks ability of the contact between wafer and related moving part；To make the position precision with higher of the wafer transmitted；To improve product quality.
Description
Technical field
The utility model belongs to semiconductor integrated circuit field, is related to transmitting arm.
Background technique
In semiconductor processing, etching is to determine one of the core process technology of characteristic size.Etching is generally divided into wet process
Etching and dry etching, it is traditional etching technics that wherein wet etching is carried out using chemical attack, it has isotropic
Disadvantage, i.e., longitudinal etching, also there is unwanted lateral etching, thus low precision, line required for not only having in etching process
Width is generally in 3um or more.Dry etching is the fine processing technique developed by the needs of large scale integrated circuit production, it has
There is the characteristics of anisotropy, ensure that longitudinal etching on to greatest extent, lateral etching can also be controlled, thus highdensity
Integrated circuit fields are used widely.
In dry etching board, including the terminal cushion chamber (Buffer Chamber) as transmission wafer, buffering
Transmission arm (Buffer Robot) in chamber plays a particularly important role.Transmit the transmission blade in arm
(Robot Blade) carries wafer, by the wafer reaction chamber incoming and outgoing into dry etching board.With contemporary semiconductor
The more and more accurate development of making technology, transmission arm in addition to meet high production capacity demand transmission speed and transmission stability it
Outside, the transmission for transmitting arm must also have both higher transmission precision, the competition that could be required in high production, high making technology
It survives in industry.
Existing transmission arm, the transmission of wafer usually has unstable phenomenon, thus reduces wafer transmission position
Precision, so that product quality reduces.
Therefore it provides a kind of novel transmission arm, to solve existing transmission arm during transmitting wafer, wafer is passed
The problem for sending the precision of position low.
Utility model content
In view of the foregoing deficiencies of prior art, it the purpose of this utility model is to provide a kind of transmission arm, is used for
Solving the problem of that the wafer position precision of transmission arm transmission in the prior art is low influences product quality.
In order to achieve the above objects and other related objects, the utility model provides a kind of transmission arm, the transmission arm
Include:
Blade is transmitted, the transmission blade is equipped at least three fluorine-containing wafer carrying portions, the fluorine-containing wafer carrying portion
The transmission blade is protruded from, and the upper surface in the fluorine-containing wafer carrying portion is located at same level, to carry wafer.
Optionally, the range of the mass fraction of the fluorine element in the fluorine-containing wafer carrying portion includes 50%~80%.
Optionally, the range of the number in the fluorine-containing wafer carrying portion includes 4~10.
Optionally, the fluorine-containing wafer carrying portion is equidistantly uniformly distributed.
Optionally, the horizontal cross-section pattern in the fluorine-containing wafer carrying portion includes one of round and polygon or group
It closes.
Optionally, the edge in the fluorine-containing wafer carrying portion includes chamfering.
Optionally, the horizontal cross-section pattern for the figure that the fluorine-containing wafer carrying portion is surrounded includes one in regular polygon
Kind.
Optionally, the center of gravity of the horizontal cross-section pattern for the figure that the fluorine-containing wafer carrying portion is surrounded and the wafer
The range of the distance of center of gravity in the horizontal direction includes 0 angstrom~5 angstroms.
Optionally, the fluorine-containing wafer carrying portion further includes the branch being connected with the lower surface in the fluorine-containing wafer carrying portion
Support member.
Optionally, the fluorine-containing wafer carrying portion is connected with the transmission blade, and connection type include be threadedly coupled,
One of pin connection and fixing connection or combination.
As described above, the transmission arm of the utility model, by with high temperature resistant, corrosion-resistant, elastic and soft fluorine-containing
Wafer carrying portion carries wafer, can increase the contact area and frictional force of fluorine-containing wafer carrying portion and crystal column surface；By wafer
When the related slide position being sent in board, it can also enhance the damping of shocks ability of the contact between wafer and related moving part；From
And make the position precision with higher of the wafer of transmission；To improve product quality.
Detailed description of the invention
Fig. 1 is shown as the positional structure schematic diagram of wafer in the prior art in the reactor chamber.
Fig. 2 is shown as the position distribution structural schematic diagram of wafer in the prior art in the reactor chamber.
Fig. 3 is shown as the online residual thickness distributed architecture schematic diagram of wafer in the prior art in the reactor chamber.
Fig. 4 is shown as the structural schematic diagram of one of embodiment one transmission blade.
Fig. 5 is shown as structural schematic diagram of the transmission blade when carrying wafer in Fig. 4.
Fig. 6 is shown as the positional structure schematic diagram of wafer in the reactor chamber in embodiment one.
Fig. 7 is shown as the position distribution structural schematic diagram of the wafer in embodiment one in the reactor chamber.
Fig. 8 is shown as the online residual thickness distributed architecture schematic diagram of the wafer in embodiment one in the reactor chamber.
Fig. 9 is shown as the structural schematic diagram of one of embodiment two transmission blade.
Figure 10 is shown as structural schematic diagram of the transmission blade when carrying wafer in Fig. 9.
Component label instructions
100 wafers
The distance between 200 wafers and crystal round fringes ring
300 crystal round fringes rings
400 transmission blades
500 fluorine-containing wafer carrying portions
600 supporting elements
Specific embodiment
The embodiments of the present invention is illustrated by particular specific embodiment below, those skilled in the art can be by this
Content disclosed by specification understands other advantages and effect of the utility model easily.
Fig. 1 is please referred to Figure 10.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., are only used
To cooperate the revealed content of specification, so that those skilled in the art understands and reads, it is practical new to be not limited to this
The enforceable qualifications of type, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or size
Adjustment it is practical new should all still to fall in this in the case where not influencing the effect of the utility model can be generated and the purpose that can reach
The revealed technology contents of type obtain in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", " left side ",
The term on " right side ", " centre " and " one " etc. is merely convenient to being illustrated for narration, rather than enforceable to limit the utility model
Range, relativeness are altered or modified, under the content of no substantial changes in technology, enforceable when being also considered as the utility model
Scope.
As shown in Figure 1, the wafer carrying portion transmitted in arm generallys use ceramic material in existing semiconductor technology,
Wafer 100 when the transmission arm through traditional ceramic material is sent in reaction chamber, wafer 100 and crystal round fringes ring 300 it
Between distance 200 often there is deviation, i.e. the offset that generates position of wafer 100.Such as Fig. 2, wafer 100 is illustrated in the reactor chamber
Position distribution structural schematic diagram, and from figure 3, it can be seen that the online residual thickness in the reactor chamber of wafer 100 is distributed knot
Structure.Since the distance between wafer 100 and crystal round fringes ring 300 200 has deviation, thus the etch rate of wafer 100 can produce
Raw difference, causes the edge of wafer 100 that can have the residual thickness of large area, reduces product quality.It is studied, leads to crystalline substance
The reason of circle the distance between 100 and crystal round fringes ring 300 200 generate deviation specifically includes that the transmission hand due to ceramic material
Arm surface smoothness, contact surface area and frictional force are not able to satisfy demand of the wafer 100 in transmit process, cause wafer
100 can generate unstable phenomenon in transmit process, especially in the related moving part position being sent to wafer 100 in reaction chamber
When setting, such as the thimble (not shown) in electrostatic chuck, due to the unstability at thimble initial stage, it is existing that thimble may have vibration
As so that the wafer carrying portion of ceramic material cannot overcome when on transmission arm transmission wafer 100 to the thimble of ceramic material
The offset and vibration that wafer 100 generates cannot be met the requirements so that the wafer 100 being sent on thimble generates the offset of position
The demand of higher technique, therefore seek wafer carrying portion and its necessity of a kind of New Type Material.
Embodiment one
As shown in Fig. 4~Fig. 5, the utility model provides a kind of transmission arm, and the transmission arm includes: transmission blade
400, it include at least three fluorine-containing wafer carrying portions 500 on the transmission blade 400, the fluorine-containing wafer carrying portion 500 is protruded
It is located at same level in the upper surface of the transmission blade 400, and the fluorine-containing wafer carrying portion 500, to carry wafer
100。
In the present embodiment, by being held with high temperature resistant, corrosion-resistant, the elastic and soft fluorine-containing wafer carrying portion 500
The wafer 100 is carried, the contact area and frictional force in the fluorine-containing wafer carrying portion 500 and 100 surface of wafer can be increased,
Keep the position precision of the wafer 100 of transmission higher；In the related slide position being sent to the wafer 100 in board
When, such as the thimble (not shown) being located on electrostatic chuck, it can also enhance the impact of the contact between the wafer 100 and related moving part
Buffer capacity makes the position precision with higher of the wafer 100 of transmission；To improve product quality.
Specifically, the excellent properties such as flaorination process product is resistant to chemical etching with its, high-low temperature resistant, ageing-resistant, insulation are extensive
Applied to every field, it has also become one of with fastest developing speed in chemical industry, most promising industry.Flaorination process product mainly divides
For inorganic fluorine and Organic fluoride two large divisions, in the present embodiment, the material in the fluorine-containing wafer carrying portion 500 includes fluororesin, fluorine
One of rubber and fluorine silicone rubber.More common double fork configurations can be used in the transmission blade 400, in order to expand
The scope of application of transmission blade 400 is stated, in another embodiment, other structures pattern can also be used in the transmission blade 400, this
Place is with no restriction.
As the further embodiment of the embodiment, the mass fraction of the fluorine element in the fluorine-containing wafer carrying portion 500
Range include 50%~80%, it is described to further increase to provide the fluorine-containing wafer carrying portion 500 of high fluorine material
Contact area and frictional force between fluorine-containing wafer carrying portion 500 and the wafer 100 are provided with elasticity and high fluorine flexible
Material further enhances the damping of shocks ability of the contact between the wafer 100 and related moving part, makes the wafer of transmission
100 position precision with higher；Improve product quality.In the present embodiment, the fluorine-containing wafer carrying portion 500 is preferably
It can also be used in more common fluororesin, such as polytetrafluoroethylene (PTFE), in another embodiment, the fluorine-containing wafer carrying portion 500
His material, does not limit excessively herein.
As the further embodiment of the embodiment, the range of the number in the fluorine-containing wafer carrying portion 500 includes 4~
10.
As shown in figure 4, the number in the fluorine-containing wafer carrying portion 500 uses 3 in the present embodiment, and it is located at double
In the diverging arms and intermediate arm of the transmission blade 400 of fork-shaped, the fluorine-containing wafer carrying portion 500 protrudes from the transmission leaf
The upper surface of piece 400, the distance that the fluorine-containing wafer carrying portion 500 protrudes from the upper surface of the transmission blade 400 includes 2mm
~10mm can be selected as needed, is not construed as limiting herein.3 fluorine-containing wafer carrying portions 500 have same level
Face, to carry the wafer 100 by the fluorine-containing wafer carrying portion 500 with same level.In another embodiment
In, the number in the fluorine-containing wafer carrying portion 500 can also be 4,6 or 8, herein with no restriction.
As the further embodiment of the embodiment, the fluorine-containing wafer carrying portion 500 is equidistantly uniformly distributed.
Specifically, the fluorine-containing wafer carrying portion 500 is equidistantly uniformly distributed according to the structure of the transmission blade 400,
To reduce the complexity for preparing the transmission blade 400, and to bear between the fluorine-containing wafer carrying portion 500 identical
Pressure improve the institute of transmission in order to improve the stability between the fluorine-containing wafer carrying portion 500 and the wafer 100
State the precision of the position of wafer 100.
As the further embodiment of the embodiment, the level for the figure that the fluorine-containing wafer carrying portion 500 is surrounded is cut
Face pattern includes one of regular polygon.
Specifically, symmetrical structure can be formed in the fluorine-containing wafer carrying portion 500 of regular polygon distribution, thus further
The raising fluorine-containing wafer carrying portion 500 and the wafer 100 between stability.In the present embodiment, 3 fluorine-containing crystalline substances
The horizontal cross-section pattern for the figure that circle supporting part 500 is surrounded includes equilateral triangle, in another embodiment, the fluorine-containing wafer
The horizontal cross-section pattern for the figure that supporting part 500 is surrounded may also include square, regular pentagon, regular hexagon etc., according to tool
The number in the fluorine-containing wafer carrying portion 500 of body is defined, herein with no restriction.
As the further embodiment of the embodiment, the level for the figure that the fluorine-containing wafer carrying portion 500 is surrounded is cut
The center of gravity of the center of gravity of face pattern and the wafer 100 in the horizontal direction at a distance from range include 0 angstrom~5 angstroms.
Specifically, the center of gravity of the horizontal cross-section pattern for the figure that the fluorine-containing wafer carrying portion 500 is surrounded and the crystalline substance
The range of the distance of the center of gravity of circle 100 in the horizontal direction includes 0 angstrom~5 angstroms, such as 2 angstroms, 4 angstroms, the fluorine-containing wafer carrying portion
Projection of the horizontal cross-section of 500 figures surrounded on the wafer 100 can cover the center of the wafer 100, preferably
The center of gravity of the horizontal cross-section pattern for the figure that the fluorine-containing wafer carrying portion 500 is surrounded and the center of gravity of the wafer 100 are in water
Square upward distance is 0, to further improve steady between the fluorine-containing wafer carrying portion 500 and the wafer 100
It is qualitative, further increase the precision of the position of the wafer 100 of transmission.
As the further embodiment of the embodiment, the horizontal cross-section pattern in the fluorine-containing wafer carrying portion 500 includes circle
One of shape and polygon or combination.In the present embodiment, the horizontal cross-section pattern in the fluorine-containing wafer carrying portion 500 is all made of
Other can also be used by curve or straight in circle, in another embodiment, the horizontal cross-section pattern in the fluorine-containing wafer carrying portion 500
One of the pattern that line is surrounded, such as rectangle, triangle, square, herein with no restriction.
As the further embodiment of the embodiment, the edge in the fluorine-containing wafer carrying portion 500 includes chamfering.
Specifically, can avoid the fluorine-containing wafer carrying when the edge in the fluorine-containing wafer carrying portion 500 includes chamfering
Damage of the edge in portion 500 to the wafer 100, and can be convenient for the fluorine-containing wafer carrying portion 500 and the transmission blade 400
Between installation convenience.The chamfering includes one of 45 degree of chamferings, 30 degree of chamferings, 60 degree of chamferings and circular arc chamfering or group
It closes, preferably circular arc chamfering, to further decrease the fluorine-containing wafer carrying portion 500 to the probability of the damage of the wafer 100.
As the further embodiment of the embodiment, the fluorine-containing wafer carrying portion 500 is connected with the transmission blade 400
It connects, and connection type includes one of threaded connection, pin connection and fixing connection or combination.
Specifically, the transmission blade 400 includes traditional ceramics transmission blade, to include the big transmission blade 400
The scope of application improves the service life and reduction of the transmission blade 400 to be conveniently replaceable the fluorine-containing wafer carrying portion 500
Cost uses interchangeable connection type between the fluorine-containing wafer carrying portion 500 and the transmission blade 400, specific to connect
Mode can be selected as needed, herein with no restriction.
As the further embodiment of the embodiment, the transmission arm further includes level meter (not shown), by described
Level meter measures the levelness of the upper surface in the fluorine-containing wafer carrying portion 500, to provide tool for the wafer 100
There is the fluorine-containing wafer carrying portion 500 of same level, improves the precision for transmitting the position of the wafer 100, avoid institute
State damage of the wafer 100 in transmit process.The level meter may include laser leveler, specific type and position, herein not
It is restricted.
Such as Fig. 6, the wafer 100 is illustrated in the transmission blade 400 through having the fluorine-containing wafer carrying portion 500
The positional structure schematic diagram being sent in reaction chamber.The wafer 100 is through having described in the fluorine-containing wafer carrying portion 500
After transmission blade 400 is sent in reaction chamber, the distance 200 etc. between the wafer 100 and the crystal round fringes ring 300
Spacing distribution, that is, the position of the wafer 100 transmitted precision with higher, the position for reducing the wafer 100 produce
The probability of raw offset.Such as Fig. 7, illustrate the position distribution structural schematic diagram of the wafer 100 in the reactor chamber, transmission it is described
The precision of the position with higher of wafer 100.From the online residual thickness of the wafer 100 in Fig. 8 in the reactor chamber point
Cloth structural schematic diagram is it is found that since the distance 200 between the wafer 100 and the crystal round fringes ring 300 is equidistantly divided
Cloth, thus the wafer 100 has uniform etch rate, so that the fringe region for reducing the wafer 100 remains larger thickness
The range in region is spent, product quality is improved.
Embodiment two
Keep those skilled in the art further for the content for further disclosing the utility model refering to Fig. 9~Figure 10
The advantages of solving the utility model and effect, the utility model also provide the structure of another transmission arm, the transmission arm packet
It includes: transmitting blade 400, include at least three fluorine-containing wafer carrying portions 500 on the transmission blade 400, the fluorine-containing wafer is held
Load portion 500 protrudes from the transmission blade 400, and the upper surface in the fluorine-containing wafer carrying portion 500 is located at same level, with
Carry wafer 100.
As the further embodiment of the embodiment, the range of the number in the fluorine-containing wafer carrying portion 500 includes 4~
10.
As shown in figure 9, the number in the fluorine-containing wafer carrying portion 500 includes 4 in the present embodiment, and it is located at double
In the diverging arms and intermediate arm of the transmission blade 400 of fork-shaped, 4 fluorine-containing wafer carrying portions 500 have same level
Face, to carry the wafer 100 by the fluorine-containing wafer carrying portion 500 with same level.In another embodiment
In, the number in the fluorine-containing wafer carrying portion 500 can also be 5,7 or 9, herein with no restriction.The fluorine-containing wafer is held
Load portion 500 is equidistantly uniformly distributed, to reduce the complexity for preparing the transmission blade 400, and makes the fluorine-containing wafer
Identical pressure is born between supporting part 500, in order to improve between the fluorine-containing wafer carrying portion 500 and the wafer 100
Stability, further increase the precision of the position of the wafer 100 of transmission.In the present embodiment, 4 fluorine-containing wafers
The horizontal cross-section pattern for the figure that supporting part 500 is surrounded includes square, so that symmetrical structure is formed, further to improve
Stability between the fluorine-containing wafer carrying portion 500 and the wafer 100.In another embodiment, the fluorine-containing wafer is held
The horizontal cross-section pattern for the figure that load portion 500 is surrounded may also comprise other regular polygons, such as regular heptagon, positive nonagon,
Herein with no restriction.
As the further embodiment of the embodiment, the fluorine-containing wafer carrying portion 500 may also include and the fluorine-containing crystalline substance
The supporting element 600 that the lower surface of circle supporting part 500 is connected, the supporting element 600 are connected with the transmission blade 400, institute
Stating supporting element 600 includes ceramic supporting element, and the transmission blade 400 includes ceramics transmission blade.
It include described in the present embodiment, between the fluorine-containing wafer carrying portion 500 and the transmission blade 400 such as Figure 10
Supporting element 600, the fluorine-containing wafer carrying portion 500 is connected by the supporting element 600 with the transmission blade 400, to subtract
Few fluorine-containing wafer carrying portion 500, thus save the cost.The fluorine-containing wafer carrying portion 500 can cover the supporting element 600
Upper surface or part cover the upper surface of the supporting element 600, herein with no restriction, the fluorine-containing wafer carrying portion 500 with
The height ratio of the supporting element 600, it may include 1/5,1/4,1/2 etc., herein with no restriction.
Specifically, the specific horizontal cross-section pattern in the fluorine-containing wafer carrying portion 500 and its level of the figure surrounded
Cross Section Morphology, as in the first embodiment, details are not described herein again.In the present embodiment, the fluorine-containing wafer is connected by the supporting element 600
Supporting part 500 and the transmission blade 400 can further drop while improving the precision of the transmission of wafer 100 position
Low cost.
In conclusion the transmission arm in the utility model, by with high temperature resistant, corrosion-resistant, elastic and soft contain
Fluorine wafer carrying portion carries wafer, can increase the contact area and frictional force of fluorine-containing wafer carrying portion and crystal column surface；Will be brilliant
When the related slide position that circle is sent in board, it can also enhance the damping of shocks ability of the contact between wafer and related moving part；
To make the position precision with higher of the wafer transmitted；To improve product quality.So effective gram of the utility model
It has taken various shortcoming in the prior art and has had high industrial utilization value.
The above embodiments are only illustrative of the principle and efficacy of the utility model, and not for limitation, this is practical new
Type.Any person skilled in the art can all carry out above-described embodiment under the spirit and scope without prejudice to the utility model
Modifications and changes.Therefore, such as those of ordinary skill in the art without departing from the revealed essence of the utility model
All equivalent modifications or change completed under mind and technical idea, should be covered by the claim of the utility model.
Claims (9)
1. a kind of transmission arm, which is characterized in that the transmission arm includes:
Blade is transmitted, includes at least three fluorine-containing wafer carrying portions on the transmission blade, the fluorine-containing wafer carrying portion protrusion
It is located at same level in the upper surface of the transmission blade, and the fluorine-containing wafer carrying portion, to carry wafer.
2. transmission arm according to claim 1, it is characterised in that: the range packet of the number in the fluorine-containing wafer carrying portion
Include 4~10.
3. transmission arm according to claim 1, it is characterised in that: the fluorine-containing wafer carrying portion equidistantly uniformly divides
Cloth.
4. transmission arm according to claim 1, it is characterised in that: the horizontal cross-section pattern in the fluorine-containing wafer carrying portion
Including one of round and polygon or combination.
5. transmission arm according to claim 1, it is characterised in that: the edge in the fluorine-containing wafer carrying portion includes falling
Angle.
6. transmission arm according to claim 1, it is characterised in that: the figure that the fluorine-containing wafer carrying portion is surrounded
Horizontal cross-section pattern includes one of regular polygon.
7. transmission arm according to claim 1, it is characterised in that: the figure that the fluorine-containing wafer carrying portion is surrounded
The center of gravity of the center of gravity of horizontal cross-section pattern and the wafer in the horizontal direction at a distance from range include 0 angstrom~5 angstroms.
8. transmission arm according to claim 1, it is characterised in that: the fluorine-containing wafer carrying portion further includes containing with described
The supporting element that the lower surface in fluorine wafer carrying portion is connected.
9. transmission arm according to claim 1, it is characterised in that: the fluorine-containing wafer carrying portion and the transmission blade
It is connected, and connection type includes one of threaded connection, pin connection and fixing connection or combination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821748086.6U CN208923074U (en) | 2018-10-26 | 2018-10-26 | Transmit arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821748086.6U CN208923074U (en) | 2018-10-26 | 2018-10-26 | Transmit arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208923074U true CN208923074U (en) | 2019-05-31 |
Family
ID=66710686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821748086.6U Active CN208923074U (en) | 2018-10-26 | 2018-10-26 | Transmit arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208923074U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854043A (en) * | 2019-11-19 | 2020-02-28 | 上海华力集成电路制造有限公司 | Wafer loading finger of pre-vacuum lock chamber |
| CN112071799A (en) * | 2019-06-10 | 2020-12-11 | 中微半导体设备(上海)股份有限公司 | Support claw, airlock chamber and plasma processing device host platform |
| TWI808476B (en) * | 2020-09-11 | 2023-07-11 | 大陸商北京北方華創微電子裝備有限公司 | manipulator |
-
2018
- 2018-10-26 CN CN201821748086.6U patent/CN208923074U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112071799A (en) * | 2019-06-10 | 2020-12-11 | 中微半导体设备(上海)股份有限公司 | Support claw, airlock chamber and plasma processing device host platform |
| CN110854043A (en) * | 2019-11-19 | 2020-02-28 | 上海华力集成电路制造有限公司 | Wafer loading finger of pre-vacuum lock chamber |
| TWI808476B (en) * | 2020-09-11 | 2023-07-11 | 大陸商北京北方華創微電子裝備有限公司 | manipulator |
| US12263574B2 (en) | 2020-09-11 | 2025-04-01 | Beijing Naura Microelectronics Equipment Co., Ltd. | Manipulator |
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