CN208834327U

CN208834327U - Living things feature recognition mould group and terminal device

Info

Publication number: CN208834327U
Application number: CN201821480801.2U
Authority: CN
Inventors: 姚国峰; 沈健
Original assignee: Shenzhen Huiding Technology Co Ltd
Current assignee: Shenzhen Goodix Technology Co Ltd
Priority date: 2018-09-11
Filing date: 2018-09-11
Publication date: 2019-05-07
Anticipated expiration: 2028-09-11

Abstract

It includes: biometric sensor and optical path modulation device that the application, which provides a kind of living things feature recognition mould group and terminal device, the living things feature recognition mould group,；Optical path modulation device is for carrying out collimation modulation to incident ray；Biometric sensor is located at the lower section of optical path modulation device, and the modulated light of collimation of the optical path modulation device output for will receive is converted to biological characteristic detection signal；Optical path modulation device is TPV device, and TPV device includes: polymeric substrates and the through-hole array that is formed on the polymeric substrates.The application can reduce the cost of living things feature recognition mould group.

Description

Biological characteristic identification module and terminal equipment

Technical Field

The embodiment of the application relates to identification technology, in particular to a biological feature identification module and terminal equipment.

Background

With the stepping of terminal devices into the full-screen era, the physical space of the biometric identification case on the display screen side of the terminal device is overstocked by the full-screen, and therefore, the Under-screen (or) biometric identification technology is receiving more and more attention. The technology of identifying biological characteristics under a screen is that a biological characteristic identification module is arranged below a display screen, so that biological characteristic identification operation is carried out in a display area of the display screen.

At present, in an off-screen biometric module, a Through Silicon Via (TSV) device made of a Silicon material such as a semiconductor Silicon wafer, a Silicon oxide (such as Silicon dioxide) or a Silicon nitride (such as Silicon nitride) is generally used as an optical path modulator.

However, the tsv device mainly operates on a silicon wafer, and the cost of the silicon wafer itself is high, and the operation process based on the silicon wafer is also complex, which makes the cost of the optical path modulator higher, and thus makes the cost of the biometric identification module higher.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a biological characteristic identification module and terminal equipment, so that the cost of the biological identification module is reduced.

In a first aspect, an embodiment of the present application provides a biometric identification module, including: a biometric sensor and an optical path modulator; the light path modulator is used for collimating and modulating incident light; the biological characteristic sensor is positioned below the light path modulator and used for converting the received light rays which are output by the light path modulator and subjected to collimation and modulation into biological characteristic detection signals;

the optical path modulator is a polymer TPV through hole device, and the TPV through hole device comprises: a polymer substrate and an array of vias formed on the polymer substrate.

In one implementation, the biometric sensor includes: the sensing array is composed of a plurality of optical sensing units; the optical path modulator includes: a plurality of modulation units, each modulation unit being a via of the TPV via device.

In another implementation, the position of each optical sensing unit corresponds to the position of one modulation unit.

In yet another implementation, the position of each optical sensing unit corresponds to the positions of a plurality of modulation units.

In yet another implementation, the biometric identification module further includes: an optical filter;

the optical filter is positioned on one side of the optical path modulator, which is far away from the biological characteristic sensor.

In yet another implementation, the biometric sensor and the optical path modulator are packaged in one chip; alternatively, the biometric sensor and the optical path modulator are separate components.

In yet another implementation, the biometric sensor is an optical fingerprint sensor.

In yet another implementation, the biometric sensor is an image sensor.

In a second aspect, an embodiment of the present application may further provide a terminal device, including a cover plate, a display screen, and a biometric feature recognition module, which are sequentially disposed; the biometric identification module is the biometric identification module of any one of the above first aspects.

In one implementation, the terminal device further includes: a circuit board; the biological characteristic identification module is welded on the circuit board.

The embodiment of the application provides a biological characteristic identification module and terminal equipment, wherein, this biological characteristic identification module can include: a biometric sensor and an optical path modulator; the light path modulator is used for collimating and modulating incident light; the biological characteristic sensor is positioned below the light path modulator and used for converting the received light rays which are output by the light path modulator and are collimated and modulated into biological characteristic detection signals; the optical path modulator is a TPV via device, the TPV via device comprising: a polymer substrate and an array of vias formed on the polymer substrate. The biological characteristic identification module adopts the TPV device as the light path modulator, so that the cost of the light path modulator is reduced, and the cost of the biological characteristic identification module is effectively reduced.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a flowchart of a method for manufacturing a through-hole device according to an embodiment of the present disclosure;

fig. 2 is a flowchart of another method for manufacturing a via device according to an embodiment of the present disclosure;

fig. 3 is a flowchart of a method for manufacturing a via device according to an embodiment of the present disclosure;

fig. 4 is a flowchart of a method for manufacturing a via device according to another embodiment of the present disclosure;

fig. 5A is a schematic structural diagram of a template having a plurality of pillar structures according to an embodiment of the present application;

FIG. 5B is a schematic structural diagram of a template deposited with an anti-stiction layer according to an embodiment of the present disclosure;

fig. 5C is a schematic view of a template coated with an organic material according to an embodiment of the present disclosure;

FIG. 5D is a schematic view of a glass cover plate placed on the coated organic material according to an embodiment of the present disclosure;

fig. 5E is a schematic structural diagram of the removed template according to an embodiment of the present application;

FIG. 5F is a schematic structural diagram of a device with multiple blind holes after removing glass according to an embodiment of the present application;

fig. 5G is a schematic structural diagram of reactive ion etching of a device having a plurality of blind holes according to an embodiment of the present application;

fig. 5H is a schematic structural diagram of a via device according to an embodiment of the present disclosure;

fig. 6 is a flowchart of a method for manufacturing a through-hole device according to a second embodiment of the present application;

fig. 7 is a flowchart of another method for manufacturing a via device according to the second embodiment of the present application;

fig. 8 is a flowchart of a method for manufacturing a via device according to a second embodiment of the present disclosure;

fig. 9A is a schematic structural diagram of a template having a plurality of pillar structures according to a second embodiment of the present application;

FIG. 9B is a schematic structural diagram of a template deposited with an anti-adhesion layer according to the second embodiment of the present application

Fig. 9C is a schematic view of the organic material coated glass substrate provided in the second embodiment of the present application;

fig. 9D is a schematic structural diagram of pressing a template onto a coated organic material according to the second embodiment of the present application;

fig. 9E is a schematic structural diagram of the second embodiment of the present application after removing the template;

fig. 9F is a schematic structural view of the second application after the glass cover plate is removed;

fig. 9G is a schematic structural diagram of reactive ion etching of a device having a plurality of blind holes according to the second embodiment of the present application;

fig. 9H is a schematic structural diagram of a via device according to a second embodiment of the present application;

fig. 10 is a schematic structural diagram of a biometric identification module according to an embodiment of the present disclosure;

fig. 11 is a schematic structural diagram of a terminal device according to an embodiment of the present application;

fig. 12A is a schematic front view of a terminal device having an off-screen biometric identification module according to an embodiment of the present disclosure;

fig. 12B is a schematic view of a partial cross-sectional structure of the terminal device shown in fig. 12A along a-a.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items. Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.

The biological characteristic identification module that this application embodiment relates can be for the biological characteristic identification module under the screen, and it can be applicable to any terminal equipment who disposes display screen and biological characteristic identification module. For example, smart mobile phones, tablet computers, and other small Personal portable devices, such as Personal Digital Assistants (PDAs), electronic books (E-books), and the like. In above-mentioned terminal equipment, the setting of biological characteristic identification module is in the below of display screen, just biological characteristic identification module can optics biological characteristic discernment, and it can detect and discern user's biological characteristics (such as fingerprint) when the user operates through the display screen.

The optical path modulator in the biological characteristic identification module can be used as the TPV device, the TPV device is made of a polymer, namely an organic material, and is lower in cost relative to a silicon wafer of the TSV device and lower in manufacturing cost.

The following description will be made on a method for manufacturing a TPV device according to an embodiment of the present application. The manufacturing method of the through hole device, provided by the embodiment of the application, can be used for firstly obtaining the template with the plurality of columnar structures, transferring the patterns, corresponding to the shapes of the plurality of columnar structures, on the template into the organic material, forming the plurality of blind holes on the organic material, and enabling the plurality of blind holes to be changed into the plurality of through holes through etching, so that the through hole device is obtained. The through hole device is a TPV device, and comprises: a polymer substrate and the plurality of through holes formed in the polymer substrate; the material of the polymer substrate is the organic material.

In the solution provided in the embodiment of the present application, the pattern of the plurality of pillar structures on the template corresponding to the shape may be transferred to the organic material in a variety of ways.

For example, in one implementation, the pattern of the plurality of pillar structures on the template corresponding to the shape may be transferred into the organic material by casting or coating. In this implementation, the organic material may be coated on the template.

In yet another implementation, the pattern of the plurality of pillar structures on the template corresponding to the shape may be transferred into the organic material by means of imprinting. In this alternative implementation, the organic material may be coated on a substrate, such as a glass substrate, by means of template imprinting.

The following description will first describe, by way of example, the fabrication of a device in which a pattern transfer is performed in a coating manner to achieve a shape corresponding to a plurality of columnar structures on a template to achieve a through-hole. Fig. 1 is a flowchart of a method for manufacturing a through-hole device according to an embodiment of the present disclosure. As shown in fig. 1, the method for manufacturing the via device may include the following steps:

s101, obtaining a template (mold) with a plurality of columnar structures.

The plurality of columnar structures of the template can be arranged on the template in an array form, namely the plurality of columnar structures can form a columnar structure array. The size and density of the plurality of pillar structures on the template, among other things, determine the shape, size, and density of the vias on the via device. Therefore, the size, density, etc. of the plurality of columnar structures on the template can be determined according to the preset through hole requirement.

For example, each pillar structure on the template may be a cylinder structure with a diameter of 12 micrometers (um), a height of 100um, and a distance between adjacent pillar structures of 20 um.

Since the through-hole device is generally applied to the field of semiconductor packaging or optics, the through-hole device has high requirements on the accuracy of the through-hole and has a smaller size of the through-hole no matter what application is. Therefore, the plurality of columnar structures are generally small, such as a predetermined size, and thus, each columnar state may also be referred to as a columnar microstructure.

The template may be made of a silicon wafer, a metal, a polymer material such as SU-8 photoresist, or the like. Even if a template of a silicon wafer is adopted, the template can be repeatedly used, so that the manufacturing cost of the through hole device can be reduced.

In one example, the method can obtain an existing template having a plurality of pillar structures thereon during the fabrication of the via device.

In another example, the method may be implemented by fabricating the template having a plurality of pillar structures during the fabrication of the via device. The template with a plurality of columnar structures can be used for multiple times once being manufactured, so that the manufacturing cost of the through hole device is controlled. The corresponding plurality of columnar structures can be manufactured in different modes for templates made of different materials.

And S102, coating an organic material on the surface of the template with the plurality of columnar structures until the plurality of columnar structures are covered.

In this embodiment, the surface of the template having the plurality of pillar structures may be uniformly coated with the organic material until a vertical distance from the surface of the coated organic material to the surface of the pillar structures is greater than or equal to a predetermined thickness, so that the coated organic material covers the plurality of pillar structures. The predetermined thickness may be, for example, 10 um. The organic material may be, for example, any organic material that can be cured.

In the implementation process, the organic material may be coated on the surface of the template having the plurality of columnar structures by any one of a spin coating (spin coating) method, a spray coating (spray coating) method, a slit coating (slit coating), a dot coating method, and the like.

Different organic material characteristics or different coating thicknesses can correspond to different coating modes. For example, when the viscosity coefficient of the organic material is low and the coating thickness is small, i.e., not too thick, the spin coating method may be used. When the viscosity coefficient of the organic material is low and the coating thickness is required to be large, a spray coating method may be used. When the viscosity coefficient of the organic material is high, the organic material can be coated by a dot coating method, also called a dispensing method.

And S103, carrying out first curing on the coated organic material.

The organic material coated on the template is subjected to a first curing, so that the organic material has a certain mechanical strength.

S104, removing the template to obtain a device with a plurality of blind holes; the shapes of the blind holes are matched with the corresponding shapes of the columnar structures.

Since the organic material undergoes volume shrinkage after the first curing, the bonding force between the organic material and the template is small, and thus the template can be removed by applying an external force.

The template after removal may be subjected to a treatment such as cleaning as appropriate and then put into use again.

Since the organic material is coated on the surface of the template with a plurality of columnar structures, blind holes with corresponding shapes of the plurality of columnar structures are formed in the organic material. The shape of the blind holes is formed by a plurality of columnar structures on the template, and the shape of the blind holes is matched with the corresponding shape of the columnar structures. Therefore, the device with the plurality of blind holes is the organic material with the plurality of blind holes with the shapes corresponding to the columnar structures. Namely, the material of the device with the plurality of blind holes is the material of the organic material.

And S105, etching the device with the plurality of blind holes, so that the plurality of blind holes are changed into a plurality of through holes, and obtaining the through hole device.

The method can etch the whole surface of the device with the plurality of blind holes, for example, the closed ends of the plurality of blind holes can be etched to open the plurality of blind holes, so that the plurality of blind holes form a plurality of through holes, and the through hole device with the plurality of through holes is obtained.

The through hole device is a TPV device, and comprises: a polymer substrate and the plurality of through holes formed in the polymer substrate; the material of the polymer substrate is the organic material.

Optionally, in the method, the device with the plurality of blind holes may be etched in a reactive ion etching manner, so that the plurality of blind holes are all changed into a plurality of through holes.

The material of the devices with the plurality of blind holes is the material of the organic material, so that in the method, the corresponding etching mode, the etching ions and the like can be selected according to the organic material.

Regardless of the material of the organic material, the etching gas used in the reactive ion etching may include at least: oxygen (O2) and argon (Ar). For different organic materials, the etching gas can also comprise: a gas having etching ions corresponding to the material of the organic material.

In a specific implementation, an etching gas may be applied to the device having the plurality of blind vias at a self-bias of 140 volts (V) at 25 watts (W) such that the plurality of blind vias each become a plurality of through vias. Wherein the etching gas can be applied to the device with a plurality of blind holes, for example, in a direction away from the direction of the opening with a plurality of blind holes.

The through hole device manufacturing method provided by the embodiment of the application can be used for obtaining the template with the plurality of columnar structures, coating the organic materials on the surface of the template with the plurality of columnar structures until the plurality of columnar structures are covered, carrying out first curing on the coated organic materials, removing the template, and obtaining the device with the plurality of blind holes, wherein the shapes of the plurality of blind holes are matched with the corresponding shapes of the plurality of columnar structures, and etching the device with the plurality of blind holes, so that the plurality of blind holes are all changed into the plurality of through holes, and the through hole device is obtained. The manufacturing method of the through hole device can obtain a plurality of through hole devices in one manufacturing process, is actually porous, and effectively reduces the manufacturing cost of the through hole devices.

Even if the number of the through holes of the through hole device is large, the number of the through holes on the through hole device can be increased only by arranging more columnar structures on the template, the manufacturing process is simple, and the manufacturing cost is low.

Meanwhile, the size, the density and the like of the through holes on the through hole device are determined by the size and the density of the columnar structures on the template, so that the through hole device can be finely manufactured by manufacturing the template with the columnar structures with fine size and density, and the fine requirements of the through hole device as an optical path modulator on the aperture, the interval and the like of the through holes are met. The dimensions of the columnar structure may include, for example: aspect ratio, aperture, etc. of each columnar structure. The density of the columnar structures is realized by the spacing between adjacent columnar structures, which can also be referred to as pitch.

In addition, the template with a plurality of columnar structures can be repeatedly used, and the manufacturing cost of the through hole device can be further reduced.

On the basis of the method shown in fig. 1, a method for manufacturing a through-hole device may also be provided in an embodiment of the present application. Fig. 2 is a flowchart of another method for manufacturing a via device according to an embodiment of the present disclosure. As shown in fig. 2, the method may coat the organic material on the surface of the template having the plurality of pillar structures until covering the plurality of pillar structures in S102, which may include:

s201, depositing an Anti-sticking layer (Anti-sticking layer) with a preset uniform thickness on the surface of the template with the plurality of columnar structures.

In practice, the anti-stiction layer may be deposited to a thickness of, for example, any of 1nm to 10 nm.

And S202, coating an organic material on the anti-sticking layer until the plurality of columnar structures are covered.

In the embodiment, the adhesion-resistant layer with a predetermined uniform thickness is deposited on the surface of the template having the plurality of columnar structures, and the organic material is coated on the adhesion-resistant layer, so that the adhesion between the organic material and the template is reduced, and the removal of the template is facilitated.

On the basis of fig. 1 or fig. 2, a method for manufacturing a through-hole device may also be provided in an embodiment of the present application. Fig. 3 is a flowchart of a method for manufacturing a via device according to an embodiment of the present disclosure. As shown in fig. 3, the first curing of the coated organic material in S103 may include:

s301, carrying out photocuring on the coated organic material, wherein the organic material is a photosensitive organic material.

The organic material may be, for example, an Epoxy (Modified Epoxy Resin), or any other photo-curable resist. When the organic material is a photosensitive organic material, the first curing may be photo-curing.

The organic material is an Ultraviolet (UV) light curable organic material, and the light curing may be, for example, UV light curing.

Alternatively, before photo-curing the coated organic material in S301 as shown above, the method may further include:

s301a, placing a glass cover plate on the coated organic material, and applying pressure to the glass cover plate.

The surface of the organic material can be more flat by applying pressure through the glass cover plate.

Since the glass cover plate has good light transmittance, when the glass cover plate is placed on the coated organic material, light can be incident on the coated organic material through the glass cover plate, thereby realizing photocuring.

Alternatively, in the case where a glass cover plate is placed on the organic material, after the removing the template in the above S104 is performed, the method may further include:

and carrying out second curing on the device with the plurality of blind holes, and removing the glass cover plate, wherein the second curing is annealing curing.

In this embodiment, an assembly including a device having a plurality of blind vias and a glass cover plate may be placed in an oven to anneal and cure the device having a plurality of blind vias in the oven. In the case of this annealing and curing, the glass cover plate is actually also placed on the organic material, i.e. the device with the plurality of blind holes. Therefore, after annealing and curing, the glass cover plate needs to be removed. In this method, the glass cover plate can be removed, for example, by peeling.

In the case of annealing and curing the device having the plurality of blind vias, the annealing temperature may be, for example, 120 degrees celsius (c) and the annealing time may be, for example, 1 hour. That is, the device having the plurality of blind vias may be placed in an environment having an annealing temperature of 120 degrees celsius for 1 hour to achieve annealing solidification.

By annealing the device with the plurality of blind holes, the mechanical strength of the device with the plurality of blind holes can be further enhanced, so that the mechanical strength of the through hole device can be further enhanced.

In the case of annealing and curing the device with the plurality of blind holes, in order to ensure that the mechanical strength of the device with the plurality of blind holes is increased as much as possible, the device is allowed to stand at a preset temperature, such as 25 ℃, for a preset time, such as 24 hours, after annealing and curing.

On the basis of the method described in any one of fig. 1 to fig. 3, the present application may further provide a method for manufacturing a through-hole device. This method may be an example of the above method. Fig. 4 is a flowchart of a method for manufacturing a via device according to another embodiment of the present disclosure. As shown in fig. 4, the method for manufacturing the via device may include:

s401, photoetching or dry etching is carried out on the preset template to obtain a template with a plurality of columnar structures.

Fig. 5A is a schematic structural diagram of a template having a plurality of pillar structures according to an embodiment of the present application. In this method, for example, the template 50 may be subjected to photolithography or dry etching to obtain the template 50 having the plurality of columnar structures 51. Each of the pillar structures may have a diameter of 12um, a distance between adjacent pillar structures may be 20um, and a height of each of the pillar structures may be 100 um. The template may be made of silicon wafer, metal, polymer material, etc.

S402, depositing an anti-sticking layer with a preset uniform thickness on the surface of the template with the plurality of columnar structures.

Fig. 5B is a schematic structural diagram of a template deposited with an anti-adhesion layer according to an embodiment of the present application. In this method, for example, an anti-adhesion layer 52 with a predetermined uniform thickness may be deposited on the surface of the template 50 having the plurality of pillar structures 51. The thickness of the anti-sticking layer 52 may be, for example, any one of 1nm to 10 nm.

And S403, coating an organic material on the surface of the anti-sticking layer until the plurality of columnar structures are covered.

Fig. 5C is a schematic view of a template coated with an organic material according to an embodiment of the present disclosure. In the method, the organic material 53 may be coated on the surface of the anti-sticking layer by a spin coating method, such that the organic material covers the plurality of pillar structures 51 until the coating thickness h of the organic material 53 is greater than or equal to a predetermined thickness, such as 10 μm. The coating thickness h of the organic material 53 may be, for example, the vertical distance from the surface of the coated organic material 53 to the surface of the anti-sticking layer 52 deposited on the columnar structure 51.

S404, placing a glass cover plate on the coated organic material, applying pressure to the glass cover plate, and carrying out light curing on the coated organic material through the glass cover plate.

Fig. 5D is a schematic structural diagram of a glass cover plate placed on the coated organic material according to an embodiment of the present disclosure. In this method, a glass cover plate 54 may be placed on the coated organic material 53, and pressure may be applied to the glass cover plate 54 to flatten the surface of the organic material 53. And, light 55 is also incident to the coated organic material 53 through the glass cover plate 54 for a duration of 300s to photo-cure the coated organic material 53 by the incident light. The wavelength range of the incident light may be, for example, 320nm to 380 nm. The intensity of the incident light may be, for example, 25mW/cm². That is, the incident light may have a light intensity of 25mW/cm, for example²UV light of (1). The coated organic material 53 is irradiated with incident light, and undergoes intermolecular crosslinking reaction to form a polymer, thereby realizing photocuring. The photo-cured organic material 53 has a predetermined mechanical strength.

S405, removing the template.

Fig. 5E is a schematic structural diagram of the removed template according to an embodiment of the present application. In this method, the template 50 may be removed to obtain the structure shown in fig. 5E, i.e. the structure comprising the organic material 53 and the glass cover plate 54.

S406, annealing and curing the coated organic material, and standing for a preset time after annealing and curing.

In this method, the structure including the organic material 53 and the glass cover plate 54 may be placed in an oven, annealed at an annealing temperature of 120 ℃ for 1 hour, and after annealing, left standing at a predetermined temperature, e.g., 25 ℃, for a predetermined time, e.g., 1 hour.

And S407, removing the glass cover plate to obtain a device with a plurality of blind holes.

Fig. 5F is a schematic structural diagram of a device with multiple blind holes after removing glass according to an embodiment of the present application. In this method, a glass cover plate 54 may be used to obtain a device having a plurality of blind holes 56. Meanwhile, a device having a plurality of blind holes 56 may be inverted to change the opening orientations of the plurality of blind holes 56.

S408, performing reactive ion etching on the device with the plurality of blind holes to change the plurality of blind holes into through holes, and obtaining the through hole device.

Fig. 5G is a schematic structural diagram of performing reactive ion etching on a device having a plurality of blind holes according to an embodiment of the present application. Fig. 5H is a schematic structural diagram of a via device according to an embodiment of the present application.

In the method, etching gas including etching ions is introduced into the closed end of the blind holes on the device with the blind holes 56 at a power of 25W and a self-bias voltage of 140V to perform reactive ion etching, so as to obtain a device with the through holes 57 shown in fig. 5H, that is, a through hole device. The via device can become a TPV device. Wherein the etching gas may include at least: oxygen and argon.

The manufacturing method of the through hole device can obtain a plurality of through hole devices in one manufacturing process, is actually porous, and effectively reduces the manufacturing cost of the through hole devices. Even if the number of the through holes of the through hole device is large, the number of the through holes on the through hole device can be increased only by arranging more columnar structures on the template, the manufacturing process is simple, and the manufacturing cost is low.

Meanwhile, the size, the density and the like of the through holes on the through hole device are determined by the size and the density of the columnar structures on the template, so that the through hole device can be finely manufactured by manufacturing the template with the columnar structures with fine size and density. The dimensions of the columnar structure may include, for example: aspect ratio, aperture, etc. of each columnar structure. The density of the columnar structures is realized by the spacing between adjacent columnar structures, which can also be referred to as pitch.

The following description will first describe, by way of example, the fabrication of a device with through holes by pattern transfer in which a plurality of columnar structures on a template are imprinted in a corresponding shape. Fig. 6 is a flowchart of a method for manufacturing a through-hole device according to a second embodiment of the present application. As shown in fig. 6, the method for manufacturing the via device may include:

s601, obtaining a template with a plurality of columnar structures.

In the second embodiment, the specific implementation of S601 may be similar to that of S101 described above, which is specifically referred to above and is not described herein again.

S602, an organic material is coated on the glass substrate.

The shape of the glass substrate may be circular, square, or other shapes. The planar size of the glass substrate may be the same as or larger than the size of the bottom surface of the template.

In the method, the organic material may be uniformly coated to a predetermined thickness after the glass substrate is cleaned. The predetermined thickness may be 120 um.

In the implementation, the organic material may be coated on the glass substrate by any one of a spin coating (spin coating) method, a spray coating (spray coating) method, a slit coating (slit coating) method, a dot coating method, and the like.

Different organic material characteristics or different coating thicknesses can correspond to different coating modes. For example, when the viscosity coefficient of the organic material is low and the coating thickness is small, i.e., not too thick, the spin coating method may be used. When the viscosity coefficient of the organic material is low and the coating thickness is required to be large, a spray coating method may be used. When the viscosity coefficient of the organic material is higher, the organic material can be coated by adopting a point coating mode, which is also called a dispensing mode.

It should be noted that S601 may be executed simultaneously with S602, or may be executed sequentially, which is not limited in this embodiment of the application.

S603, pressing the side of the template having the plurality of pillar structures to the coated organic material, so as to print the pattern with the shape corresponding to the plurality of pillar structures on the coated organic material.

In the method, the side of the template having the plurality of columnar structures may be pressed to the coated organic material at a predetermined constant pressure for a predetermined period of time until all of the plurality of columnar structures are pressed into the coated organic material.

In the second embodiment, by pressing the side of the template having the plurality of columnar structures to the coated organic material, that is, by means of imprinting, pattern transfer of the shapes corresponding to the plurality of columnar structures on the template is realized and is imprinted on the coated organic material.

S604, carrying out first curing on the organic material printed with the images with the shapes corresponding to the plurality of columnar structures.

The organic material printed with the images of the shapes corresponding to the plurality of columnar structures is subjected to first curing, so that the organic material has certain mechanical strength.

S605, removing the template to obtain a device with a plurality of blind holes; the shapes of the plurality of blind holes are matched with those of the plurality of columnar structures.

Because the template with the plurality of columnar structures is pressed to the coated organic material, blind holes with shapes corresponding to the plurality of columnar structures are formed on the organic material printed with the patterns with shapes corresponding to the plurality of columnar structures. The patterns with the shapes corresponding to the columnar structures are the shapes of the blind holes.

The shape of the blind holes is formed by a plurality of columnar structures on the template, and the shape of the blind holes is matched with the corresponding shape of the columnar structures. Therefore, the device with the plurality of blind holes is the organic material with the plurality of blind holes with the shapes corresponding to the columnar structures. Namely, the material of the device with the plurality of blind holes is the material of the organic material.

S606, removing the glass substrate, and etching the device with the plurality of blind holes, so that the plurality of blind holes are changed into a plurality of through holes, and the through hole device is obtained.

By executing the above S605 to actually obtain the assembly including the glass substrate and the device having the plurality of blind holes, the glass substrate needs to be removed to obtain the through holes, and under the condition that the glass substrate is removed, the entire surface of the device having the plurality of blind holes may be etched, for example, the closed ends of the plurality of blind holes may be etched to open the plurality of blind holes, so that the plurality of blind holes form the plurality of through holes, thereby obtaining the through hole device having the plurality of through holes.

The through hole device manufacturing method provided by the embodiment of the application can be used for coating an organic material on a glass substrate by obtaining a template with a plurality of columnar structures, pressing one side, with the plurality of columnar structures, of the template to the coated organic material, printing patterns with shapes corresponding to the plurality of columnar structures on the coated organic material, performing first curing on the organic material printed with the images with shapes corresponding to the plurality of columnar structures, and removing the template to obtain a device with a plurality of blind holes, wherein the plurality of blind holes are matched with the plurality of columnar structures in shape, and meanwhile, removing the glass substrate and etching the device with the plurality of blind holes to enable the plurality of blind holes to be changed into a plurality of through holes, so that the through hole device is obtained. The manufacturing method of the through hole device can obtain a plurality of through hole devices in one manufacturing process, is actually porous, and effectively reduces the manufacturing cost of the through hole devices.

And, because the organic material is coated on the glass cover plate in the method, and the size of the glass cover plate is generally larger, the method can more effectively reduce the manufacturing process cost for the through hole device with larger size.

Alternatively, on the basis of the method described in fig. 6, where the step S602 of coating the organic material on the glass substrate may include:

a Release layer (Release layer) is coated on the glass substrate, and an organic material is coated on a surface of the Release layer.

The material of the release layer may be a material that can be eliminated. By coating the release layer on the glass substrate and coating the organic material on the surface of the release layer, the subsequent stripping of the glass substrate and the organic material can be facilitated. The release layer is only needed to be eliminated, so that the glass substrate and the organic material can be stripped conveniently and quickly.

Optionally, the removing the glass substrate in the method S606 may include:

coating a dissolving solution corresponding to the material of the release layer at the release layer to eliminate the release layer, thereby removing the glass substrate; or,

placing an assembly comprising a device having a plurality of blind holes and the glass substrate in a dissolving solution corresponding to the material of the release layer to eliminate the release layer, thereby removing the glass substrate; or,

and irradiating laser with the wavelength corresponding to the material of the release layer at the release layer to eliminate the release layer, so as to remove the glass substrate.

Different release layer materials may correspond to different ways of eliminating the release layer.

If the material of the release layer is a material that can be chemically dissolved, in the method, a dissolving solution corresponding to the material of the release layer can be coated at the release layer to eliminate the release layer through the dissolving solution; the assembly including the device having the plurality of blind holes and the glass substrate may also be placed in a dissolving solution corresponding to the material of the release layer to eliminate the release layer by the dissolving solution.

If the material of the release layer can be a material that can be eliminated by laser, then in the method, laser light of a corresponding wavelength of the material of the release layer can be irradiated at the release layer to eliminate the release layer by the laser light of the corresponding wavelength.

In any case, the glass substrate can be separated from the device having the plurality of blind holes as long as the release layer is eliminated, thereby achieving removal of the glass substrate.

Optionally, on the basis of any one of the methods provided in the second embodiment, a method for manufacturing a through hole device may also be provided in the second embodiment of the present application. Fig. 7 is a flowchart of another method for manufacturing a via device according to the second embodiment of the present application. As shown in fig. 7, pressing the side of the template having the plurality of pillar structures to the coated organic material in S603 in the above method may include:

and S701, depositing an anti-sticking layer with a preset uniform thickness on the surface of the template with the plurality of columnar states.

The description of S701 can refer to S201 described above, and is not repeated herein.

S702, pressing the side of the template on which the anti-sticking layer is deposited to the coated organic material.

In the scheme, after the anti-adhesion layers with the preset uniform thickness are deposited on the surfaces of the plurality of columnar states on the template, the side, on which the anti-adhesion layers are deposited, of the template is pressed to the coated organic material, so that the viscosity between the template and the organic material is reduced through the anti-adhesion layers, and the removal of the template is facilitated.

Alternatively, the organic material as shown above may be a photosensitive organic material. The performing the first curing of the organic material printed with the image having the shape corresponding to the plurality of columnar structures in S604 may include:

and photo-curing the organic material printed with the image with the shape corresponding to the plurality of columnar structures.

The organic material may be, for example, an Epoxy (Modified Epoxy Resin), or any other photo-curable resist. The organic material is a UV light curable organic material, and the light curing may be, for example, UV light curing. When the organic material is a photosensitive organic material, the first curing may be photo-curing.

Optionally, before removing the glass substrate in the step S604, the method may further include:

and carrying out second curing on the device with the plurality of blind holes, wherein the second curing is annealing curing.

For a detailed description of the second curing, reference may be made to the description of the second curing in the above embodiments, and details are not repeated herein.

On the basis of the method described in fig. 6 or fig. 7, the present application may further provide a method for manufacturing a through-hole device. This method may be an example of the above method. Fig. 8 is a flowchart of a method for manufacturing a via device according to a second embodiment of the present disclosure. As shown in fig. 8, the method for manufacturing the via device may include:

s801, carrying out photoetching or dry etching on the preset template to obtain the template with a plurality of columnar structures.

Fig. 9A is a schematic structural diagram of a template having a plurality of pillar structures according to a second embodiment of the present application. In this method, for example, the template 90 may be subjected to photolithography or dry etching to obtain the template 90 having the plurality of columnar structures 91. Each of the pillar structures may have a diameter of 12um, a distance between adjacent pillar structures may be 20um, and a height of each of the pillar structures may be 100 um. The template may be made of silicon wafer, metal, polymer material, etc.

S802, depositing an anti-sticking layer with a preset uniform thickness on the surface of the template with the plurality of columnar structures.

Fig. 9B is a schematic structural diagram of the template deposited with the anti-adhesion layer according to the second embodiment of the present application. In this method, for example, the anti-sticking layer 92 may be deposited to a predetermined uniform thickness on the surface of the template 90 having the plurality of pillar structures 91. The thickness of the anti-sticking layer 92 may be, for example, any one of 1nm to 10 nm.

S803, a release layer is coated on the glass substrate, and an organic material is coated on the release layer.

Fig. 9C is a schematic view of the glass substrate coated with an organic material according to the second embodiment of the present application. In this method, a release layer 94 may be coated on a glass substrate 93, and an organic material 95 having a predetermined thickness, for example, 120um, may be coated on the release layer 94. The material of the release layer 94 may be, for example, an organic material that can be dissolved by a chemical solution to facilitate the removal of the glass substrate 93. The organic material 95 is different from the organic material of the release layer 94. The organic material 95 may be a photo-curable organic material, such as an epoxy-based resin.

S804, pressing the side of the template having the plurality of pillar structures to the coated organic material to print the pattern with the corresponding shape of the plurality of pillar structures into the coated organic material.

Fig. 9D is a schematic structural diagram of pressing a template onto a coated organic material according to the second embodiment of the present application. In the method, the side of the template 90 having the plurality of pillar structures 91 may be pressed to the coated organic material 95 with a predetermined pressure and maintained for a predetermined time.

And S805, carrying out photocuring on the coated organic material through the glass substrate.

With continued reference to fig. 9D, in the method, light 96 may also be incident on the coated organic material 95 through the glass substrate 93 for a predetermined duration to photocure the coated organic material via the incident light. The specific parameters of the photocuring process can be referred to in S404, and are not described herein again.

And S806, removing the template.

Fig. 9E is a schematic structural diagram of the second embodiment of the present application after removing the template. In this method, the template 90 may be removed to obtain the structure shown in fig. 9E, i.e., the structure including the organic material 95, the release layer 94, and the glass cover plate 93.

S807, annealing and curing the coated organic material, and standing for a preset time after annealing and curing.

And S808, removing the glass cover plate.

Fig. 9F is a schematic structural diagram of the second application after the glass cover plate is removed. If the release layer 94 is a material that can be removed by a chemical solution, the method may place the structure including the organic material 95, the release layer 94 and the glass cover plate 93 in a solution corresponding to the material of the release layer 94, so as to remove the release layer 94 by the solution, so that the organic material 95 and the glass cover plate 93 are separated, and the glass cover plate 93 may be removed, thereby obtaining the device with a plurality of blind holes 97 shown in fig. 9F.

Meanwhile, a device having a plurality of blind holes 97 may be inverted to change the opening orientations of the plurality of blind holes 97.

And S809, performing reactive ion etching on the device with the plurality of blind holes to change the plurality of blind holes into through holes, thereby obtaining the through hole device.

Fig. 9G is a schematic structural diagram of performing reactive ion etching on a device having a plurality of blind holes according to the second embodiment of the present application. Fig. 9H is a schematic structural diagram of a via device according to the second embodiment of the present application.

In the method, etching gas including etching ions is introduced into the closed end of the plurality of blind holes on the device having the plurality of blind holes 97 at a power of 25W and a self-bias voltage of 140V to perform reactive ion etching, so as to obtain a device having the plurality of through holes 98 shown in fig. 9H, that is, a through hole device. The via device can become a TPV device. Wherein the etching gas may include at least: oxygen and argon.

In the second embodiment, when the technical effect of the first embodiment is achieved, compared with the first embodiment, the glass substrate used in the method provided by the second embodiment can be a glass substrate with a larger size, so that the process cycle and the cost of a single device can be reduced. For example, the glass substrate used in the 8.5 generation display panel has a length of 2200 mm and a width of 2500 mm. If the template is cut into a square having a side of 120 mm, and then the templates having a plurality of pillar structures are sequentially pressed onto the organic material coated on the glass substrate while the above-described S804 is performed, a position of the corresponding glass substrate may be different each time. After the last pressing, the above steps S805-808 can be continuously performed, which can greatly improve the production efficiency and reduce the manufacturing cost of the TPV.

The biometric identification module and the terminal device including the TPV device are exemplified as follows.

Fig. 10 is a schematic structural diagram of a biometric identification module according to an embodiment of the present disclosure. As shown in fig. 10, the biometric recognition module 100 includes: a biometric sensor 102 and an optical path modulator 101; the light path modulator 101 is used for collimating and modulating incident light; the biometric sensor 102 is located below the optical path modulator 101, and is configured to convert the received collimated and modulated light output by the optical path modulator 101 into a biometric detection signal.

The optical path modulator 101 is a TPV device including: a polymer substrate and an array of vias formed on the polymer substrate. The via array is an array including a plurality of vias. The TPV device as the optical path modulator 101 can be manufactured by the method of manufacturing the through-hole device described in any of the above embodiments.

In this embodiment, the biometric module 100 may be an optical biometric module, such as an optical fingerprint module, which can be used to collect biometric information of a user, such as fingerprint image information. The biometric sensor 102 may be an optical biometric sensor, such as an optical fingerprint sensor or an image sensor, among others. When the biometric sensor 102 is an optical fingerprint sensor, the biometric module 100 can be an optical fingerprint module.

The biometric identification module 100 may be a sub-screen biometric identification module, and the light path modulator 11 may be configured to collimate and modulate light incident through the display screen, and to emit the collimated and modulated light to the biometric sensor 102. The biometric sensor 102 is configured to convert the received collimated and modulated light into a biometric detection signal, so as to perform biometric identification according to the biometric detection signal.

In this embodiment, a TPV device is used as the optical path modulator 11, and the optical path modulator 11 can modulate the collimation of the light incident to the through hole through the through hole in the through hole array on the TPV device and emit the light after the collimation modulation to the biometric sensor 102.

Optionally, the biometric sensor 102 may include: the sensing array is composed of a plurality of optical sensing units; the optical path modulator 11 includes: a plurality of modulation units, each modulation unit being a via of a TPV via device.

The modulation unit may also be referred to as a collimation unit. The optical path modulator 101 may also be referred to as an optical Collimator (collimater). The through-hole as the collimating unit or the modulating unit may be a through-hole having a high aspect ratio.

In one example, the position of each optical sensing unit may correspond to the position of one modulation unit.

In another example, the position of each optical sensing unit may also correspond to the positions of a plurality of modulation units.

In yet another example, the position of the optical sensing unit in the biometric sensor 102 may not correspond to the position of the modulation unit in the optical path modulator 101. The plurality of modulation units in the optical path modulator 101 may be irregularly arranged, so that there is no specific correspondence between the modulation units and the optical sensing unit of the biometric sensor 102. When the modulation units of the optical path modulator 101 are arranged irregularly, the biometric sensor 102 corrects the light detected by each sensing unit through a later software algorithm, and outputs a biometric detection signal based on the corrected light.

Optionally, the biometric identification module 100 further includes: optical filters (filters); the filter may be located on a side of the optical path modulator 101 facing away from the biometric sensor 102. The optical filter may filter the incident light to filter the ambient light, and may transmit the filtered light to the optical path modulator 11.

Wherein the biometric sensor 102 and the optical path modulator 101 can be packaged in one chip. Alternatively, the biometric sensor 102 and the optical path modulator 101 may be mounted inside the biometric identification module 100 as separate components.

The biometric identification module that this application embodiment provided can include: a biometric sensor and an optical path modulator; the light path modulator is used for collimating and modulating incident light; the biological characteristic sensor is positioned below the light path modulator and used for converting the received light rays which are output by the light path modulator and are collimated and modulated into biological characteristic detection signals; the optical path modulator is a TPV via device, the TPV via device comprising: a polymer substrate and an array of vias formed on the polymer substrate. The biological characteristic identification module adopts the TPV device as the light path modulator, and the material cost and the manufacturing cost of the TPV device are lower, so that the cost of the light path modulator is reduced, and the cost of the biological characteristic identification module is effectively reduced.

The embodiment of the application also can provide a terminal device with the biological characteristic identification module. Fig. 11 is a schematic structural diagram of a terminal device according to an embodiment of the present application. As shown in fig. 11, the terminal device 110 may include: a housing 111, a cover plate 112, a display screen 113 and a biometric identification module 114. The cover plate 112, the display screen 112 and the biometric identification module 113 are located within the housing 111.

The cover plate 112 is attached to one surface of the display screen 113, and the other surface of the display screen 113 faces the light inlet surface of the biometric feature recognition module 114. The biometric module 114 is any one of the biometric modules described above.

Optionally, the terminal device 110 may further include: a circuit board; the biometric identification module 114 is soldered to the circuit board.

The Circuit board may be, for example, a Flexible Printed Circuit (FPC), and the biometric identification module 114 may be soldered to the Circuit board through a pad, and may implement electrical connection and signal transmission of other peripheral circuits or other components of the terminal device 110 through the Circuit board.

For example, the biometric identification module 114 may receive a control signal from the processing unit via the circuit board, and may transmit a biometric detection signal output by the biometric identification module 114 to the processing unit via the circuit board.

The terminal device provided by the embodiment of the application can be provided with the biological characteristic identification module, and the corresponding principle and beneficial effect are referred to above, which is not described herein again.

For convenience of understanding, as an example and not by limitation, the below-screen biometric identification apparatus provided by the present application is described by taking the terminal device as a smart phone and the biometric identification module as an optical fingerprint module as an application scenario.

Referring to fig. 12A and 12B, fig. 12A is a schematic front view of a terminal device having an off-screen biometric module according to an embodiment of the present disclosure, and fig. 12B is a schematic partial sectional view of the terminal device shown in fig. 12A along a-a. The terminal device 120 may be embodied as a smart phone, which includes: display screen 130 and biological characteristic identification module 140, wherein, display screen 130 has display area 131, biological characteristic identification module 140 sets up the below at display screen 130.

The display screen 130 may be a self-luminous display screen employing as display pixels having self-luminous display units, such as an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen; in other alternative embodiments, the Display 130 may also be a Liquid Crystal Display (LCD) or other passive light emitting Display, which is not limited in this application. On the other hand, the display screen 130 is specifically a touch display screen, which not only can perform image display, but also can detect touch or pressing operation of a user, thereby providing a human-computer interaction interface for the user. For example, in one embodiment, the terminal device 120 may include a Touch sensor, which may be embodied as a Touch Panel (TP), which may be disposed on a surface of the display screen 130, or may be partially or entirely integrated within the display screen 130, thereby forming a Touch display screen.

The biometric identification module 140 may be embodied as an optical biometric identification module, such as an optical fingerprint module, which is mainly used for collecting biometric information (such as fingerprint image information) of a user; in this embodiment, the biometric characteristic recognition module 140 may be disposed at least in a local area below the display screen 130, so that the biometric characteristic collection area (or sensing area) 132 of the biometric characteristic recognition module 140 is at least partially located in the display area 131 of the display screen 130.

As an example, the biometric identification module 140 may specifically include an optical biometric sensor having an optical sensing array, such as an optical fingerprint sensor; the optical sensing array includes a plurality of optical sensing units, and the corresponding area of the optical sensing array is the biometric feature acquisition area 132 of the biometric feature recognition module 140. As shown in fig. 12A, the biometric acquisition area 132 is located in the display area 131 of the display 130, so that when the user needs to unlock or otherwise verify the terminal device 120, the user only needs to press a finger on the biometric acquisition area 132 located on the display 130, and then the biometric input operation can be implemented. Since the biometric feature collection and detection can be implemented inside the display area 131 of the display screen 130, the terminal device 120 adopting the above structure does not need a special reserved space on the front side to set a fingerprint key (such as a Home key), and thus a full-screen scheme can be adopted, and the display area 131 of the display screen 130 can be basically extended to the whole front side of the terminal device 120.

It should be understood that fig. 12A and 12B illustrate the biometric recognition module 140 as an example of an optical biometric recognition module under a screen.

In this embodiment, taking the OLED display screen as an example of the display screen 130, the display screen 130 has an array of OLED display units arranged in an array, and the biometric identification module 140 may use the OLED display units (i.e., OLED light sources) of the OLED display screen 130 located in the biometric acquisition area 132 as excitation light sources for biometric detection and identification. Of course, it should be understood that in other alternative implementations, the biometric identification module 140 may also use an internal light source or an external light source to provide the optical signal for biometric detection and identification, in which case, the under-screen biometric identification apparatus may be applied not only to a self-luminous display screen such as an OLED display screen, but also to a non-self-luminous display screen such as a liquid crystal display screen or other passive luminous display screen. Moreover, the optical sensing array of the biometric identification module 140 is specifically a Photo detector (Photo detector) array, which includes a plurality of Photo detectors distributed in an array, and the Photo detectors can be used as the optical sensing units as described above.

When a finger touches, presses, or approaches (for convenience of description, this application refers to pressing) the biometric acquisition area 132, light emitted from the display unit of the biometric acquisition area 132 is reflected at the finger and forms reflected light, wherein the reflected light may carry biometric information of the user's finger. For example, after the light is reflected by the fingerprint on the surface of the finger of the user, the reflected light carries the fingerprint information of the user because the reflected light of the ridges and the valleys of the fingerprint is different. The reflected light returns to the display screen 130 and is received by the photodetector array of the biometric identification module 140 therebelow and converted into a corresponding electrical signal, i.e., a biometric detection signal. The terminal device 120 may obtain the biometric information of the user based on the biometric detection signal, and may further perform biometric matching verification, thereby completing the identity verification of the current user to determine whether the user has the right to perform corresponding operations on the terminal device 120.

In other alternative embodiments, the biometric identification module 140 may also be disposed in the entire area below the display screen 130, so as to expand the biometric collection area 132 to the entire display area 131 of the entire display screen 130, thereby implementing full-screen biometric identification.

It should be understood that, in a specific implementation, the terminal device 120 further includes a cover plate 150, the cover plate 150 may be a transparent cover plate, such as a glass cover plate or a sapphire cover plate, which is located above the display screen 130 and covers the front surface of the terminal device 120, and the surface of the cover plate 150 may also be provided with a protective layer. Therefore, in the embodiment of the present application, the pressing of the display screen 130 by the finger may actually mean that the finger presses the cover plate 150 above the display screen 130 or the surface of the protective layer covering the cover plate 150.

As an alternative implementation, as shown in fig. 12B, the biometric identification module 140 includes a biometric sensor 142 and an optical component 141, the biometric sensor 142 is used as an optical detection unit, which may be specifically an optical fingerprint sensor or an image sensor, and includes a sensing array, a reading circuit electrically connected to the sensing array, and other auxiliary circuits, which may be fabricated on a chip through a semiconductor process; the optical component 141 may be disposed above the sensing array of the biometric sensor 142, and may specifically include an optical filter, an optical path modulator, and other optical elements, where the optical filter may be used to filter ambient light penetrating through the finger, and the optical path modulator may be an optical collimator, and the optical collimator may employ a through hole device having a through hole array with a high aspect ratio, and is mainly used to collimate and modulate light propagating downwards, so that reflected light reflected from the surface of the finger is guided to the sensing array for optical detection. In this embodiment, the optical path modulator may be a TPV device, and the TPV device includes: a polymer substrate and an array of vias formed on the polymer substrate. The polymer is an organic material. The TPV device may be a device obtained by using any of the above-described methods for manufacturing a via device.

Fig. 12B shows a possible structure of the biometric module 140 in fig. 12A, wherein the biometric module 140 may include an optical component 141 and a biometric sensor 142, the optical component 141 includes an optical path modulator and an optical filter, light emitted from the display 130 is reflected on the surface of the finger to be detected above the display 130, the optical path modulator uses a TPV device as an optical path collimator and collimates and modulates reflected light reflected from the surface of the finger through an array of through holes therein, and guides the reflected light to the optical filter, the reflected light is filtered by the optical filter and then received by the biometric sensor 142, and the biometric sensor 142 may further detect the received reflected light to realize biometric identification such as fingerprint identification.

In specific implementation, the optical component 141 and the biometric sensor 142 may be packaged in the same optical fingerprint chip, or may be installed inside the biometric identification module 140 as a component that is relatively independent from the biometric sensor 142.

In this embodiment, the optical path modulator may specifically be an optical Collimator (collimater) or TPV device made of an organic material by using any one of the above methods for manufacturing a through hole device, and the optical path modulator has a plurality of collimating units, that is, the through hole array. One through hole of the through hole array can be used as an alignment unit. The collimating unit may specifically be a through hole with a high aspect ratio, which may serve as a modulating unit of the optical path modulator. Specifically, in the reflected light reflected by the finger, the light incident on the modulation unit can pass through and be received by the optical sensing units below the modulation unit, and each optical sensing unit can basically receive the reflected light of the fingerprint lines guided by the through hole above the optical sensing unit, so that the sensing array can detect the fingerprint image of the finger.

In the biometric identification module 140, each modulation unit of the optical path modulator may correspond to one optical sensing unit in the sensing array of the biometric sensor 142. Alternatively, the modulation units and the optical sensing units of the sensing array may also have a non-one-to-one correspondence relationship to reduce moire interference, for example, one optical sensing unit may correspond to a plurality of modulation units, or the modulation units may also have an irregular arrangement to achieve no specific correspondence relationship with the optical sensing units of the sensing array. When the modulation units of the optical path modulator are arranged irregularly, the biometric identification module 140 can correct the reflected light detected by each sensing unit through a later software algorithm.

On the other hand, a circuit board, such as an FPC, may be disposed below the biometric module 140, and the biometric module 140 may be soldered to the circuit board through a pad, and may be electrically interconnected with other peripheral circuits or other components of the terminal device 120 and transmit signals through the circuit board. For example, the biometric identification module 140 may receive a control signal from the processing unit of the terminal device 120 via the circuit board, and may also output the biometric detection signal to the processing unit or the control unit of the terminal device 120 via the circuit board.

In the under-screen biological characteristic identification module that terminal equipment adopted that this application embodiment provided, regard the TPV device as the light path modulator in the optical assembly, also called optical collimator, reduced the cost of light path modulator to reduce terminal equipment's cost.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A biometric identification module, comprising: a biometric sensor and an optical path modulator; the light path modulator is used for collimating and modulating incident light; the biological characteristic sensor is positioned below the light path modulator and used for converting the received light rays which are output by the light path modulator and subjected to collimation and modulation into biological characteristic detection signals;

the optical path modulator is a polymer through hole TPV device, and the TPV device comprises: a polymer substrate and an array of vias formed on the polymer substrate.

2. The biometric identification module of claim 1, wherein the biometric sensor comprises: the sensing array is composed of a plurality of optical sensing units; the optical path modulator includes: a plurality of modulation units, each modulation unit being a via of the TPV device.

3. The biometric recognition module of claim 2, wherein each of the optical sensing units is positioned to correspond to a position of one of the modulating units.

4. The biometric module of claim 2, wherein the position of each optical sensing unit corresponds to the positions of the plurality of modulating units.

5. The biometric identification module of any one of claims 1-4, further comprising: an optical filter;

6. The biometric identification module of any one of claims 1-4, wherein the biometric sensor and the optical path modulator are packaged in a single chip; alternatively, the biometric sensor and the optical path modulator are separate components.

7. The biometric identification module of any one of claims 1-4, wherein the biometric sensor is an optical fingerprint sensor.

8. The biometric identification module of any one of claims 1-4, wherein the biometric sensor is an image sensor.

9. A terminal device, comprising: the device comprises a shell, a cover plate, a display screen and a biological characteristic identification module; the cover plate, the display screen and the biological characteristic identification module are positioned in the shell;

the cover plate is attached to one surface of the display screen, and the other surface of the display screen faces to a light inlet surface of the biological characteristic identification module;

the biometric module set according to any one of claims 1 to 8.

10. The terminal device according to claim 9, further comprising: a circuit board; the biological characteristic identification module is welded on the circuit board.