CN208738227U

CN208738227U - Lead frame structure and encapsulating structure

Info

Publication number: CN208738227U
Application number: CN201821547739.4U
Authority: CN
Inventors: 程成
Original assignee: Jiangsu Changjiang Electronics Technology Co Ltd
Current assignee: JCET Group Co Ltd
Priority date: 2018-09-20
Filing date: 2018-09-20
Publication date: 2019-04-12
Anticipated expiration: 2028-09-20

Abstract

The utility model discloses a kind of lead frame structure and encapsulating structure, lead frame structure includes Ji Dao, even muscle, pin and pad, Ji Dao is for connecting chip, connect muscle linker island and extends towards the outside of Ji Dao, pin is spaced apart with Ji Dao, company's muscle, wherein, at least partly pad connection and the company's of protruding out muscle.Pad is provided at company's muscle of the utility model, at this time, it can be under the premise of not increasing pin occupied space, the other end of ground wire is designed into company's muscle welding disking area outside Ji Dao, can further promote the occupancy that chip occupies Ji Dao, improves space utilization rate, minimize encapsulating products, moreover, pad can increase the area in routing region at even muscle, guarantee routing quality.

Description

Lead frame structure and encapsulating structure

Technical field

The utility model relates to encapsulation technology field more particularly to a kind of lead frame structure and encapsulating structures.

Background technique

The rapid development of hyundai electronics information technology, electronic product develop to miniaturization, portability, multifunction direction, this Drive semiconductor package product that there is the development trend of miniaturization, this just needs to encapsulate design and maximally utilises encapsulation sky Between, reduce the size of semiconductor package product.

The a part of lead frame structure as encapsulating structure also develops towards miniaturization, in general, lead frame structure Including substrate and it is formed in the island substrate Zhong Ji, even muscle and pin, it can be more by diminution line-spacing, line width, shortening finger, setting The modes such as output pin are enclosed to reduce the size of lead frame structure.

Under the premise of following above-mentioned lead frame structure miniaturization means, when the no ground of the chip for being bound to lead frame structure When line, base island size need to only consider chip size and excessive glue range, in general, chip will retain 80um's or so to the edge Ji Dao Distance；When chip has ground wire connection pad, usually the other end of ground wire is connected on Ji Dao, at this point, base island size also needs Consider the offset space of two solder joints of ground wire.If a solder joint is implanted on chip and another solder joint is implanted on Ji Dao, Chip will at least retain the distance of 300um to the edge Ji Dao, opposite, if instead beaten on ground wire to chip from Ji Dao, core The island Pian Daoji edge is also required to retain the distance of 130um.

It can be seen that if designing ground pin at this time, it will it is small to be unfavorable for encapsulating products for the occupied space for expanding pin Type, therefore, how to further realize the miniaturization of lead frame structure is current urgent problem.

Summary of the invention

The purpose of this utility model is to provide a kind of lead frame structure and encapsulating structures.

To realize one of above-mentioned purpose of utility model, one embodiment of the utility model provides a kind of lead frame structure, packet Include: Ji Dao, even muscle, pin and pad, for connecting chip, the even muscle connects the Ji Dao and towards the base Ji Dao The outside on island extends, and the pin and the Ji Dao, the even muscle are spaced apart, wherein at least partly described pad connect and Protrude out the even muscle.

As the further improvement of one embodiment of the utility model, the lead frame structure further includes supporting block, described Supporting block includes the supporting block upper surface and supporting block lower surface being oppositely arranged, and the Ji Dao includes table on the Ji Dao being oppositely arranged The island Mian Jiji lower surface, it is described even muscle include the company's muscle upper surface being oppositely arranged and even muscle lower surface, the upper surface Ji Dao with The even muscle upper surface flushes, the supporting block upper surface connection even muscle lower surface, and the supporting block lower surface and institute The island Shu Ji lower surface flushes.

As the further improvement of one embodiment of the utility model, the supporting block is hot deorienting supporting block.

As the further improvement of one embodiment of the utility model, lead between the supporting block and the even muscle lower surface Viscose is crossed to fix.

As the further improvement of one embodiment of the utility model, the lead frame structure further includes fixing piece, described Fixing piece is used to for the pad being fixedly arranged on the even muscle upper surface.

As the further improvement of one embodiment of the utility model, the fixing piece includes rivet, and the rivet runs through The pad simultaneously extends in the supporting block.

As the further improvement of one embodiment of the utility model, the pad is ground pad.

To realize one of above-mentioned purpose of utility model, one embodiment of the utility model provides a kind of encapsulating structure, comprising:

Lead frame structure described in any one technical solution as above；

Chip is set on the Ji Dao；

Lead connects the chip and the pin, pad；

Encapsulation piece encapsulates the lead frame structure, the chip and the lead.

As the further improvement of one embodiment of the utility model, the lead frame structure includes supporting block, the branch Bracer is removed in package fabrication process.

As the further improvement of one embodiment of the utility model, the lead includes connecting the chip and the pipe The signal wire of foot and the ground line for connecting the chip and the pad.

Compared with prior art, the utility model has the beneficial effects that: at company's muscle of one embodiment of the utility model It is provided with pad, at this point it is possible to which the other end of ground wire is designed into outside Ji Dao under the premise of not increasing pin occupied space Even muscle welding disking area can further promote the occupancy that chip occupies Ji Dao, improve space utilization rate, keep encapsulating products small-sized Change, moreover, pad can increase the area in routing region at even muscle, guarantees routing quality.

Detailed description of the invention

Fig. 1 is the top view of the lead frame structure of one embodiment of the utility model；

Fig. 2 is the lead frame structure partial sectional view of one embodiment of the utility model；

Fig. 3 a to Fig. 3 d is the company's muscle and pad cooperation schematic diagram of the utility model other embodiments；

Fig. 4 is that the encapsulating structure of one embodiment of the utility model omits the schematic diagram of encapsulation piece；

Fig. 5 is the encapsulating structure cross-sectional view of one embodiment of the utility model；

Fig. 6 is the manufacturing method block diagram of the lead frame structure of one embodiment of the utility model；

Fig. 7 to Figure 10 is each step signal of the manufacturing method of the lead frame structure of one embodiment of the utility model Figure；

Figure 11 is the manufacturing method block diagram of the encapsulating structure of one embodiment of the utility model；

Figure 12 to Figure 17 is each step schematic diagram of the manufacturing method of the encapsulating structure of one embodiment of the utility model (each step schematic diagram that the manufacturing method of lead frame structure of the Fig. 7 into Figure 10 is omitted).

Specific embodiment

The utility model is described in detail below with reference to specific embodiment shown in the drawings.But these embodiment party Formula is not intended to limit the utility model, structure that those skilled in the art are made according to these embodiments, method or Transformation functionally is all contained in the protection scope of the utility model.

In each diagram of the utility model, for the ease of illustration, structure or partial certain sizes can be relative to them Its structure or part are exaggerated, and therefore, are only used for the basic structure of the theme of diagram the utility model.

In addition, the term of the representation space relative position used herein such as "upper", " top ", "lower", " lower section " is A unit as shown in the drawings or feature are described for the purpose convenient for explanation relative to another unit or feature Relationship.

The term of relative space position can be intended to include equipment in use or work other than orientation as shown in the figure Different direction, for example, if by figure equipment overturn, be described as being located at other units or feature " lower section " or " it Under " unit will be located at other units or feature " top ", therefore, exemplary term " lower section " can include above and below this Two kinds of orientation, equipment can otherwise be directed (be rotated by 90 ° or other directions), and be interpreted accordingly used herein With the description language of space correlation.

It is the schematic diagram of the lead frame structure 100 of one embodiment of the utility model in conjunction with Fig. 1 and Fig. 2.

Lead frame structure 100 includes base island 11, even muscle 12, pin 13 and pad 20.

Base island 11 is for connecting chip.

Here, base island 11 is located at the intermediate region of lead frame structure 100.

Connect 12 linker island 11 of muscle and extends towards the outside on base island 11.

Here, connect the corner regions that muscle 12 is distributed in lead frame structure 100.

Pin 13 is spaced apart with base island 11, company's muscle 12.

Here, pin 13 is distributed in the peripheral regions of lead frame structure 100, and pin 13 is arranged around base island 11.

It should be understood that in practical processing procedure, if if can be prior to forming butt island 11, involvement muscle 12 in a bulk of substrate And several pins 13, adjacent company's muscle 12, pin 13 can be connected to, and then be formed again by cutting operation several independent Lead frame structure 100.

In the present embodiment, at least partly pad 20 connection and the company's of protruding out muscle 12.

It should be noted that " at least partly pad 20 connection and company of protruding out muscle 12 " to refer to that pad 20 can be whole right The setting of 12 region of muscle should be connected, alternatively, 20 part linker island 11 of pad, part connection connects muscle 12, moreover, pad 20 is at least partly The company's of protruding out muscle 12, the i.e. width in at least partly region of pad 20 are greater than the width of even muscle 12, in this way, can increase routing region Area.

It here, is circular pad with pad 20, and for 20 company's of being fully located at muscle of pad, 12 region, and pad 20 will not touch Encounter neighbouring pin 13.

In addition, pad 20 can be ground pad 20, ground pad 20 is used for and the subsequent chip for being connected to base island 11 Ground wire connection pad mutual conduction, but not limited to this.

Pad 20 can meet subsequent routing demand far from the surface of even muscle 12 by the way of silver-plated or NiPdAu.

The quantity of pad 20 and setting position etc. can according to actual needs depending on, pad 20 can be wide according to even muscle 12 The flake structure of degree, the even well in advances such as muscle 12 and 13 gap of pin.

It is provided with pad 20 at company's muscle 12 of present embodiment, at this point it is possible to before not increasing by 13 occupied space of pin It puts, the other end of ground wire is designed into 20 region of pad for connecting muscle 12 outside base island 11, can further promote chip and occupy base The occupancy on island 11 improves space utilization rate, minimizes encapsulating products, moreover, pad 20 can increase routing at even muscle 12 The area in region guarantees routing quality.

In the present embodiment, lead frame structure 100 further includes supporting block 30.

Supporting block 30 includes the supporting block upper surface 301 and supporting block lower surface 302 being oppositely arranged.

Base island 11 includes the upper surface Ji Dao 111 and the lower surface Ji Dao 112 being oppositely arranged.

Company's muscle 12 includes the company's muscle upper surface 121 being oppositely arranged and company muscle lower surface 122.

The upper surface Ji Dao 111 is flushed with even muscle upper surface 121, and the connection of supporting block upper surface 301 connects muscle lower surface 122, and Supporting block lower surface 302 is flushed with the lower surface Ji Dao 112.

Here, supporting block 30 and pad 20 are set to the opposite sides of same even muscle 12, and supporting block 30 and pad 20 are right It should be arranged, supporting block 30 will not touch neighbouring pin 13.

Preferably, the size of supporting block 30 is greater than 20 size of pad, on the even thickness direction of muscle 12, supporting block 30 is in even Orthographic projection of the pad 20 at even muscle 12 is completely covered in orthographic projection at muscle 12.

Company's muscle 12 of lead frame structure 100 is half-etching metal part, and base island 11 is solid metal part, that is, It says, even the thickness of muscle 12 is less than the thickness on base island 11, and base island 11 and the intersection for connecting muscle 12 are formed with stage portion, due to half-etching The intensity of metal is less than the intensity of solid metal, when the routing at the even pad 20 in 12 region of muscle, it may appear that routing shakes, welds Point falls off, the bonding wire soldered balls quality problem such as loosely.

Supporting block 30 is arranged in the lower section of even muscle 12 in present embodiment, when the routing at the even pad 20 in 12 region of muscle, Even muscle 12 and pad 20 can shake the support of supporting block 30 so that connecting muscle 12 and 20 position of pad stabilization and intensity height to avoid routing It is dynamic to wait ball bondings quality problem, to greatly improve routing quality.

In the present embodiment, it is fixed between supporting block 30 and company muscle lower surface 122 by viscose, passes through the compensation of viscose Effect, it is ensured that after supporting block 30 is fixed, supporting block lower surface 302 is flushed with the lower surface Ji Dao 112, and then improves support The support effect of block 30, and supporting block 30, the even isostructural required precision of muscle 12 can be reduced.

In the present embodiment, lead frame structure 100 further includes fixing piece 40, and fixing piece 40 is for pad 20 to be fixedly arranged on Even muscle upper surface 121.

Here, fixing piece 40 includes rivet 40, and rivet 40 is through pad 20 and extends in supporting block 30, certainly, pad It can be other fixed forms between 20 and company's muscle 12.

Preferably, rivet 40 sequentially passes through pad 20, even muscle 12 and is inserted into inside supporting block 30, and the end of rivet 40 is fallen into Supporting block lower surface 302 is not protruded out in 30 inside of supporting block.

Here, supporting block 30 is made of hot deorienting material, and hot deorienting material, which refers to, reaches preset value in heating temperature When the material can disappear.

In conjunction with Fig. 3 a to Fig. 3 d, even muscle 12 and pad 20 can be variform.

Join Fig. 3 a, even muscle 12a is in line-styled, and pad 20a is rounded.

Join Fig. 3 b, even muscle 12b is U-shaped, and pad 20b is rounded.

Join Fig. 3 c, even muscle 12c is in hollow circular, and pad 20c is elongated.

Join Fig. 3 d, even muscle 12d is in " ten " font, and pad 20d is rounded.

In conjunction with Fig. 4 and Fig. 5, one embodiment of the utility model also provides a kind of encapsulating structure 200.

Encapsulating structure 200 includes lead frame structure 100, chip 201, lead (202,203) and encapsulation piece 204.

Chip 201 is set on base island 11.

Here, chip 201 is fixed on the center on base island 11 by load glue 205, and 11 surrounding of base island has for load glue 205 The region of excessive glue.

Lead (202,203) includes connecting several signal wires 202 of chip 201 and pin 13 and connecting chip 201 and connect The ground line 203 of ground pad 20.

Encapsulation piece 204 encapsulates lead frame structure 100, chip 201 and lead (202,203).

Here, encapsulation piece 204 coats all upper areas of lead frame structure 100 and connects 122 region of muscle lower surface, is located at The encapsulation piece 204 of 100 lower section of lead frame structure is flushed with the lower surface Ji Dao 112, and encapsulation piece 204 exposes the lower surface Ji Dao 112 and pin 13.

It should be noted that when lead frame structure 100 includes supporting block 30, the quilt in package fabrication process of supporting block 30 It removes.

That is, supporting block 30 is in package fabrication process will quilt when lead frame structure 100 includes supporting block 30 It removes, the encapsulating structure 200 finally obtained does not include supporting block 30.

Specifically, supporting block 30 is made of hot deorienting material, when in being provided with chip 201 in lead frame structure 100 And lead (202,203) and when not set encapsulation piece 204, supporting block 30 can be removed by heating operation, it is convenient and efficient, and The end of rivet 40 sinks into inside supporting block 30, and the surface of encapsulating structure 200 after molding will not expose rivet 40.

In conjunction with Fig. 6 to Figure 10, one embodiment of the utility model provides a kind of manufacturing method of lead frame structure 100, knot Close the explanation of aforementioned lead frame structure 100, manufacturing method comprising steps of

In conjunction with Fig. 7, a substrate 10 is provided；

Base island 11, even muscle 12 and pin 13 are formed in substrate 10, base island 11 connects 12 linker island of muscle for connecting chip 11 and extend towards the outside on base island 11, pin 13 and base island 11, company's muscle 12 are spaced apart；

In conjunction with Fig. 8 to Figure 10, pad 20, at least partly connection of pad 20 and the company's of protruding out muscle 12 are formed at even muscle 12.

Specifically, step " forming pad 20 at even muscle 12 " includes:

In conjunction with Fig. 8, in the even fixed supporting block 30 in muscle lower surface 122；

Here, by viscose by 30 company's of being set to muscle lower surface 122 of supporting block, and branch is guaranteed by the thickness of control viscose Bracer lower surface 302 is flushed with the lower surface Ji Dao 112.

In conjunction with Fig. 9 and Figure 10, in the fixed pad 20 in region of the corresponding supporting block 30 in even muscle upper surface 121.

Here, by rivet 40 successively by pad 20, even muscle 12 and 30 anchor pad 20 of supporting block, rivet 40 extends Into supporting block 30.

In addition, supporting block 30 is arranged in the lower section of even muscle 12 in present embodiment, beaten when at the even pad 20 in 12 region of muscle When line, the support of supporting block 30 even muscle 12 and pad 20 can be to avoid beating so that even muscle 12 and 20 position of pad is stable and intensity is high The ball bondings quality problems such as line shaking, to greatly improve routing quality.

Other explanations of the manufacturing method of the lead frame structure 100 of present embodiment can refer to aforementioned lead frame structure 100 explanation, details are not described herein.

In conjunction with Figure 11 to Figure 17, one embodiment of the utility model also provides a kind of manufacturing method of encapsulating structure 200, knot Close the manufacturing method of the explanation and Fig. 7 of aforementioned encapsulation structure 200 to aforementioned lead frame structure 100 shown in Fig. 10, encapsulation knot The manufacturing method of structure 200 includes the forming process of lead frame structure 100 and the forming process of subsequent encapsulating structure 20.

Wherein, the forming process of lead frame structure 100 includes the following steps:

In conjunction with Fig. 7, a substrate 10 is provided；

Base island 11, even muscle 12 and pin 13 are formed in substrate 10, base island 11 is for connecting chip 201, and even muscle 12 connects Base island 11 and extend towards the outside on base island 11, pin 13 and base island 11, company's muscle 12 are spaced apart；

In conjunction with Fig. 8 to Figure 10, pad 20, at least partly connection of pad 20 and the company's of protruding out muscle 12 are formed at even muscle 12；

Specifically, step " forming pad 20 at even muscle 12 " includes:

In conjunction with Fig. 8, in the even fixed supporting block 30 in muscle lower surface 122, supporting block lower surface 302 and the lower surface Ji Dao 112 are neat It is flat, and supporting block 30 is made of hot deorienting material；

Here, by viscose by 30 company's of being set to muscle lower surface 122 of supporting block, and support is guaranteed by control viscose thickness Block lower surface 302 is flushed with the lower surface Ji Dao 112.

In conjunction with Fig. 9 and Figure 10, in the fixed pad 20 in region of the corresponding supporting block 30 in even muscle upper surface 121；

The forming process of subsequent encapsulating structure 200 includes the following steps:

In conjunction with Figure 11 and Figure 12, chip 201 is set at base island 11；

Here, chip 201 is set to the intermediate region on base island 11 by load glue 205.

In conjunction with Figure 13 to Figure 15, chip 201 and pin 13 are connected using lead (signal wire 202), and (connect using lead Ground wire 203) connect chip 201 and pad 20；

Here, signal wire 202 and ground line 203 are plain conductor, and signal wire 202 and the setting for being grounded 203 do not have There is precedence relationship.

In conjunction with Figure 16, heats supporting block 30 and supporting block 30 is disappeared.

Here, temperature ratio DB (201 loading process of chip, ginseng that the hot deorienting material disappearance of supporting block 30 needs are formed Figure 12) processing procedure, WB (temperature of bonding process, ginseng Figure 13 to Figure 15) processing procedure is high, in this way, in front in DB processing procedure and WB processing procedure, Supporting block 30 can always the company's of support muscle 12 and pad 20 and improve routing effect.

In conjunction with Figure 17, encapsulating forms encapsulating structure 200.

In addition, supporting block 30 is arranged in the lower section of even muscle 12 in present embodiment, when chip 201 is connected with 20 routing of pad When, the support of supporting block 30 connects muscle 12 and pad 20, so that even muscle 12 and 20 position of pad stabilization and intensity height, it can be to avoid routing The ball bondings quality problems such as shaking, to greatly improve routing quality.

Other explanations of the manufacturing method of the encapsulating structure 200 of present embodiment can be with reference to aforementioned encapsulation structure 200 Illustrate, details are not described herein.

It should be appreciated that although this specification is described in terms of embodiments, but not each embodiment only includes one A independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should will say As a whole, the technical solution in each embodiment may also be suitably combined to form those skilled in the art can for bright book With the other embodiments of understanding.

Tool of the series of detailed descriptions listed above only for the feasible embodiment of the utility model Body explanation, they are all without departing from made by the utility model skill spirit not to limit the protection scope of the utility model Equivalent implementations or change should be included within the scope of protection of this utility model.

Claims

1. A lead frame structure, characterized in that it comprises: a base island, a connecting rib, a pin and a pad, the base island is used to connect a chip, and the connecting rib connects the base island and faces the base island The pins extend from the outer side of the base island and the connecting ribs, wherein at least part of the pads are connected and protrude out of the connecting ribs.

2 . The lead frame structure according to claim 1 , wherein the lead frame structure further comprises a support block, the support block comprises an upper surface of the support block and a lower surface of the support block arranged oppositely, and the base island comprises The surface of the base island and the lower surface of the base island are arranged oppositely, the connecting rib includes the upper surface and the lower surface of the connecting rib that are arranged oppositely, the surface of the base island is flush with the upper surface of the connecting rib, and the support The upper surface of the block is connected to the lower surface of the connecting rib, and the lower surface of the support block is flush with the lower surface of the base island.

3 . The lead frame structure of claim 2 , wherein the support block is a heat dissipation support block. 4 .

4 . The lead frame structure of claim 2 , wherein the support block and the lower surface of the connecting rib are fixed by adhesive. 5 .

5 . The lead frame structure according to claim 2 , wherein the lead frame structure further comprises a fixing member, and the fixing member is used for fixing the bonding pad on the upper surface of the connecting rib. 6 .

6 . The lead frame structure of claim 5 , wherein the fixing member comprises a rivet, and the rivet penetrates the pad and extends into the support block. 7 .

7. The lead frame structure of claim 1, wherein the pad is a ground pad.

8. A package structure, characterized in that, comprising:

The lead frame structure according to any one of claims 1-7;

a chip, arranged on the base island;

Leads, connecting the chip and the pins and pads;

An encapsulation component encapsulates the lead frame structure, the chip and the lead.

9. The package structure of claim 8, wherein the leadframe structure includes a support block that is removed during package fabrication.

10 . The package structure according to claim 8 , wherein the lead wire comprises a signal wire connecting the chip and the pin and a ground wire connecting the chip and the pad. 11 .