CN208707775U - Image sensor, camera module and electronic device - Google Patents
Image sensor, camera module and electronic device Download PDFInfo
- Publication number
- CN208707775U CN208707775U CN201821764543.0U CN201821764543U CN208707775U CN 208707775 U CN208707775 U CN 208707775U CN 201821764543 U CN201821764543 U CN 201821764543U CN 208707775 U CN208707775 U CN 208707775U
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- image sensor
- pad
- camera module
- utility
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Abstract
The utility model discloses a kind of image sensor, camera module and electronic devices, image sensor has opposite first surface and second surface, first surface has photosensitive region and the non-photo-sensing region positioned at photosensitive region periphery, and second surface is equipped with the pad for connecting with circuit board.Image sensor according to the present utility model, by the way that the pad connecting on image sensor with circuit board is located on the second surface of image sensor, the pad for setting that non-photo-sensing region is connect with circuit board on the first surface can be cancelled, it can reduce the width in non-photo-sensing region, in the identical situation of area of photosensitive region, it can reduce the area of image sensor, and then reduce the volume of camera module, be advantageously implemented the miniaturization of electronic device.
Description
Technical field
The utility model relates to technical field of electronic device, more particularly, to a kind of image sensor, camera module and
Electronic device.
Background technique
In the related technology, the area of image sensor is larger, is unfavorable for realizing the miniaturization of camera module, and then unfavorable
In the miniaturization for realizing electronic device.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art.For this purpose, the utility model mentions
A kind of image sensor out, the image sensor area are small.
The utility model also proposes that a kind of camera module, the camera module include above-mentioned image sensor.
The utility model also proposes that a kind of electronic device, the electronic device include above-mentioned camera module.
According to the image sensor of the utility model embodiment, the image sensor has opposite first surface and the
Two surfaces, the first surface have photosensitive region and positioned at the non-photo-sensing region of the photosensitive region periphery, second tables
Face is equipped with the pad for connecting with circuit board.
According to the image sensor of the utility model embodiment, pass through the pad that will be connect on image sensor with circuit board
It is located on the second surface of image sensor, the weldering for setting that non-photo-sensing region is connect with circuit board on the first surface can be cancelled
Disk can reduce the width in non-photo-sensing region, in the identical situation of area of photosensitive region, can reduce image sensor
Area, and then reduce the volume of camera module, it is advantageously implemented the miniaturization of electronic device.
Some embodiments according to the present utility model, the second surface are equipped with embedded groove, and the pad is embedded in institute
It states in embedded groove.
Some embodiments according to the present utility model, the pad be it is multiple, multiple pads are along the image sensing
The circumferential direction of device is spaced apart.
Some embodiments according to the present utility model, the pad be it is multiple, multiple pads are embarked on journey arranges in column.
Some embodiments according to the present utility model, the pad are arranged close to the edge of the image sensor.
In some embodiments of the utility model, the pad is opposite with the non-photo-sensing region.
In some embodiments of the utility model, the pad is opposite with the photosensitive region, the pad it is close
The edge at the image sensor edge is aligned with the outer edge of the photosensitive region.
Some embodiments according to the present utility model, the cross section of the pad are round, ellipse or polygon.
According to the camera module of the utility model embodiment, including above-mentioned image sensor.
According to the camera module of the utility model embodiment, pass through the pad that will be connect on image sensor with circuit board
It is located on the second surface of image sensor, the weldering for setting that non-photo-sensing region is connect with circuit board on the first surface can be cancelled
Disk can reduce the width in non-photo-sensing region, in the identical situation of area of photosensitive region, can reduce image sensor
Area, and then reduce the volume of camera module, it is advantageously implemented the miniaturization of electronic device.
According to the electronic device of the utility model embodiment, including above-mentioned camera module.
According to the electronic device of the utility model embodiment, by the way that the pad connecting on image sensor with circuit board is set
On the second surface of image sensor, the pad for setting that non-photo-sensing region is connect with circuit board on the first surface can be cancelled,
The width that can reduce non-photo-sensing region can reduce the face of image sensor in the identical situation of area of photosensitive region
Product, and then reduce the volume of camera module, it is advantageously implemented the miniaturization of electronic device.
The additional aspect and advantage of the utility model will be set forth in part in the description, partially will be from following description
In become obvious, or recognized by the practice of the utility model.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model from the description of the embodiment in conjunction with the following figures will
Become obvious and be readily appreciated that, in which:
Fig. 1 is the top view according to the image sensor of the utility model embodiment；
Fig. 2 is the bottom view according to the image sensor of the utility model embodiment；
Fig. 3 is the sectional view according to the camera module of the utility model embodiment；
Fig. 4 is the main view according to the electronic device of the utility model embodiment.
Appended drawing reference:
Electronic device 1000,
Camera module 100,
Image sensor 1,
First surface 10, photosensitive region 101, non-photo-sensing region 102,
Second surface 20, embedded groove 201,
Pad 30,
Circuit board 2, mounting groove 21, packaging part 3, infrared fileter 4, camera lens 5.
Specific embodiment
The embodiments of the present invention are described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the utility model, and should not be understood as to the utility model
Limitation.
Below with reference to Fig. 1-Fig. 4 description according to the image sensor 1 of the utility model embodiment, camera module 100 and
Electronic device 1000.
As depicted in figs. 1 and 2, opposite first surface 10 is had according to the image sensor of the utility model embodiment 1
With second surface 20.Wherein, first surface 10 has photosensitive region 101 and the non-photo-sensing region positioned at 101 periphery of photosensitive region
102, photosensitive region 101 is located at the intermediate position of first surface 10, and non-photo-sensing region 102 is arranged around photosensitive region 101, non-sense
Light region 102 is close to the edge of first surface 10.Second surface 20 is equipped with the pad 30 for connecting with circuit board 2.
In the related technology, the pad for connecting with circuit board is located at first surface, and is located at non-photo-sensing region, that is, welds
Disk and photosensitive region are located at the same side of image sensor, and second surface, that is, image sensor deviates from the surface of photosensitive region not
If pad.This scheme makes the non-photo-sensing peak width of first surface larger, so that the area of image sensor is larger,
Cause camera module volume larger.
And in the utility model, the pad 30 that image sensor 1 is connect with circuit board 2 is located on second surface 20, i.e.,
By the pad 30 that image sensor 1 is connect with circuit board 2 be located at image sensor 1 on the surface of photosensitive region 101, can
To cancel the pad 30 for connecting with circuit board 2 being located on first surface 10, it can cancellation is located at non-photo-sensing region 102
The pad 30 for being connect with circuit board 2, can reduce the width in non-photo-sensing region 102, in the area phase of photosensitive region 101
With in the case where, reduce the area of image sensor 1, and then reduce the volume of camera module 100, is advantageously implemented electronics dress
Set 1000 miniaturization.
According to the image sensor 1 of the utility model embodiment, by will be connect on image sensor 1 with circuit board 2
Pad 30 is located on the second surface 20 of image sensor 1, can be cancelled and is located at non-photo-sensing region 102 and electricity on first surface 10
The pad 30 that road plate 2 connects, can reduce the width in non-photo-sensing region 102, in the identical situation of the area of photosensitive region 101
Under, it can reduce the area of image sensor 1, and then reduce the volume of camera module 100, be advantageously implemented electronic device
1000 miniaturization.
In some embodiments of the utility model, as shown in figure 3, second surface 20 is equipped with embedded groove 201, pad 30
It is embedded in embedded groove 201.It is possible thereby to the reliability fixed to pad 30 be improved, to improve image sensor 1 and circuit
The reliability connected between plate 2.It simultaneously can be to avoid pad 30 is directly arranged on second surface 20 and causes at second surface 20
The lightening of electronic device 1000 is advantageously implemented in vacant state so as to reduce the height of camera module 100.
As shown in Fig. 2, pad 30 be it is multiple, multiple pads 30 along image sensor 1 circumferential direction be spaced apart.Thus may be used
When connecting to avoid pad 30 with circuit board 2, the connecting line between multiple pads 30 and circuit board 2 is interfered, and can be made
The connecting line arrangement of multiple pads 30 and circuit board 2 is more neat.Certainly, the utility model is without being limited thereto, and multiple pads 30 are also
It can embark on journey and arrange in column.It is possible thereby to increase the diversity of multiple 30 arrangement modes of pad.Certainly, multiple pads 30 can be with
It is arranged in other forms according to actual needs.
In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or more.
In the description of the present invention, it should be understood that the orientation or positional relationship of the instructions such as term " circumferential direction " is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitations of the present invention.
Optionally, as shown in Fig. 2, pad 30 is arranged close to the edge of image sensor 1.Thus convenient for multiple pads 30 with
Circuit board 2 connects.Specifically, pad 30 can be opposite with non-photo-sensing region 102, pad 30 can be made closer to image sensing
The edge of device 1, further convenient for the connection between pad 30 and circuit board 2.Certainly, the utility model is without being limited thereto, pad 30
Can also be opposite with photosensitive region 101, it is possible thereby to increase the diversity that position is arranged in pad 30.Further, pad 30
Edge close to 1 edge of image sensor is aligned with the outer edge of photosensitive region 101.Thus when pad 30 and photosensitive region 101
When opposite, pad 30 can be made close to the edge of image sensor 1, to greatest extent convenient between pad 30 and circuit board 2
Connection.
In some embodiments of the utility model, as depicted in figs. 1 and 2, image sensor 1 be rectangular shape, i.e., first
Surface 10 and second surface 20 are rectangular surfaces, and photosensitive region 101 can be rectangular area, and non-photo-sensing region 102 can be
Rectangular loop.Certainly, the utility model is without being limited thereto, and image sensor 1 can also be circle, first surface 10 and second surface
20 can be circle, photosensitive region 101 or circle, and non-photo-sensing region 102 can be circular ring shape.
Optionally, the cross section of pad 30 is round, ellipse or polygon.Thus, it is possible to increase the structure of pad 30
Diversity.For example, in the illustrated example shown in fig. 2, the cross section of pad 30 is rectangle.
As shown in figure 3, according to the camera module 100 of the utility model embodiment, including above-mentioned image sensor 1.
In addition, camera module 100 includes circuit board 2, packaging part 3, infrared fileter 4 and camera lens 5.It is set on circuit board 2
There is mounting groove 21, image sensor 1 is located in mounting groove 21, and mounting groove 21 can play fixed effect to image sensor 1.
In addition, image sensor 1 is located in mounting groove 21, the structure of camera module 100 can be made more compact, camera shooting can be reduced
Height of the head mould group 100 along its axial direction.Packaging part 3 is set on the circuit board 2, and packaging part 3 is used to carry out image sensor 1
Encapsulation, camera lens 5 are located at the side of the separate circuit board 2 of packaging part 3.
In the description of the present invention, it should be understood that the orientation or positional relationship of the instructions such as term " axial direction " is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitations of the present invention.
Packaging part 3 is equipped with groove 31 away from the side of circuit board 2, and the bottom wall of groove 31 is equipped with and 1 phase of image sensor
Pair light hole 32, external light can pass through light hole 32 to be received by image sensor 1.Infrared fileter 4 is located at recessed
In slot 31, and infrared fileter 4 covers light hole 32, can be supported directly on packaging part 3 to avoid infrared fileter 4, infrared
The distance between optical filter 4 and image sensor 1 are closer, can be with so as to so that the structure of camera module 100 is more compact
Camera module 100 is reduced along the height of its axial direction.In addition, infrared fileter 4 is located in groove 31, it can be to avoid infrared
Optical filter 4 is supported on packaging part 3, along the axis direction of camera module 100, reduces the occupied space of infrared fileter 4,
Camera module 100 can be further decreased along the height of its axial direction, be advantageously implemented the lightening of electronic device 1000.
According to the camera module 100 of the utility model embodiment, by will be connect on image sensor 1 with circuit board 2
Pad 30 be located on the second surface 20 of image sensor 1, can cancel be located on first surface 10 non-photo-sensing region 102 with
The pad 30 that circuit board 2 connects, can reduce the width in non-photo-sensing region 102, in the identical situation of the area of photosensitive region 101
Under, it can reduce the area of image sensor 1, and then reduce the volume of camera module 100, be advantageously implemented electronic device
1000 miniaturization.
As shown in figure 4, according to the electronic device 1000 of the utility model embodiment, including above-mentioned camera module 100.Its
In above-mentioned camera module 100 can be electronic device 1000 front camera mould group 100 or rear camera mould group 100.
According to the electronic device 1000 of the utility model embodiment, by will be connect on image sensor 1 with circuit board 2
Pad 30 is located on the second surface 20 of image sensor 1, can be cancelled and is located at non-photo-sensing region 102 and electricity on first surface 10
The pad 30 that road plate 2 connects, can reduce the width in non-photo-sensing region 102, in the identical situation of the area of photosensitive region 101
Under, it can reduce the area of image sensor 1, and then reduce the volume of camera module 100, be advantageously implemented electronic device
1000 miniaturization.
Illustratively, electronic device 1000 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 4.Specifically, electronic device 1000 can be with
For mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device
(such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), knee
Laptop, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such as
Wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 1000 can also for other wearable devices (for example,
Such as electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics tatoo, the wear-type of electronic equipment or smartwatch is set
Standby (HMD)).
Electronic device 1000 can also be that any one of multiple electronic devices 1000, multiple electronic devices 1000 include
But it is not limited to cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media to broadcast
Put device, music recorder, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, meter
Device, programmable remote control, pager, laptop computer, desktop computer, printer, netbook computer, individual digital is calculated to help
Reason (PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) are broadcast
Put device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 1000 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 1000 can be such as cellular phone, media play
The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the utility model.In the present specification, to above-mentioned art
The schematic representation of language may not refer to the same embodiment or example.Moreover, description specific features, structure, material or
Person's feature can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that the embodiments of the present invention, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of variations, modification, replacement in the case where not departing from the principles of the present invention and objective
And modification, the scope of the utility model are defined by the claims and their equivalents.
Claims (10)
1. a kind of image sensor, which is characterized in that the image sensor has opposite first surface and second surface, institute
First surface is stated with photosensitive region and positioned at the non-photo-sensing region of the photosensitive region periphery, the second surface, which is equipped with, to be used
In the pad being connect with circuit board.
2. image sensor according to claim 1, which is characterized in that the second surface is equipped with embedded groove, described
Pad is embedded in the embedded groove.
3. image sensor according to claim 1, which is characterized in that the pad is multiple, multiple pad edges
The circumferential direction of the image sensor is spaced apart.
4. image sensor according to claim 1, which is characterized in that the pad be it is multiple, multiple pads at
Row is arranged in column.
5. image sensor according to claim 1, which is characterized in that the pad is close to the side of the image sensor
Edge setting.
6. image sensor according to claim 5, which is characterized in that the pad is opposite with the non-photo-sensing region.
7. image sensor according to claim 5, which is characterized in that the pad is opposite with the photosensitive region, institute
The edge close to the image sensor edge for stating pad is aligned with the outer edge of the photosensitive region.
8. image sensor according to claim 1, which is characterized in that the cross section of the pad is round, ellipse
Or polygon.
9. a kind of camera module, which is characterized in that including image sensor according to claim 1 to 8.
10. a kind of electronic device, which is characterized in that including camera module according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821764543.0U CN208707775U (en) | 2018-10-29 | 2018-10-29 | Image sensor, camera module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821764543.0U CN208707775U (en) | 2018-10-29 | 2018-10-29 | Image sensor, camera module and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208707775U true CN208707775U (en) | 2019-04-05 |
Family
ID=65948080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821764543.0U Expired - Fee Related CN208707775U (en) | 2018-10-29 | 2018-10-29 | Image sensor, camera module and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208707775U (en) |
-
2018
- 2018-10-29 CN CN201821764543.0U patent/CN208707775U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190405 |