CN208674079U - Semiconductor processing equipment - Google Patents
Semiconductor processing equipment Download PDFInfo
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- CN208674079U CN208674079U CN201821301133.2U CN201821301133U CN208674079U CN 208674079 U CN208674079 U CN 208674079U CN 201821301133 U CN201821301133 U CN 201821301133U CN 208674079 U CN208674079 U CN 208674079U
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- pedestal
- axis
- cavity
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 110
- 238000000034 method Methods 0.000 claims abstract description 57
- 230000008569 process Effects 0.000 claims abstract description 48
- 230000007246 mechanism Effects 0.000 claims description 37
- 101100107923 Vitis labrusca AMAT gene Proteins 0.000 claims description 3
- 230000002159 abnormal effect Effects 0.000 abstract description 13
- -1 process cavity Chemical compound 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 238000001514 detection method Methods 0.000 description 7
- 239000011553 magnetic fluid Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 206010046270 Up and down phenomenon Diseases 0.000 description 2
- 230000005856 abnormality Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to semiconductor processing equipments, disclose a kind of semiconductor processing equipment that pedestal self-balancing can be kept with adjust automatically pedestal, including process cavity, rotary shaft and rotating electric machine, pedestal and bracket are provided in process cavity, bracket support pedestal, one end of rotary shaft is protruded into process cavity and the connection of the spindle drive of prop, the other end and rotating electric machine, and semiconductor processing equipment further includes the levelness self balancing device for adjusting the pedestal in rotation to keep foundation level degree.By the way that levelness self balancing device is arranged, it can timely and accurately detect that the rotation of pedestal is abnormal, so as to adjust the levelness balance of pedestal in time, keep the rotational concentricity and levelness of pedestal, guarantee that technique is normal, improve processing quality.
Description
Technical field
The utility model relates to semiconductor processing equipments, in particular to one kind can be with adjust automatically pedestal to keep pedestal water
The semiconductor processing equipment of Pingdu.
Background technique
In existing semiconductor processing equipment, as shown in Figure 1, accepting the pedestal of wafer can rotate in technical process,
So that each region of pedestal is heated evenly, processing quality is improved.Specific structure is that pedestal is located in process cavity, and bracket is held
Torquay seat, rotary shaft supporting support, one end of rotary shaft are stretched out process cavity and are connected to motor.Motor work, driving rotation
Axis rotation, and then driving arm rotation, pedestal rotation, each region of pedestal is heated evenly, the wafer on pedestal also by
It is hot uniform.
But bracket can occur constantly to wear in continuous rotation process, bracket abrasion will lead to pedestal rotation not
Balance ultimately causes process abnormality so that pedestal decentraction phenomenon occurs and swings up and down phenomenon.And at current semiconductor
It manages in equipment, have no detection and adjusts the function of the rotation status of pedestal.
Utility model content
In order to solve the above-mentioned technical problem the utility model proposes, and it is an object of the present invention to provide a kind of semiconductor processing equipment.
The semiconductor processing equipment of the utility model can timely and accurately detect pedestal by setting levelness self balancing device
Rotation is abnormal, so as to adjust the levelness balance of pedestal in time, keep the rotational concentricity and levelness of pedestal, guarantees work
Skill is normal, improves processing quality.
Specifically, the utility model provides a kind of semiconductor processing equipment, including process cavity, rotary shaft and rotation
Rotating motor, is provided with pedestal and bracket in the process cavity, pedestal described in the bracket support, and the one of the rotary shaft
End is protruded into the process cavity and bracket, the other end of pedestal described in support are connect with the spindle drive of the rotating electric machine,
The semiconductor equipment further includes for adjusting the pedestal in rotation to keep the levelness of the foundation level degree certainly flat
Weigh device.
Compared to existing technologies, semiconductor processing equipment provided by the utility model is certainly flat by setting levelness
Weigh device, and levelness self balancing device can timely and accurately detect that the rotation of pedestal is abnormal and adjusts the position of pedestal in time
It sets, keeps the rotary balance of pedestal, thereby may be ensured that the rotational concentricity and levelness of pedestal, so that semiconductor processing equipment
Technique it is normal, improve processing quality.
In addition, preferably, the levelness self balancing device includes controller and communicates to connect with the controller
Testing agency, levelness automatic mechanism, wherein the testing agency is used to detect the rotation status of the pedestal, and
The rotation status signal of the pedestal is sent to the controller;The controller is used to receive the rotation status signal,
And adjustment state instruction is sent to the levelness automatic mechanism;The levelness automatic mechanism and the bracket pass
Dynamic connection, the levelness automatic mechanism receive the rotation status that the adjustment state instructs and adjusts the pedestal.
Testing agency can in time detection pedestal rotation status and the rotation status signal of pedestal is fed back into controller,
Controller is according to the adjusting work of the rotation status signal level control degree automatic mechanism received.When the rotation of pedestal is sent out
When raw abnormal, the abnormal rotation status signal of pedestal is sent to controller by testing agency, and controller is according to abnormal rotation
Status signal issues corresponding adjustment state instruction to levelness automatic mechanism, and levelness automatic mechanism is according to reception
The adjustment state instruction arrived adjusts the rotation status of pedestal, so that pedestal keeps levelness balance, the work of semiconductor processing equipment
Skill is normal, improves processing quality.
Further, preferably, the levelness automatic mechanism includes X-axis adjustment component and Y-axis adjustment group
Part, the X-axis adjustment component, Y-axis adjustment component carry out the adjusting of X-direction and Y direction to the pedestal respectively.
When the rotation of pedestal is abnormal, X-axis adjust component, Y-axis adjustment component respectively to pedestal carry out X-direction with
And the adjusting of Y direction, keep the levelness of pedestal to balance, the regulative mode of levelness automatic mechanism is simple, adjusts high
Effect.
In addition, preferably, X-axis adjustment component includes the X-axis of X-axis cavity and the driving X-axis cavity rotation
Motor, the X-axis cavity and the rotary shaft are rotatablely connected;The Y-axis adjustment component includes Y-axis cavity and the driving Y
The y-axis motor of axocoel body rotation, the Y-axis cavity are fixedly connected with the X-axis cavity.
When pedestal is when X-direction shifts, the work of X-axis motor drives X-axis cavity in the X-axis direction to balance position
Offset is set, the balance in X-direction is held the base in.When pedestal is when Y direction shifts, y-axis motor work drives Y
Axocoel body holds the base in the balance in Y direction in the Y-axis direction to deviation of balance position.X-axis adjusts component, Y-axis adjustment
The structure of component is simple, adjusts efficient.
Further, preferably, the X-axis cavity is located in the Y-axis cavity, and the X-axis cavity and the rotation
Shaft is rotatablely connected by bearing.
When y-axis motor driving Y-axis cavity in the Y-axis direction to deviation of balance position when, Y-axis chamber can be driven simultaneously intracorporal
X-axis component, in the Y-axis direction to deviation of balance position.X-axis component and Y-axis component cooperate, and the levelness of pedestal is kept to balance,
The rotational concentricity and levelness of pedestal are kept, guarantees that technique is normal, improves processing quality.
In addition, preferably, the testing agency is gyro sensor or encoder.
Gyro sensor can precisely determine the orientation of moving object, so as to precisely determine the offset direction of pedestal
It is excellent with information, the detection accuracy of testing agency such as angle.
In addition, preferably, the level cross-sectionn of the bracket be in cross, the bottom surface of the pedestal offer with it is described
The cross recess of bracket adaptation, the bracket are inserted into the cross recess.
Criss-cross bracket can be well embedded in the cross recess of pedestal, and the connection of bracket and pedestal is simply firm,
Pedestal is not easy to slip from bracket.
In addition, preferably, the bracket is integrally formed or is fixedly connected with the rotary shaft.
Bracket and rotary shaft, which are integrally formed, to be arranged, so that bracket and rotary shaft be avoided to generate sliding, bracket can be preferably
Band moving base rotates.
In addition, preferably, the rotary shaft include bar portion and protrude into the rotating electric machine main shaft fixed part, institute
The main shaft for stating fixed part and the rotating electric machine is fixed by positioning pin.
The fixed part of rotary shaft and the main shaft of rotating electric machine are fixed by positioning pin, facilitate consolidating for rotary shaft and rotating electric machine
Fixed, rotating electric machine can preferably drive the rotation of bracket.
In addition, preferably, the process cavity is ASM process cavity or AMAT process cavity.
Detailed description of the invention
Fig. 1 is the overall schematic of semiconductor processing equipment in the prior art;
Fig. 2 is the overall schematic of the utility model semiconductor processing equipment;
Fig. 3 is the structural schematic diagram between pedestal, bracket, rotary shaft and rotating electric machine;
Fig. 4 is the structural schematic diagram of bellows and bottom blowpipe;
Fig. 5 is the diagrammatic cross-section of line A-A in Fig. 3.
Description of symbols:
100, process cavity;101, exhaust outlet;102, process gas pipe;1, pedestal;11, cross recess;200, wafer;2, it props up
Frame;3, rotary shaft;31, positioning pin;32, bar portion;33, fixed part;4, rotating electric machine;5, controller;6, testing agency;7, horizontal
Spend automatic mechanism;71, X-axis adjusts component;71a, X-axis cavity;71b, X-axis motor;72, Y-axis adjusts component;72a, Y-axis
Cavity;72b, y-axis motor;8, bottom blowpipe;81, bellows;82, sealing plate;83, water inlet;84, water outlet;85, O-shaped sealing
Circle;9, sealing mechanism.
Specific embodiment
With reference to the accompanying drawings of the specification, the utility model is described in further detail.It is schematically simple in attached drawing
Change shows the structure etc. of semiconductor processing equipment.
In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
Referring to Fig. 1, in previous semiconductor processing equipment, 2 support pedestal 1 of bracket, pedestal 1 carries wafer 200, pedestal
1 rotates in process cavity 100.But the bracket 2 of rotation can occur constantly to wear in continuous rotation process, bracket 2
Abrasion, which will lead to pedestal 1 and rotate uneven, pedestal 1, to be there is decentraction and swings up and down phenomenon, and process abnormality is ultimately caused.And
In existing equipment, there are no the functions for the rotation status for detecting and adjusting pedestal 1.
The embodiments of the present invention provides a kind of semiconductor processing equipment, is configured with levelness automatic mechanism
7, levelness automatic mechanism 7 can timely and accurately detect that the rotation of pedestal 1 is abnormal and adjusts the water of pedestal 1 in time
Pingdu balance, keeps the rotational concentricity and levelness of pedestal 1, guarantees that technique is normal.
Referring specifically to shown in Fig. 2, semiconductor processing equipment includes process cavity 100, pedestal 1, bracket 2, rotary shaft 3, rotation
Rotating motor 4 and levelness automatic mechanism 7.
Process cavity 100 is ASM process cavity or AMAT process cavity.In the present embodiment, process cavity 100 is whole
Body is arranged in a rectangular parallelepiped shape, and one of side of process cavity 100 is provided with exhaust outlet 101, on process cavity 100 with
The opposite side of exhaust outlet 101 is equipped with process gas pipe 102.Work is passed through into process cavity 100 by process gas pipe 102
Skill gas, the exhaust gas after processing then pass through exhaust outlet 101 and process cavity 100 are discharged.
Pedestal 1 and bracket 2 are all set in process cavity 100, wherein pedestal 1 is used for carrying wafer 200, bracket 2
In support pedestal 1.
Rotary shaft 3 and process cavity 100 are rotatablely connected by bearing, and one end of rotary shaft 3 is protruded into inside process cavity 100
And it fixes with bracket 2, be sequentially connected outside other end stretching process cavity 100 and with rotating electric machine 4.Rotating electric machine 4 rotates, driving
Rotary shaft 3 rotates, and then the pedestal 1 on driving arm 2 and bracket 2 rotates, while the wafer 200 on pedestal 1 is rotated.
Each region of pedestal 1 is heated evenly, and wafer 200 is also heated evenly, and improves processing quality.
Levelness automatic mechanism 7 keeps 1 levelness of pedestal to balance for adjusting pedestal 1.Levelness adjust automatically
Mechanism 7 can timely and accurately detect that the rotation of pedestal 1 is abnormal and adjust the position of pedestal 1 in time, keep turning for pedestal 1
Dynamic balancing thereby may be ensured that the rotational concentricity and levelness of pedestal 1 mention so that the technique of semiconductor processing equipment is normal
High technology quality.
It is shown in Figure 3, for avoid between pedestal 1 and bracket 2 generate sliding, the level cross-sectionn of bracket 2 be set as be in
Cross, the bottom surface of pedestal 1 offer cross recess 11, and cross recess 11 is adapted to bracket 2, and bracket 2 is inserted into cross recess 11.Such as
This, bracket 2 can be well embedded in the cross recess 11 of pedestal 1, and the connection of bracket 2 and pedestal 1 is simply firm, and pedestal 1 is not
Sliding even slips easily from bracket 2.
Shown in Figure 5, rotary shaft 3 includes bar portion 32 and fixed part 33, and fixed part 33 is set far from process cavity 100
It sets.Fixed part 33 protrudes into the main shaft of rotating electric machine 4 and fixed by positioning pin 31 with the main shaft of rotating electric machine 4.At this point, rotation
The fixed part 33 of axis 3 and the main shaft of rotating electric machine 4 are fixed by positioning pin 31, facilitate the connection of rotary shaft 3 and rotating electric machine 4 jail
Gu stablizing, rotating electric machine 4 can preferably drive the rotation of bracket 2.
In present embodiment, bracket 2 and rotary shaft 3 are integrally formed and are arranged, so that bracket 2 and rotary shaft 3 be avoided to generate cunning
Dynamic, bracket 2 can preferably band moving base 1 rotation.
Shown in Figure 2, levelness self balancing device includes controller 5, testing agency 6 and levelness automatic adjusting machine
Structure 7, testing agency 6 and levelness automatic mechanism 7 are communicated to connect with controller 5.Wherein, testing agency 6 is for examining
The rotation status of pedestal 1 is surveyed, and the rotation status signal of pedestal 1 is sent to controller 5;Controller 5 is contorted for receiving
State signal, and adjustment state instruction is sent to levelness automatic mechanism 7;Levelness automatic mechanism 7 and bracket 2 are driven
Connection, levelness automatic mechanism 7 receive adjustment state and instruct and adjust the rotation status of pedestal 1.
At this point, testing agency 6 can in time detection pedestal 1 rotation status and by the rotation status signal of pedestal 1 feed back
To controller 5, controller 5 is according to the adjusting work of the rotation status signal level control degree automatic mechanism 7 received.When
When the rotation of pedestal 1 is abnormal, the abnormal rotation status signal of pedestal 1 is sent to controller 5 by testing agency 6, is controlled
Device 5 issues corresponding adjustment state to levelness automatic mechanism 7 according to abnormal rotation status signal and instructs, and levelness is certainly
Dynamic adjustment mechanism 7 adjusts the rotation status of pedestal 1 according to the adjustment state instruction received, so that pedestal 1 keeps levelness flat
Weighing apparatus, guarantees that the technique of semiconductor processing equipment is normal, improves processing quality.
In present embodiment, testing agency 6 is gyro sensor.Gyro sensor can precisely determine moving object
Orientation, offset direction and information, the detection accuracy of testing agency 6 such as angle so as to precisely determine pedestal 1 be excellent.?
In other embodiments, testing agency 6 or encoder or other detection instruments.
Shown in Figure 2, levelness automatic mechanism 7 includes that X-axis adjustment component 71 and Y-axis adjust component 72, X-axis
Adjust component 71, Y-axis adjustment component 72 carries out the adjusting of X-direction and Y direction to pedestal 1 respectively.When the rotation of pedestal 1
When being abnormal, X-axis adjusts component 71, Y-axis adjustment component 72 carries out the tune of X-direction and Y direction to pedestal 1 respectively
Section keeps the levelness balance of pedestal 1, and the regulative mode of levelness automatic mechanism 7 is simple, adjusts efficient.
Shown in Figure 2, it includes X-axis cavity 71a and X-axis motor 71b, X-axis motor 71b and X-axis that X-axis, which adjusts component 71,
Cavity 71a transmission connection, X-axis cavity 71a and rotary shaft 3 are rotatablely connected.It includes Y-axis cavity 72a and Y that Y-axis, which adjusts component 72,
Spindle motor 72b, y-axis motor 72b and Y-axis cavity 72a transmission connection, Y-axis cavity 72a are fixedly connected with X-axis cavity 71a.Work as base
Seat 1 is when X-direction shifts, X-axis motor 71b work, and driving X-axis cavity 71a is inclined to equilbrium position in the X-axis direction
It moves, keeps the balance of pedestal 1 in the X-axis direction.When pedestal 1 is when Y direction shifts, y-axis motor 72b work drives Y
Axocoel body 72a to deviation of balance position, keeps the balance of pedestal 1 in the Y-axis direction in the Y-axis direction.X-axis adjusts component 71, Y
The structure of axial adjustment component 72 is simple, adjusts efficient.
Particularly, X-axis cavity 71a is located in Y-axis cavity 72a, and X-axis cavity 71a and rotary shaft 3 are rotated by bearing and connected
It connects.When y-axis motor 72b driving Y-axis cavity 72a in the Y-axis direction to deviation of balance position when, Y-axis cavity 72a can be driven simultaneously
Interior X-axis component, in the Y-axis direction to deviation of balance position.X-axis component and Y-axis component cooperate, and keep the levelness of pedestal 1
Balance keeps the rotational concentricity and levelness of pedestal 1, guarantees that technique is normal, improves processing quality.
Particularly, in the present embodiment, the bottom surface of process cavity 100 and the top surface of Y-axis cavity 72a are by transparent material
Matter is made, and the top surface of X-axis cavity 71a, the rotation status of the timely detection pedestal 1 of testing agency 6 is arranged in testing agency 6.
In conjunction with shown in Fig. 2 and Fig. 4, bottom blowpipe 8 is coaxially surrounded by rotary shaft 3, bottom blowpipe 8 is located at process cavity
It is connected outside 100 and with process cavity 100.Bellows 81 is also coaxially surrounded by outside bottom blowpipe 8, bottom blowpipe 8 is close to process cavity
One end of body 100 is stretched out outside bellows 81 and is sealed with bellows 81 by O-ring seal 85, and bottom blowpipe 8 is far from process cavity
100 one end is located in bellows 81, and 81 bottom of bellows is provided with sealing plate 82.Offered on bellows 81 water inlet 83,
Water outlet 84, water inlet 83 are located at the lower section of water outlet 84, and circulation has cooling water in bellows 81.It is cold when temperature control component 7 works
But water is passed through 81 cavity wall of bellows from water inlet 83, then is flowed out by water outlet 84, can be to the bottom blowpipe 8 in bellows 81
Operating ambient temperature cools down, and guarantees that the operating ambient temperature of bottom blowpipe 8 is not too high, semiconductor technology is not dry by high temperature
It disturbs.Bellows 81 can also realize bottom blowpipe 8 and extraneous sealing, guarantee that the work of bottom blowpipe 8 is not interfered by outside.
Shown in Figure 2, semiconductor processing equipment further includes sealing mechanism 9, and sealing mechanism 9 is arranged outside rotary shaft 3.It is close
Sealing mechanism 9 can carry out dynamic Fluid Sealing to the rotary shaft 3 in rotation, and sealing effect is excellent.Meanwhile when rotary shaft 3 is revolved
When turning, sealing mechanism 9 can also completely cut off process cavity 100 and exchange with extraneous gas.
Particularly, sealing mechanism 9 be magnetic fluid component (structure and working principle of magnetic fluid component are the prior art,
Do not do and excessively repeat herein), magnetic fluid component is arranged between bottom blowpipe 8 and Y-axis cavity 72a.Magnetic fluid component can be to sky
The different mediums such as gas and water steam, pollutant carry out strict static seal or dynamic sealing, so as to preferably to the rotation in rotation
Shaft 3 is sealed.For magnetic fluid component as sealing mechanism 9, sealing performance is excellent, high efficient and reliable, and sealing life is long.
It should be noted that the levelness automatic mechanism 7 in the utility model is applicable not only to semiconductor processes and sets
In standby, it is also applied for other devices for needing to keep rotary balance.
To those skilled in the art, in the range of the utility model technical idea can as needed and for
Each step of above-mentioned control method is deleted or sequence adjusts.
It will be understood by those skilled in the art that in above-mentioned each embodiment, in order to keep reader more preferably geographical
It solves the application and proposes many technical details.But even if without these technical details and based on the respective embodiments described above
Various changes and modifications can also realize each claim of the application technical solution claimed substantially.Therefore, in reality
In, can to above embodiment, various changes can be made in the form and details, without departing from the spirit of the utility model
And range.
Claims (10)
1. a kind of semiconductor processing equipment, including process cavity, rotary shaft and rotating electric machine, are arranged in the process cavity
There are pedestal and bracket, pedestal described in the bracket support, one end of the rotary shaft is protruded into the process cavity and support
Bracket, the other end of the pedestal are connect with the spindle drive of the rotating electric machine, which is characterized in that the semiconductor equipment is also
Including the levelness self balancing device for adjusting the pedestal in rotation to keep the foundation level degree.
2. semiconductor processing equipment according to claim 1, which is characterized in that the levelness self balancing device includes control
Device processed and the testing agency communicated to connect with the controller, levelness automatic mechanism, wherein
The testing agency is used to detect the rotation status of the pedestal, and the rotation status signal of the pedestal is sent to institute
State controller;
The controller sends adjustment state for receiving the rotation status signal, and to the levelness automatic mechanism
Instruction;
The levelness automatic mechanism and the bracket are sequentially connected, and the levelness automatic mechanism receives the tune
Section status command and the rotation status for adjusting the pedestal.
3. semiconductor processing equipment according to claim 2, which is characterized in that the levelness automatic mechanism includes
X-axis adjusts component and Y-axis adjusts component, and the X-axis adjustment component, Y-axis adjustment component carry out X-axis side to the pedestal respectively
To and Y direction adjusting.
4. semiconductor processing equipment according to claim 3, which is characterized in that the X-axis adjustment component includes X-axis cavity
And the X-axis motor of the driving X-axis cavity rotation, the X-axis cavity and the rotary shaft are rotatablely connected;
Y-axis adjustment component includes the y-axis motor of Y-axis cavity and the driving Y-axis cavity rotation, the Y-axis cavity with
The X-axis cavity is fixedly connected.
5. semiconductor processing equipment according to claim 4, which is characterized in that the X-axis cavity is located at the Y-axis cavity
It is interior, and the X-axis cavity and the rotary shaft are rotatablely connected by bearing.
6. semiconductor processing equipment according to claim 2, which is characterized in that the testing agency is gyro sensor
Or encoder.
7. semiconductor processing equipment according to claim 1, which is characterized in that the level cross-sectionn of the bracket is in cross
Shape, the bottom surface of the pedestal offer the cross recess being adapted to the bracket, and the bracket is inserted into the cross recess.
8. -7 described in any item semiconductor processing equipments according to claim 1, which is characterized in that the bracket and the rotation
Shaft is integrally formed or is fixedly connected.
9. -7 described in any item semiconductor processing equipments according to claim 1, which is characterized in that the rotary shaft includes bar
Portion and protrude into the rotating electric machine main shaft fixed part, the main shaft of the fixed part and the rotating electric machine passes through positioning
Pin is fixed.
10. semiconductor processing equipment according to claim 1, which is characterized in that the process cavity is ASM process cavity
Or AMAT process cavity.
Priority Applications (1)
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CN201821301133.2U CN208674079U (en) | 2018-08-13 | 2018-08-13 | Semiconductor processing equipment |
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CN201821301133.2U CN208674079U (en) | 2018-08-13 | 2018-08-13 | Semiconductor processing equipment |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114318525A (en) * | 2021-12-23 | 2022-04-12 | 北京北方华创微电子装备有限公司 | Semiconductor epitaxial equipment and method for adjusting coaxiality of base and preheating ring of semiconductor epitaxial equipment |
CN115110053A (en) * | 2022-07-26 | 2022-09-27 | 北京北方华创微电子装备有限公司 | Leveling base and semiconductor process equipment |
TWI866054B (en) * | 2022-11-03 | 2024-12-11 | 大陸商西安奕斯偉材料科技股份有限公司 | Level detection device and level detection method |
WO2025044246A1 (en) * | 2023-08-30 | 2025-03-06 | 江苏天芯微半导体设备有限公司 | Semiconductor device and shaft adjustment method |
-
2018
- 2018-08-13 CN CN201821301133.2U patent/CN208674079U/en not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114318525A (en) * | 2021-12-23 | 2022-04-12 | 北京北方华创微电子装备有限公司 | Semiconductor epitaxial equipment and method for adjusting coaxiality of base and preheating ring of semiconductor epitaxial equipment |
CN115110053A (en) * | 2022-07-26 | 2022-09-27 | 北京北方华创微电子装备有限公司 | Leveling base and semiconductor process equipment |
CN115110053B (en) * | 2022-07-26 | 2023-09-08 | 北京北方华创微电子装备有限公司 | Adjustable level base and semiconductor process equipment |
TWI866054B (en) * | 2022-11-03 | 2024-12-11 | 大陸商西安奕斯偉材料科技股份有限公司 | Level detection device and level detection method |
WO2025044246A1 (en) * | 2023-08-30 | 2025-03-06 | 江苏天芯微半导体设备有限公司 | Semiconductor device and shaft adjustment method |
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