CN208655700U - Prepare flexible display screen composite substrate - Google Patents
Prepare flexible display screen composite substrate Download PDFInfo
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- CN208655700U CN208655700U CN201821238282.9U CN201821238282U CN208655700U CN 208655700 U CN208655700 U CN 208655700U CN 201821238282 U CN201821238282 U CN 201821238282U CN 208655700 U CN208655700 U CN 208655700U
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- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 239000002131 composite material Substances 0.000 title claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 35
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 26
- 239000004642 Polyimide Substances 0.000 claims description 17
- 229920001721 polyimide Polymers 0.000 claims description 17
- YZCKVEUIGOORGS-IGMARMGPSA-N Protium Chemical compound [1H] YZCKVEUIGOORGS-IGMARMGPSA-N 0.000 claims description 13
- 241000720974 Protium Species 0.000 claims description 12
- 238000005229 chemical vapour deposition Methods 0.000 claims description 12
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 10
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 9
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 8
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 8
- 229910002601 GaN Inorganic materials 0.000 claims description 7
- FMGSKLZLMKYGDP-USOAJAOKSA-N dehydroepiandrosterone Chemical class C1[C@@H](O)CC[C@]2(C)[C@H]3CC[C@](C)(C(CC4)=O)[C@@H]4[C@@H]3CC=C21 FMGSKLZLMKYGDP-USOAJAOKSA-N 0.000 claims description 6
- 206010027146 Melanoderma Diseases 0.000 abstract description 17
- 238000012545 processing Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- 150000001875 compounds Chemical class 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 155
- 238000002360 preparation method Methods 0.000 description 12
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 229920001621 AMOLED Polymers 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000007792 gaseous phase Substances 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electroluminescent Light Sources (AREA)
Abstract
Flexible display screen composite substrate is prepared the utility model relates to a kind of, wherein compound substrate structure includes: substrate；Sacrificial layer, sacrificial layer are arranged in substrate, and sacrificial layer is translucent inorganic layer；And flexible layer, flexible layer are arranged on sacrificial layer.The setting that the utility model passes through sacrificial layer; adhesion strength when reducing laser lift-off between substrate and flexible layer; improve the adhesion strength and peeling effect in laser lift-off processing procedure between substrate and flexible layer, to achieve the effect that protect flexible layer, reduce blackspot stain incidence.
Description
Technical field
The utility model relates to a kind of flexible display technologies field, more particularly to a kind of flexible display screen for preparing with compound
Substrate.
Background technique
Active-matrix Organic Light Emitting Diode (Active-matrix organic light emitting diode,
AMOLED) display technology is more concerned in recent years, is exactly this display technology used by current most of flexible display screens.?
In the research and development of flexible display screen, required one of the technical problem overcome is exactly to carry out laser lift-off to the flexible base board with glass
The problem of (Laser Lift Off, LLO).To with glass flexible base board carry out laser lift-off (Laser Lift Off,
LLO in processing procedure), it is likely to result in flexible base board damage, subsequent steam invasion will lead to luminous organic material failure, and then lead
It causes that blackspot or stain can be generated when organic light-emitting diode, causes biggish yield loss and waste of material.
By the long-term observation of applicant with the study found that the flexible base board of AMOLED after through laser lift-off (LLO)
The main reason for blackspot or stain can be generated is polyimides (PI) stronger adhesion strength between substrate and glass, keeps polyamides sub-
Amine (PI) is difficult to remove to generate damage at laser lift-off (LLO), causes luminous organic material to fail after steam invasion, into
And when making organic light-emitting diode, since some materials of failure can not shine, so stain can be generated.
Prior art discloses one kind to increase organic layer/amorphous silicon layer/organic layer between substrate glasses and flexible substrates
Sandwich structure, be designed to deal with after laser lift-off processing procedure the technical issues of generating blackspot or stain by such structure.
But this multilayered structure production cost of the prior art is opposite to be improved, and production process is complicated, causes equipment capacity low.
Utility model content
The technical problem to be solved by the utility model is to provide a kind of preparation method of flexible display screen and preparation are flexible
Display screen composite substrate remains the sacrificial layer of protium by being arranged between substrate and flexible layer, to improve laser stripping
Blackspot or stain can be led to the problem of in processing procedure from (Laser Lift Off, LLO).
The technical scheme adopted by the utility model to solve the technical problem is as follows: providing a kind of flexible display screen for preparing with multiple
Substrate is closed, wherein composite substrate includes: substrate；Sacrificial layer, sacrificial layer are arranged in substrate, and the sacrificial layer is translucent nothing
Machine layer；And flexible layer, flexible layer are arranged on sacrificial layer.
The further technical solution of the utility model is that sacrificial layer is by chemical vapor deposition and without dehydrogenation
Handle the inorganic layer of preparation.
The further technical solution of the utility model is that the atomicity percentage composition of the hydrogen atom in sacrificial layer is greater than
2%, preferably 5-10%.
The further technical solution of the utility model is that sacrificial layer is simple layer structure.
The further technical solution of the utility model is that the main material of sacrificial layer is amorphous silicon, silicon carbide or nitridation
Gallium.
The further technical solution of the utility model is that the main material of the sacrificial layer is amorphous silicon, and thickness is less than
20nm, preferably 5-10nm；The main material of the sacrificial layer is silicon carbide, and thickness is less than 30nm, preferably 10-20nm；Institute
The main material for stating sacrificial layer is gallium nitride, and thickness is less than 30nm, preferably 10-20nm.
The further technical solution of the utility model is that substrate is glassy layer, and the material of the preferably described flexible layer is poly-
Acid imide.
The utility model also provides a kind of preparation method of flexible display screen, wherein the preparation method includes following step
It is rapid:
The deposited sacrificial layer in substrate, the sacrificial layer are to contain protium and translucent inorganic layer；
Flexible layer is formed on sacrificial layer；
Electronic component is formed on flexible layer；And
Laser irradiation substrate, so that protium forms hydrogen gas bubbles in sacrificial layer, to remove sacrificial layer and inorganic layer.
The further technical solution of the utility model is that sacrificial layer is to pass through chemical gaseous phase using hydrogenous material as material
Sedimentation is formed in substrate, and does not carry out Dehydroepiandrosterone derivative to sacrificial layer preferably after chemical vapor deposition sacrificial layer, more preferably sacrificial
The atomicity percentage composition of hydrogen atom in domestic animal layer is greater than 2%, preferably 5-10%.
The further technical solution of the utility model is, during laser irradiation substrate, used laser beam
Power is 19-22.5W.
The utility model has had the advantage that compared with prior art:
1, the utility model is by setting sacrificial layer, and while guaranteeing cohesive force between substrate and flexible layer, utilization is sacrificial
Domestic animal layer be translucent inorganic layer the characteristics of, enable an operator to through substrate and sacrificial layer observation flexible layer, in order to
The technique of alignment is realized in flexible display screen manufacturing process；And sacrificial layer is enabled to absorb incidental energy in laser lift-off
Amount forms minute bubbles to promote the remaining protium of institute in sacrificial layer to be converted into hydrogen；The generation of these minute bubbles is conducive to promote
It separates sacrificial layer with flexible layer, the adhesive force between substrate and flexible layer is reduced, so as to improve substrate in laser lift-off processing procedure
Adhesion strength and peeling effect between flexible layer, to achieve the effect that protect flexible layer, reduce blackspot stain incidence；
2, the sacrificial layer of the utility model is single-layer inorganic layer, without additional addition organic layer, compared with the prior art more
Layer structure, the flexible base board structure of the utility model is more simple, and production cost and equipment produce, therefore can be greatly lowered, and
Improvement is equally obvious；
3, less than 20 nanometers of the thickness of the utility model sacrificial layer (nm), and preferred thickness range is 5-10 nanometers
(nm), therefore the light transmission rate of the flexible base board structure of the utility model will not be affected because the thickness of sacrificial layer is blocked up,
The flexible base board structure of the utility model can keep high light transmission rate, improve the comparison of AMOLED product aligning label
Degree is, it can be achieved that exactitude position, guarantees that the size of subsequent cutting is normal；
4, amorphous silicon or silicon carbide or gallium nitride may be selected in the material of the utility model sacrificial layer, according to product actual process
Processing procedure selects corresponding sacrificial layer, and material selection is more flexible.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the composite substrate for preparing flexible display screen of an embodiment of the present invention.
Fig. 2 is the step flow chart of the laser-stripping method of an embodiment of the present invention.
Specific embodiment
As shown in Figure 1, in an embodiment of the utility model, discloses and a kind of prepare flexible display screen composite base
Plate, wherein compound substrate structure 400 includes substrate 100, sacrificial layer 200 and flexible layer 300, in which:
Substrate 100 is glassy layer, rigid support can be provided for flexible layer, and laser beam can be enable to be perforated through glass
Layer realizes laser lift-off；Can there is no particular/special requirement for the selection of glassy layer in the present invention, referring to the normal of this field
Rule selection.
Sacrificial layer 200 is arranged in substrate 100, is containing protium and translucent inorganic layer, for this field skill
Inorganic layer can be selected according to the attachment force request between substrate 100 and flexible layer 300 for art personnel, it is attached meeting
In the case where force request, selection contains protium and translucent organic layer.
In a preferred embodiment, which can be using hydrogenous material as material, pass through chemical vapour deposition technique
It is formed in substrate 100, this mode, which is formed by nature in sacrificial layer 200, can have protium.It is used in the field OLED
During chemical vapour deposition technique makes inorganic layer, the step of increasing a Dehydroepiandrosterone derivative is generally required, in order to make nothing
It is free of in machine layer or contains protium less, and the utility model runs in the opposite direction with this, selects after chemical vapor deposition sacrificial layer
Dehydroepiandrosterone derivative is not carried out to sacrificial layer 200, so that containing protium in sacrificial layer 200.
In a preferred embodiment, the atomicity percentage composition (number content) of the hydrogen atom in the sacrificial layer 200 is greater than
2%, preferably 5-10%；Wherein the atomicity percentage composition of hydrogen atom can pass through Secondary Ion Mass Spectrometry (secondary ion
Mass spectroscopy, SIMS) measurement acquisition.
In a preferred embodiment, the main material of sacrificial layer 200 is amorphous silicon or silicon carbide (SiC) or gallium nitride
(GaN), wherein amorphous silicon is preferably a-Si.The material of right sacrificial layer 200 is not limited thereto, and those skilled in the art can root
Other suitable inorganic material are selected according to the introduction of the utility model.
Amorphous silicon, silicon carbide or gallium nitride are known as to the main material of sacrificial layer 200 in the present invention, be exactly because
In sacrificial layer 200 other than these main materials, also contain (remaining) protium, and the content of protium is lower,
5%-10% range or so.
In a preferred embodiment, the main material of the sacrificial layer 200 is amorphous silicon, and the thickness of sacrificial layer 200 is less than
20 nanometers (nm), and the preferred thickness range of the sacrificial layer 200 of the utility model is 5-10 nanometers (nm), the thickness within the scope of this
Sacrificial layer 200 be translucent, higher light transmission rate can be kept, and can be realized in flexible display screen manufacturing process
Alignment, improve the contrast of AMOLED product aligning label, it can be achieved that exactitude position, guarantees that the size of subsequent cutting is normal,
The heat during laser lift-off can be absorbed simultaneously, promote remaining protium reaction to generate hydrogen gas bubbles, and then reduce sacrificial
Adhesive force between domestic animal layer 200 and flexible layer 300, accelerates the separation of flexible layer 300 and substrate 100, is damaged with surface laser soft
Property layer.Similarly, in another preferred embodiment, the material of the sacrificial layer 200 is silicon carbide, and the thickness of sacrificial layer 200 is small
In 30nm, preferably 10-20nm；In a further preferred embodiment, the material of the sacrificial layer 200 is gallium nitride, sacrificial layer 200
Thickness be less than 30nm, preferably 10-20nm.
Flexible layer 300 is arranged on sacrificial layer, and the selection of flexible layer is referred to the conventional selection of this field, such as at this
The material of preferred flexible layer 300 is polyimides (PI) in utility model.
In addition, referring to FIG. 2, in another embodiment of the utility model, it is also proposed that a kind of preparation of flexible display screen
Method, wherein preparation method the following steps are included:
Step 500: using hydrogenous material as material, sacrificial layer 200 being formed in by substrate 100 by chemical vapour deposition technique
On；Certainly in other examples, this material can not be limited, this specific method can not also be limited；
In a preferred embodiment, hydrogenous material can be silane (SiH4)。
In a preferred embodiment, for the method using chemical vapor deposition sacrificial layer, preferably in chemical gaseous phase
Dehydroepiandrosterone derivative is not carried out to sacrificial layer 200 after the step of deposited sacrificial layer, to retain the hydrogen content in sacrificial layer 200；
It in a preferred embodiment, can be by the condition of control chemical vapor deposition, to adjust the hydrogen in sacrificial layer 200
Content such as can be so that the atomicity percentage composition of the hydrogen atom in sacrificial layer 200 is greater than 2%, preferably 5-10%
5%, 6%, 7%, 8%, 9% or 10%；
It in a preferred embodiment, can be by the condition of control chemical vapor deposition, to adjust the thickness of sacrificial layer 200
Degree, and then obtain translucent inorganic layer；Such as the material of the sacrificial layer 200 is amorphous silicon, controls the sacrificial layer 200
Thickness is less than 20nm, can be 5nm-10nm, such as can be 5nm, 6nm, 7nm, 8nm, 9nm, 10nm.In another example described sacrificial
Domestic animal layer 200 material be silicon carbide, control sacrificial layer 200 thickness be less than 30nm, can be 10-20nm, for example, 10nm,
12nm,15nm,18nm,20nm.For another example the material of the sacrificial layer 200 is gallium nitride, the thickness of the sacrificial layer 200 is controlled
Degree is less than 30nm, can be 10-20nm, for example, 10nm, 12nm, 15nm, 18nm, 20nm.
Step 600: flexible layer is formed on sacrificial layer；
Step 700: the other structures contained by electronic component and flexible screen are formed on flexible layer, for example including but
It is not limited to TFT, OLED, mould group layer and wiring, and these processing procedures and structure are known way, and above-mentioned reality
The flexible base board structure for applying example mainly emphasizes used in the laser lift-off processing procedure, therefore in the specification of the utility model just no longer
Repeat these fabrication steps explanation.
Step 800: control laser beam is irradiated to laser beam on sacrificial layer 200 via substrate 100, in sacrificial layer 200
Hydrogen atom be combined with each other and forms hydrogen.It is microcosmic that the generation of hydrogen gas bubbles forces the interface of sacrificial layer 200 and flexible layer 300 to occur
Separation reduces the binding force between sacrificial layer 200 and flexible layer 300, and then when flexible layer 300 is separated with substrate 100, reduces
The stress of flexible layer 300 reduces the probability that flexible layer 300 is destroyed, substrate 100 is easily divided with flexible layer 300
From.
Wherein, for the power of laser beam there is no particular/special requirement, substrate 100 can be slightly above and flexible layer 300 is direct
Used power when being affixed, such as can be 19-22.5W, the power of usual laser beam increases with the thickness of sacrificial layer,
Such as when sacrificial layer 200 is with a thickness of 5nm, the power of used laser beam can be 19.3W；And in sacrificial layer 200
When with a thickness of 10nm, the power of used laser beam is 22.1W.
The preparation method of the utility model flexible display screen is further illustrated below with reference to specific embodiment and reference examples
And prepare the beneficial effect of flexible display screen composite substrate.
Reference examples
Flexible display screen is prepared using existing conventional composite substrate: where composite substrate includes the substrate set gradually
100 and flexible layer 300.Wherein substrate 100 is glassy layer, and flexible layer 300 is polyimides (PI).
The substrate in laser lift-off composite substrate after flexible display screen is completed in preparation: with power for 14.9W laser beam by
Composite substrate is irradiated in 100 place side of substrate, and further removes corresponding substrate 100 and sacrificial layer 200.
It is tested using 69 samples as radix, after laser lift-off, the sample of blackspot or stain occurs in flexible display screen
Quantity is 4, and the incidence through statistics blackspot and stain is 58%.
Embodiment 1
Flexible display screen is prepared using the utility model composite substrate: where composite substrate includes the substrate set gradually
100, sacrificial layer 200 and flexible layer 300.Wherein substrate 100 is glassy layer (material and thickness are same as Example 1), flexible layer
300 be polyimides (material and thickness are same as Example 1)；Sacrificial layer 200 be by chemical vapor deposition process preparation and
Amorphous silicon (a-Si) layer without Dehydroepiandrosterone derivative, amorphous silicon (a-Si) layer with a thickness of 5nm.
The substrate in laser lift-off composite substrate after flexible display screen is completed in preparation: with power for 19.3W laser beam by
Composite substrate is irradiated in 100 place side of substrate, and further removes corresponding substrate 100 and sacrificial layer 200.
It is tested using 41 samples as radix, after laser lift-off, the sample of blackspot or stain occurs in flexible display screen
Quantity is 0, and the incidence through statistics blackspot and stain is 0%.
Embodiment 2
Prepare flexible display screen using the utility model composite substrate: where the structure of composite substrate referring to
Embodiment 1, sacrificial layer 200 is using the amorphous silicon being prepared with the identical technique of embodiment 1 in composite substrate
(a-Si) layer, amorphous silicon (a-Si) layer with a thickness of 10nm.
The substrate in laser lift-off composite substrate after flexible display screen is completed in preparation: with power for 22.1W laser beam by
Composite substrate is irradiated in 100 place side of substrate, further to remove corresponding substrate 100 and sacrificial layer 200.
It is tested using 45 samples as radix, after laser lift-off, the sample of blackspot or stain occurs in flexible display screen
Quantity is 0, and the incidence through statistics blackspot and stain is 0%.
As shown in embodiment 1-2 and reference examples, the flexible base board structure of the Organic Light Emitting Diode of not set sacrificial layer exists
Blackspot or stain a situation arises be 4/69, incidence 5.80%；Organic Light Emitting Diode with amorphous silicon (a-Si) layer
A situation arises is 0/86 for flexible base board structure blackspot or stain, incidence 0%, and the thickness control of amorphous silicon (a-Si) layer exists
At 5 nanometers or 10 nanometers, occur without blackspot or stain.
Therefore, single layer amorphous silicon (a-Si) layer is added between glassy layer and polyimides (PI) layer, can be obviously reduced
The probability that polyimides (PI) layer is destroyed improves the adherency in laser lift-off processing procedure between glassy layer and polyimides (PI) layer
Power and peeling effect reduce the effect of blackspot or stain incidence to reach protection polyimides (PI) layer.
In addition, the utility model is also further by adjusting the technological parameter of chemical vapor deposition process, to condition of equivalent thickness
The influence of hydrogen atom content is tested in lower sacrificial layer, and the atomicity percentage composition of hydrogen atom exists in test discovery sacrificial layer
When 5%-10%, the resultant effect of the glass effects of the adhesive force and substrate and flexible layer of substrate and flexible layer is best.When
So, the atomicity percentage composition of hydrogen atom in sacrificial layer is not limited within the scope of this, it can as long as it is greater than 2%
The incidence of blackspot or stain is reduced to a certain extent.Furthermore
Several preferred embodiments of the utility model have shown and described in above description, but as previously described, it should be understood that
The utility model is not limited to forms disclosed herein, and is not to be taken as the exclusion to other embodiments, and can be used for
Other combinations, modifications, and environments, and above-mentioned introduction or correlation can be passed through within the scope of the inventive concept described herein
The technology or knowledge in field are modified.And changes and modifications made by those skilled in the art do not depart from the spirit of the utility model
And range, then it all should be in the protection scope of the appended claims for the utility model.
Claims (10)
1. a kind of prepare flexible display screen composite substrate, which is characterized in that the composite substrate includes:
Substrate；
Sacrificial layer, the sacrificial layer are arranged in substrate, and the sacrificial layer is the translucent inorganic layer containing protium；And
Flexible layer, the flexible layer are arranged on sacrificial layer.
2. composite substrate according to claim 1, which is characterized in that the sacrificial layer is heavy by chemical vapour deposition technique
Product and the inorganic layer prepared without Dehydroepiandrosterone derivative.
3. composite substrate according to claim 2, which is characterized in that the atomicity percentage of the hydrogen atom in the sacrificial layer
Content is 5-10%.
4. composite substrate according to claim 1, which is characterized in that the sacrificial layer is simple layer structure.
5. composite substrate as claimed in any of claims 1 to 4, which is characterized in that the main body material of the sacrificial layer
Matter is amorphous silicon, silicon carbide or gallium nitride.
6. composite substrate according to claim 5, which is characterized in that the main material of the sacrificial layer is amorphous silicon, institute
Stating sacrificial layer thickness is 5-10nm.
7. composite substrate according to claim 5, which is characterized in that the main material of the sacrificial layer is silicon carbide, institute
State sacrificial layer with a thickness of 10-20nm.
8. composite substrate according to claim 4, which is characterized in that the material of the sacrificial layer is gallium nitride, described sacrificial
Domestic animal layer with a thickness of 10-20nm.
9. composite substrate according to claim 1, which is characterized in that the substrate is glassy layer.
10. composite substrate according to claim 1, which is characterized in that the material of the flexible layer is polyimides.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807671A (en) * | 2018-08-02 | 2018-11-13 | 昆山国显光电有限公司 | The preparation method of flexible display screen and prepare flexible display screen composite substrate |
| CN110098225A (en) * | 2019-04-18 | 2019-08-06 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and preparation method thereof |
| CN116892000A (en) * | 2023-07-11 | 2023-10-17 | 安徽立光电子材料股份有限公司 | Preparation method of composite copper foil and composite copper foil |
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2018
- 2018-08-02 CN CN201821238282.9U patent/CN208655700U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807671A (en) * | 2018-08-02 | 2018-11-13 | 昆山国显光电有限公司 | The preparation method of flexible display screen and prepare flexible display screen composite substrate |
| WO2020024564A1 (en) * | 2018-08-02 | 2020-02-06 | 昆山国显光电有限公司 | Preparation method for flexible display screen and composite substrate for preparing flexible display screen |
| US11211573B2 (en) | 2018-08-02 | 2021-12-28 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Manufacturing methods for flexible display screens and composite substrates for flexible display screens |
| CN110098225A (en) * | 2019-04-18 | 2019-08-06 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and preparation method thereof |
| CN116892000A (en) * | 2023-07-11 | 2023-10-17 | 安徽立光电子材料股份有限公司 | Preparation method of composite copper foil and composite copper foil |
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