CN208596860U - Coating clamp for semiconductor laser - Google Patents
Coating clamp for semiconductor laser Download PDFInfo
- Publication number
- CN208596860U CN208596860U CN201821115859.7U CN201821115859U CN208596860U CN 208596860 U CN208596860 U CN 208596860U CN 201821115859 U CN201821115859 U CN 201821115859U CN 208596860 U CN208596860 U CN 208596860U
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- China
- Prior art keywords
- cover board
- board frame
- shaped
- shaped matrix
- hanging hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model belongs to semiconductor coated film technical field, it is related to a kind of coating clamp for semiconductor laser, cover board frame including square frame-shaped and the U-shaped matrix being fixed on above cover board frame, the U-shaped matrix is equipped with a step groove towards the inner wall of cover board frame one side, there is a T-shaped plate that can slide between cover board frame and U-shaped matrix along step groove, the T-shaped plate includes the slide plate portion that can be placed between cover board frame and U-shaped matrix and the ear for being symmetrically set in slide plate portion both sides, a hanging hole is equipped in each ear, the two sides of the U-shaped matrix correspond to each hanging hole and link up with equipped with L shape, it is hooked tightly between corresponding hanging hole and L shape hook by elastic component.The utility model maintains chip by the way of stacking-clamping, not direct to be in contact with chip coated surface, effectively protects the cleaning of coated surface.The utility model assembly simultaneously is simple, can be used directly without specially treated, and coating effects are good, and chip aid is securely, low in cost.
Description
Technical field
The utility model relates to semiconductor coated film technical field, in particular to a kind of coating film sandwich for semiconductor laser
Tool.
Background technique
Semiconductor laser is also referred to as semiconductor laser diode or abbreviation laser diode (LaserDiode, LD),
The laser that specific wavelength can be emitted is a kind of important semiconductor photoelectronic device.With traditional high-power CO2, YAG solid swash
Light device is compared, and semiconductor laser has apparent technical advantage, such as small in size, light-weight, high-efficient, energy consumption is small, the service life
Long and metal absorbs the advantages that high to semiconductor laser, thus applied to quickly industry, agricultural, accurate measurement and detection,
The various aspects such as communication and information processing, medical treatment, military affairs, and revolutionary breakthrough is caused in many fields, market demand is huge
Greatly.Traditional coating clamp fixed chip generally by the way of stacking-clamping, i.e., by fixture be placed in a surfacing pedestal it
On, using susceptor surface as benchmark face, tens of chips are stacked on susceptor surface one by one, and a Cavity surface of chip and pedestal table
Face contact keeps the precision stacked on the basis of this surface.After stacking sufficient amount of chip, with the clamping device on fixture
Chip stack is clamped, fixture is removed from pedestal and is packed into coating machine progress plated film.Stacking-clamping mode can guarantee in plated film
Multiple chip Cavity surfaces are in same level in the process, it is ensured that and it is uniform in cavity surface film coating, while semiconductor laser can be prevented
Electrode surface plate film.
But since semiconductor laser material itself is very fragile, be easy to be broken off, if so clamp structure design does not conform to
Reason, chip clamp insecure easy sliding or fall, and cause breakage；In stacking process, one of Cavity surface of every chip with
Susceptor surface Full connected, and be easy that opposite sliding occurs on this surface, and the Cavity surface of laser diode chip is that its is most important
Part, slight pollution or damage may cause serious influence to the Performance And Reliability of chip.
Utility model content
The main purpose of the utility model is to provide a kind of coating clamp for semiconductor laser, using first stacking
The mode fixed chip clamped again has easy to operate, simple structure, advantage easy to process, easy to accomplish, it can be ensured that core
Piece is secured, avoids and reduce chip damage and pollution suffered during load.
The utility model is achieved through the following technical solutions above-mentioned purpose: a kind of coating film sandwich for semiconductor laser
Tool, the cover board frame including square frame-shaped and the U-shaped matrix being fixed on above cover board frame, the U-shaped matrix is towards cover board frame one side
Inner wall is equipped with a step groove, has a T-shaped plate that can slide between cover board frame and U-shaped matrix along step groove, the T-shaped plate
Including the slide plate portion that can be placed between cover board frame and U-shaped matrix and the ear for being symmetrically set in slide plate portion both sides, each ear
On be equipped with a hanging hole, the two sides of the U-shaped matrix correspond to each hanging hole and link up with equipped with L shape, corresponding hanging hole and L shape hook
Between hooked by elastic component it is tight.
Specifically, the outside of L shape hook and corresponding hanging hole aligned in position.
Specifically, the lower section of the cover board frame is separable to be equipped with a supporting block, the top of the supporting block has one
The boss of the hollow space of a embeddable cover board frame.
Further, the height of the boss is lower than the thickness of cover board frame.
Specifically, the cover board frame is fixed surrounding by four screws with the U-shaped matrix.
By adopting the above technical scheme, the beneficial effect of technical solutions of the utility model is:
The utility model maintains chip by the way of stacking-clamping, not direct to be in contact with chip coated surface, effectively
The cleaning for protecting coated surface, while the utility model assembly is simple, can be used directly without specially treated, coating effects
Good, chip aid is securely, low in cost.
Detailed description of the invention
Fig. 1 is the explosive view that embodiment carries coating clamp.
In the figure, it is marked as
1- cover board frame；
2-U mold base, 21-L shape hook, 22- step groove；
3-T shape plate, 31- slide plate portion, 32- ear, 321- hanging hole；
4- supporting block, 41- boss.
Specific embodiment
The utility model is described in further detail combined with specific embodiments below.
Embodiment:
As shown in Figure 1, a kind of coating clamp for semiconductor laser, cover board frame 1 including square frame-shaped and it is fixed on
The U-shaped matrix 2 of 1 top of cover board frame, U-shaped matrix 2 are equipped with a step groove 22 towards the inner wall of 1 one side of cover board frame, there is a T
Shape plate 3 can slide between cover board frame 1 and U-shaped matrix 2 along step groove 22, T-shaped plate 3 include can be placed in cover board frame 1 with it is U-shaped
Slide plate portion 31 between matrix 2 and the ear 32 for being symmetrically set in 31 both sides of slide plate portion are equipped with an extension in each ear 32
Hole 321, the two sides of U-shaped matrix 2 correspond to each hanging hole 321 equipped with L shape hook 21, corresponding hanging hole 321 and L shape hook 21 it
Between hooked by elastic component it is tight.Chip can be placed between cover board frame 1 and U-shaped matrix 2 after stacking, and three faces of chip are by U-shaped base
The step groove 22 of body 2 limits, and another side is limited by the slide plate portion 31 of T-shaped plate 3, and elastic component enables T-shaped plate 3 and U-shaped matrix 2 close
Trend in this way clamps chip.It is outer that the structure of the hollow part of cover board frame 1 and U-shaped matrix 2 can allow the surface of chip to be exposed to
Portion thus can be convenient plated film.The utility model is not direct to be in contact with chip coated surface, effectively protects coated surface
Cleaning, while the utility model assembly is simple, can be used directly without specially treated, coating effects are good, and chip accommodates securely,
It is low in cost.
As shown in Figure 1, outside and corresponding 321 aligned in position of hanging hole of L shape hook 21.Elastic component can generate in this way
The elastic force that direction is slid into along T-shaped plate 3, avoids T-shaped plate 3 from loosening and chip is caused to fall.
As shown in Figure 1, the lower section of cover board frame 1 is separable to be equipped with a supporting block 4, the top of supporting block 4 has one
The boss 41 of 1 hollow space of cover board frame can be matched.In chip insertion, boss 41 is inserted into cover board frame 1, makes chip will not be because
Surprisingly passes through cover board frame 1 and fall.Equal chips complete it is fixed after, take supporting block 4 away, the bottom surface of chip can be exposed on it is outer into
Row plated film operation.
As shown in Figure 1, the height of boss 41 is lower than the thickness of cover board frame 1.The purpose of supporting block 4 is to prevent chip from falling,
If the top surface of boss 41 is too near to the upper surface of cover board frame 1, bottom surface may be subjected to boss 41 during chip slides into
Scraping and be not achieved protection appearance purpose.
As shown in Figure 1, cover board frame 1 is fixed surrounding by four screws with U-shaped matrix 2.Cover board frame 1 and U-shaped base in this way
2 relative position of body is just completely fixed, and will not be allowed around chip and be scratched because being mutually shifted.
Above-described is only some embodiments of the utility model.For those of ordinary skill in the art,
Without departing from the concept of the present invention, various modifications and improvements can be made, these belong to practical
Novel protection scope.
Claims (5)
1. a kind of coating clamp for semiconductor laser, it is characterised in that: cover board frame including square frame-shaped and be fixed on lid
U-shaped matrix above sheet frame, the U-shaped matrix are equipped with a step groove towards the inner wall of cover board frame one side, there is a T-shaped plate
It can be slid between cover board frame and U-shaped matrix along step groove, the T-shaped plate includes that can be placed between cover board frame and U-shaped matrix
Slide plate portion and be symmetrically set in the ear on slide plate portion both sides, be equipped with a hanging hole in each ear, the two of the U-shaped matrix
Side corresponds to each hanging hole and links up with equipped with L shape, is hooked tightly between corresponding hanging hole and L shape hook by elastic component.
2. coating clamp according to claim 1, it is characterised in that: the outside of L shape hook and corresponding hanging hole position
Set alignment.
3. coating clamp according to claim 1, it is characterised in that: the lower section of the cover board frame is separable to be equipped with one
Supporting block, the top of the supporting block have the boss of the hollow space of an embeddable cover board frame.
4. coating clamp according to claim 3, it is characterised in that: the height of the boss is lower than the thickness of cover board frame.
5. coating clamp according to claim 1, it is characterised in that: the cover board frame and the U-shaped matrix pass through four
Screw fixes surrounding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821115859.7U CN208596860U (en) | 2018-07-13 | 2018-07-13 | Coating clamp for semiconductor laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821115859.7U CN208596860U (en) | 2018-07-13 | 2018-07-13 | Coating clamp for semiconductor laser |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208596860U true CN208596860U (en) | 2019-03-12 |
Family
ID=65602998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821115859.7U Active CN208596860U (en) | 2018-07-13 | 2018-07-13 | Coating clamp for semiconductor laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208596860U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111501042A (en) * | 2020-06-02 | 2020-08-07 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
-
2018
- 2018-07-13 CN CN201821115859.7U patent/CN208596860U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111501042A (en) * | 2020-06-02 | 2020-08-07 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
| CN111501042B (en) * | 2020-06-02 | 2023-09-01 | 海南师范大学 | Edge-emitting semiconductor laser chip cavity surface coating clamp |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |