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CN208589426U - A kind of mechanical arm and semiconductor processing equipment of pre- anti-scratch crystal column surface - Google Patents

A kind of mechanical arm and semiconductor processing equipment of pre- anti-scratch crystal column surface Download PDF

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Publication number
CN208589426U
CN208589426U CN201821266817.3U CN201821266817U CN208589426U CN 208589426 U CN208589426 U CN 208589426U CN 201821266817 U CN201821266817 U CN 201821266817U CN 208589426 U CN208589426 U CN 208589426U
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CN
China
Prior art keywords
mechanical arm
distance
yoke
wafer
crystal column
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Active
Application number
CN201821266817.3U
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Chinese (zh)
Inventor
蔡松柏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan Xinxin Integrated Circuit Co ltd
Original Assignee
Wuhan Xinxin Semiconductor Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Wuhan Xinxin Semiconductor Manufacturing Co Ltd filed Critical Wuhan Xinxin Semiconductor Manufacturing Co Ltd
Priority to CN201821266817.3U priority Critical patent/CN208589426U/en
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Publication of CN208589426U publication Critical patent/CN208589426U/en
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Abstract

The utility model provides the mechanical arm and its semiconductor processing equipment of a kind of pre- anti-scratch crystal column surface, semiconductor processing equipment is provided with the mechanical arm to mobile wafer, wherein, mechanical arm includes: fork-shaped ontology, and fork-shaped ontology includes including a pair of yoke disposed in parallel;A pair of of positioning pin is respectively arranged at the end of a pair of of yoke;Distance-sensor group is provided on each positioning pin.The beneficial effects of the utility model are to provide mechanical arm moving parameter by setting distance-sensor, can effectively prevent arm and scratch or hit wafer, to avoid result in scrap of the product, play the role of reducing wafer loss rate and save the cost.

Description

A kind of mechanical arm and semiconductor processing equipment of pre- anti-scratch crystal column surface
Technical field
The utility model relates to semiconductor processing equipment technical field more particularly to a kind of machines of pre- anti-scratch crystal column surface Tool arm and semiconductor processing equipment.
Background technique
In the manufacturing process of semiconductor chip, process equipment generallys use mechanical arm and carries out loading or unloading operation to wafer, But in the prior art, it is only provided with the wafer sensor for detecting wafer on mechanical arm, wafer cannot be protected Shield, thus mechanical arm pick and place during wafer may the following occurs, the first situation is that mechanical arm collision is brilliant When circle, i.e. mechanical arm pick and place wafer position changes in coordinates, mechanical arm may scratch wafer, and second situation is in machinery Arm collides when taking wafer, leads to wafer damage, and the scratch of wafer is not easy to be found, have greatly may cause it is subsequent The processing of wafer pair impacts, these are all that those skilled in the art do not expect to see.
Summary of the invention
For the above-mentioned problems in the prior art, one kind is now provided and is intended to control machinery by setting distance-sensor Arm is mobile, to prevent the mechanical arm and semiconductor processing equipment of the pre- anti-scratch crystal column surface for scratching or hitting wafer.
Specific technical solution is as follows:
A kind of mechanical arm of pre- anti-scratch crystal column surface, is applied to semiconductor processing equipment, and semiconductor processing equipment is set It is equipped with the mechanical arm to mobile wafer, wherein mechanical arm includes:
Fork-shaped ontology, fork-shaped ontology include a pair of yoke disposed in parallel;
A pair of of positioning pin is respectively arranged at the end of a pair of of yoke;
Distance-sensor group is provided on each positioning pin.
Preferably, the mechanical arm of pre- anti-scratch crystal column surface, wherein be provided with interconnecting piece between a pair of of yoke, connect Portion is provided with wafer inductor.
Preferably, the mechanical arm of pre- anti-scratch crystal column surface, wherein distance-sensor group includes to detect on yoke The top distance-sensor of side.
Preferably, the mechanical arm of pre- anti-scratch crystal column surface, wherein distance-sensor group includes to detect under yoke The lower section distance-sensor of side.
Preferably, the mechanical arm of pre- anti-scratch crystal column surface, wherein distance-sensor group includes prolonging to detect yoke Stretch the front distance-sensor in direction.
Preferably, the mechanical arm of pre- anti-scratch crystal column surface, wherein mechanical arm includes controller, to control machine Tool arm is mobile, and distance-sensor group connects controller by signal wire, mobile to provide control mechanical arm to controller Parameter.
Preferably, the mechanical arm of pre- anti-scratch crystal column surface, wherein fork-shaped ontology includes card slot, and signal wire is set to In card slot.
Preferably, the mechanical arm of pre- anti-scratch crystal column surface, wherein the size of distance-sensor group and the size of yoke It is adapted.
A kind of semiconductor processing equipment, wherein the mechanical arm including any of the above-described pre- anti-scratch crystal column surface.
Above-mentioned technical proposal has the following advantages that or the utility model has the advantages that provides mechanical arm movement by setting distance-sensor Parameter can effectively prevent arm and scratch or hit wafer, to avoid result in scrap of the product, playing reduces wafer loss rate and section The about effect of cost.
Detailed description of the invention
Fig. 1 is a kind of implementation of the mechanical arm and its semiconductor processing equipment of pre- anti-scratch crystal column surface of the utility model The overall structure diagram of example;
Fig. 2 is a kind of implementation of the mechanical arm and its semiconductor processing equipment of pre- anti-scratch crystal column surface of the utility model Partial enlarged view at the A of Fig. 1 of example;
Appended drawing reference: 1, wafer inductor, 2, yoke, 3, positioning pin, 4, distance-sensor group, 5, mechanical arm, 6, fork Shape ontology, 7, interconnecting piece.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are in the premise for not making creative work Under every other embodiment obtained, fall within the protection scope of the utility model.
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can To be combined with each other.
The utility model is described in further detail in the following with reference to the drawings and specific embodiments, but not as the utility model It limits.
As shown in Figs. 1-2, the present invention provides a kind of mechanical arm of pre- anti-scratch crystal column surface, is applied to semiconductor machining Equipment, semiconductor processing equipment are provided with the mechanical arm 5 to mobile wafer, in the point-to-point transmission of mechanical arm 5, pick and place brilliant Bowlder is provided with distance-sensor group 4 on mechanical arm 5, when mechanical arm 5 picks and places the position coordinates variation of wafer, passes through Distance-sensor group 4, which is arranged, to provide corresponding parameter to process equipment, and then keeps process equipment mobile in control mechanical arm 5 When effectively prevent arm to scratch or hit wafer, to avoid result in scrap of the product, reduce wafer loss rate, save the cost.
Mechanical arm 5 specifically includes that
Fork-shaped ontology 6, fork-shaped ontology 6 include a pair of yoke 2 disposed in parallel, and yoke 2 is used to grab wafer;
A pair of of positioning pin 3 is respectively arranged at the end of a pair of of yoke 2;Distance-sensor group is provided on each positioning pin 3 4.Distance-sensor group 4 is usually whole during mechanical arm 5 picks and places wafer to open, and setting distance-sensor group 4 can be with Sensing a certain range of barrier, distance-sensor group 4 provides control mechanical arm 5 mobile parameter to process equipment, Promote process equipment control mechanical arm 5 mobile according to above-mentioned parameter or stop moving, prevent mechanical arm 5 when picking and placing wafer with Barrier collides, to play the role of protecting wafer.
Interconnecting piece 7 is provided between a pair of of yoke 2, interconnecting piece 7 is provided with wafer inductor 1, and wafer inductor 1 is used to feel Wafer is answered, when wafer inductor 1 senses that wafer is placed on mechanical arm 5, mechanical arm 5 is started to work.
As preferred embodiment, distance-sensor group 4 includes answering to detect the top distance perception of 2 top of yoke Device, to detect the lower section distance-sensor of 2 lower section of yoke and to detect the front distance-sensor of 2 extending direction of yoke.
During mechanical arm 5 picks and places wafer, the direction of action that mechanical arm 5 picks and places wafer is respectively yoke 2 Upwards, downwards or forward, and top distance-sensor, lower section distance-sensor and the front distance that distance-sensor group 4 is equipped with The detection direction of inductor is respectively the extending direction of the top of yoke 2, the lower section of yoke 2 and yoke 2 (i.e. before yoke 2 Side), to pick and place the process of wafer before it can play the top to yoke 2, the lower section of yoke 2 and yoke 2 in mechanical arm 5 Fang Jinhang protection, avoids wafer from being scraped off or be knocked, and then reduces the scrappage of wafer.
In the present embodiment, when distance-sensor group 4 senses that there is barrier in the top, lower section or front of yoke 2, Xiang Jia Construction equipment provides control mechanical arm 5 mobile parameter, promote process equipment control mechanical arm 5 according to above-mentioned parameter it is mobile or Stop movement, to play the role of protecting wafer.
Preferably, range≤1.5mm of the detection range of distance-sensor group 4, i.e., when distance-sensor group 4 senses When the top of yoke 2, the positional distance wafer position of the barrier of lower section or front are less than or equal to when 1.5mm, just to processing Equipment provides the distance value, so that process equipment controls the stopping of mechanical arm 5 or commutation in time, to effectively avoid machinery Arm 5 collides wafer.
It in a preferred embodiment, further include a controller, controller is arranged on process equipment, to control machinery Arm 5 is mobile, and distance-sensor group 4 connects controller by signal wire, mobile to provide control mechanical arm 5 to controller Parameter.
In the present embodiment, fork-shaped ontology 6 includes card slot, and signal wire is set in card slot, distance-sensor group 4 and controller It is connected by line route signal, and provides control mechanical arm 5 mobile parameter, mechanical arm 5 is connect with controller, controller It is mobile according to above-mentioned parameter for controlling mechanical arm 5.
The size of distance-sensor group 4 is adapted with the size of yoke 2.Preferably, in the present embodiment, distance-sensor Height≤4mm of group 4, length≤10mm.The width of distance-sensor group 4 can be adjusted according to the width of yoke 2.
The operating procedure of the utility model is as follows:
Step S1: a pair of of positioning pin 3 with distance-sensor group 4 is mounted on to the end of a pair of of yoke 2 of mechanical arm 5 Portion, the connection of 4 signal of distance-sensor group is for controlling the mobile controller of mechanical arm 5;
Step S2: when distance-sensor group 4 senses barrier, i.e., range information is issued to controller, promotes to control Device controls mechanical arm 5 according to above-mentioned range information movement or stops moving, to play the role of protecting wafer.
It further include a kind of semiconductor processing equipment in the technical solution of the utility model, which includes The mechanical arm of any of the above-described pre- anti-scratch crystal column surface.
To sum up, the mechanical arm of a kind of pre- anti-scratch crystal column surface provided by the invention, by the way that distance-sensor group is arranged 4, reach during mechanical arm 5 picks and places wafer, when sensing the barrier on 5 direction of transfer of mechanical arm, distance perception It answers device group 4 to provide control mechanical arm 5 mobile parameter to controller, promotes controller control mechanical arm 5 according to above-mentioned ginseng Number is mobile or stops movement, plays and effectively prevent arm to scratch or hit wafer, to avoid result in scrap of the product, reduces wafer Scrappage, the effect of save the cost.
The above is only the utility model preferred embodiments, are not intended to limit the embodiments of the present invention and protection Range should can appreciate that all with the utility model specification and diagramatic content institute to those skilled in the art The equivalent replacement made and obviously change obtained scheme, the protection scope of the utility model should all be included in It is interior.

Claims (9)

1. a kind of mechanical arm of pre- anti-scratch crystal column surface is applied to semiconductor processing equipment, the semiconductor processing equipment It is provided with the mechanical arm to mobile wafer, which is characterized in that the mechanical arm includes:
Fork-shaped ontology, the fork-shaped ontology include a pair of yoke disposed in parallel;
A pair of of positioning pin is respectively arranged at the end of a pair of yoke;
Distance-sensor group is provided on each positioning pin.
2. the mechanical arm of pre- anti-scratch crystal column surface as described in claim 1, which is characterized in that between a pair of yoke It is provided with interconnecting piece, the interconnecting piece is provided with wafer inductor.
3. the mechanical arm of pre- anti-scratch crystal column surface as described in claim 1, which is characterized in that the distance-sensor group Including to detect the top distance-sensor above the yoke.
4. the mechanical arm of pre- anti-scratch crystal column surface as described in claim 1, which is characterized in that the distance-sensor group Including to detect the lower section distance-sensor below the yoke.
5. the mechanical arm of pre- anti-scratch crystal column surface as described in claim 1, which is characterized in that the distance-sensor group Including the front distance-sensor to detect the yoke extending direction.
6. the mechanical arm of pre- anti-scratch crystal column surface as claimed in claim 5, which is characterized in that the mechanical arm includes One controller, mobile to control the mechanical arm, the distance-sensor group connects the controller by signal wire, uses The mobile parameter of the mechanical arm is controlled to provide to the controller.
7. the mechanical arm of pre- anti-scratch crystal column surface as claimed in claim 6, which is characterized in that the fork-shaped ontology includes Card slot, the signal wire are set in the card slot.
8. the mechanical arm of pre- anti-scratch crystal column surface as described in claim 1, which is characterized in that the distance-sensor group Size be adapted with the size of the yoke.
9. a kind of semiconductor processing equipment, which is characterized in that including pre- anti-scratch wafer such as described in any one of claims 1-8 The mechanical arm on surface.
CN201821266817.3U 2018-08-07 2018-08-07 A kind of mechanical arm and semiconductor processing equipment of pre- anti-scratch crystal column surface Active CN208589426U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821266817.3U CN208589426U (en) 2018-08-07 2018-08-07 A kind of mechanical arm and semiconductor processing equipment of pre- anti-scratch crystal column surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821266817.3U CN208589426U (en) 2018-08-07 2018-08-07 A kind of mechanical arm and semiconductor processing equipment of pre- anti-scratch crystal column surface

Publications (1)

Publication Number Publication Date
CN208589426U true CN208589426U (en) 2019-03-08

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112542412A (en) * 2020-12-07 2021-03-23 长江存储科技有限责任公司 Mechanical arm and wafer grabbing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112542412A (en) * 2020-12-07 2021-03-23 长江存储科技有限责任公司 Mechanical arm and wafer grabbing device

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GR01 Patent grant
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CP03 Change of name, title or address

Address after: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province

Patentee after: Wuhan Xinxin Integrated Circuit Co.,Ltd.

Country or region after: China

Address before: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province

Patentee before: Wuhan Xinxin Semiconductor Manufacturing Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address