CN208434106U - A kind of vibration component and vibrating sensor for vibrating sensor - Google Patents
A kind of vibration component and vibrating sensor for vibrating sensor Download PDFInfo
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- CN208434106U CN208434106U CN201821236487.3U CN201821236487U CN208434106U CN 208434106 U CN208434106 U CN 208434106U CN 201821236487 U CN201821236487 U CN 201821236487U CN 208434106 U CN208434106 U CN 208434106U
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- vibrating diaphragm
- vibration component
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- Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
Abstract
本实用新型涉及一种用于振动传感器的振动组件,包括中空的承载部、将承载部中空位置覆盖住的振膜,以及贴合在振膜上的质量块;所述振膜包括位于边缘且连接在承载部上的固定部,位于中部区域且与质量块贴合在一起的振动部,以及位于固定部与振动部之间用于调节振膜振动幅度以及振动阻尼的连接部。本实用新型的振动组件,可以显著提高振动组件的灵敏度,并可通过连接部提高振膜的振幅,改善振膜的阻尼特性,以调节振膜的振动频率。另外制造时,质量块可直接粘附在振膜上,较大程度地简化了产品结构,降低了加工难度,提高产品的一致性;另外还优化了产品对环境的适应能力,提升了产品可靠性。
The utility model relates to a vibration assembly for a vibration sensor, which comprises a hollow bearing part, a vibrating membrane covering the hollow position of the bearing part, and a mass block attached to the vibration membrane; A fixed part connected to the bearing part, a vibration part located in the middle area and attached to the mass block, and a connecting part located between the fixed part and the vibration part for adjusting the vibration amplitude and vibration damping of the diaphragm. The vibrating assembly of the utility model can significantly improve the sensitivity of the vibrating assembly, and can increase the amplitude of the vibrating membrane through the connecting portion, improve the damping characteristic of the vibrating membrane, and adjust the vibration frequency of the vibrating membrane. In addition, when manufacturing, the mass block can be directly attached to the diaphragm, which greatly simplifies the product structure, reduces the processing difficulty, and improves the consistency of the product; in addition, the adaptability of the product to the environment is optimized, and the reliability of the product is improved. sex.
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CN201821236487.3U CN208434106U (en) | 2018-08-01 | 2018-08-01 | A kind of vibration component and vibrating sensor for vibrating sensor |
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CN201821236487.3U CN208434106U (en) | 2018-08-01 | 2018-08-01 | A kind of vibration component and vibrating sensor for vibrating sensor |
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Cited By (22)
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CN110149574A (en) * | 2019-05-18 | 2019-08-20 | 安徽奥飞声学科技有限公司 | A kind of MEMS structure |
CN110300364A (en) * | 2019-07-18 | 2019-10-01 | 东莞市瑞勤电子有限公司 | Bone conduction silicon microphone |
CN110536220A (en) * | 2019-08-22 | 2019-12-03 | 歌尔股份有限公司 | The method and vibration sensing device of vibration sensing device sense vibrations |
CN110602615A (en) * | 2019-08-22 | 2019-12-20 | 歌尔股份有限公司 | Vibration assembly for vibration sensing device and vibration sensing device |
CN110631685A (en) * | 2019-09-05 | 2019-12-31 | 无锡韦尔半导体有限公司 | Vibration detection device and manufacturing method thereof |
CN110907029A (en) * | 2019-11-18 | 2020-03-24 | 歌尔股份有限公司 | Calibration method of vibration sensing device |
CN111031424A (en) * | 2019-12-06 | 2020-04-17 | 歌尔股份有限公司 | Vibration sensing device, earphone and electronic equipment |
WO2020258171A1 (en) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Vibration sensor and audio device |
CN112161698A (en) * | 2020-03-25 | 2021-01-01 | 美律电子(深圳)有限公司 | Vibration sensor |
WO2021000163A1 (en) * | 2019-06-30 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | Bone-conduction mems microphone and mobile terminal |
WO2021031498A1 (en) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | Vibration sensing apparatus |
CN112995864A (en) * | 2019-12-02 | 2021-06-18 | 易音特电子株式会社 | Acoustic vibration sensor using piezoelectric element having cantilever structure |
WO2021134201A1 (en) * | 2019-12-30 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Optical bone conduction microphone |
WO2021134170A1 (en) * | 2019-12-30 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Bone conduction microphone |
CN114697824A (en) * | 2020-12-28 | 2022-07-01 | 深圳市韶音科技有限公司 | Vibration sensor |
WO2022142291A1 (en) * | 2020-12-28 | 2022-07-07 | 深圳市韶音科技有限公司 | Vibration sensor |
WO2022140921A1 (en) * | 2020-12-28 | 2022-07-07 | 深圳市韶音科技有限公司 | Vibration sensor |
CN115244951A (en) * | 2021-01-11 | 2022-10-25 | 深圳市韶音科技有限公司 | Impedance device and system for simulating influence of head on vibration of vibration unit |
US11662248B2 (en) | 2021-08-11 | 2023-05-30 | Shenzhen Shokz Co., Ltd. | Vibration sensors |
TWI846123B (en) * | 2021-11-26 | 2024-06-21 | 大陸商深圳市韶音科技有限公司 | Vibration assembly and loudspeaker |
TWI847339B (en) * | 2021-11-26 | 2024-07-01 | 大陸商深圳市韶音科技有限公司 | Vibration assemblies and sound transmission devices |
JP7649573B2 (en) | 2021-01-14 | 2025-03-21 | シェンツェン・ショックス・カンパニー・リミテッド | speaker |
-
2018
- 2018-08-01 CN CN201821236487.3U patent/CN208434106U/en active Active
Cited By (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110149574A (en) * | 2019-05-18 | 2019-08-20 | 安徽奥飞声学科技有限公司 | A kind of MEMS structure |
WO2020258171A1 (en) * | 2019-06-27 | 2020-12-30 | 瑞声声学科技(深圳)有限公司 | Vibration sensor and audio device |
WO2021000163A1 (en) * | 2019-06-30 | 2021-01-07 | 瑞声声学科技(深圳)有限公司 | Bone-conduction mems microphone and mobile terminal |
CN110300364A (en) * | 2019-07-18 | 2019-10-01 | 东莞市瑞勤电子有限公司 | Bone conduction silicon microphone |
CN110300364B (en) * | 2019-07-18 | 2024-05-28 | 东莞市瑞勤电子有限公司 | Bone conduction silicon microphone |
CN110536220A (en) * | 2019-08-22 | 2019-12-03 | 歌尔股份有限公司 | The method and vibration sensing device of vibration sensing device sense vibrations |
CN110602615A (en) * | 2019-08-22 | 2019-12-20 | 歌尔股份有限公司 | Vibration assembly for vibration sensing device and vibration sensing device |
WO2021031498A1 (en) * | 2019-08-22 | 2021-02-25 | 歌尔微电子有限公司 | Vibration sensing apparatus |
WO2021031299A1 (en) * | 2019-08-22 | 2021-02-25 | 潍坊歌尔微电子有限公司 | Method for sensing vibration by vibration sensing device and vibration sensing device |
CN110631685A (en) * | 2019-09-05 | 2019-12-31 | 无锡韦尔半导体有限公司 | Vibration detection device and manufacturing method thereof |
CN110907029A (en) * | 2019-11-18 | 2020-03-24 | 歌尔股份有限公司 | Calibration method of vibration sensing device |
CN110907029B (en) * | 2019-11-18 | 2022-04-15 | 潍坊歌尔微电子有限公司 | Calibration method of vibration sensing device |
CN112995864A (en) * | 2019-12-02 | 2021-06-18 | 易音特电子株式会社 | Acoustic vibration sensor using piezoelectric element having cantilever structure |
US11696508B2 (en) | 2019-12-02 | 2023-07-04 | Em-Tech Co., Ltd. | Sound vibration sensor using piezoelectric element having cantilever structure |
CN112995864B (en) * | 2019-12-02 | 2022-08-02 | 易音特电子株式会社 | Acoustic vibration sensor using piezoelectric element having cantilever structure |
CN111031424A (en) * | 2019-12-06 | 2020-04-17 | 歌尔股份有限公司 | Vibration sensing device, earphone and electronic equipment |
CN111031424B (en) * | 2019-12-06 | 2021-11-16 | 潍坊歌尔微电子有限公司 | Vibration sensing device, earphone and electronic equipment |
WO2021134170A1 (en) * | 2019-12-30 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Bone conduction microphone |
WO2021134201A1 (en) * | 2019-12-30 | 2021-07-08 | 瑞声声学科技(深圳)有限公司 | Optical bone conduction microphone |
CN112161698A (en) * | 2020-03-25 | 2021-01-01 | 美律电子(深圳)有限公司 | Vibration sensor |
WO2022140921A1 (en) * | 2020-12-28 | 2022-07-07 | 深圳市韶音科技有限公司 | Vibration sensor |
CN114697824A (en) * | 2020-12-28 | 2022-07-01 | 深圳市韶音科技有限公司 | Vibration sensor |
WO2022142291A1 (en) * | 2020-12-28 | 2022-07-07 | 深圳市韶音科技有限公司 | Vibration sensor |
JP7600382B2 (en) | 2020-12-28 | 2024-12-16 | シェンツェン・ショックス・カンパニー・リミテッド | Vibration Sensors |
CN114697824B (en) * | 2020-12-28 | 2023-08-25 | 深圳市韶音科技有限公司 | Vibration sensor |
CN115244951A (en) * | 2021-01-11 | 2022-10-25 | 深圳市韶音科技有限公司 | Impedance device and system for simulating influence of head on vibration of vibration unit |
JP7649573B2 (en) | 2021-01-14 | 2025-03-21 | シェンツェン・ショックス・カンパニー・リミテッド | speaker |
US12072228B2 (en) | 2021-08-11 | 2024-08-27 | Shenzhen Shokz Co., Ltd. | Vibration sensors |
US11662248B2 (en) | 2021-08-11 | 2023-05-30 | Shenzhen Shokz Co., Ltd. | Vibration sensors |
TWI846123B (en) * | 2021-11-26 | 2024-06-21 | 大陸商深圳市韶音科技有限公司 | Vibration assembly and loudspeaker |
TWI847339B (en) * | 2021-11-26 | 2024-07-01 | 大陸商深圳市韶音科技有限公司 | Vibration assemblies and sound transmission devices |
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Effective date of registration: 20200617 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |
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Address after: F / F, phase II, Qingdao International Innovation Park, 1 Keyuan Weiyi Road, Laoshan District, Qingdao City, Shandong Province, 266104 Patentee after: Geer Microelectronics Co.,Ltd. Country or region after: China Address before: Room 103, 396 Songling Road, Laoshan District, Qingdao City, Shandong Province 266104 Patentee before: Goer Microelectronics Co.,Ltd. Country or region before: China |