CN208338183U - heat sink - Google Patents

Abstract

The utility model discloses a heat abstractor contains casing and fan. The casing contains backplate and side wall, and the side wall encircles and connects the backplate in order to form the space with the backplate, and the backplate has air inlet and a plurality of water conservancy diversion structures, and the side wall is formed with the gas vent, and a plurality of water conservancy diversion structures extend to the gas vent by the air inlet to a plurality of water conservancy diversion structures are a plurality of runners with space separation. The fan is rotatably arranged in the space and is configured to suck airflow into the space through the air inlet. Therefore, the utility model discloses a heat abstractor can increase effective convection area, promotes the radiating effect.

Description

heat sink

technical field

The utility model relates to a heat dissipation device, in particular to a heat dissipation device applied to a mobile device.

Background technique

Smartphones are now quite popular and an indispensable part of people's lives. Smartphones are becoming thinner and thinner in order to be portable. However, such a design makes the electronic components in the mobile phone closely spaced, causing difficulties in heat dissipation, especially when using applications with a large amount of computing such as games, which will generate a lot of heat, which will greatly increase the temperature of the mobile phone, in addition to the poor user experience. In addition, it may also cause shortened battery life or other problems.

Therefore, how to propose a heat dissipation device that can solve the above problems is one of the directions urgently needed.

Utility model content

In view of this, the purpose of the present invention is to provide a heat dissipation device, which can effectively assist the mobile device to dissipate heat and cool down.

According to an embodiment of the present invention, a heat dissipation device includes a casing and a fan. The shell includes a back panel and side walls. The side walls surround the connection back panel to form a space with the back panel. The back panel has an air inlet and a plurality of guide structures. The side walls are formed with exhaust ports. The air port extends to the exhaust port, and a plurality of guide structures divide the space into a plurality of flow passages; the fan is rotatably arranged in the space, and is configured to suck the air flow into the space from the air inlet port.

In a preferred embodiment, the orthographic projection of the fan onto the back panel overlaps the air intake.

In a preferred embodiment, the vent is located at the edge of the back plate.

In a preferred embodiment, each flow guide structure includes a first extension portion and a second extension portion that are connected, the first extension portion extends parallel to the edge from the air inlet, and the second extension portion faces from the first extension portion. Edge extension.

In a preferred embodiment, the heat dissipating device further comprises a connection seat connected to the housing, the connection seat includes a first support portion facing the air inlet, and the fan is rotatably connected to the first support portion.

In a preferred embodiment, the connection base further includes a circuit board, and the circuit board is arranged in the connection base and is electrically connected to the fan.

In a preferred embodiment, the connection base further includes a second support portion and an electrical connector, the second support portion is connected to the first support portion, and the electrical connector is disposed on the second support portion and electrically connected to the circuit board.

In a preferred embodiment, the back plate has a first edge, and the second support portion is located at the first edge.

In a preferred embodiment, the second support portion includes a plurality of output holes, located on the bottom surface of the second support portion away from the first support portion, and electrically connected to the electrical connector.

In a preferred embodiment, the heat dissipating device further includes a buckle structure, which is disposed on the casing.

In a preferred embodiment, the back plate has a second edge opposite to the first edge, and the snap structure is located on the second edge.

In a preferred embodiment, the first support portion is extended from the second support portion along a direction, and the second support portion and the buckle structure are opposite to each other in the above-mentioned direction.

To sum up, the heat dissipation device disclosed in the present invention can be installed on an electronic device. The heat dissipation device includes a fan and a casing, and the fan is configured to draw ambient air into the casing to form an airflow flowing over the rear surface of the electronic device. A guide structure is arranged in the casing to guide the flow direction of the air flow, which can increase the effective convection heat dissipation area and improve the heat dissipation effect.

The above descriptions will be described in detail below with embodiments, and further explanations will be provided to the technical solutions of the present invention.

Description of drawings

In order to make the above-mentioned and other objects, features, advantages and embodiments of the present utility model more obvious and easy to understand, the descriptions of the accompanying drawings are as follows:

1A is an exploded view of a heat sink and an electronic device according to an embodiment of the present invention.

FIG. 1B is a combined view of the heat dissipation device and the electronic device shown in FIG. 1A .

2 is a front view of a housing of a heat sink according to an embodiment of the present invention.

3 is a side view of a connection base of a heat sink and an electronic device according to an embodiment of the present invention.

Detailed ways

Please refer to FIG. 1A and FIG. 1B . FIG. 1A is an exploded view of a heat dissipation device 100 and an electronic device 500 according to an embodiment of the present invention. FIG. 1B is a combined view of the heat dissipation device 100 and the electronic device 500 shown in FIG. 1A . As shown in FIG. 1A and FIG. 1B , the heat dissipation device 100 includes a casing 110 and a fan 120 . The casing 110 includes a back plate 111 and side walls 112 . The side wall 112 surrounds and connects the back panel 111 to form a space 113 with the back panel 111 . The fan 120 is rotatably disposed in the space 113 .

Please also refer to FIG. 2 , which is a front view of the housing 110 of the heat sink 100 according to an embodiment of the present invention. As shown in FIG. 1A and FIG. 2 , the back plate 111 has an air inlet 111 a and a plurality of flow guide structures 111 b. Sidewalls 112 also form exhaust ports 114 . The flow guiding structure 111 b extends from the air inlet 111 a to the air outlet 114 , and divides the space 113 into a plurality of flow channels 115 . The fan 120 is configured to draw the airflow f into the space 113 through the air inlet 111a.

In one embodiment, the side wall 112 of the heat dissipation device 100 is against the rear surface 510 of the electronic device 500 (see FIG. 3 ), so that the space 113 of the heat dissipation device 100 is connected to the rear surface 510 . After the fan 120 sucks the air flow f into the space 113 through the air inlet 111a, the air flow f will pass through the rear surface 510 of the electronic device 500 along the flow channel 115, and be discharged from the air outlet 114, so as to assist the air with a higher temperature by convection. The electronic device 500 dissipates and cools down.

The air guide structure 111b guides the air flow f to increase the area of the air flow f passing through the rear surface 510, thereby improving the heat dissipation effect. In addition, the flow guide structure 111 b guides the heated airflow f to leave the space 113 through the exhaust port 114 .

In one embodiment, the orthographic projection 120a (indicated by the dotted line in FIG. 1A ) projected by the fan 120 onto the back plate 111 overlaps the air inlet 111a , making it easy to suck the airflow f into the space 113 .

In one embodiment, the back plate 111 has a first edge 111c, and the exhaust port 114 is located at the first edge 111c. For example, the first edge 111c may be the lower long side of the backplane 111 . When the user operates the electronic device 500 laterally and holds the two short sides of the casing 110 with both hands, the user's hands can be prevented from being directly blown by the hot air exiting from the exhaust port 114 at the lower first edge 111c.

In one embodiment, the flow guiding structure 111b includes a first extending portion 111b1 and a second extending portion 111b2 that are connected to each other. The first extension 111b1 extends from the air inlet 111a in parallel to the first edge 111c, and the second extension 111b2 extends from the first extension 111b1 toward the first edge 111c. In other embodiments, the first extension portion 111b1 extends from the air inlet 111a obliquely to the first edge 111c.

In one embodiment, the heat dissipation device 100 further includes a connection seat 130 . Please refer to FIG. 3 , which is a side view of the connection base 130 of the heat dissipation device 100 and the electronic device 500 according to an embodiment of the present invention. As shown in FIG. 3 , and referring to FIG. 1A , the connection base 130 includes a first support portion 131 , which faces the air inlet 111 a on the backplane 111 , and the fan 120 is rotatably connected to the first support portion 131 .

In one embodiment, as shown in FIG. 3 , the connection base 130 further includes a circuit board 135 (represented by a dotted line in FIG. 3 ), which is disposed in the connection base 130 and is electrically connected to the fan 120 . The circuit board 135 is used to control the switch of the fan 120 , or to further control the rotation speed of the fan 120 .

In one embodiment, as shown in FIG. 3 , the connection base 130 further includes a second support portion 132 and an electrical connector 133 . The second support portion 132 is connected to the first support portion 131 , and the electrical connector 133 is disposed on the second support portion 132 . The electrical connector 133 is electrically connected to the circuit board 135 and is pluggably connected to the electronic device 500 for receiving information sent by the electronic device 500 . The above information includes, but is not limited to, the temperature information of the electronic device 500 , and the circuit board 135 has to adjust the rotational speed of the fan 120 according to the information. For example, when the temperature of the electronic device 500 is higher than the preset value, the circuit board 135 can increase the rotation speed of the fan 120 to increase the cooling efficiency, and when the temperature of the electronic device 500 is lower than the preset value, the rotation speed of the fan 120 can be reduced or the fan 120 can be turned off to Reduce power consumption.

In one embodiment, the second support portion 132 is connected to the back plate 111 of the housing 110 and is partially located in the space 113 . In addition, as shown in FIG. 3 , when the electronic device 500 is connected to the electrical connector 133 , the first support portion 131 and part of the second support portion 132 contact the rear surface 510 of the electronic device 500 . Thus, the heat dissipation device 100 can be stably supported on the rear surface 510 .

In one embodiment, the electronic device 500 can supply power to the fan 120 via the electrical connector 133 .

In one embodiment, the second support portion 132 includes a plurality of output holes 132a (represented by dotted lines in FIG. 3 ), located on the bottom surface 132b of the second support portion 132 away from the first support portion 131 and electrically connected to electrical connectors 133. The output hole 132a may be an input/output port such as a headphone jack or a USB port. When the electronic device 500 is placed horizontally, the output hole 132a is disposed on the bottom surface 132b of the first support portion 131 to facilitate the user's operation, so that the user does not need to connect to the electronic device 500 when holding the electronic device 500. influences.

Please refer back to FIG. 1A and FIG. 2 . In one embodiment, the heat dissipation device 100 further includes a buckle structure 140 disposed on the casing 110 and configured to fix the heat dissipation device 100 to the electronic device 500 . In one embodiment, the back plate 111 has a second edge 111d opposite to the first edge 111c, and the buckle structure 140 is located on the second edge 111d. 3, the second support portion 132 is located at the first edge 111c, and the electrical connector 133 extends toward the second edge 111d. In addition, the first support portion 131 extends from the second support portion 132 in a direction away from the first edge 111 c (ie, a direction toward the second edge 111 d ), and the second support portion 132 and the buckle structure 140 are in this direction opposite each other. Therefore, when the electronic device 500 is connected to the electrical connector 133 , the electronic device 500 can be firmly clamped between the second support portion 132 and the buckle structure 140 .

In one embodiment, as shown in FIG. 1A , the buckle structure 140 includes a first buckle portion 141 and a second buckle portion 142 that are connected to each other. The first snap portion 141 is connected to the side wall 112 and extends away from the side wall 112 , and the second snap portion 142 extends away from the back plate 111 from the first snap portion 141 and is configured to snap on the side 520 of the electronic device 500 , so as to prevent the electronic device 500 from being separated from the heat dissipation device 100 .

To sum up, the present invention discloses a heat dissipation device, which can be arranged on the rear surface of an electronic device. The heat dissipation device includes a fan and a casing, and the fan is configured to draw ambient air into the casing to form an airflow flowing over the rear surface of the electronic device. A guide structure is arranged in the casing to plan the flow direction of the air flow, increase the effective convective heat dissipation area, improve the heat dissipation effect, and guide the air flow to leave the heat dissipation device through the exhaust port.

Although the present utility model has been disclosed above with examples, it is not intended to limit the present utility model. Any person skilled in the art can make some changes and modifications without departing from the spirit and scope of the present utility model. Therefore, this The scope of protection of the utility model shall be determined by the claims.

Claims (12)

1. A heat sink, characterized in that, comprising: The casing includes a back panel and side walls, the side walls are connected to the back panel to form a space with the back panel, the back panel has an air inlet and a plurality of guide structures, and the side walls form a space with the back panel. an exhaust port, the plurality of flow guide structures extend from the air inlet to the exhaust port, and the plurality of flow guide structures divide the space into a plurality of flow passages; and The fan is rotatably installed in the space and configured to draw airflow into the space from the air inlet. 2 . The heat dissipation device according to claim 1 , wherein an orthographic projection of the fan onto the back plate overlaps with the air inlet. 3 . 3 . The heat dissipation device according to claim 1 , wherein the exhaust port is located at the edge of the back plate. 4 . 4 . The heat dissipation device according to claim 3 , wherein each of the flow guiding structures comprises a first extension part and a second extension part which are connected to each other, and the first extension part is parallel to the air inlet by the air inlet. 5 . The edge extends and the second extension extends from the first extension toward the edge. 5 . The heat dissipation device according to claim 1 , wherein the heat dissipation device further comprises a connection seat connected to the casing, the connection seat includes a first support portion facing the air inlet, and The fan is rotatably connected to the first support portion. 6 . The heat dissipation device of claim 5 , wherein the connection base further comprises a circuit board, the circuit board is disposed in the connection base and is electrically connected to the fan. 7 . 7 . The heat dissipation device of claim 6 , wherein the connection base further comprises a second support portion and an electrical connector, the second support portion is connected to the first support portion, and the electrical connector It is arranged on the second support portion and is electrically connected to the circuit board. 8 . The heat dissipation device of claim 7 , wherein the back plate has a first edge, and the second support portion is located at the first edge. 9 . 9 . The heat dissipation device of claim 7 , wherein the second support portion comprises a plurality of output holes, located on a bottom surface of the second support portion away from the first support portion, and electrically connected to the plurality of output holes. 10 . the electrical connector. 10 . The heat dissipation device according to claim 8 , wherein the heat dissipation device further comprises a buckle structure disposed on the casing. 11 . 11 . The heat dissipation device of claim 10 , wherein the back plate has a second edge opposite to the first edge, and the snap structure is located at the second edge. 12 . 12 . The heat sink according to claim 11 , wherein the first support portion extends from the second support portion in one direction, and the second support portion and the buckle structure are located at the same location. 13 . opposite each other in the above-mentioned directions.