CN208333743U - A kind of ceramic pressure sensor encapsulating structure - Google Patents
A kind of ceramic pressure sensor encapsulating structure Download PDFInfo
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- CN208333743U CN208333743U CN201821119901.2U CN201821119901U CN208333743U CN 208333743 U CN208333743 U CN 208333743U CN 201821119901 U CN201821119901 U CN 201821119901U CN 208333743 U CN208333743 U CN 208333743U
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- pressure sensor
- ceramic pressure
- circuit board
- encapsulating structure
- core
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Abstract
The utility model discloses a kind of ceramic pressure sensor encapsulating structures, including shell, ceramic pressure sensor comprising ceramic pressure sensor core and circuit board, for placing the circuit board support of the circuit board, copper ring compact heap and retaining ring, the intracavity bottom of the shell is equipped with the placing groove for placing the ceramic pressure sensor core, a seal groove is extended upward on the inside of the placing groove, sealing ring is equipped in the seal groove, circuit board support described in physical connection above the ceramic pressure sensor core, the copper ring compact heap is equipped with above the circuit board support, the retaining ring is arranged in the top of the copper ring compact heap, the ceramic sensor element core is uniformly pressed in the shell by the retaining ring.The ceramic pressure sensor casing packing structure of the utility model effectively reduces null offset phenomenon existing for existing ceramic pressure sensor.
Description
Technical field
The utility model relates to sensor packaging techniques field more particularly to a kind of ceramic pressure sensor encapsulating structures.
Background technique
Ceramic pressure sensor has been existed since introducing in 2000 is domestic based on ceramic excellent characteristic and cheap price
Mesolow industrial circle is used widely.But pressure sensor produced is in terminal client use process, it is regular go out
Existing null offset phenomenon.Null offset: referring to when the input of sensor and constant environment temperature, what output quantity changed over time
Phenomenon is exactly to drift about.It is due to sensor internal links performance is unstable or internal temperature change caused by, be reflection
The index of sensor stability.
For null offset phenomenon, inner sensor producer of state mainly starts with from sealing structure, and common solution is anti-
Charge and discharge high temperature ageing 8 hours or more are answered to eliminate stress, so that the elastic deformation of sealing rubber ring solidifies, to make sensor
Performance tend towards stability.Which can effectively reduce electronic device resistance and mismatch caused null offset, and temporarily
Solidify the elastic deformation of seal rubber, but with the extension of use time and the variation of use environment, seal rubber elasticity is still
It can so change, to influence the precision of sensor to pressure core one corresponding reaction force release again, still will appear
Null offset phenomenon.
Utility model content
The technical problem to be solved by the present invention is to for the generally existing zero point of pressure sensor in the prior art
Drift phenomenon provides a kind of ceramic pressure sensor encapsulating structure that can effectively reduce null offset.
The technical scheme adopted by the utility model to solve the technical problem is as follows: a kind of ceramic pressure sensor encapsulation knot
Structure, including shell, the ceramic pressure sensor comprising ceramic pressure sensor core and circuit board, for placing the circuit board
Circuit board support, copper ring compact heap and retaining ring, the intracavity bottom of the shell is equipped with for placing the ceramic pressure sensing
The placing groove of device core extends upward a seal groove on the inside of the placing groove, and sealing ring is equipped in the seal groove, described
Circuit board support described in physical connection above ceramic pressure sensor core, the circuit board support top are equipped with the copper ring pressure
The retaining ring is arranged in the top of tight block, the copper ring compact heap, is uniformly pressed the ceramic sensor element core by the retaining ring
Tightly in the shell.
Further, the outer wall of the ceramic pressure sensor core is equipped with equally distributed groove, the circuit board
There is the stabilizer blade being adapted to the groove on bracket, ceramic pressure sensor core and circuit board support is made to be fixedly connected on one
It rises.
Further, the shell includes lower case and upper housing, and the lower case and upper housing are detachably secured to one
It rises.
Specifically, the inner wall of the lower case is equipped with the card slot for placing the retaining ring.
Further, the placing groove and seal groove are arranged in the lower case, and the bottom of the lower case has
The through-hole that external testing medium is connected to the ceramic pressure sensor core.
Further, the upper housing is hollow structure, and the hollow structure is embedded to be cased with conical seal ring, the ceramics
The conducting wire of pressure sensor is pierced by through the conical seal ring.
Further, the conducting wire is ventilation cable.
Further, the top of the conical seal ring is equipped with a compression sealing block and presses the conical seal ring
Tightly.
It further, further include the casing for being located at the conducting wire above the upper housing and compressing on the outside of sealing block.
It further, further include the heat-shrink tube being externally provided in described sleeve pipe.
The beneficial effects of the utility model are: by extending upward a sealing on the inside of sensor core placing groove
Slot, seal groove is interior to be arranged sealing ring between ceramic pressure sensor core, is attached to the elastic reactance of sealing ring laterally
Sensor core groove wall section, and additonal pressure is not generated to the strain of sensor core is unilateral, exist relative to sealing ring setting
The end face of ceramic pressure sensor core, assembling stress greatly reduces, thus caused by reducing the Flexible change because of sealing ring
Null offset；By the way that copper ring compact heap is arranged in the top of ceramic pressure sensor core and applies to the copper ring compact heap
The retaining ring of pressure, relative to the pressing process using internal screw thread, makes the entire uniform plane stress of ceramic pressure drag core as compressing,
It avoids and additional stress is generated to sensor surface elastomer, and copper ring compact heap is not compared to rubber pad or nylon compact heap
Flexible deformation can be generated, thus the null offset phenomenon for reducing sensor of amplitude peak.
Detailed description of the invention
It, below will be to required in embodiment description in order to illustrate more clearly of the technical solution of the utility model embodiment
The attached drawing used is briefly described, it is therefore apparent that and the drawings in the following description are merely some embodiments of the present invention,
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings
Other attached drawings, in attached drawing:
Fig. 1 is the ceramic pressure sensor overall structure diagram of the utility model preferred embodiment；
Fig. 2 is the ceramic pressure sensor configuration schematic diagram of the utility model preferred embodiment；
Fig. 3 is the ceramic pressure sensor the schematic diagram of the section structure of the utility model preferred embodiment；
Fig. 4 is the lower case overall structure diagram of the utility model preferred embodiment；
Fig. 5 is the structural schematic diagram at another visual angle of lower case in Fig. 4；
Fig. 6 is the ceramic sensor element core schematic diagram of the utility model preferred embodiment；
Fig. 7 is the support structure for circuitboard schematic diagram of the utility model preferred embodiment；
Fig. 8 is the upper housing structural schematic diagram of the utility model preferred embodiment.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, what be will be described below is various
Embodiment will refer to corresponding attached drawing, these attached drawings constitute a part of embodiment, and which describe realize that this is practical new
The various embodiments that type may use.It should be appreciated that other embodiments also can be used, or embodiment enumerated herein is carried out
Modification structurally and functionally, without departing from the scope of the utility model and essence.
Shown in referring to Figure 1 to Figure 7, a kind of ceramic pressure sensor encapsulating structure of the utility model preferred embodiment, packet
Include shell 10, the ceramic pressure sensor comprising ceramic pressure sensor core 20 and circuit board (not shown go out), for placing
Circuit board support 30, copper ring compact heap 40 and the retaining ring 50 of circuit board, the bottom of shell 10 have one to lead to ceramic pressure sensing
The through-hole 10a of device core 20, to be connected to testing medium；The intracavity bottom of shell 10, which is equipped with, is used for placing ceramic pressure sensor core
The placing groove 11 of body, the inside of placing groove 11 extend upward a seal groove 12, the sensor core placing groove in terms of shape
11 and seal groove 12 be combined into the step-like of a protrusion, O-shaped sealing ring 13 and ceramic pressure sensor are equipped in seal groove 12
The groove inner wall of core 20 is sealed, and the elastic reactance of sealing ring 13 is laterally attached to ceramic pressure sensor core 20
Inner wall, and do not generate additonal pressure to the strain of ceramic pressure sensor core is unilateral；It is arranged relative to sealing ring in ceramics
The end face of pressure sensor core, assembling stress greatly reduces, and the variation of extension and use environment at any time, sealing ring
13 elasticity occur variations the foil gauge of core will not be had an impact, so as to avoid changing because of caoutchouc elasticity caused by zero
Point drift phenomenon.
The top of the ceramic pressure sensor core 20 connects circuit board support 30, sets above the circuit board support 30
There is copper ring compact heap 40, retaining ring 50 is arranged in the top of copper ring compact heap 40, and retaining ring 50 is the stainless steel retaining ring of elasticity, in shell 10
Inner wall be equipped with the card slot 14 for placing the retaining ring 50.Ceramic pressure sensor core 20 is uniformly compressed by retaining ring 50 in this way
In shell 10, relative to the pressing process using internal screw thread, make the entire uniform plane stress of ceramic pressure sensor core 20,
Avoid it is not only difficult to Torque Control but also with the gas expansion in use process using internal screw thread pressing process, can be right
Transmitter's precision impacts this problem, and the pressing force of retaining ring 50 acts directly on circuit board support 30, avoids pair
The elastomer on 20 surface of ceramic pressure sensor core generates additional stress, reduces null offset, and copper ring compact heap 40
Compared to the elastic components such as rubber pad or nylon compact heap flexible deformation will not be generated, so that amplitude peak reduces sensor
Null offset phenomenon.
Referring to Fig. 6, further, equally distributed groove is equipped on the outer wall of the ceramic pressure sensor core 20
21, the section of groove 21 be it is arc-shaped, there is the stabilizer blade 31 being adapted to the groove 21, stabilizer blade 31 on the circuit board support 30
Be similarly circular section, global shape similar to semi-cylindrical, make in this way ceramic sensor element core 20 and circuit board support 30 compared with
Good is fixed together, to preferably avoid answering for the assembly generation of circuit board support and ceramic sensor element core
Power.
Preferably, the quantity of the groove 21 is 4, so on the one hand relative to 2 or 3 grooves, compresses copper ring
Block 40 acts on the pressure on circuit board support 30 more evenly, on the other hand relative to more grooves are opened up, can make to process
Cost minimization has preferable economy.Certainly, the quantity of groove 21 is also possible to 2,3 etc., does not do herein further
Limitation.
Further, the shell 10 includes lower case 101 and upper housing 102, the lower case 101 and upper housing 102
It is connected through a screw thread, on the one hand ensure that the stability that lower case is connected with upper housing, be in addition additionally provided with spiral shell in lower case 101
Bolt shape structural member 103 facilitates the maintenance to ceramic pressure sensor and protects consequently facilitating dismantling to lower case and upper housing
It supports.It should be understood that upper housing and lower case can also be using other detachable connection methods, such as buckle, screw
Connection type guarantees the stability of connection.Specifically, in the present embodiment, being equipped in the inner wall of lower case 101 and placing button
The card slot 14 of ring 50, the placing groove 11 and seal groove 12 are arranged in the lower case 101, the bottom of the lower case 101
Portion has the through-hole 10a for being connected to external testing medium with the ceramic pressure sensor core 20.
Referring to Fig. 2 and Fig. 8, further, the upper housing 102 is hollow structure, in order to sensor body structure
External wire 70 is pierced by, and the hollow structure is embedded to be cased with conical seal ring 60, and the conducting wire 70 of the ceramic pressure sensor passes through
The conical seal ring 60 is pierced by, and the inner wall of upper housing 102 is the cone being adapted to conical seal ring 60, by the way that taper is close
Seal pushing is assembled in upper housing, and wire outlet is made to have good leakproofness.In the present embodiment, the conducting wire 70 is logical
Pneumoelectric cable.
Further, the top of the conical seal ring 60 be equipped with one compress sealing block 80 to the conical seal ring 60 into
Row compresses, and referring to Fig. 2, compression sealing block 80 is cylinder table structure, i.e., is adapted with the shape of upper housing 102 to conical seal ring
60 are compressed, while the diameter of part becomes smaller and is adapted with 70 shape of conducting wire being pierced by upper housing 102.
Further, it is provided with casing 90 on the outside of the conducting wire 70 above the upper housing 102 and compression sealing block 80,
Protective effect just is played to conducting wire in this way, and is externally provided with heat-shrink tube 91 in casing 90, to preferably enhance ventilation cable
Insulation effect.Ventilation cable and special sealing technique using extraordinary centre with airway, both ensure that sensing
The watertightness of device, and reference pressure chamber is communicated with environmental pressure, to ensure that the high-precision and high stability of measurement.
The ceramic pressure sensor encapsulating structure of the utility model embodiment, by lateral in sensor core placing groove
On extend a seal groove, O-shaped sealing ring is set in seal groove between ceramic pressure sensor core, makes the bullet of sealing ring
Property reaction force is laterally attached to sensor core groove wall section, and does not generate to the strain of ceramic pressure sensor core is unilateral
Additonal pressure, by the way that copper ring compact heap is arranged above the core of ceramic sensor element and applies pressure to the copper ring compact heap
Retaining ring as compress, relative to using internal screw thread pressing process, make the entire uniform plane stress of sensor core, assembling is answered
Power greatly reduces, and avoids and generates additional stress to sensor surface elastomer, and copper ring compact heap compared to rubber pad or
Nylon compact heap will not generate flexible deformation, thus the null offset phenomenon for reducing sensor of amplitude peak.It just drops in this way
It is low current using power cost caused by high temperature energization aging；Pass through the upper housing and conical seal ring in shell structure
Setting, sealing effect is good, and cable is convenient for being pierced by；It compresses sealing block and casing adapts to the structure of external cable connection, rise
Good protective effect is arrived；Heat-shrink tube is set and enhances the insulating properties of structure, when ventilation cable makes test reference pressure chamber with
Environmental pressure communicates, to ensure that the high-precision and high stability of measurement.
It should be understood that the encapsulating structure of the ceramic pressure sensor of the utility model, is tested through a large number of experiments,
It was found that effect is very good in 5Mpa pressure application scenarios below, suppresses test and be still able to maintain well up to 1,000,000 times or more
Leakproofness and stability.
The above is only the preferred embodiment of the utility model only, and those skilled in the art know, is not departing from this
In the case where the spirit and scope of utility model, various changes or equivalent replacement can be carried out to these features and embodiment.Separately
Outside, it under the introduction of the utility model, can modify to these features and embodiment to adapt to particular situation and material
Without departing from the spirit and scope of the utility model.Therefore, the utility model is not by specific embodiment disclosed herein
It limits, the embodiment within the scope of fallen with claims hereof belongs to the protection scope of the utility model.
Claims (10)
1. a kind of ceramic pressure sensor encapsulating structure, which is characterized in that including shell (10), include ceramic pressure sensor core
The ceramic pressure sensor of body (20) and circuit board, circuit board support (30), copper ring compact heap for placing the circuit board
(40) it is equipped with retaining ring (50), the intracavity bottom of the shell (10) for placing the ceramic pressure sensor core (20)
Placing groove (11) extends upward a seal groove (12) on the inside of the placing groove (11), is equipped in the seal groove (12) close
Seal (13), circuit board support (30) described in physical connection, the circuit board above the ceramic pressure sensor core (20)
The copper ring compact heap (40) is equipped with above bracket (30), the retaining ring (50) is arranged in the top of the copper ring compact heap (40),
The ceramic pressure sensor core (20) is uniformly pressed in the shell (10) by the retaining ring (50).
2. ceramic pressure sensor encapsulating structure according to claim 1, which is characterized in that the ceramic pressure sensor
The outer wall of core (20) is equipped with equally distributed groove (21), has and the groove (21) on the circuit board support (30)
The stabilizer blade (31) of adaptation, is fixed together ceramic pressure sensor core (20) with circuit board support (30).
3. ceramic pressure sensor encapsulating structure according to claim 1, which is characterized in that under the shell (10) includes
Shell (101) and upper housing (102), the lower case (101) and upper housing (102) are detachably fixed together.
4. ceramic pressure sensor encapsulating structure according to claim 3, which is characterized in that the lower case (101)
Inner wall is equipped with the card slot (14) for placing the retaining ring (50).
5. ceramic pressure sensor encapsulating structure according to claim 3, which is characterized in that the placing groove (11) and close
Sealing groove (12) is arranged in the lower case (101), and the bottom of the lower case (101) has external testing medium and institute
State the through-hole (10a) of ceramic pressure sensor core (20) connection.
6. ceramic pressure sensor encapsulating structure according to claim 3, which is characterized in that the upper housing (102) is
Hollow structure, the hollow structure is embedded to be cased with conical seal ring (60), and the conducting wire (70) of the ceramic pressure sensor is through institute
Conical seal ring (60) is stated to be pierced by.
7. ceramic pressure sensor encapsulating structure according to claim 6, which is characterized in that the conducting wire (70) is ventilation
Cable.
8. ceramic pressure sensor encapsulating structure according to claim 6, which is characterized in that the conical seal ring (60)
Top be equipped with one compress sealing block (80) conical seal ring (60) is compressed.
9. ceramic pressure sensor encapsulating structure according to claim 8, which is characterized in that further include being located at the upper casing
The casing (90) on the outside of the conducting wire (70) and compression sealing block (80) above body (102).
10. ceramic pressure sensor encapsulating structure according to claim 9, which is characterized in that further include in described sleeve pipe
(90) heat-shrink tube (91) being externally provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821119901.2U CN208333743U (en) | 2018-07-16 | 2018-07-16 | A kind of ceramic pressure sensor encapsulating structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821119901.2U CN208333743U (en) | 2018-07-16 | 2018-07-16 | A kind of ceramic pressure sensor encapsulating structure |
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| Publication Number | Publication Date |
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| CN208333743U true CN208333743U (en) | 2019-01-04 |
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| CN201821119901.2U Active CN208333743U (en) | 2018-07-16 | 2018-07-16 | A kind of ceramic pressure sensor encapsulating structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111928991A (en) * | 2020-09-10 | 2020-11-13 | 中国地震局工程力学研究所 | Integrated miniature pore pressure sensor |
-
2018
- 2018-07-16 CN CN201821119901.2U patent/CN208333743U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111928991A (en) * | 2020-09-10 | 2020-11-13 | 中国地震局工程力学研究所 | Integrated miniature pore pressure sensor |
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