Utility model content
The purpose of this utility model is that in place of solving the above deficiencies in the existing technologies.
To achieve the above object, first aspect the utility model provides a kind of micro-fluidic chip, including electrode layer and miniflow
Channel layer, miniflow channel layer are located above electrode layer, and electrode layer includes at least micro- heating electrode, micro- heating electrode with can measure temperature with
Control temperature.
Preferably, miniflow channel layer includes flow channel layer, and flow channel layer includes inlet, runner, medicament fixed area, test section,
In, inlet is sequentially connected medicament fixed area and test section by runner.
Preferably, electrode layer includes substrate, and electrode layer includes substrate, and micro- heating electrode is located in substrate, micro- heating electrode
It has been sequentially arranged above dielectric layer and test electrode.
Preferably, electrode layer further includes substrate and test electrode, and in the upper surface of substrate, there are the first preset areas of mutual exclusion
Domain and with the second predeterminable area, the first predeterminable area of micro- heating electrode position, test electrode be located at the second predeterminable area.
Preferably, the material of micro- heating electrode is platinum, gold, copper or aluminium.
Preferably, the material of dielectric layer is medium electricity inorganic thin film or organic polymer film.
It is further preferred that medium electricity inorganic thin film selects silica or nitrogen silicon compound SiNx film.
The utility model embodiment realizes the heating to position is directed to by the way that micro- heating electrode is added in micro-fluidic chip
And thermometric, the accuracy of micro-fluidic test is improved, for the micro-fluidic chip, prior art equipment is can use and carries out low cost
Volume production.
Specific embodiment
With reference to the accompanying drawings and examples, the technical solution of the utility model is described in further detail.
Test resistance is to test electrode in the utility model.
If Fig. 1 be a kind of structural schematic diagram of electrode layer provided by the embodiment of the utility model, in Fig. 1, in substrate 1 according to
Secondary to be provided with micro- heating electrode 2, dielectric layer 3 tests electrode 4.
In one example, the material of micro- heating electrode 2 is platinum, gold, same or aluminium.
In one example, the material of dielectric layer 3 is medium electricity inorganic thin film or organic polymer film.Such as dielectric
Layer can be silica, and the media electricity inorganic thin film such as silicon nitride or aluminium oxide is also possible to Pai Nuolin, poly-methyl methacrylate
Ester, the films such as organic polymers such as polytetrafluoroethylene (PTFE) (Poly tetra fluoroethylene, PTFE).
If Fig. 2 is a kind of structure top view of flow channel layer provided by the embodiment of the utility model, in Fig. 2, flow channel layer packet
An inlet 601 is included, which connects 2 medicament fixed areas 603 by runner 602, and each medicament fixed area 603 connects
One test section 604.Wherein, capillary phenomenon is utilized from driving principle, so that liquid flowing is not required in the runner for connecting inlet
Want it is external pump or integrated micropump system, for microfluidic chip technology in the equipment of wearable size design provide possibility
Property.
Fig. 3 be a kind of structure top view of perforated layer provided by the embodiment of the utility model, such as Fig. 3, perforated layer include into
Fluid apertures 701, exhaust/drainage hole 702, Fig. 3 are covered on flow channel layer as shown in Figure 2 as cap rock.
Fig. 4 is a kind of individual flow channel layer provided by the embodiment of the utility model.Fig. 5 provides for the utility model embodiment
The individual flow channel layer of another kind.
Fig. 6 is a kind of structural schematic diagram of miniflow channel layer provided by the embodiment of the utility model, miniflow channel layer shown in fig. 6
Flow channel layer and perforated layer are combined.
Fig. 7 is by flow channel layer, perforated layer, and electrode layer is bonded to the structural schematic diagram of the micro-fluidic chip obtained together.
In a preferred embodiment, dielectric layer selects silica, with a thickness of 100-500nm.
In one example, test electrode selects copper, gold, silver, aluminium, platinum, chromium, cobalt, the alloy metal materials such as iron.
In a preferred embodiment, test electrode selects copper or platinum, with a thickness of 100-300nm.
In the above-described embodiments, micro- heating electrode and test electrode are in different physical layers, in another embodiment
In, such as Fig. 8, heating electrode 2 and test electrode 4 be can be set in same layer.
In one example, with PTFE solution for test electrode carries out it is hydrophobic, it is corrosion-resistant, bio-compatibility handle, make
Electrode conductive can have again hydrophobic, corrosion-resistant, bio-compatibility, and can permanent retention.Specifically, with PTFE solution for
It tests electrode and carries out coating treatment.Wherein PTFE can select AF-1600 model, and solvent can select CF-40 model.
In one example, coating way can use spin coating, and the modes such as painting are stained in spraying.
Such as Fig. 9, the utility model embodiment provides a kind of preparation method of micro-fluidic chip, comprising:
Step 601, substrate is cleaned and is dried.
Here substrate is aforementioned substrate.
Step 602, micro- heating electrode is prepared on substrate, obtains electrode layer.
Step 603, fluid channel is prepared.
Step 604, aperture is carried out to the feed liquor of fluid channel and drain location, obtained with perforated layer miniflow channel layer.
Step 605, electrode layer and miniflow channel layer are bonded, obtain micro-fluidic chip.
In one example, such as Figure 10, step 602 is specifically included:
Step 6021, micro- heating electrode is prepared on substrate.
Step 6022, dielectric layer film is prepared on micro- heating electrode.
Step 6023, the preparation test electrode on dielectric layer film, obtains electrode layer.
In one example, step 601 includes: respectively to clean substrate 10 minutes with alcohol and deionized water, then, by substrate
It dries 30 minutes in 80 degrees Celsius of baking ovens, or is dried 30 minutes with heating plate.It should be noted that if it is polymer-based
Piece cannot be cleaned using acetone.
In one example, step 6021 specifically includes: using silk-screen printing or magnetic control or electron beam evaporation process
Micro- heating electrode is prepared, specifically, blocking the position for not needing plated electrode using metal, is then plated in the position that do not block
Metal forms electrode.Wherein, electrode material can be copper, gold, aluminium, the alloy materials such as platinum, preferably platinum.
In one example, step 6022 specifically includes: prepared by the mode of using plasma enhancing chemical meteorology deposition
Dielectric layer.It is a kind of mode that gas ions, which enhance chemical vapor deposition, according to design requirement, can also with electron beam evaporation deposition,
Or atomic layer deposition mode is used, or use spin coating mode, or using modes such as spraying methods.Wherein, dielectric layer film
It can be silica, the media electricity inorganic thin film such as silicon nitride or aluminium oxide is also possible to Pai Nuolin, poly-methyl methacrylate
Ester, the films, preferably silica such as organic polymers such as PTFE, medium thickness 100-500nm.
In one example, step 6023 specifically includes: using silk-screen printing or magnetic control or electron beam evaporation deposition technique
Preparation test electrode, test electrode can choose copper, gold, silver, aluminium, platinum, chromium, cobalt, the alloy metal materials such as iron.It is specific at one
Example in, the copper or platinum with a thickness of 100-300nm can be selected.This electrode can be chemically modified according to application.It needs
Illustrate, when testing micro-fluidic chip using electrochemical principle mode, just needs to plate test electrode, glimmering using immune protein
Plating test this layer of electrode is not had to when light mode is tested.Wherein, coating treatment can be carried out with PTFE solution for test electrode,
Make electrode that conductive can there is again hydrophobic, corrosion-resistant, bio-compatibility, and can permanent retention.
In one embodiment, PTFE selects AF-1600 model, and solvent selects CF-40 model.Wherein, coating way can
To use spin coating, the modes such as painting are stained in spraying.
In another example, step 602 includes: the heterogeneity phantom for first carrying out finite element thermal field simulation heating electrode, so
Runner position is combined to select the position of micro- heating electrode afterwards.Copper equally can be selected in the test electrode, and gold is silver-colored, aluminium, platinum, chromium,
Cobalt, the alloy metal materials such as iron.
In a preferred embodiment, test electrode selects copper or platinum with a thickness of 100-300nm, can use screen printing
Brush or magnetic control or electron beam evaporation process.Test electrode can be chemically modified according to application.
In one example, the mode that step 603 can be photolithography patterning combination etching prepares runner;It can also be use
The mode of nano impression directly prepares runner;Runner can also be prepared by the way of numerically-controlled machine tool machinery processing etc.;It can also be with
By the way of micro- injection molding;It can also be by the way of roll forming;It is also possible to the mode of laser ablation.It is preferred at one
In example, micro- injection molding or roll forming mode are selected.
In one example, the mode of laser ablation can be used in the aperture of step 604, and the side of plastic foil punching press can be used
Formula.
In one example, the bonding of step 605 includes the side that miniflow channel layer and electrode layer are limited by optics or physics
After formula is aligned, it is bonded.The mode of glue envelope can be used in bonding, while can also be using heat-sealing or supersonic welding sealing-in.
Such as Figure 11, the utility model embodiment provides the preparation method of another micro-fluidic chip, this method comprises:
Step 801, electrode and temperature control electrode are tested in silk-screen printing on substrate.
Step 802, dispenser is on reaction zone point using bioprotein or antibody required for this.
Step 803, portal on cover plate for tunnel inlets and liquid outlet punching press.
Step 804, double-sided adhesive stamps out micro-fluidic runner.
Step 805, good with the alignment sealing-in of the double-sided adhesive of the good micro-fluidic runner of cover plate punching press sinking to the bottom.
In one example, flow channel layer is replaced with double-sided adhesive, when doing bonding sealing-in, it is only necessary to which layers of two-sided is existed
The effect of bonding is realized in centre.Wherein, double-sided adhesive can form corresponding figure by way of punching press.
Above specific embodiment has carried out further the purpose of this utility model, technical scheme and beneficial effects
It is described in detail, it should be understood that the above is only the specific embodiments of the utility model, is not used to limit originally practical
Novel protection scope, within the spirit and principle of the utility model, any modification, equivalent substitution, improvement and etc. done,
It should be included within the scope of protection of this utility model.