CN208170316U - Waterproof device of high-power integrated surface light source - Google Patents
Waterproof device of high-power integrated surface light source Download PDFInfo
- Publication number
- CN208170316U CN208170316U CN201820734272.8U CN201820734272U CN208170316U CN 208170316 U CN208170316 U CN 208170316U CN 201820734272 U CN201820734272 U CN 201820734272U CN 208170316 U CN208170316 U CN 208170316U
- Authority
- CN
- China
- Prior art keywords
- shell
- heat dissipation
- chip
- led chip
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 10
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000004519 grease Substances 0.000 claims description 6
- 201000009310 astigmatism Diseases 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000741 silica gel Substances 0.000 abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 3
- 238000002347 injection Methods 0.000 abstract 1
- 239000007924 injection Substances 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 230000001795 light effect Effects 0.000 abstract 1
- 235000009537 plain noodles Nutrition 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model provides a watertight fittings of integrated area source of high power, includes L ED chip, heat dissipation base plate, inner shell and shell, wherein the heat dissipation base plate encapsulation has a plurality of L ED chip, the parcel has heat dissipation silica gel around the L ED chip, the inner shell passes through the heat dissipation base plate of the L ED chip that PVC glued injection encircleed and is provided with heat dissipation silica gel, a plurality of locating hole has been seted up in the middle of the inner shell, the locating hole is fixed with the cooperation of the locating pin on the PC shell of one shot injection moulding, PC shell both ends are series connection fixed screens and lead wire position, and the middle arc bowl that corresponds the position arch with L ED chip and have printing opacity and reflection of light, a toper plain noodles of loosing of concave yield in the middle of the arc bowl, the utility model discloses simple structure, the heat dissipation is faster, and waterproof nature is good, long service life, and light effect is good, but wide application in the beautified.
Description
Technical field
The utility model relates to technical field of LED illumination, especially a kind of high power integrates the water-tight device of area source.
Background technique
Energy-saving light source of the LED as modernization has been widely used for the every field of society, and uses tradition LED
The LED light source of encapsulation is generated heat more apparent due to its thermal resistance height, especially high-power LED light source, can be seriously affected LED light source
Service life.
Manufacture and design in application field in LED lamp at present, the especially outdoor LED lamp for having waterproof requirement, waterproof is arranged
Apply mostly is to use lens, LED lamp bead and aluminum substrate component parts, then reach anti-with sealing rubber ring and lamp casing lock sealing
Water function, such waterproof component parts is relatively more, and structure is complicated, and water-proof function effect is not very good.
Summary of the invention
In order to overcome the disadvantages mentioned above of the prior art, the purpose of the utility model is to provide a kind of structure is simple, heat dissipation is more
Fastly, light efficiency is higher, good waterproof performance, a kind of water-tight device of the integrated area source of high power with long service life.
Technical solution adopted by the utility model to solve its technical problems is：
A kind of high power integrates the water-tight device of area source, including LED chip, heat-radiating substrate, inner casing and PC shell,
In：The heat-radiating substrate is packaged with several LED chips, and thermal grease is enclosed with around the LED chip, and the inner casing passes through
The heat-radiating substrate for being provided with the LED chip of thermal grease is surrounded in the injection molding of PVC glue, offers several positioning among the inner casing
Positioning pin on the PC shell of hole, the location hole and single injection-molded, which cooperates, to be fixed, and PC shell both ends are series connection
Fixed detent and lead position, it is intermediate to have light transmission and reflective arc bowl with LED chip corresponding position protrusion.It is recessed among the arc bowl
One taper astigmatism face.
As further improvement of the utility model：The heat-radiating substrate is the good copper base or aluminum substrate of thermal conductivity.
Compared with prior art, the utility model has the beneficial effects that：
The utility model structure is simple, and LED chip and heat sink are carried out waterproof sealing by injection molding inner casing, effectively improved
The waterproof performance that product open air uses, while LED chip is directly encapsulated on heat-radiating substrate, it is wrapped up with transparent thermal grease
LED chip, not only can increase the heat dissipation contact surface with heat-radiating substrate, and heat is quickly shed, and can to LED point light source into
The preliminary astigmatism of row, avoids dazzle, inner casing is fixed on PC shell, pass through light transmission corresponding with LED chip and reflective arc bowl, energy
Enough increase the light efficiency effect that LED chip light source issues, by the series connection detent at both ends, can connect several this products.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the structural schematic diagram of PC shell
Specific embodiment
Now in conjunction with Detailed description of the invention, the present invention will be further described with embodiment：
With reference to Fig. 1 and Fig. 2, the water-tight device that a kind of high power integrates area source includes LED chip 1, and heat-radiating substrate 2 is interior
Shell 3 and PC shell 4, wherein：The heat-radiating substrate 2 is packaged with several LED chips 1, is enclosed with heat dissipation around the LED chip 1
Silica gel 5, the inner casing 3 surrounds the heat-radiating substrate 2 for being provided with the LED chip of thermal grease by the injection molding of PVC glue, in the inner casing
Between offer several location holes, the positioning pin 41 on the PC shell 4 of the location hole and single injection-molded, which cooperates, to be fixed,
PC shell both ends are connect fixed detent 42 and lead position 45, intermediate to have light transmission and anti-with LED chip corresponding position protrusion
The arc bowl 43 of light.A taper astigmatism face 44 is recessed among the arc bowl.
The heat-radiating substrate is the good copper base or aluminum substrate of thermal conductivity.
The utility model first uses COB encapsulation technology, and LED chip is encapsulated on aluminum substrate, and carries out to LED chip scattered
Hot silica gel smears package processing, then carries out PVC glue in the aluminum substrate encapsulated to LED and is molded to form inner casing, finally infuses with primary
It moulds molding PC shell and carries out assembling fixation, when use can carry out this product multiple by the series connection detent at PC shell both ends
It is used in series, constitutes a variety of application shapes and form, can be widely applied for the lightening lamp and beauty of billboard and public place of entertainment
Change lamp application.With good lighting effects, longer service life.
In conclusion after those skilled in the art read the utility model file, skill according to the present utility model
Art scheme and technical concept are not necessarily to creative mental labour and make other various corresponding conversion schemes, and it is practical new to belong to this
The range that type is protected.
Claims (2)
1. a kind of high power integrates the water-tight device of area source, including LED chip, heat-radiating substrate, inner casing and PC shell, feature
It is：The heat-radiating substrate is packaged with several LED chips, and thermal grease is enclosed with around the LED chip, and the inner casing passes through
The heat-radiating substrate for being provided with the LED chip of thermal grease is surrounded in the injection molding of PVC glue, offers several positioning among the inner casing
Positioning pin on the PC shell of hole, the location hole and single injection-molded, which cooperates, to be fixed, and PC shell both ends are series connection
Fixed detent and lead position, it is intermediate to have light transmission and reflective arc bowl with LED chip corresponding position protrusion, it is recessed among the arc bowl
One taper astigmatism face.
2. the water-tight device that a kind of high power according to claim 1 integrates area source, it is characterised in that：The heat dissipation base
Plate is the good copper base or aluminum substrate of thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734272.8U CN208170316U (en) | 2018-05-17 | 2018-05-17 | Waterproof device of high-power integrated surface light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820734272.8U CN208170316U (en) | 2018-05-17 | 2018-05-17 | Waterproof device of high-power integrated surface light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208170316U true CN208170316U (en) | 2018-11-30 |
Family
ID=64368251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820734272.8U Expired - Fee Related CN208170316U (en) | 2018-05-17 | 2018-05-17 | Waterproof device of high-power integrated surface light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208170316U (en) |
-
2018
- 2018-05-17 CN CN201820734272.8U patent/CN208170316U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181130 Termination date: 20200517 |