CN208113217U - Water cooling plate and computing equipment comprising same - Google Patents
Water cooling plate and computing equipment comprising same Download PDFInfo
- Publication number
- CN208113217U CN208113217U CN201820696894.6U CN201820696894U CN208113217U CN 208113217 U CN208113217 U CN 208113217U CN 201820696894 U CN201820696894 U CN 201820696894U CN 208113217 U CN208113217 U CN 208113217U
- Authority
- CN
- China
- Prior art keywords
- copper pipe
- water
- face
- cooled plate
- flat copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 99
- 239000010949 copper Substances 0.000 claims abstract description 99
- 229910052802 copper Inorganic materials 0.000 claims abstract description 99
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 38
- 239000004411 aluminium Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 35
- 239000007788 liquid Substances 0.000 claims description 22
- 238000004364 calculation method Methods 0.000 claims description 12
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 abstract description 8
- 238000003801 milling Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000010438 heat treatment Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000019628 coolness Nutrition 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a water-cooling board and including computing equipment of this water-cooling board, water-cooling board include the base member and connect liquid-cooling pipe on the base member, wherein, the base member is aluminium base board, aluminium base board includes the first surface, liquid-cooling pipe includes the copper pipe, the copper pipe includes first band copper pipe face and second band copper pipe face, first surface, first band copper pipe face and second band copper pipe face are the plane respectively, first band copper pipe face is connected on the first surface. The utility model discloses well water-cooling board adopts the mode that flat copper pipe and aluminium base board are connected, need not the milling flutes, flies the equal technology, has simplified the process, has reduced product weight and cost simultaneously.
Description
Technical field
The utility model relates to a kind of water-cooled plates, specifically, be related to it is a kind of for calculating the water-cooled plate of equipment cooling.
Background technique
In modern electronic equipment, component integrated level is higher and higher, and the component counts of upper side administration are also more and more,
In equipment operation, calorific value is correspondingly also increasing.Under high temperature environment, if component heat dissipation is bad, it will cause
Integrated circuit job insecurity, and then equipment performance reduces, and working life shortens.Therefore, modern electronic equipment is for heat dissipation
Performance has high requirement.
In the prior art, generally can be there are two types of radiating mode, one is air-cooled, one is water coolings.In dissipating for water cooling
Water-cooled plate is typically used in hot mode, water-cooled plate is a kind of for reducing heater surface temperature, the device of cooling heater, is
An important component in water-cooling heat radiating system.When using water-cooling pattern, water-cooled plate is contacted with electronic equipment, makes electronics
Heat transfer in equipment is into water-cooled plate, to realize the heat dissipation of electronic equipment.
Existing water-cooled plate need on matrix groove milling, to copper pipe fitting carry out fly equality multiple tracks technique to guarantee heat dissipation performance, work
Skill very complicated, higher cost constrain the application of water-cooled plate in the electronic device to a certain extent.
Utility model content
The purpose of the utility model is to provide a kind of water-cooled plate and the calculating equipment to be radiated using the water-cooled plate, water
Cold plate manufacture craft under the premise of guaranteeing heat dissipation is simple, at low cost.
To achieve the goals above, the water-cooled plate of the utility model includes the liquid cooling of matrix and connection on the matrix
Pipe, wherein described matrix is aluminum substrate, and the aluminum substrate includes first surface, and the liquid cooling pipe includes copper pipe, the copper pipe packet
The first flat copper pipe face and the second flat copper pipe face are included, the first surface, the first flat copper pipe face and the second flat copper pipe face are respectively flat
Face, first flat copper pipe face connect on the first surface.
In one embodiment of above-mentioned water-cooled plate, second flat copper pipe face is parallel with first flat copper pipe face.
In one embodiment of above-mentioned water-cooled plate, the copper pipe further includes the first cambered surface and the second cambered surface, and described first
Cambered surface and the second cambered surface are separately connected first flat copper pipe face and the second flat copper pipe face.
In one embodiment of above-mentioned water-cooled plate, the copper pipe includes sequentially connected inlet, tube body and liquid out
Mouthful, wherein the S-type arrangement of tube body.
In one embodiment of above-mentioned water-cooled plate, the aluminum substrate includes structure fixation hole, and the tube body includes multiple
Parallel pipe main body, the structure fixation hole are set between the adjacent pipe main body.
In one embodiment of above-mentioned water-cooled plate, the copper pipe further includes the first bend pipe and the second bend pipe, the tube body
It is connected by first bend pipe with the inlet, the tube body is connected by second bend pipe with the liquid outlet
It connects.
In one embodiment of above-mentioned water-cooled plate, the aluminum substrate further includes second surface, and the second surface is flat
Face, wherein the copper pipe is two, and two copper pipes are connected to the first surface and second surface.
In one embodiment of above-mentioned water-cooled plate, the copper pipe connects with the first surface and/or second surface welding
It connects.
The utility model also provides a kind of calculating equipment comprising calculation power plate and the corresponding calculation power plate setting are thought described
Calculate the heat-sink unit of power plate heat dissipation, wherein the heat-sink unit includes above-mentioned water-cooled plate.
In one embodiment of above-mentioned calculating equipment, second flat copper pipe face corresponds to the calculation power plate setting.
The beneficial functional of the utility model is that the water-cooled plate of the utility model uses flat copper pipe to be connected with aluminum substrate
Mode without groove milling, flies equality technique, simplifies process, while reducing product weight and cost.
The utility model is described in detail below in conjunction with the drawings and specific embodiments, but not as to the utility model
Restriction.
Detailed description of the invention
Fig. 1 is the top view of an embodiment of the water-cooled plate of the utility model；
Fig. 2 is the A-A cross-sectional view of Fig. 1；
Fig. 3 is the top view of another embodiment of the water-cooled plate of the utility model；
Fig. 4 is the B-B cross-sectional view of Fig. 3；
Fig. 5 is the sectional view of the another embodiment of the water-cooled plate of the utility model；
Fig. 6 is the structural schematic diagram of an embodiment of the calculating equipment of the utility model；
Fig. 7 is the structural schematic diagram of another embodiment of the calculating equipment of the utility model.
Wherein, appended drawing reference
100 water-cooled plates
110 aluminum substrates
120 copper pipes
111 first surfaces
121 first flat copper pipe faces
122 second flat copper pipe faces
123 first cambered surfaces
124 second cambered surfaces
120a inlet
120b tube body
120c liquid outlet
200 water-cooled plates
210 aluminum substrates
220 copper pipes
220a inlet
220b tube body
220c liquid outlet
The first bend pipe of 220d
The second bend pipe of 220e
213 structure fixation holes
220b1-b4 pipe main body
300 water-cooled plates
310 aluminum substrates
320 copper pipes
320a/b copper pipe
311 first surfaces
312 second surfaces
10 calculate equipment
11 power supply units
12 control units
13 calculate power plate
14 radiators
13a operation chip
Specific embodiment
Technical solutions of the utility model are described in detail in the following with reference to the drawings and specific embodiments, with further
Understand the purpose of this utility model, scheme and effect, but is not intended as the limit of the appended claims for the utility model protection scope
System.
It is directed to the reference of " embodiment ", " another embodiment ", " the present embodiment " etc. in specification, refers to the reality of description
Applying example may include specific feature, structure or characteristic, each embodiment of but not must comprising these special characteristics, structure or
Characteristic.In addition, such statement not refers to the same embodiment.Further, describe in conjunction with the embodiments specific feature,
When structure or characteristic, regardless of either with or without specific description, it has been shown that such feature, structure or characteristic are integrated to other realities
Apply in example is in the knowledge of those skilled in the range.
Some vocabulary is used in specification and following claims to censure specific components or component, this field
The member of ordinary skill, it is to be appreciated that technology user or manufacturer can be different noun or term come call the same component or
Component.This specification and following claims not in such a way that the difference of title is as component or component is distinguished, and
It is the criterion with component or component difference functionally as differentiation.In specification in the whole text and subsequent claim
Mentioned " comprising " and "comprising" is an open term, therefore should be construed to " including but not limited to ".In addition, " connection "
One word includes any direct and indirect connection means herein.
It should be noted that such as occur in the description of the present invention, term " transverse direction ", " longitudinal direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, be not instruction
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitations of the present invention.For " first ", " second ", " third ", " the 4th " grade convenient for clear explanation, addressed herein
Sequence term be for by element, region, partially with another the same or similar element, region, partially distinguish, Er Feiyong
To limit specific element, region, part.
Water-cooled plate includes matrix and the liquid cooling pipe that is connected on matrix, for being connected with fluid circulation system in liquid cooling pipe.
In following embodiment, using aluminium as basic material, copper material as being illustrated for liquid cooling pipe material, but it should be noted that,
The material that other good heat conductivities can also be used in matrix and liquid cooling pipe is made.
It as depicted in figs. 1 and 2, is the structural schematic diagram of an embodiment of the water-cooled plate of the utility model.This is practical new
In type, the matrix of water-cooled plate 100 uses aluminum substrate 110, and liquid cooling pipe uses copper pipe 120, as shown, copper pipe 120 is connected to aluminium
The upper surface of substrate 110.Specifically, aluminum substrate 110 includes first surface 111, and copper pipe 120 includes 121 He of the first flat copper pipe face
Second flat copper pipe face 122, the first surface 111 of aluminum substrate 110, the first flat copper pipe face 121 of copper pipe 120 and the second flat copper pipe face
122 be respectively plane, and the first flat copper pipe face 121 of copper pipe 120 is connected on the first surface 111 of aluminum substrate 110.
In the present embodiment, reduced costs to a certain extent and weight using aluminium sheet as substrate first.In addition, this implementation
Example is formed by the way of combining the first surface in plane of aluminum substrate with the first flat copper pipe face in plane of copper pipe
Water-cooled plate, plane is connected not only with plane to be made to combine enough closely, to guarantee that heat dissipation performance is good, while eliminating aluminum substrate
Groove milling technique.
In another embodiment of the utility model, as depicted in figs. 1 and 2, the second flat copper pipe face 122 of copper pipe 120 with
First flat copper pipe face 121 is parallel.Second flat copper pipe face 122 is for example for being bonded with heating element to radiate.Wherein, first
Flat copper pipe face 121 and the second flat copper pipe face 122 need to guarantee certain flatness, it is ensured that fit closely.First flat copper pipe face, 121 He
The distance between second flat copper pipe face 122 is adjusted as needed.
It should be noted that Heat Conduction Material can be filled in the gap between the second flat copper pipe face 122 and heating element, it is thermally conductive
Material is, for example, heat conductive silica gel or thermally conductive rubber mat etc., so that in actual production manufacturing process, for the second flat copper pipe face 122
Flatness be not up to technique require and between heating element there are gap or part there are the situation in gap carry out it is compatible.Together
When, by filling Heat Conduction Material, the practical heat dissipation area of heating element can also be increased, enhance radiating efficiency.
In another embodiment of the utility model, as depicted in figs. 1 and 2, copper pipe 120 further includes 123 He of the first cambered surface
Second cambered surface 124, the first cambered surface 123 and the second cambered surface 124 are separately connected the first flat copper pipe face 121 and the second flat copper pipe face 122.
That is, referring to Fig. 2, from the point of view of the cross section of copper pipe 120, copper pipe 120 by the first flat copper pipe face 121, the first cambered surface 123,
Second flat copper pipe face 122 and the second cambered surface 124 are in turn connected to form.
In the present embodiment, copper pipe 120 can be to be formed after circular common round copper pipe carries out flattening technique by cross section, convenient
Fast.
In another embodiment of the utility model, as shown in Figure 1, copper pipe 120 include inlet 120a, tube body 120b with
And liquid outlet 120c, inlet 120a, tube body 120b and liquid outlet 120c are sequentially connected, that is to say, that inlet 120a with
And liquid outlet 120c is connected to the both ends of tube body 120b, inlet 120a and liquid outlet 120c are used for and liquid circulation system
System communicates.Wherein, the S-type first surface 111 for being arranged in aluminum substrate 110 of tube body 120b.Tube body 120b and heating element phase
It is corresponding, the heat of heating element is taken away by fluid circulation system.
In another embodiment of the utility model, as shown in figure 3, water-cooled plate 200 includes aluminum substrate 210 and is connected to aluminium
Copper pipe 220 on substrate 210.Wherein, copper pipe 220 includes inlet 220a, tube body 220b and liquid outlet 220c, in addition, copper pipe
220 further include the first bend pipe 220d and the second bend pipe 220e, and tube body 220b is connected by the first bend pipe 220d with inlet 220a
It connects, tube body 220b is connected by the second bend pipe 220e with liquid outlet 220c.
The present embodiment effectively reduces copper pipe entirety occupied space by the first bend pipe of setting and the second bend pipe, is water cooling
Plate installation and the arrangement of other components provide convenience.
As shown in Figure 3 and Figure 4, aluminum substrate 210 further includes multiple structure fixation holes 213, and structure fixation hole 213 is used for water cooling
The structure of plate is fixed.Wherein, tube body 220b includes multiple parallel pipe main bodys, and multiple structure fixation holes 213 of aluminum substrate 210 are set
It is placed between adjacent tubes main body.The present embodiment has four parallel pipe main body 220b1 to 220b4, aluminum substrate with tube body 220b
210 have and are illustrated for two rows of structure fixation hole 213a, 213b, but are not limited thereto.As shown, structure fixation hole
213a is set between two parallel pipe main body 220b1 and 220b2, and structure fixation hole 213b is set to two parallel pipe masters
Between body 220b3 and 220b4.
In the present embodiment, the space of aluminum substrate is taken full advantage of by rationally arranging, and it is solid not have to separately reserved setting structure
The space for determining hole reduces the size of aluminum substrate 210, further reduces costs and weight.
As shown in figure 5, Fig. 5 is the sectional view of another embodiment of the water-cooled plate of the utility model.As shown, this implementation
In example, flat copper pipe is arranged in the two sides up and down of aluminum substrate.Specifically, water-cooled plate 300 includes aluminum substrate 310 and is connected to aluminium
Copper pipe 320 on substrate 310.Aluminum substrate 310 includes first surface 311 and second surface 312, wherein first surface 311 and the
Two surfaces 312 are oppositely arranged and are plane.Above-mentioned flat copper pipe is two groups, i.e. copper pipe 320a and copper pipe 320b are separately connected
In the first surface 311 and second surface 312 of aluminum substrate 310.
In the present embodiment, in the two-sided connection flat copper pipe of one piece of aluminum substrate, one piece of aluminum substrate is as two pieces of uses, more into one
Step saves cost.Meanwhile when applying between two heating elements, radiating efficiency is substantially improved.
In above-mentioned each embodiment, the first surface and/or second surface of copper pipe and aluminum substrate preferably preferably use welding
Connection.
As shown in fig. 6, the calculating equipment 10 of the utility model include power supply unit 11, control unit 12, calculate power plate 13 with
And cooling system, wherein power supply unit 11, control unit 12 can be independent one or more plate bodys, can also partially integrate
Or one or more plate bodys are all integrated into, it may also do with calculation power plate 13 and completely or partially integrate, the utility model does not limit
It is fixed.Power supply unit 11 is connected respectively to provide electric power for control unit 12 and calculation power plate 13 with control unit 12 and calculation power plate 13
Source.Cooling system includes the components such as radiator 14, radiator fan, and corresponding calculation power plate 13 setting of radiator 14, which is thought, calculates power plate 13
Heat dissipation guarantees the normal work for calculating power plate 13 or even whole equipment.
As shown in fig. 7, multiple calculation power plates 13 are usually arranged in one calculating equipment 10 in order to increase the calculation power for calculating equipment,
And each is calculated and multiple operation chip 13a is generally arranged on power plate 13.It should be noted that diagram is merely illustrative, power plate 13 is calculated
Quantity, it is each calculate power plate 13 on operation chip 13a quantity and each operation chip 13a arrangement mode all in accordance with need into
Row setting, there is no restriction.
The radiator 13 of the calculating equipment of the utility model includes water-cooled plate as described above, water-cooled plate as escribed above
100, the corresponding power plate 13 of calculating in the second flat copper pipe face 122 of the copper pipe 120 in water-cooled plate 100 is arranged, specifically, copper pipe 120
The corresponding operation chip 13a setting calculated on power plate 13 in second flat copper pipe face 122, guarantee, which is taken away, calculates power plate heat.Wherein, copper pipe
The spacing between multiple rows of operation chip 13a in spacing between 120 multiple pipe main bodys and calculation power plate 13 matches, to reduce
Thermal contact resistance improves radiating efficiency.
Calculating equipment in the utility model for example can be the calculating equipment that the mine machine of mine is dug for ideal money, but this
Utility model is not limited.
Certainly, the utility model can also have other various embodiments, without departing substantially from the spirit of the present invention and its essence
In the case of, those skilled in the art work as can make various corresponding changes and modifications, but these according to the utility model
Corresponding changes and modifications all should belong to the protection scope of the utility model the attached claims.
Claims (10)
1. a kind of water-cooled plate, the liquid cooling pipe including matrix and connection on the matrix, which is characterized in that described matrix is aluminium base
Plate, the aluminum substrate include first surface, and the liquid cooling pipe includes copper pipe, and the copper pipe includes that the first flat copper pipe face and second are flat
Copper pipe face, the first surface, the first flat copper pipe face and the second flat copper pipe face are respectively plane, wherein first flat copper pipe
Face connects on the first surface.
2. water-cooled plate according to claim 1, which is characterized in that second flat copper pipe face and first flat copper pipe face
It is parallel.
3. water-cooled plate according to claim 2, which is characterized in that the copper pipe further includes the first cambered surface and the second cambered surface,
First cambered surface and the second cambered surface are separately connected first flat copper pipe face and the second flat copper pipe face.
4. water-cooled plate according to claim 1, which is characterized in that the copper pipe includes sequentially connected inlet, tube body
And liquid outlet, wherein the S-type arrangement of tube body.
5. water-cooled plate according to claim 4, which is characterized in that the aluminum substrate includes structure fixation hole, the tube body
Including multiple parallel pipe main bodys, the structure fixation hole is set between the adjacent pipe main body.
6. water-cooled plate according to claim 4, which is characterized in that the copper pipe further includes the first bend pipe and the second bend pipe,
The tube body is connected by first bend pipe with the inlet, and the tube body passes through second bend pipe and the liquid out
Mouth is connected.
7. water-cooled plate according to any one of claims 1 to 6, which is characterized in that the aluminum substrate further includes second surface,
The second surface is plane, wherein the copper pipe is two, and two copper pipes are connected to the first surface and the
Two surfaces.
8. water-cooled plate according to claim 7, which is characterized in that the copper pipe and the first surface and/or the second table
Face is welded to connect.
9. a kind of calculating equipment, including calculating power plate and the corresponding heat dissipation list calculated the setting of power plate and think the calculation power plate heat dissipation
Member, which is characterized in that the heat-sink unit includes water-cooled plate as claimed in any one of claims 1 to 8.
10. calculating equipment according to claim 9, which is characterized in that second flat copper pipe face corresponds to the calculation power plate
Setting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820696894.6U CN208113217U (en) | 2018-05-10 | 2018-05-10 | Water cooling plate and computing equipment comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820696894.6U CN208113217U (en) | 2018-05-10 | 2018-05-10 | Water cooling plate and computing equipment comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208113217U true CN208113217U (en) | 2018-11-16 |
Family
ID=64114771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820696894.6U Active CN208113217U (en) | 2018-05-10 | 2018-05-10 | Water cooling plate and computing equipment comprising same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208113217U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110989787A (en) * | 2019-12-02 | 2020-04-10 | 北京比特大陆科技有限公司 | Liquid cooling server |
-
2018
- 2018-05-10 CN CN201820696894.6U patent/CN208113217U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110989787A (en) * | 2019-12-02 | 2020-04-10 | 北京比特大陆科技有限公司 | Liquid cooling server |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107979962A (en) | Water-cooled circuit plate heat dissipating device | |
| CN108153401A (en) | A kind of computer server radiator | |
| CN108183282B (en) | Battery module thermal management device based on vapor chamber | |
| CN208113217U (en) | Water cooling plate and computing equipment comprising same | |
| CN207820432U (en) | Water-cooled circuit plate heat dissipating device | |
| CN208462136U (en) | A kind of pcb board convenient for heat dissipation | |
| CN207834526U (en) | A kind of battery modules heat management device based on soaking plate | |
| CN206452607U (en) | A kind of PCB printed circuit boards with heat sinking function | |
| CN209420018U (en) | Power panel, heat radiation structure and cooking utensil | |
| CN208113216U (en) | Heat dissipation work structure and computing equipment comprising same | |
| CN208861233U (en) | A cooling device for a high-power computer | |
| CN209296991U (en) | Radiator structure for optical module | |
| CN206713155U (en) | A kind of arc-shaped circuit board | |
| CN206097044U (en) | Novel water -cooling radiator for computer | |
| CN210900129U (en) | Uniform temperature plate radiator | |
| CN108024488A (en) | Water-jacket typ circuit plate heat dissipating device | |
| CN208141314U (en) | Combined radiating device | |
| CN208387183U (en) | A kind of radiator structure of vehicle-mounted integral machine | |
| CN207909067U (en) | A kind of computer server radiator | |
| CN114679896A (en) | Tile type TR assembly heat pipe type air cooling radiator | |
| CN201839578U (en) | Radiator for power unit module | |
| CN207441688U (en) | Radiating subassembly, semiconductor heater and semiconductor cooking apparatus | |
| CN201341296Y (en) | Heat radiating structure of communication machine box | |
| CN206685368U (en) | IGBT heat radiation modules and vehicle | |
| CN207587725U (en) | Water-cooling heat dissipation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |