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CN207977457U - The three of surface adhesive type stack antenna - Google Patents

The three of surface adhesive type stack antenna Download PDF

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Publication number
CN207977457U
CN207977457U CN201820256994.7U CN201820256994U CN207977457U CN 207977457 U CN207977457 U CN 207977457U CN 201820256994 U CN201820256994 U CN 201820256994U CN 207977457 U CN207977457 U CN 207977457U
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hole
matrix
antenna
metal layer
feed
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林若南
杨才毅
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RUIFENG INDUSTRY Co Ltd
Taoglas
Taungs Group Ltd
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RUIFENG INDUSTRY Co Ltd
Taoglas
Taungs Group Ltd
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Abstract

本实用新型公开了一种表面粘着式的三堆叠天线,包括:一第一天线、一第二天线、一第三天线及一电路板;依序的将该第一天线、该第二天线及该第三天线堆叠于该电路板后,使该第三天线上的第三馈入组件穿过该第二天线、该第一天线及该电路板并与该电路板电性连接,该第二天线上的两个第二馈入组件穿过该第一天线及该电路板并与该电路板电性连接,该第一天线上的两个第一馈入组件穿过该电路板并与该电路板电性连接;以该第一天线的第一辐射金属层、第二天线的第二辐射金属层及该第三天线的第三辐射金属层进行不同通讯系统的信号接收,并且可以表面粘着的方式电性连接在电子装置的主板上,可大幅度降低组装的人力,提升效率及使用上的简便性。

The utility model discloses a surface-adhesive three-stack antenna, comprising: a first antenna, a second antenna, a third antenna and a circuit board; sequentially, the first antenna, the second antenna and the After the third antenna is stacked on the circuit board, the third feeding component on the third antenna passes through the second antenna, the first antenna and the circuit board and is electrically connected to the circuit board, the second The two second feed-in components on the antenna pass through the first antenna and the circuit board and are electrically connected to the circuit board, and the two first feed-in components on the first antenna pass through the circuit board and are connected to the circuit board The circuit board is electrically connected; use the first radiating metal layer of the first antenna, the second radiating metal layer of the second antenna, and the third radiating metal layer of the third antenna to receive signals of different communication systems, and can be surface-mounted The method is electrically connected to the main board of the electronic device, which can greatly reduce the manpower of assembly, improve efficiency and ease of use.

Description

表面粘着式的三堆叠天线Surface Mount Triple Stack Antenna

技术领域technical field

本实用新型是有关一种天线,尤其是指一种用于多频带的表面粘着式的三堆叠天线。The utility model relates to an antenna, in particular to a surface-adhesive three-stack antenna for multi-frequency bands.

背景技术Background technique

传统的携带式GPS系统都内建一接收GPS信号的接收天线结构,此GPS系统的接收天线结构为插针式的平板天线结构。此平板天线结构上具有一陶瓷介质的基体,该基体表面具有一辐射金属层,该基体的底面具有一接地金属层,该基体上开设一贯穿孔,该贯穿孔贯穿该辐射金属层及该接地金属层,该贯穿孔以提供一呈针状物的信号馈入体穿过,在该信号馈入体穿过该基体后与该辐射金属层电性连接,不与该接地金属层电性连接,以形成可电性固接于电子器物主板上的平板天线结构。Traditional portable GPS systems have a built-in receiving antenna structure for receiving GPS signals. The receiving antenna structure of this GPS system is a pin-type flat antenna structure. The planar antenna structure has a substrate of ceramic dielectric, the surface of the substrate has a radiating metal layer, the bottom surface of the substrate has a grounding metal layer, and a through hole is opened on the substrate, and the through hole penetrates the radiating metal layer and the grounding metal layer, the through-hole is provided with a needle-shaped signal feeder to pass through, and after the signal feeder passes through the substrate, it is electrically connected to the radiation metal layer, and is not electrically connected to the ground metal layer, To form a planar antenna structure that can be electrically fixed on the main board of the electronic device.

由于此种的插针式的平板天线结构仅适用于接收单一系统的信号,而且所使用的基体为立方体形,造成体积较大,导致无法安装在新一代轻薄短小的携带式的电子器物上,在与电子器物的主板焊接时可能因温度曲线而无法满足让体积较大的陶瓷介质的基体达到足以焊接的均匀温度,造成焊接加工上的困扰。而且此种插针式的平板天线结构在与电子器物的主板电性固接时,该插针式的平板天线结构要贴胶手焊,无法机器打件。Since this kind of pin-type flat-panel antenna structure is only suitable for receiving signals of a single system, and the substrate used is cube-shaped, resulting in a large volume, it cannot be installed on a new generation of light, thin, and small portable electronic devices. When soldering with the main board of electronic devices, it may not be possible to satisfy the large-volume ceramic medium substrate to achieve a uniform temperature sufficient for soldering due to the temperature curve, causing troubles in soldering processing. Moreover, when the pin-type planar antenna structure is electrically fixed with the main board of the electronic device, the pin-type planar antenna structure needs to be glued and hand-welded, and cannot be machined.

实用新型内容Utility model content

因此,本实用新型的主要目的,在于解决传统缺失,本实用新型在于提供一种通过电路板与三个堆叠在一起的平板天线组合成表面粘着的三堆叠平板天线,能接收不同系统的信号,且使该三堆叠平板天线以表面粘着的方式电性连接在电子装置的主板上,可大幅度降低组装的人力,提升效率及使用上的简便性。Therefore, the main purpose of the present utility model is to solve the traditional deficiencies. The utility model is to provide a three-stacked planar antenna that is adhered to the surface by combining a circuit board and three stacked planar antennas, which can receive signals from different systems. Moreover, the three-stacked planar antenna is electrically connected to the main board of the electronic device in a surface-adhesive manner, which can greatly reduce manpower for assembly, and improve efficiency and ease of use.

为达成上述的目的,本实用新型提供一种表面粘着式的三堆叠天线,包括:一第一天线、一第二天线、一第三天线及一电路板。该第一天线上具有一第一基体,该第一基体的表面具有一第一辐射金属层,该第一基体的底面具有一接地金属层,于该第一天线上具有两个穿过该第一基体的第一馈入组件,该两个第一馈入组件穿过该第一基体与该第一辐射金属层电性连接,该两个第一馈入组件穿过该第一基体的底面不与该接地金属层电性连接。该第二天线上具有一第二基体,该第二基体配置于该第一基体的第一辐射金属层的表面上,于该第二基体表面上具有一第二辐射金属层,该第二天线具有两个第二馈入组件,该两个第二馈入组件分别穿过该第二基体与该第一基体并与该第二辐射金属层电性连接,该两个第二馈入组件穿过该第一基体底面外部不与该接地金属层电性连接。该第三天线上具有一第三基体,该第三基体配置于该第二基体的第二辐射金属层的表面上,于该第三基体表面上具有一第三辐射金属层,该第三天线具有一第三馈入组件,该第三馈入组件与第三辐射金属层电性连接后,分别穿过该第三基体、该第二基体及该第一基体,并且该第三馈入组件穿过该第一基体底面外部不与该接地金属层电性连接。该电路板与穿过该第三基体、该第二基体及该第一基体的该第三馈入组件、该两个第二馈入组件及该两个第一馈入组件电性连接。To achieve the above purpose, the utility model provides a surface-mounted three-stack antenna, including: a first antenna, a second antenna, a third antenna and a circuit board. The first antenna has a first substrate, the surface of the first substrate has a first radiation metal layer, the bottom surface of the first substrate has a ground metal layer, and the first antenna has two A first feed-in component of a base body, the two first feed-in components pass through the first base body and are electrically connected to the first radiation metal layer, the two first feed-in components pass through the bottom surface of the first base body Not electrically connected to the ground metal layer. There is a second substrate on the second antenna, the second substrate is disposed on the surface of the first radiating metal layer of the first substrate, and there is a second radiating metal layer on the surface of the second substrate, the second antenna There are two second feed-in components, the two second feed-in components pass through the second base body and the first base body and are electrically connected with the second radiation metal layer, the two second feed-in components pass through The outside of the bottom surface of the first substrate is not electrically connected to the ground metal layer. There is a third substrate on the third antenna, the third substrate is arranged on the surface of the second radiating metal layer of the second substrate, a third radiating metal layer is arranged on the surface of the third substrate, the third antenna There is a third feed-in component, after the third feed-in component is electrically connected with the third radiating metal layer, and passes through the third base, the second base and the first base respectively, and the third feed-in component The outside of the bottom surface of the first substrate is not electrically connected to the ground metal layer. The circuit board is electrically connected with the third feed-in component passing through the third base, the second base and the first base, the two second feed-in components and the two first feed-in components.

在本实用新型的一实施例中,该第一基体上开设有一第一通孔、一第二通孔、一第三通孔、一第四通孔及一第五通孔,该第一通孔、该第二通孔、该第三通孔、该第四通孔及该第五通孔贯通该第一基体、第一辐射金属层及该接地金属层,并且呈十字形排列。In one embodiment of the present utility model, a first through hole, a second through hole, a third through hole, a fourth through hole and a fifth through hole are opened on the first substrate, and the first through hole The holes, the second through hole, the third through hole, the fourth through hole and the fifth through hole pass through the first substrate, the first radiation metal layer and the ground metal layer, and are arranged in a cross shape.

在本实用新型的一实施例中,该两个第一馈入组件由该第四通孔及该第五通孔贯穿该第一基体。In an embodiment of the present invention, the two first feeding components pass through the first base through the fourth through hole and the fifth through hole.

在本实用新型的一实施例中,该第二基体上设有贯穿该第二基体及该第二辐射金属层的一第六通孔、一第七通孔及一第八通孔,该第六通孔、该第七通孔及该第八通孔分别对应该第一基体的该第一通孔、该第二通孔及该第三通孔。In one embodiment of the present invention, the second substrate is provided with a sixth through hole, a seventh through hole and an eighth through hole penetrating through the second substrate and the second radiating metal layer. The six through holes, the seventh through hole and the eighth through hole respectively correspond to the first through hole, the second through hole and the third through hole of the first substrate.

在本实用新型的一实施例中,该两个第二馈入组件分别穿过该第七通孔及该第八通孔并与该第二辐射金属层电性连接后,该两个第二馈入组件分别再穿过该第二通孔及该第三通孔并延伸于该第一基体底面外部不与该接地金属层电性连接。In an embodiment of the present invention, after the two second feed-in components respectively pass through the seventh through hole and the eighth through hole and are electrically connected with the second radiation metal layer, the two second feed-in components The feed-in component respectively passes through the second through hole and the third through hole and extends outside the bottom surface of the first base without being electrically connected to the ground metal layer.

在本实用新型的一实施例中,该第三基体上设有贯穿该第三基体及该第三辐射金属层的一第九通孔,该第九通孔对应该第二基体的第六通孔及该第一基体的第一通孔。In an embodiment of the present invention, the third base is provided with a ninth through hole penetrating through the third base and the third radiating metal layer, and the ninth through hole corresponds to the sixth through hole of the second base. hole and the first through hole of the first substrate.

在本实用新型的一实施例中,该第三馈入组件穿过该第三基体的第九通孔、该第二基体的第六通孔及该第一基体的第一通孔至该第一基体的底面外部,在该第三馈入组件穿过该第九通孔时与该第三辐射金属层电性连接,而该第三馈入组件穿过该第一基体底面外部不与该接地金属层电性连接。In an embodiment of the present utility model, the third feeding component passes through the ninth through hole of the third base, the sixth through hole of the second base and the first through hole of the first base to the first through hole The outside of the bottom surface of a substrate is electrically connected to the third radiating metal layer when the third feed-in component passes through the ninth through hole, and the third feed-in component passes through the outside of the bottom surface of the first substrate and is not connected to the The ground metal layer is electrically connected.

在本实用新型的一实施例中,该第三馈入组件呈T形状,该第三馈入组件具有一头部,该头部延伸一杆体。In an embodiment of the present invention, the third feed-in component is T-shaped, and the third feed-in component has a head extending from a rod body.

在本实用新型的一实施例中,该电路板具有一正面及一背面,该电路板还具有一第一穿孔、一第二穿孔、一第三穿孔、一第四穿孔及一第五穿孔,该第一穿孔、该第二穿孔、该第三穿孔、该第四穿孔及该第五穿孔分别对应该第一通孔、该第二通孔、该第三通孔、该第四通孔及该第五通孔。In one embodiment of the present invention, the circuit board has a front and a back, and the circuit board also has a first through hole, a second through hole, a third through hole, a fourth through hole and a fifth through hole, The first through hole, the second through hole, the third through hole, the fourth through hole and the fifth through hole respectively correspond to the first through hole, the second through hole, the third through hole, the fourth through hole and the the fifth through hole.

在本实用新型的一实施例中,该第一穿孔、该第二穿孔、该第三穿孔、该第四穿孔及该第五穿孔位于该背面上各具有一电性接点,各电性接点的一端延伸有一电性固接点,该两个第一馈入组件及该两个第二馈入组件与该第三馈入组件穿过该第一天线的第一基体底面外部,并依序的穿过该第四穿孔、该第五穿孔及该第二穿孔、该第三穿孔与该第一穿孔而与该电路板背面的电性接点电性连接。In one embodiment of the present invention, the first through hole, the second through hole, the third through hole, the fourth through hole and the fifth through hole each have an electrical contact on the back surface, and each electrical contact One end extends an electrical connection point, the two first feed-in components, the two second feed-in components and the third feed-in component pass through the outside of the bottom surface of the first substrate of the first antenna, and sequentially pass through The fourth through hole, the fifth through hole, the second through hole, the third through hole and the first through hole are electrically connected to the electrical contacts on the back of the circuit board.

在本实用新型的一实施例中,该第二基体的面积小于该第一辐射金属层的面积,在该第二基体配置于该第一辐射金属层的表面时,使该第一辐射金属层外露。In an embodiment of the present invention, the area of the second base is smaller than the area of the first radiating metal layer, and when the second base is arranged on the surface of the first radiating metal layer, the first radiating metal layer exposed.

在本实用新型的一实施例中,该第三基体的面积小于该第二辐射金属层的面积,在该第三基体配置于该第二辐射金属层的表面时,使该第二辐射金属层外露。In an embodiment of the present invention, the area of the third base is smaller than the area of the second radiating metal layer, and when the third base is arranged on the surface of the second radiating metal layer, the second radiating metal layer exposed.

在本实用新型的一实施例中,该第一基体、该第二基体及该第三基体为陶瓷介质材料制成的扁形的板状体或块状体。In an embodiment of the present utility model, the first base body, the second base body and the third base body are flat plate-shaped bodies or block-shaped bodies made of ceramic dielectric materials.

附图说明Description of drawings

图1为本实用新型的表面粘着式的三堆叠天线分解示意图;Fig. 1 is the exploded schematic view of the three-stack antenna of the surface mount type of the present invention;

图2为本实用新型中的电路板的背面示意图;Fig. 2 is the back schematic diagram of the circuit board in the utility model;

图3为本实用新型的表面粘着式的三堆叠天线组合示意图;FIG. 3 is a schematic diagram of a surface-mounted three-stack antenna assembly of the present invention;

图4为本实用新型的表面粘着式的三堆叠天线侧剖视示意;Fig. 4 is a schematic side sectional view of a surface-mounted three-stack antenna of the present invention;

图5为本实用新型的表面粘着式的三堆叠天线与电子器物的主板电性固接的第一状态的示意图;5 is a schematic diagram of a first state in which the surface-mounted three-stack antenna of the present invention is electrically fixed to the main board of the electronic device;

图6为本实用新型的表面粘着式的三堆叠天线与电子器物的主板电性固接的第二状态的示意图。6 is a schematic diagram of a second state in which the surface-mounted three-stack antenna of the present invention is electrically fixed to the main board of the electronic device.

附图中的符号说明:Explanation of symbols in the accompanying drawings:

10 表面粘着式的三堆叠天线;1 第一天线;11 第一基体;12 第一辐射金属层;13接地金属层;14 第一通孔;15 第二通孔;16 第三通孔;17 第四通孔;18 第五通孔;19a、19b 第一馈入组件;2 第二天线;21 第二基体;22 第二辐射金属层;23 第六通孔;24 第七通孔;25 第八通孔;26a、26b 第二馈入组件;3 第三天线;31 第三基体;32 第三辐射金属层;33 第九通孔;34 第三馈入组件;341 头部;342 杆体;4 电路板;41 正面;42 背面;43第一穿孔;44 第二穿孔;45 第三穿孔;46 第四穿孔;47 第五穿孔;48 电性接点;49 电性固接点;20 主板。10 surface-mounted three-stack antenna; 1 first antenna; 11 first substrate; 12 first radiation metal layer; 13 ground metal layer; 14 first through hole; 15 second through hole; 16 third through hole; 17 The fourth through hole; 18 The fifth through hole; 19a, 19b The first feeding component; 2 The second antenna; 21 The second substrate; 22 The second radiation metal layer; 23 The sixth through hole; 24 The seventh through hole; 25 8th through hole; 26a, 26b second feeding component; 3 third antenna; 31 third substrate; 32 third radiation metal layer; 33 ninth through hole; 34 third feeding component; 341 head; 342 rod body ; 4 circuit board; 41 front; 42 back; 43 first perforation; 44 second perforation; 45 third perforation; 46 fourth perforation; 47 fifth perforation; 48 electrical contacts;

具体实施方式Detailed ways

有关本实用新型的技术内容及详细说明,现在配合图式说明如下:Relevant technical content and detailed description of the present utility model, cooperate drawing description now as follows:

请参阅图1至4所示,为本实用新型的表面粘着式的三堆叠天线分解、组合、侧剖及电路板的背面示意图。如图所示:本实用新型的表面粘着式的三堆叠天线10,包括:一第一天线1、一第二天线2、一第三天线3及一电路板4。其中,将该第一天线1、该第二天线2及该第三天线3堆叠呈近似锥状的表面粘着式的三堆叠天线10,以下简称三堆叠天线10,并将该三堆叠天线10电性固接于该电路板4上,以形成可以表面粘着于电子设备的主板(图中未示)的表面粘着式的三堆叠天线10。Please refer to FIGS. 1 to 4 , which are schematic diagrams of disassembly, assembly, side section and the back of the circuit board of the surface-mounted three-stack antenna of the present invention. As shown in the figure: the surface-mounted three-stack antenna 10 of the present invention includes: a first antenna 1 , a second antenna 2 , a third antenna 3 and a circuit board 4 . Wherein, the first antenna 1, the second antenna 2 and the third antenna 3 are stacked to form a three-stack antenna 10 of an approximately cone-shaped surface mount type, hereinafter referred to as the three-stack antenna 10, and the three-stack antenna 10 is electrically Permanently fixed on the circuit board 4 to form a surface-mounted three-stack antenna 10 that can be surface-mounted to the main board (not shown in the figure) of the electronic device.

该第一天线1,其上具有一第一基体11,该第一基体11的表面具有一第一辐射金属层12,该第一基体11的底面具有一接地金属层13,该第一基体11上开设有一第一通孔14、一第二通孔15、一第三通孔16、一第四通孔17及一第五通孔18,该第一通孔14、该第二通孔15、该第三通孔16、该第四通孔17及该第五通孔18贯通该第一基体11、第一辐射金属层12及该接地金属层13,并且呈十字形排列。另外,于该第一天线1上还包含有两个第一馈入组件19a、19b,该两个第一馈入组件19a、19b由该第四通孔17及该第五通孔18贯穿该第一基体11并与该第一辐射金属层12电性连接,在该两个第一馈入组件19a、19b穿过该第一基体11底面外部后不与该接地金属层13电性连接。在本图式中,该第一基体11为陶瓷介质材料制成的扁形的板状体或块状体。The first antenna 1 has a first substrate 11 on it, the surface of the first substrate 11 has a first radiation metal layer 12, the bottom surface of the first substrate 11 has a ground metal layer 13, the first substrate 11 Provide a first through hole 14, a second through hole 15, a third through hole 16, a fourth through hole 17 and a fifth through hole 18, the first through hole 14, the second through hole 15 , the third through hole 16 , the fourth through hole 17 and the fifth through hole 18 pass through the first substrate 11 , the first radiation metal layer 12 and the ground metal layer 13 and are arranged in a cross shape. In addition, the first antenna 1 also includes two first feeding components 19a, 19b, and the two first feeding components 19a, 19b pass through the fourth through hole 17 and the fifth through hole 18. The first base body 11 is also electrically connected to the first radiation metal layer 12 , and is not electrically connected to the ground metal layer 13 after the two first feeding components 19 a , 19 b pass through the outside of the bottom surface of the first base body 11 . In this drawing, the first substrate 11 is a flat plate or block made of ceramic dielectric material.

该第二天线2,其上具有一第二基体21,该第二基体21配置于该第一基体11的第一辐射金属层12的表面上,该第二基体21的面积小于该第一辐射金属层12的面积,在该第二基体21配置于该第一辐射金属层12的表面时,使该第一辐射金属层12外露。另外,于该第二基体21表面上具有一第二辐射金属层22,该第二基体21上设有贯穿该第二基体21及该第二辐射金属层22的一第六通孔23、一第七通孔24及一第八通孔25,该第六通孔23、第七通孔24及该第八通孔25分别对应该第一基体11的该第一通孔14、该第二通孔15及该第三通孔16。该第二天线2还包含两个第二馈入组件26a、26b,该两个第二馈入组件26a、26b分别穿过该第七通孔24及该第八通孔25并与该第二辐射金属层22电性连接后,该两个第二馈入组件26a、26b分别再穿过该第二通孔15及该第三通孔16并延伸于该第一基体11底面外部后不与该接地金属层13电性连接。在本图式中,该第二基体21为陶瓷介质材料制成的扁形的板状体或块状体。The second antenna 2 has a second substrate 21 disposed on the surface of the first radiation metal layer 12 of the first substrate 11. The area of the second substrate 21 is smaller than that of the first radiation The area of the metal layer 12 exposes the first radiating metal layer 12 when the second base 21 is disposed on the surface of the first radiating metal layer 12 . In addition, there is a second radiating metal layer 22 on the surface of the second base 21, and the second base 21 is provided with a sixth through hole 23 penetrating through the second base 21 and the second radiating metal layer 22, a The seventh through hole 24 and an eighth through hole 25, the sixth through hole 23, the seventh through hole 24 and the eighth through hole 25 respectively correspond to the first through hole 14, the second through hole 11 of the first substrate 11. The through hole 15 and the third through hole 16 . The second antenna 2 also includes two second feed-in components 26a, 26b, the two second feed-in components 26a, 26b pass through the seventh through hole 24 and the eighth through hole 25 respectively and communicate with the second After the radiation metal layer 22 is electrically connected, the two second feed-in components 26a, 26b pass through the second through hole 15 and the third through hole 16 respectively and extend outside the bottom surface of the first substrate 11 without contact with The ground metal layer 13 is electrically connected. In this drawing, the second substrate 21 is a flat plate or block made of ceramic dielectric material.

该第三天线3,其上具有一第三基体31,该第三基体31配置于该第二基体21的第二辐射金属层22的表面上,该第三基体31的面积小于该第二辐射金属层22的面积,在该第三基体31配置于该第二辐射金属层22的表面时,使该第二辐射金属层22外露。另外,于该第三基体31表面上具有一第三辐射金属层32,该第三基体31上设有贯穿该第三基体31及该第三辐射金属层32的一第九通孔33,该第九通孔33对应该第二基体21的第六通孔23及该第一基体11的第一通孔14。该第三天线3还包含有一第三馈入组件34,该第三馈入组件34呈T形状,该第三馈入组件34具有一头部341,该头部341延伸一杆体342,该杆体342穿过该第三基体31的第九通孔33、该第二基体21的第六通孔23及该第一基体11的第一通孔14至该第一基体11的底面外部。在该第三馈入组件34穿过该第九通孔33时与该第三辐射金属层32电性连接,在该第三馈入组件34穿过该第一基体11底面外部时不与该接地金属层13电性连接。在本图式中,该第三基体31为陶瓷介质材料制成的扁形的板状体或块状体。The third antenna 3 has a third substrate 31 disposed on the surface of the second radiating metal layer 22 of the second substrate 21, and the area of the third substrate 31 is smaller than that of the second radiating metal layer. The area of the metal layer 22 exposes the second radiating metal layer 22 when the third base 31 is disposed on the surface of the second radiating metal layer 22 . In addition, there is a third radiating metal layer 32 on the surface of the third base body 31, and a ninth through hole 33 penetrating through the third base body 31 and the third radiating metal layer 32 is provided on the third base body 31. The ninth through hole 33 corresponds to the sixth through hole 23 of the second base 21 and the first through hole 14 of the first base 11 . The third antenna 3 also includes a third feed component 34, the third feed component 34 is T-shaped, the third feed component 34 has a head 341, the head 341 extends a rod 342, the rod 342 passes through the ninth through hole 33 of the third base 31 , the sixth through hole 23 of the second base 21 and the first through hole 14 of the first base 11 to the outside of the bottom surface of the first base 11 . When the third feeding component 34 passes through the ninth through hole 33, it is electrically connected with the third radiation metal layer 32, and when the third feeding component 34 passes through the outside of the bottom surface of the first substrate 11, it does not connect with the third feeding component 34. The ground metal layer 13 is electrically connected. In this drawing, the third substrate 31 is a flat plate or block made of ceramic dielectric material.

该电路板4,其具有一正面41及一背面42,该正面41为一粘合区,可布设粘胶或双面胶的任一种,该电路板4上具有一第一穿孔43、一第二穿孔44、一第三穿孔45、一第四穿孔46及一第五穿孔47,该第一穿孔43、该第二穿孔44、该第三穿孔45、该第四穿孔46及该第五穿孔47分别对应该第一通孔14、该第二通孔15、该第三通孔16、该第四通孔17及该第五通孔18。该第一穿孔43、该第二穿孔44、该第三穿孔45、该第四穿孔46及该第五穿孔47位于该背面42上各具有一电性接点48,各电性接点48的一端延伸有一电性固接点49。在该两个第一馈入组件19a、19b及该两个第二馈入组件26a、26b与该第三馈入组件34穿过该第一天线1的第一基体11底面外部后,再依序的穿过该第四穿孔46、该第五穿孔47及该第二穿孔44、该第三穿孔45与该第一穿孔43并与该电路板4背面42的电性接点48电性连接。再通过该电路板4的电性固接点49与电子器物的主板(图中未示)电性固接。The circuit board 4 has a front side 41 and a back side 42, the front side 41 is a bonding area, any one of viscose or double-sided adhesive can be laid, the circuit board 4 has a first perforation 43, a The second through hole 44, a third through hole 45, a fourth through hole 46 and a fifth through hole 47, the first through hole 43, the second through hole 44, the third through hole 45, the fourth through hole 46 and the fifth through hole The through holes 47 respectively correspond to the first through hole 14 , the second through hole 15 , the third through hole 16 , the fourth through hole 17 and the fifth through hole 18 . The first through hole 43 , the second through hole 44 , the third through hole 45 , the fourth through hole 46 and the fifth through hole 47 each have an electrical contact 48 on the back surface 42 , and one end of each electrical contact 48 extends There is an electrical fixed point 49 . After the two first feed-in components 19a, 19b, the two second feed-in components 26a, 26b and the third feed-in component 34 pass through the outside of the bottom surface of the first substrate 11 of the first antenna 1, then Pass through the fourth through hole 46 , the fifth through hole 47 , the second through hole 44 , the third through hole 45 and the first through hole 43 in sequence and electrically connect with the electrical contacts 48 on the back surface 42 of the circuit board 4 . Then, through the electrical fixing point 49 of the circuit board 4, it is electrically fixed to the main board (not shown in the figure) of the electronic device.

请参阅图4所示,为本实用新型的表面粘着式的三堆叠天线侧剖视示意。如图所示:在本实用新型的该第一基体11、该第二基体21及该第三基体31依序的堆叠后,以该两个第一馈入组件19a、19b,两个第二馈入组件26a、26b及该第三馈入组件34分别穿过该第一穿孔43、该第二穿孔44、该第三穿孔45、该第四穿孔46及该第五穿孔47与电路板4的电性接点48连接后,形成具有该第一天线1、该第二天线2及该第三天线3在一起的表面粘着式的三堆叠天线。Please refer to FIG. 4 , which is a schematic side sectional view of the surface-mounted three-stack antenna of the present invention. As shown in the figure: after the first base body 11, the second base body 21 and the third base body 31 of the present utility model are sequentially stacked, the two first feed-in components 19a, 19b, the two second feed-in components The feed-in components 26a, 26b and the third feed-in component 34 respectively pass through the first through hole 43, the second through hole 44, the third through hole 45, the fourth through hole 46 and the fifth through hole 47 and the circuit board 4 After the electrical contacts 48 are connected, a surface-mounted three-stack antenna with the first antenna 1 , the second antenna 2 and the third antenna 3 together is formed.

在该第一天线1、该第二天线2及该第三天线3堆叠后,该第一天线1形成可接收GPSL5/L2信号频率为1100MHZ-1250MHZ。该第二天线2形成可接收GPS/GNSS/Beidou信号频率为1500MHZ-1650MHZ。该第三天线3形成可接收SDARS/WLAN信号频率为2300MHZ-2500MHZAfter the first antenna 1 , the second antenna 2 and the third antenna 3 are stacked, the first antenna 1 can receive the GPSL5/L2 signal at a frequency of 1100MHZ - 1250MHZ . The second antenna 2 can receive GPS/GNSS/Beidou signals with a frequency of 1500MHZ - 1650MHZ . The third antenna 3 can receive SDARS/WLAN signals with a frequency of 2300MHZ - 2500MHZ .

请参阅图5、6所示,为本实用新型的表面粘着式的三堆叠天线与电子器物的主板电性固接的第一、第二状态的示意图。如图所示:当本实用新型的该第一天线1、该第二天线2及该第三天线3与该电路板4组合成表面粘着式的三堆叠天线10后,以该电路板4背面的电性固接点49与电子器物的主板20电性连接后,该两个第一馈入组件19a、19b,两个第二馈入组件26a、26b及该第三馈入组件34所接收的信号将传至该主板20上处理。Please refer to FIGS. 5 and 6 , which are schematic views of the first and second states of the surface-mounted three-stack antenna of the present invention being electrically fixed to the main board of the electronic device. As shown in the figure: when the first antenna 1, the second antenna 2, and the third antenna 3 of the present invention are combined with the circuit board 4 to form a surface-mounted three-stack antenna 10, the back of the circuit board 4 After the electrical fixed point 49 is electrically connected to the main board 20 of the electronic device, the two first feed-in components 19a, 19b, the two second feed-in components 26a, 26b and the third feed-in component 34 receive The signal will be transmitted to the main board 20 for processing.

由于该三堆叠天线以表面粘着的方式电性连接在电子装置的主板20上,可大幅度降低组装的人力,提升效率及使用上的简便性。Since the three-stack antenna is electrically connected to the main board 20 of the electronic device in a surface-adhesive manner, manpower for assembly can be greatly reduced, and efficiency and ease of use can be improved.

以上所述仅为本实用新型的较佳实施例,并非要局限本实用新型的专利保护范围,因此举凡运用本实用新型说明书或图式内容所做的等效变化,均同理皆包含于本实用新型的权利保护范围内,合予陈明。The above descriptions are only preferred embodiments of the present utility model, and are not intended to limit the scope of patent protection of the present utility model. Therefore, all equivalent changes made by using the description or drawings of the utility model are all included in this utility model in the same way. Within the scope of protection of utility model rights, it is agreed to Chen Ming.

Claims (10)

1. the three of a kind of surface adhesive type stack antenna, which is characterized in that including:
There is in the first antenna one first antenna one first matrix, the surface of first matrix to have one first radiation metal Layer, the bottom surface of first matrix have a ground metal layer, and in tool in the first antenna, there are two pass through the of first matrix One feed-in component, this two the first feed-in components pass through first matrix to be electrically connected with the first radiation metal layer, this two First feed-in component passes through the bottom surface of first matrix not to be electrically connected with the ground metal layer;
There is on second antenna one second antenna one second matrix, second matrix to be configured at the first spoke of first matrix It penetrates on the surface of metal layer, in having one second radiation metal layer on second matrix surface, there are two for second antenna tool Two feed-in components, this two the second feed-in components be each passed through second matrix and first matrix and with second radiation metal Layer is electrically connected, this two the second feed-in components are passed through and are not electrically connected with the ground metal layer outside the first matrix bottom surface;
There is on the third antenna one third antenna a third matrix, the third matrix to be configured at the second spoke of second matrix It penetrates on the surface of metal layer, in having a third radiation metal layer on the third matrix surface, the third antenna is with a third Feed-in component is each passed through the third matrix, second base after the third feed-in component is electrically connected with third radiation metal layer Body and first matrix, and the third feed-in component passes through and does not connect electrically with the ground metal layer outside the first matrix bottom surface It connects;
One circuit board, with across the third matrix, second matrix and first matrix the third feed-in component, this two Two feed-in components and this two the first feed-in components are electrically connected.
2. the three of surface adhesive type as described in claim 1 stack antenna, which is characterized in that wherein, opened on first matrix Equipped with a first through hole, one second through-hole, a third through-hole, a fourth hole and a fifth hole, the first through hole, this second Through-hole, the third through-hole, the fourth hole and the fifth hole penetrate through first matrix, the first radiation metal layer and ground connection gold Belong to layer, and be in cross-shaped arrangement, this two the first feed-in components run through first base by the fourth hole and the fifth hole Body.
3. the three of surface adhesive type as claimed in claim 2 stack antenna, which is characterized in that wherein, set on second matrix There are one the 6th through-hole, one the 7th through-hole and one the 8th through-hole through second matrix and the second radiation metal layer, the 6th Through-hole, the 7th through-hole and the 8th through-hole correspond to the first through hole, second through-hole and third of first matrix respectively Through-hole, this two the second feed-in components are each passed through the 7th through-hole and the 8th through-hole and electrical with the second radiation metal layer After connection, this two the second feed-in components are then passed through second through-hole and the third through-hole and extend the first matrix bottom respectively It is not electrically connected with the ground metal layer outside face.
4. the three of surface adhesive type as claimed in claim 3 stack antenna, which is characterized in that wherein, set on the third matrix There are one the 9th through-hole through the third matrix and the third radiation metal layer, the 9th through-hole to correspond to the 6th of second matrix The first through hole of through-hole and first matrix.
5. the three of surface adhesive type as claimed in claim 4 stack antenna, which is characterized in that wherein, the third feed-in component First through hole across the 9th through-hole of the third matrix, the 6th through-hole of second matrix and first matrix is to first base It outside the bottom surface of body, is electrically connected, and is somebody's turn to do with the third radiation metal layer when the third feed-in component passes through nine through-holes Third feed-in component is passed through and is not electrically connected with the ground metal layer outside the first matrix bottom surface.
6. the three of surface adhesive type as described in claim 1 stack antenna, which is characterized in that wherein, the third feed-in component There is a head, the head to extend a body of rod for t shape, the third feed-in component.
7. the three of surface adhesive type as claimed in claim 5 stack antenna, which is characterized in that wherein, which has one Front and a back side, the circuit board also have one first perforation, one second perforation, third perforation, one the 4th perforation and one the Five perforation, this first perforation, this second perforation, the third perforation, the 4th perforation and the 5th perforation correspond to respectively this first Through-hole, second through-hole, the third through-hole, the fourth hole and the fifth hole, first perforation, second perforation, this Three perforation, the 4th perforation and the 5th perforation, which are located on the back side, respectively has an electrical contact, and one end of each electrical contact is prolonged Stretching has an electrical affixed point, this two the first feed-in components and this two the second feed-in components are passed through with the third feed-in component and are somebody's turn to do Outside first matrix bottom surface of first antenna, and sequentially pass through the 4th perforation, the 5th perforation and second perforation, this Three, which perforate, is electrically connected with first perforation with the electrical contact of the back of circuit board.
8. the three of surface adhesive type as described in claim 1 stack antenna, which is characterized in that wherein, the face of second matrix Product makes this less than the area of the first radiation metal layer when second matrix is configured at the surface of the first radiation metal layer First radiation metal layer is exposed.
9. the three of surface adhesive type as described in claim 1 stack antenna, which is characterized in that wherein, the face of the third matrix Product makes this less than the area of the second radiation metal layer when the third matrix is configured at the surface of the second radiation metal layer Second radiation metal layer is exposed.
10. the three of surface adhesive type as described in claim 1 stack antenna, which is characterized in that wherein, which is somebody's turn to do Second matrix and plate body or blocks that the third matrix is flat made of ceramic medium material.
CN201820256994.7U 2018-02-13 2018-02-13 The three of surface adhesive type stack antenna Active CN207977457U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110165387A (en) * 2018-02-13 2019-08-23 陶格斯集团有限公司 The three of surface adhesive type stack antenna

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110165387A (en) * 2018-02-13 2019-08-23 陶格斯集团有限公司 The three of surface adhesive type stack antenna

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