CN207968667U - Novel camera module - Google Patents

Abstract

The embodiment of the utility model discloses novel camera module, including optical lens, light sense device and light filter, the light sense device includes: the first photosensitive chip is used for receiving the visible light emitted from the optical lens and inducing to generate a two-dimensional image information electric signal corresponding to the shot object; the second photosensitive chip is used for receiving the infrared light emitted from the optical lens and inducing to generate a depth information electric signal corresponding to the shot object; and the optical filter is positioned between the optical lens and the second photosensitive chip and used for reflecting visible light to the first photosensitive chip and transmitting infrared light to the second photosensitive chip. The embodiment of the utility model provides a through design light filter, first sensitization chip and second sensitization chip, make the visible light reflection get into first sensitization chip, the infrared light then transmits and gets into second sensitization chip to can acquire high definition two-dimensional image signal simultaneously and contain the three-dimensional image signal of degree of depth information, make abundant preparation for the later stage through software fitting generation 3D high definition image.

Description

New camera module

Technical field:

The utility model relates to a novel camera module.

Background technique:

The existing camera module at least includes an optical lens and a photosensitive device opposite to the optical lens. The photosensitive device is located on the light exit path of the optical lens, and is used to receive the light emitted from the optical lens and generate corresponding electrical signals. It is generally a 2D photosensitive chip, such as a CMOS image sensor or a CCD image sensor, but it can only Generate high-definition 2D image information, but cannot provide depth information.

Invention content:

In order to overcome the problem that the existing camera module can only generate high-definition 2D image information but cannot provide depth information, the embodiment of the utility model provides a new camera module.

A new type of camera module, including an optical lens, a photosensitive device located on the light exit path of the optical lens, and a filter, the photosensitive device includes:

The first photosensitive chip is used to receive visible light emitted from the optical lens and generate a two-dimensional image information electrical signal corresponding to the subject; and

The second photosensitive chip is used to receive the infrared light emitted from the optical lens and generate a depth information electrical signal corresponding to the object to be photographed;

The optical filter is located between the optical lens and the second photosensitive chip, and is used for reflecting visible light to the first photosensitive chip and transmitting infrared light to the second photosensitive chip.

In the embodiment of the utility model, by designing the optical filter, the first photosensitive chip and the second photosensitive chip, the visible light is reflected into the first photosensitive chip, and the infrared light is transmitted into the second photosensitive chip, thereby simultaneously obtaining high-definition two-dimensional image signals, And the 3D image signal containing depth information is fully prepared for the later generation of 3D high-definition images through software fitting.

Description of drawings:

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some implementations of the present invention. For example, those of ordinary skill in the art can also obtain other drawings based on these drawings on the premise of not paying creative efforts.

FIG. 1 is a schematic structural diagram of a new camera module according to an embodiment of the present invention.

Detailed ways:

In order to make the technical problems, technical solutions and beneficial effects solved by the utility model clearer, the utility model will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model, and are not intended to limit the utility model.

When the embodiments of the present invention refer to "first", "second" and other ordinal numerals, unless they really express the order according to the context, it should be understood that they are only used for distinction.

In the description of the present utility model, it should be noted that, unless otherwise clearly stipulated and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a flexible connection. Detachable connection, or integral connection; it can be mechanical connection or electrical connection; it can be direct connection or indirect connection through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations.

As shown in Figure 1, the embodiment of the utility model provides a new type of camera module, including an optical lens 1, a photosensitive device located on the light exit path of the optical lens 1, and a filter 3, and the photosensitive device includes:

The first photosensitive chip 21 is used to receive the visible light emitted from the optical lens 1 and generate a two-dimensional image information electrical signal corresponding to the subject; and

The second photosensitive chip 22 is used to receive the infrared light emitted from the optical lens 1 and generate a depth information electrical signal corresponding to the object;

The filter 3 is located between the optical lens 1 and the second photosensitive chip 22 , and is used for reflecting visible light to the first photosensitive chip 21 and transmitting infrared light to the second photosensitive chip 22 .

In the embodiment of the utility model, by designing the optical filter, the first photosensitive chip and the second photosensitive chip, the visible light is reflected into the first photosensitive chip, and the infrared light is transmitted into the second photosensitive chip, thereby simultaneously obtaining high-definition two-dimensional image signals, And the 3D image signal containing depth information is fully prepared for the later generation of 3D high-definition images through software fitting.

In this embodiment, the depth information refers to distance information. In this embodiment, a single lens is used, and the principle of refraction of light is used to realize the simultaneous viewing of two chips, without the need to calibrate the field of view, and a 3D high-definition image can be generated through software fitting in the later stage. It can be applied to fields including but not limited to 3D modeling, ATM machine alarm, face/gesture recognition, human flow monitoring, somatosensory games, intelligent robot obstacle avoidance, automatic driving, etc.

In this embodiment, the optical lens may be, but not limited to, a lens composed of four, five, six, seven or eight lenses.

Further, as a specific embodiment without limitation, the filter 3 is arranged obliquely. Simple structure.

Still further, as a preferred embodiment without limitation, the angle between the filter 3 and the second photosensitive chip 22 is 30° to 60°. The structure is simple and can ensure that the optical axis of visible light enters the first photosensitive chip vertically.

Furthermore, as a specific implementation but not limitation, the angle between the filter 3 and the second photosensitive chip 22 is 45°. The structure is simple, and the optical axis of visible light can enter the first photosensitive chip vertically.

Still further, as a specific implementation but not limitation, the first photosensitive chip 21 is located above the second photosensitive chip 22 and is perpendicular to the second photosensitive chip 22 . The structure is simple and the layout is reasonable.

Still further, as a specific embodiment without limitation, the first photosensitive chip 21 is a CMOS image sensor or a CCD image sensor, and its pixel size is 1280*960.

Furthermore, as a specific implementation manner without limitation, the second photosensitive chip 22 is a 3D photosensitive chip with at least 320*240 pixels. Including but not limited to TOF chips. Of course, other 3D light-sensing chips produced by companies such as Infineon and Texas Instruments can also be used.

The foregoing is one or more implementations provided in conjunction with specific content, and it is not considered that the specific implementation of the present utility model is limited to these descriptions. Anything similar to or identical to the method and structure of the present utility model, or some technical deduction or replacement made on the premise of the concept of the present utility model, should be regarded as the protection scope of the utility model.

Claims (7)

1. A novel camera module, comprising an optical lens and a photosensitive device positioned on the light exit path of the optical lens, characterized in that it also includes an optical filter, and the photosensitive device includes: The first photosensitive chip is used to receive visible light emitted from the optical lens and generate a two-dimensional image information electrical signal corresponding to the subject; and The second photosensitive chip is used to receive the infrared light emitted from the optical lens and generate a depth information electrical signal corresponding to the object to be photographed; The optical filter is located between the optical lens and the second photosensitive chip, and is used for reflecting visible light to the first photosensitive chip and transmitting infrared light to the second photosensitive chip. 2. The novel camera module according to claim 1, characterized in that the optical filter is arranged obliquely. 3. The new camera module according to claim 1 or 2, characterized in that the angle between the filter and the second photosensitive chip is 30-60°. 4. The novel camera module according to claim 3, wherein the angle between the optical filter and the second photosensitive chip is 45°. 5. The novel camera module according to claim 4, wherein the first photosensitive chip is located above the second photosensitive chip and is perpendicular to the second photosensitive chip. 6. The novel camera module according to claim 5, wherein the first photosensitive chip is a CMOS image sensor or a CCD image sensor. 7. The novel camera module according to claim 5, wherein the second photosensitive chip is a 3D photosensitive chip.