CN207967026U - 电池片载板翻转机构及电池片镀膜工艺生产线 - Google Patents
电池片载板翻转机构及电池片镀膜工艺生产线 Download PDFInfo
- Publication number
- CN207967026U CN207967026U CN201820347129.3U CN201820347129U CN207967026U CN 207967026 U CN207967026 U CN 207967026U CN 201820347129 U CN201820347129 U CN 201820347129U CN 207967026 U CN207967026 U CN 207967026U
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- cell piece
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- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
- H10F77/311—Coatings for devices having potential barriers for photovoltaic cells
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electroplating Methods And Accessories (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
Abstract
Description
Claims (10)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820347129.3U CN207967026U (zh) | 2018-03-14 | 2018-03-14 | 电池片载板翻转机构及电池片镀膜工艺生产线 |
PCT/CN2018/097492 WO2019174174A1 (zh) | 2018-03-14 | 2018-07-27 | 翻转机构及镀膜生产线 |
EP18186253.3A EP3540790A1 (en) | 2018-03-14 | 2018-07-30 | Turnover mechanism and coating production line |
US16/048,746 US20190284680A1 (en) | 2018-03-14 | 2018-07-30 | Turnover mechanism and coating production line |
KR2020180003511U KR20190002361U (ko) | 2018-03-14 | 2018-07-30 | 플리핑 기구 및 코팅 생산 라인 |
JP2018002930U JP3218390U (ja) | 2018-03-14 | 2018-07-30 | 反転機構及びフィルムコーティング生産ライン |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820347129.3U CN207967026U (zh) | 2018-03-14 | 2018-03-14 | 电池片载板翻转机构及电池片镀膜工艺生产线 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN207967026U true CN207967026U (zh) | 2018-10-12 |
Family
ID=63103796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201820347129.3U Expired - Fee Related CN207967026U (zh) | 2018-03-14 | 2018-03-14 | 电池片载板翻转机构及电池片镀膜工艺生产线 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20190284680A1 (zh) |
EP (1) | EP3540790A1 (zh) |
JP (1) | JP3218390U (zh) |
KR (1) | KR20190002361U (zh) |
CN (1) | CN207967026U (zh) |
WO (1) | WO2019174174A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109698153A (zh) * | 2019-01-22 | 2019-04-30 | 通威太阳能(安徽)有限公司 | 一种太阳能电池片翻转机构 |
CN109772731A (zh) * | 2019-03-12 | 2019-05-21 | 哈工大机器人(山东)智能装备研究院 | 18650型锂电池分选磁流变液机扫码装置及工作方法 |
CN111532737A (zh) * | 2020-04-22 | 2020-08-14 | 广东生波尔光电技术有限公司 | 一种可实现多规格产品的180°自动翻转机构 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102454698B1 (ko) * | 2020-07-23 | 2022-10-17 | 주식회사 로보스타 | 텔레스코픽 암 로봇 |
CN114032521B (zh) * | 2021-10-11 | 2023-05-30 | 桂林芯隆科技有限公司 | 一种bar条光学镀膜无损伤夹具 |
CN113823579B (zh) * | 2021-11-19 | 2023-11-17 | 杭州中欣晶圆半导体股份有限公司 | 一种硅片表面缺口检测装置 |
CN114859067A (zh) * | 2022-04-26 | 2022-08-05 | 厦门微亚智能科技有限公司 | 一种膜缺陷检测设备 |
CN115464890B (zh) * | 2022-08-24 | 2024-11-08 | 安徽天航机电有限公司 | 一种薄壁金属垫片双面涂胶装置及其使用方法 |
Family Cites Families (23)
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US2967630A (en) * | 1958-02-26 | 1961-01-10 | Coe Mfg Co | Apparatus for handling rigid sheet material |
US4573863A (en) * | 1984-11-13 | 1986-03-04 | St. Regis Corporation | Fluid driven tube positioner |
US4798282A (en) * | 1987-11-17 | 1989-01-17 | Hitech Robotics Ltd. | Zoning conveyor |
IT1219110B (it) * | 1988-03-15 | 1990-05-03 | Prima Ind Spa | Dispositivo manipolatore di pezzi di lamiera per una pressa piegatrice e procedimento per la fabbricazione di pezzi profilati di lamiera mediante piegatura alla pressa |
EP0511751B1 (en) * | 1991-04-30 | 1996-03-20 | Emhart Inc. | Apparatus for setting blind rivets |
JPH0555342A (ja) * | 1991-08-26 | 1993-03-05 | Hitachi Ltd | ウエーハチヤツクおよびウエーハ搬送装置 |
JPH06156721A (ja) * | 1992-11-19 | 1994-06-03 | Fuji Electric Co Ltd | 板材の旋回装置 |
US5421889A (en) * | 1993-06-29 | 1995-06-06 | Tokyo Electron Limited | Method and apparatus for inverting samples in a process |
US5924545A (en) * | 1996-03-18 | 1999-07-20 | Isi Norgren Inc. | Rotatable shuttle transfer unit |
JP2909432B2 (ja) * | 1996-05-30 | 1999-06-23 | 芝浦メカトロニクス株式会社 | スピン洗浄処理ユニット |
DE10121115A1 (de) * | 2001-04-28 | 2002-10-31 | Leica Microsystems | Haltevorrichtung für Wafer |
JP4467367B2 (ja) * | 2004-06-22 | 2010-05-26 | 大日本スクリーン製造株式会社 | 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法 |
CN1976851B (zh) * | 2004-07-22 | 2011-06-15 | 平田机工株式会社 | 搬送装置 |
DE102005056378A1 (de) * | 2005-11-24 | 2007-05-31 | Heiko Schmidt | Verfahren zum Einbringen und Verankern wenigstens eines Verbindungselementes in einem Werkstück sowie Vorrichtung zum Durchführen des Verfahrens |
US7188721B1 (en) * | 2006-02-10 | 2007-03-13 | Chunghwa Picture Tubes, Ltd. | Adjustment apparatus |
CN201377004Y (zh) * | 2009-03-10 | 2010-01-06 | 睿明科技股份有限公司 | 硬式基板的取件机构 |
CN101988190A (zh) * | 2010-05-25 | 2011-03-23 | 东莞宏威数码机械有限公司 | 镀膜基片前置处理装置及前置处理方法 |
CN103687795B (zh) * | 2011-07-21 | 2016-05-11 | 蒂森克虏伯系统工程股份有限公司 | 用于在传送装置上停止和/或对准运输货物的器件和方法以及传送装置 |
CH705297A1 (de) * | 2011-07-21 | 2013-01-31 | Tecan Trading Ag | Greiferzange mit austauschbaren Greiferfingern. |
JP6045869B2 (ja) * | 2012-10-01 | 2016-12-14 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
CN103611715B (zh) * | 2013-11-18 | 2016-02-03 | 临海市锦铮机械有限公司 | 镜片多轴双面自动清洗机 |
CN104858094B (zh) * | 2015-06-09 | 2019-06-18 | 临海市劳尔机械有限公司 | 一种全自动树脂镜片镀膜喷涂机 |
CN107032628A (zh) * | 2016-12-06 | 2017-08-11 | 东莞市天合机电开发有限公司 | 一种光学玻璃自动翻转机构 |
-
2018
- 2018-03-14 CN CN201820347129.3U patent/CN207967026U/zh not_active Expired - Fee Related
- 2018-07-27 WO PCT/CN2018/097492 patent/WO2019174174A1/zh active Application Filing
- 2018-07-30 US US16/048,746 patent/US20190284680A1/en not_active Abandoned
- 2018-07-30 EP EP18186253.3A patent/EP3540790A1/en not_active Withdrawn
- 2018-07-30 JP JP2018002930U patent/JP3218390U/ja not_active Expired - Fee Related
- 2018-07-30 KR KR2020180003511U patent/KR20190002361U/ko not_active Ceased
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109698153A (zh) * | 2019-01-22 | 2019-04-30 | 通威太阳能(安徽)有限公司 | 一种太阳能电池片翻转机构 |
CN109698153B (zh) * | 2019-01-22 | 2023-09-26 | 通威太阳能(安徽)有限公司 | 一种太阳能电池片翻转机构 |
CN109772731A (zh) * | 2019-03-12 | 2019-05-21 | 哈工大机器人(山东)智能装备研究院 | 18650型锂电池分选磁流变液机扫码装置及工作方法 |
CN111532737A (zh) * | 2020-04-22 | 2020-08-14 | 广东生波尔光电技术有限公司 | 一种可实现多规格产品的180°自动翻转机构 |
Also Published As
Publication number | Publication date |
---|---|
KR20190002361U (ko) | 2019-09-24 |
WO2019174174A1 (zh) | 2019-09-19 |
JP3218390U (ja) | 2018-10-11 |
US20190284680A1 (en) | 2019-09-19 |
EP3540790A1 (en) | 2019-09-18 |
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Legal Events
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GR01 | Patent grant | ||
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TR01 | Transfer of patent right |
Effective date of registration: 20210106 Address after: 101102 102-lq307, 1-3 / F, building 26, 17 huanke Middle Road, Jinqiao Science and technology industrial base, Tongzhou Park, Zhongguancun Science and Technology Park, Tongzhou District, Beijing Patentee after: Deyun Chuangxin (Beijing) Technology Co.,Ltd. Address before: 100176 Beijing Daxing District Beijing Economic and Technological Development Zone, No. 66 Building, No. 2 Jingyuan North Street, 7th Floor 805 Patentee before: BEIJING JUNTAI INNOVATION TECHNOLOGY Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181012 |