CN207853961U - Fingerprint bonding structure and mobile terminal - Google Patents
Fingerprint bonding structure and mobile terminal Download PDFInfo
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- CN207853961U CN207853961U CN201820257817.0U CN201820257817U CN207853961U CN 207853961 U CN207853961 U CN 207853961U CN 201820257817 U CN201820257817 U CN 201820257817U CN 207853961 U CN207853961 U CN 207853961U
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- fingerprint
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- bonding structure
- conducting layer
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- 239000010410 layer Substances 0.000 claims description 110
- 229920000742 Cotton Polymers 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002390 adhesive tape Substances 0.000 claims description 15
- 239000012945 sealing adhesive Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 8
- 239000003292 glue Substances 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical compound CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Fingerprint bonding structure and mobile terminal provided by the utility model, it is related to mobile phone manufacturing technology field, the fingerprint bonding structure includes display screen, heat-conducting layer and fingerprint sensor module, and the heat-conducting layer is set to the display screen bottom, and the fingerprint sensor module is set to the heat-conducting layer bottom.In fingerprint bonding structure provided by the utility model, the heat-conducting layer is set to the display screen bottom, the fingerprint sensor module is set to the heat-conducting layer bottom, by the way that fingerprint sensor module is set on heat-conducting layer, it prevents from causing fitting mark, has many advantages, such as that service life is long and is not easy to come unglued.
Description
Technical field
The utility model is related to mobile phone manufacturing technology fields, more particularly, to a kind of fingerprint bonding structure and mobile terminal.
Background technology
Optical sensor is a kind of sensor, is measured according to optical principle, it has many advantages, such as non-contact
With non-destroyed measurement, almost interference-free, high-speed transfer and can telemetering, remote control etc..
Optical sensor is provided in mobile phone, optical fingerprint sensor is directly arranged under display screen in the prior art
Side, be easy to cause fitting marking problem, some angle, which visually observes, can find out trace, impact the mobile phone service life, easily come unglued
The defects of.
Existing optical fingerprint sensor is directly arranged at the lower section of display screen, impacts the mobile phone service life, easily comes unglued
Defect.
Utility model content
One of the utility model is designed to provide a kind of fingerprint bonding structure, is sensed with solving existing optical finger print
Device is directly arranged at the lower section of display screen, impacts the mobile phone service life, the technical problems such as easily come unglued.
Another of the utility model is designed to provide a kind of mobile terminal, includes the fingerprint fitting knot of above-mentioned offer
Structure.
In order to solve the above technical problems, the utility model uses following technical scheme；The utility model first aspect carries
The fingerprint bonding structure of confession, wherein including display screen, heat-conducting layer and fingerprint sensor module, the heat-conducting layer is set to described
Display screen bottom, the fingerprint sensor module are set to the heat-conducting layer bottom.
In fingerprint bonding structure provided by the utility model, the heat-conducting layer is set to the display screen bottom, the finger
Line sensor assembly is set to the heat-conducting layer bottom, by the way that fingerprint sensor module to be set on heat-conducting layer, prevents from causing
It is bonded mark, has many advantages, such as that service life is long and is not easy to come unglued.
In any of the above-described technical solution, further, the heat-conducting layer includes foamed cotton layer and is set to foamed cotton layer bottom
Thin metal layer, the fingerprint sensor module is set on the foamed cotton layer.
In any of the above-described technical solution, further, set corresponding to the fingerprint sensor module on the heat-conducting layer
It is equipped with trepanning.
In any of the above-described technical solution, further, the heat-conducting layer further includes being set to the foamed cotton layer bottom
Thin metal layer, the fingerprint sensor module are set on the thin metal layer.
In any of the above-described technical solution, further, pass through adhesive-layer between the foamed cotton layer and the thin metal layer
Bonding.
In any of the above-described technical solution, further, the fingerprint sensor module includes fingerprint sensor and frame,
The fingerprint sensor is set to by frame on the heat-conducting layer.
Fingerprint sensor bottom is provided with circuit board connected to it, and frame is set on circuit board.
Frame is set to the both sides of circuit board so that fingerprint sensor is more smoothly fixed on heat-conducting layer.
Frame includes two support columns, and support column is located at the both sides of circuit board, and fingerprint sensor is located at two supports
Between column.
In any of the above-described technical solution, further, the frame is by sticking double faced adhesive tape on the heat-conducting layer.Frame
By sticking double faced adhesive tape on foamed cotton layer or thin copper layer, double faced adhesive tape is PSA double faced adhesive tapes at the top of frame.
In any of the above-described technical solution, further, the frame sides pass through edge sealing adhesive and the upper two-sided gluing
Patch.It is pasted by double faced adhesive tape and fixes and reinforce gluing power in heat-conducting layer and edge sealing adhesive, fitting is more secured.
Setting edge sealing adhesive makes connection more secured, it is not easy to come unglued, edge sealing can be both provided with around support column
Glue can also be provided with multiple junctions on the support columns by mode for dispensing glue.
Further include the glass cover-plate being set at the top of the display screen further in any of the above-described technical solution.
The mobile terminal that the utility model second aspect provides is provided with the fingerprint bonding structure of first aspect offer, because
Whole advantageous effects of this fingerprint bonding structure provided with first aspect, just do not repeat one by one herein.
Mobile terminal can be mobile phone, apparatus such as computer.
In mobile terminal provided in this embodiment, display screen bottom is provided with heat-conducting layer, is provided in heat-conducting layer bottom
Fingerprint sensor module, fingerprint sensor module include fingerprint sensor, and fingerprint sensor is set to heat-conducting layer by frame
On foamed cotton layer or thin metal layer, is realized and fixed by double faced adhesive tape and edge sealing adhesive.It prevents from being set up directly on PLED screen cabling in the raised floor patch
Mark is closed, cause defect in appearance and influence service life etc..
Using above-mentioned technical proposal, the utility model has the advantages that：
In fingerprint bonding structure provided by the utility model, the heat-conducting layer is set to the display screen bottom, the finger
Line sensor assembly is set to the heat-conducting layer bottom, by the way that fingerprint sensor module to be set on heat-conducting layer, prevents from causing
It is bonded mark, has many advantages, such as that service life is long and is not easy to come unglued.
Further, the heat-conducting layer includes foamed cotton layer and is set to the thin metal layer of foamed cotton layer bottom, and the fingerprint passes
Sensor module is set on the foamed cotton layer.
Further, the heat-conducting layer further includes the thin metal layer for being set to the foamed cotton layer bottom, the fingerprint sensing
Device module is set on the thin metal layer.
The additional aspect and advantage of the utility model will become apparent in following description section, or new by this practicality
The practice of type is recognized.
Description of the drawings
It below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific implementation mode or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram for the fingerprint bonding structure that the utility model background technology provides；
Fig. 2 is the structural schematic diagram for the fingerprint bonding structure that the utility model embodiment one provides；
Fig. 3 is the structural schematic diagram of heat-conducting layer in the fingerprint bonding structure that the utility model embodiment one provides；
Fig. 4 is the knot that fingerprint sensor is connect with foamed cotton layer in the fingerprint bonding structure that the utility model embodiment one provides
Structure schematic diagram；
Fig. 5 is that fingerprint sensor is connect with thin metal layer in the fingerprint bonding structure that the utility model embodiment two provides
Structural schematic diagram.
Reference numeral：
1：Glass cover-plate；2：Display screen；3：Heat-conducting layer；
4：First adhesive-layer；5：Foamed cotton layer；6：Second adhesive-layer；
7：Thin metal layer；8：Double faced adhesive tape；11：Edge sealing adhesive；
12：Fingerprint sensor；13：Frame；14：Circuit board.
Specific implementation mode
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
The every other embodiment that field those of ordinary skill is obtained without making creative work, belongs to this practicality
Novel protected range.It should be noted that in the absence of conflict, the feature in embodiments herein and embodiment can
To be combined with each other.
It is in the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
The utility model and simplifying describes for ease of description, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for description purposes only, and are not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, can also be electrical connection；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, it can understand above-mentioned art with concrete condition
The concrete meaning of language in the present invention.
In order to solve the lower section that existing optical fingerprint sensor is directly arranged at display screen, the mobile phone service life is impacted,
It easily comes unglued etc. technical problems.
Explanation is further explained to the utility model with reference to specific embodiment.
Embodiment one
Fig. 1 is the structural schematic diagram for the fingerprint bonding structure that the utility model background technology provides；Fig. 2 is the utility model
The structural schematic diagram for the fingerprint bonding structure that embodiment one provides；Fig. 3 is the fingerprint fitting that the utility model embodiment one provides
The structural schematic diagram of heat-conducting layer in structure；Fig. 4 is fingerprint sensing in the fingerprint bonding structure that the utility model embodiment one provides
The structural schematic diagram that device is connect with foamed cotton layer.
As shown in Figures 1 to 4, the fingerprint bonding structure that the embodiment of the utility model first aspect provides, including display
Screen 2, heat-conducting layer 3 and fingerprint sensor module, the heat-conducting layer 3 are set to 2 bottom of the display screen, the fingerprint sensor mould
Block is set to 3 bottom of the heat-conducting layer.
In fingerprint bonding structure provided by the utility model, the heat-conducting layer 3 is set to 2 bottom of the display screen, described
Fingerprint sensor module is set to 3 bottom of the heat-conducting layer, by the way that fingerprint sensor module to be set on heat-conducting layer 3, prevents
Fitting mark is caused, has many advantages, such as that service life is long and is not easy to come unglued.
Heat-conducting layer 3 is pasted onto display screen 2 by the first adhesive-layer 4, and display screen 2 is that (Chinese is entitled by OLED：Organic light emission two
Pole pipe, English are entitled：Organic Light-Emitting Diode) shield, heat-conducting layer 3 is pasted onto by the first adhesive-layer 4
The bottom of OLED screen.
In any of the above-described technical solution, further, the heat-conducting layer 3 is heat conduction foamed cotton layer, including foamed cotton layer 5 and is set
It is placed in the thin metal layer 7 of 5 bottom of foamed cotton layer, the fingerprint sensor module is set on the foamed cotton layer 5.Thin metal layer can be with
For copper lamina or other can transmit the thin metal layer of heat.
In any of the above-described technical solution, further, set corresponding to the fingerprint sensor module on the heat-conducting layer 3
It is equipped with trepanning.Fingerprint sensor module passes through trepanning, is connect with foamed cotton layer 5.
The structures such as groove body can also be provided with, pass through convenient for fingerprint sensor module and connect afterwards with foamed cotton layer 5, the setting
Mode so that overall structure is more frivolous.
In any of the above-described technical solution, further, the fingerprint sensor module includes fingerprint sensor 12 and frame
Frame 13, the fingerprint sensor 12 are set to by frame 13 on the heat-conducting layer 3.
12 bottom of fingerprint sensor is provided with circuit board 14 connected to it, and frame 13 is set on circuit board 14.Fingerprint
Sensor 12 is optical fingerprint sensor.
Frame 13 is set to the both sides of circuit board so that fingerprint sensor 12 is more smoothly fixed on heat-conducting layer 3.
Frame 13 includes two support columns, and support column is located at the both sides of circuit board, and fingerprint sensor 12 is located at two
Between support column.
In any of the above-described technical solution, further, the frame 13 is pasted on the heat-conducting layer 3 by double faced adhesive tape 8
On.The top of frame 13 is pasted on by double faced adhesive tape 8 on foamed cotton layer 5 or thin copper layer 7, and double faced adhesive tape 8 is PSA double faced adhesive tapes 8.
In any of the above-described technical solution, further, 13 side of the frame by edge sealing adhesive 11 with it is upper described two-sided
Glue 8 is pasted.It is pasted by double faced adhesive tape 8 and fixes and reinforce gluing power in heat-conducting layer 3 and edge sealing adhesive 11, fitting is more secured.
Edge sealing adhesive 11 is set so that connection is more secured, it is not easy to come unglued, envelope can be both provided with around support column
Side glue can also be provided with multiple junctions on the support columns by mode for dispensing glue.
Further include the glass cover-plate 1 for being set to 2 top of the display screen further in any of the above-described technical solution.
The mobile terminal that the utility model second aspect provides is provided with the fingerprint bonding structure of first aspect offer, because
Whole advantageous effects of this fingerprint bonding structure provided with first aspect, just do not repeat one by one herein.
Mobile terminal can be mobile phone, apparatus such as computer.
Embodiment two
Fig. 5 is that fingerprint sensor 12 connects with thin metal layer 7 in the fingerprint bonding structure that the utility model embodiment two provides
The structural schematic diagram connect, as shown in figure 5, in the present embodiment two, further, the heat-conducting layer 3 further includes being set to the bubble
The thin metal layer 7 of 5 bottom of cotton layer, the fingerprint sensor module are set on the thin metal layer 7.
The fingerprint sensor module is set on the thin metal layer 7, is not necessarily to trepanning so that connection is more convenient, raw
It is higher to produce efficiency.
In any of the above-described technical solution, further, pass through viscose glue between the foamed cotton layer 5 and the thin metal layer 7
Layer bonding.It is Nian Jie by the second adhesive-layer 6 between the foamed cotton layer 5 and the thin metal layer 7.Remaining is the same as embodiment one.
In mobile terminal provided in this embodiment, 2 bottom of display screen is provided with heat-conducting layer 3, is arranged in 3 bottom of heat-conducting layer
It includes fingerprint sensor 12 to have fingerprint sensor module, fingerprint sensor module, and fingerprint sensor 12 is set to by frame 13
On the foamed cotton layer 5 or thin metal layer 7 of heat-conducting layer 3, is realized and fixed by double faced adhesive tape 8 and edge sealing adhesive 11.It prevents from being set up directly on
PLED screen cabling in the raised floor is bonded mark, cause defect in appearance and influence service life etc..
In conclusion in fingerprint bonding structure provided by the utility model, the heat-conducting layer 3 is set to the display screen 2
Bottom, the fingerprint sensor module is set to 3 bottom of the heat-conducting layer, by the way that fingerprint sensor module is set to heat-conducting layer
It on 3, prevents from causing fitting mark, has many advantages, such as that service life is long and is not easy to come unglued.
Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the utility model, rather than limits it
System；Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should
Understand：It still can be with technical scheme described in the above embodiments is modified, either to which part or whole
Technical characteristic carries out equivalent replacement；And these modifications or replacements, this practicality that it does not separate the essence of the corresponding technical solution are new
The range of each embodiment technical solution of type.In addition, it will be appreciated by those of skill in the art that although some implementations described herein
Example includes certain features included in other embodiments rather than other feature, but the group of the feature of different embodiments is desirable
Taste within the scope of the utility model and forms different embodiments.For example, in claims above, institute
The one of arbitrary of claimed embodiment mode can use in any combination.It is disclosed in the background technology part
Information is merely intended to deepen the understanding to the general background technology of the utility model, and is not construed as recognizing or with any shape
Formula implies that the information constitutes the prior art known to those skilled in the art.
Claims (10)
1. a kind of fingerprint bonding structure, which is characterized in that including display screen, heat-conducting layer and fingerprint sensor module, the heat conduction
Layer is set to the display screen bottom, and the fingerprint sensor module is set to the heat-conducting layer bottom.
2. fingerprint bonding structure according to claim 1, which is characterized in that the heat-conducting layer includes foamed cotton layer and is set to
The thin metal layer of foamed cotton layer bottom, the fingerprint sensor module are set on the foamed cotton layer.
3. fingerprint bonding structure according to claim 2, which is characterized in that correspond to the fingerprint on the heat-conducting layer and pass
Sensor module is provided with trepanning.
4. fingerprint bonding structure according to claim 2, which is characterized in that the heat-conducting layer further includes being set to the bubble
The thin metal layer of cotton layer bottom, the fingerprint sensor module are set on the thin metal layer.
5. fingerprint bonding structure according to claim 2 or 4, which is characterized in that the foamed cotton layer and the thin metal layer
Between be bonded by adhesive-layer.
6. fingerprint bonding structure according to claim 1, which is characterized in that the fingerprint sensor module includes that fingerprint passes
Sensor and frame, the fingerprint sensor are set to by frame on the heat-conducting layer.
7. fingerprint bonding structure according to claim 6, which is characterized in that the frame is by sticking double faced adhesive tape in described
On heat-conducting layer.
8. fingerprint bonding structure according to claim 7, which is characterized in that the frame sides pass through edge sealing adhesive and upper institute
State sticking double faced adhesive tape.
9. fingerprint bonding structure according to claim 1, which is characterized in that further include being set at the top of the display screen
Glass cover-plate.
10. a kind of mobile terminal, which is characterized in that including fingerprint bonding structure as described in any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820257817.0U CN207853961U (en) | 2018-02-13 | 2018-02-13 | Fingerprint bonding structure and mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820257817.0U CN207853961U (en) | 2018-02-13 | 2018-02-13 | Fingerprint bonding structure and mobile terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207853961U true CN207853961U (en) | 2018-09-11 |
Family
ID=63409305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820257817.0U Active CN207853961U (en) | 2018-02-13 | 2018-02-13 | Fingerprint bonding structure and mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207853961U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461374A (en) * | 2018-11-12 | 2019-03-12 | 京东方科技集团股份有限公司 | Display module and preparation method thereof |
-
2018
- 2018-02-13 CN CN201820257817.0U patent/CN207853961U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461374A (en) * | 2018-11-12 | 2019-03-12 | 京东方科技集团股份有限公司 | Display module and preparation method thereof |
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