CN207772351U - A kind of refrigeration cooling equipment of injection mold - Google Patents
A kind of refrigeration cooling equipment of injection mold Download PDFInfo
- Publication number
- CN207772351U CN207772351U CN201721767018.XU CN201721767018U CN207772351U CN 207772351 U CN207772351 U CN 207772351U CN 201721767018 U CN201721767018 U CN 201721767018U CN 207772351 U CN207772351 U CN 207772351U
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- mold
- refrigeration
- semiconductor chilling
- injection
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Abstract
The utility model provides a kind of refrigeration cooling equipment of injection mold, including：Mold case, refrigeration mechanism, heat dissipation tank；Mold case includes two full symmetric babinets, and box house is divided into cold water storage cistern and equipment box by partition board；The side of two babinets fits, and forms mold space；The top of mold case is equipped with injecting hole；Heat dissipation tank includes two full symmetric L-type babinets, and the horizontal segment bottom surface of L-type babinet is connected with the top of mold case；Two L-type babinets fit on one side, form injection channel, and injection channel is connected with injecting hole；Refrigeration mechanism includes protective shell, semiconductor chilling plate and heat-conducting silicone grease, and semiconductor chilling plate overlapping is positioned in protective shell, and the heat-conducting silicone grease is equipped between two adjacent semiconductor chilling plates.The cooling procedure of injection molding can be rapidly completed in a kind of cooling equipment of the refrigeration of injection mold described in the utility model, while being avoided that early coagulation phenomena.
Description
Technical field
The utility model belongs to cooling apparatus field, and equipment is cooled down more particularly, to a kind of refrigeration of injection mold.
Background technology
Injection molding is also known as injection molding molding, is a kind of important forming method.Injection molding have speed of production it is fast,
The advantages that work efficiency is high, finished size is accurate is suitable for producing complex-shaped part in enormous quantities.
Existing injection mold radiates merely by cross-ventilation after pouring raw material, causes raw material shaping speed excessively slow,
Working efficiency is reduced, while the raw material of molten state is easy to happen " early solidifying " phenomenon in mold mouth.So needing to research and develop a kind of high
The Novel injection mold of efficiency cools down equipment.
Utility model content
In view of this, the utility model is directed to a kind of refrigeration cooling equipment of injection mold, to improve injection molding
Working efficiency.
In order to achieve the above objectives, the technical solution of the utility model is realized in：
A kind of refrigeration cooling equipment of injection mold, including：Mold case, refrigeration mechanism, heat dissipation tank；The mold case includes
Two full symmetric babinets, the box house are divide into upper part and lower part by partition board, and top is cold water storage cistern, and lower section is equipment
Case, cold water storage cistern are internally provided with heat transferring medium；It is equipped with mold slot in the side of babinet, two babinets carry the one of mold slot
Side fits, and forms mold space；The top of the mold case is equipped with injecting hole, and the injecting hole runs through the upper end of mold case simultaneously
It is connected to mold space；The heat dissipation tank includes two full symmetric L-type babinets, and the L-type box house is equipped with heat transferring medium,
The horizontal segment bottom surface of L-type babinet is connected with the top of the mold case；Channel slot is equipped on one end of L-type babinet horizontal segment,
Two L-type babinets fitting on one side with channel slot, forms injection channel, and the injection channel is connected with injecting hole
It is logical；The refrigeration mechanism includes protective shell, semiconductor chilling plate and heat-conducting silicone grease, and the semiconductor chilling plate overlapping is positioned over guarantor
In protective case, the huyashi-chuuka (cold chinese-style noodles) of the latter semiconductor chilling plate is towards the hot face of previous semiconductor chilling plate, in two adjacent semiconductors
The heat-conducting silicone grease is equipped between cooling piece；The cold end of the refrigeration mechanism is inserted into cold water storage cistern, the system from the outside of cold water storage cistern
L-type babinet is inserted into the hot junction of cold structure from the inside of L-type babinet vertical section；The cold end of refrigeration mechanism can absorb the heat in environment
Amount is the heat transferring medium refrigeration inside cold water storage cistern, and the hot junction of refrigeration mechanism can be L-type box house to Environment release heat
Heat transferring medium heats；Front and back two surface of the mold case is equipped with fixed lock, and the fixed lock can be in the note of the present apparatus
It is moulded into type and plays position-limiting action in the process.
Further, the equipment box is internally provided with first circulation pipeline, and the both ends of the first circulation pipeline are inserted into
Inside cold water storage cistern, first circulation pump is additionally provided on first circulation pipeline, the first circulation pump can promote changing in cold water storage cistern
Thermal medium flows, and accelerates process of refrigerastion；The top of the L-type babinet horizontal segment is equipped with second circulation pipeline, the second circulation
L-type box house is inserted at the both ends of pipeline, and second circulation pump is additionally provided on second circulation pipeline, and the second circulation pumps energy
Promote the heat transferring medium in L-type babinet to flow, accelerates heat transfer process.
Further, thermal insulation board is equipped between the mold box top and heat dissipation tank horizontal ends, the thermal insulation board can prevent
The heat exchange of heat dissipation tank and mold case.
Further, the fitting position of the two tanks is equipped with sealing strip, is additionally provided on babinet and is matched with sealing strip
Groove；The sealing strip is placed in groove, can guarantee the leakproofness of the present apparatus.
Further, there are 10 ° of inclinations angle for the side wall Yu vertical plane of the injection channel, injection raw material can be facilitated to enter
Mold space.
Further, the internal box wall in the mold space is equipped with 3 ° of demoulding oblique angle, contributes to the demoulding of finished product.
Further, the inner wall of the protective shell is equipped with grooving, and the grooving can limit semiconductor chilling plate；
The inner wall size of the protective shell is less than semiconductor refrigerating chip size, can prevent refrigeration mechanism inner inlet from short circuit occurs.
Compared with the existing technology, a kind of refrigeration cooling equipment of injection mold described in the utility model has following excellent
Gesture：
A kind of refrigeration of injection mold described in the utility model cools down equipment, simple in structure easily operated, can accelerate note
Mould molding cooling procedure；For the present apparatus using semiconductor chilling plate as refrigeration mechanism, temperature control is accurate, can be different originals
Material selects its suitable cooling temperature；The injection channel of the present apparatus is effectively utilized the hot junction heat of semiconductor chilling plate, can keep away
Exempt from early coagulation phenomena.
Description of the drawings
The attached drawing for constituting the part of the utility model is used to provide a further understanding of the present invention, this practicality is new
The illustrative embodiments and their description of type are not constituted improper limits to the present invention for explaining the utility model.
In attached drawing：
Fig. 1 is the trimetric drawing of the utility model；
Fig. 2 is the front section view of the utility model；
Fig. 3 is the side sectional view of the utility model；
Fig. 4 is the babinet and sealing strip schematic diagram of the utility model；
Fig. 5 is the L-type babinet schematic diagram of the utility model；
Fig. 6 is the refrigeration mechanism cut-away illustration of the utility model.
Reference sign：
1- mold casees；11- babinets；111- grooves；112- sealing strips；113- mold slots；12- cold water storage cisterns；13- equipment boxs；
14- injecting holes；15- fixes lock；16- partition boards；2- refrigeration mechanisms；21- protective shells；22- semiconductor chilling plates；23- thermal conductive silicons
Fat；3- heat dissipation tanks；31-L molding box bodies；32- injection channels；33- channel slots；4- molds space；5- first circulation pipelines；51-
One circulating pump；6- second circulation pipelines；61- second circulations pump；7- thermal insulation boards.
Specific implementation mode
It should be noted that in the absence of conflict, the feature in the embodiments of the present invention and embodiment can
To be combined with each other.
In the description of the present invention, it should be understood that term "center", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified device or element must have a particular orientation, with specific azimuth configuration and operation, therefore cannot understand
For limitations of the present invention.In addition, term " first ", " second " etc. are used for description purposes only, and should not be understood as indicating
Or it implies relative importance or implicitly indicates the quantity of indicated technical characteristic." first ", " second " etc. are defined as a result,
Feature can explicitly or implicitly include one or more this feature.It is in the description of the present invention, unless another
It is described, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, can also be electrical connection；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, on being understood by concrete condition
State the concrete meaning of term in the present invention.
The utility model will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in Figure 1, Figure 2 and Figure 3, a kind of refrigeration of injection mold cools down equipment, including：Mold case 1, refrigeration mechanism 2,
Heat dissipation tank 3；Mold case 1 includes two full symmetric babinets 11, is divide into upper part and lower part by partition board 16 inside babinet 11, on
Side is cold water storage cistern 12, and lower section is equipment box 13, and cold water storage cistern 12 is internally provided with heat transferring medium；It is equipped with mold in the side of babinet 11
Slot 113, side of the two tanks 11 with mold slot 113 fit, and form mold space 4, and the internal box wall in mold space 4 is equipped with 3 °
Demoulding oblique angle, contribute to the demoulding of finished product；The fitting position of two tanks 11 is equipped with sealing strip 112, is additionally provided on babinet 11
With 112 matched groove 111 of sealing strip；Sealing strip 112 is placed in groove 111, can guarantee the leakproofness of the present apparatus；Mold case
1 top is equipped with injecting hole 14, and injecting hole 14 is through the upper end of mold case 1 and is connected to mold space 4；Heat dissipation tank 3 includes two
Full symmetric L-type babinet 31, L-type babinet 31 are internally provided with heat transferring medium, horizontal segment bottom surface and the mold case 1 of L-type babinet 31
Top be connected, thermal insulation board 7 is equipped between the top of mold case 1 and 3 horizontal ends of heat dissipation tank, thermal insulation board 7 can prevent heat dissipation tank 3 and modeling
The heat exchange of moulding box 1；Channel slot 33 is equipped on one end of 31 horizontal segment of L-type babinet, two L-type babinets 31 carry channel slot 33
It fits on one side, forms injection channel 32, injection channel 32 is connected with injecting hole 14, the side wall and vertical plane of injection channel 32
There are 10 ° of inclinations angle, and injection raw material can be facilitated to enter mold space 4；The cold end of refrigeration mechanism 2 is inserted from the outside of cold water storage cistern 12
Enter cold water storage cistern 12, L-type babinet 31 is inserted into the hot junction of refrigeration mechanism 2 from the inside of 31 vertical section of L-type babinet；Refrigeration mechanism 2 it is cold
End can absorb the heat in environment, be the heat transferring medium refrigeration inside cold water storage cistern 12, the hot junction of refrigeration mechanism 2 can be to Environment release
Heat is the heat transferring medium heating inside L-type babinet 31；Front and back two surface of mold case 1 is equipped with fixed lock 15, fixing lock
Button 15 can play position-limiting action in the injection molding process of the present apparatus.
To accelerate heat exchange process, equipment box 13 to be internally provided with first circulation pipeline 5, the both ends of first circulation pipeline 5 are equal
It is inserted into inside cold water storage cistern 12, first circulation pump 51 is additionally provided on first circulation pipeline 5, first circulation pump 51 can promote cold water storage cistern
Heat transferring medium flowing in 12, accelerates process of refrigerastion；The top of 31 horizontal segment of L-type babinet is equipped with second circulation pipeline 6, and second follows
The both ends in endless tube road 6 are inserted into inside L-type babinet 31, and second circulation pump 61, second circulation are additionally provided on second circulation pipeline 6
Pump 61 can promote the heat transferring medium in L-type babinet 31 to flow, and accelerate heat transfer process.
As shown in fig. 6, refrigeration mechanism 2 includes protective shell 21, semiconductor chilling plate 22 and heat-conducting silicone grease 23, semiconductor refrigerating
The overlapping of piece 22 is positioned in protective shell 21, and the huyashi-chuuka (cold chinese-style noodles) of the latter semiconductor chilling plate 22 is towards previous semiconductor chilling plate 22
Hot face is equipped with heat-conducting silicone grease 23 between two adjacent semiconductor chilling plates 22；The inner wall of protective shell 21 is equipped with grooving, grooving
Semiconductor chilling plate 22 can be limited；The inner wall size of protective shell 21 is less than 22 size of semiconductor chilling plate, can prevent from making
Short circuit occurs for 2 inner inlet of cold structure.
Fig. 4 and Fig. 5 is used to help understand the structure of babinet 11 and L-type babinet 31.
Semiconductor chilling plate is TEC1-12706 type semiconductor chilling plates, heat-conducting silicone grease Noctua-NT- in the present embodiment
H1, first circulation pump and second circulation pump are conventional centrifugal pump.The composition of above equipment be connected as it is big well known, therefore not
It repeats herein.
Before start-up operation, present apparatus assembly is finished, and fastens fixed lock 15.When start-up operation, refrigeration mechanism is opened
2, since cold end and the hot junction of semiconductor chilling plate 22 are sequentially connected, so the hot and cold side temperature difference of refrigeration mechanism is very big, such one
Cold can be provided for the cooling of mold, the hot junction of refrigeration mechanism 2 is that injection channel 32 is provided by the cold end of refrigeration mechanism 2
Heat.The plastics of thawing are poured into from injection channel 32, plastics enter mold space 4 by injecting hole 14.It opens after cooling solid
Lock button 15, you can take out molding workpiece.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Within the spirit and principle of utility model, any modification, equivalent replacement, improvement and so on should be included in the utility model
Protection domain within.
Claims (7)
1. a kind of refrigeration of injection mold cools down equipment, it is characterised in that：Including：Mold case (1), refrigeration mechanism (2), heat dissipation tank
(3)；The mold case (1) includes two full symmetric babinets (11), is divided by partition board (16) inside the babinet (11)
Upper and lower two parts, top are cold water storage cistern (12), and lower section is equipment box (13), and cold water storage cistern (12) is internally provided with heat transferring medium；
The side of babinet (11) is equipped with mold slot (113), and side of two babinets (11) with mold slot (113) fits, shape
At mold space (4)；The top of the mold case (1) is equipped with injecting hole (14), and the injecting hole (14) is through mold case (1)
Upper end is simultaneously connected to mold space (4)；The heat dissipation tank (3) includes two full symmetric L-type babinets (31), the L-type babinet
(31) it is internally provided with heat transferring medium, the horizontal segment bottom surface of L-type babinet (31) is connected with the top of the mold case (1)；In L-type case
One end of body (31) horizontal segment is equipped with channel slot (33), and two L-type babinets (31) carry the one side phase of channel slot (33)
Fitting, forms injection channel (32), and the injection channel (32) is connected with injecting hole (14)；The refrigeration mechanism (2) includes
Protective shell (21), semiconductor chilling plate (22) and heat-conducting silicone grease (23), semiconductor chilling plate (22) overlapping are positioned over protection
In shell (21), the huyashi-chuuka (cold chinese-style noodles) of the latter semiconductor chilling plate (22) is towards the hot face of previous semiconductor chilling plate (22), adjacent
Two semiconductor chilling plates (22) between be equipped with the heat-conducting silicone grease (23)；The cold end of the refrigeration mechanism (2) is from cold water storage cistern
(12) cold water storage cistern (12) is inserted into outside, and L is inserted into the hot junction of the refrigeration mechanism (2) from the inside of L-type babinet (31) vertical section
Molding box body (31)；Front and back two surface of the mold case (1) is equipped with fixed lock (15).
2. a kind of refrigeration of injection mold according to claim 1 cools down equipment, it is characterised in that：The equipment box (13)
It is internally provided with first circulation pipeline (5), cold water storage cistern (12) inside is inserted at the both ends of the first circulation pipeline (5), first
First circulation pump (51) is additionally provided on circulating line (5)；The top of L-type babinet (31) horizontal segment is equipped with second circulation pipeline
(6), L-type babinet (31) inside is inserted at the both ends of the second circulation pipeline (6), is additionally provided on second circulation pipeline (6)
Second circulation pumps (61).
3. a kind of refrigeration of injection mold according to claim 1 cools down equipment, it is characterised in that：The mold case (1)
Thermal insulation board (7) is equipped between top and heat dissipation tank (3) horizontal ends.
4. a kind of refrigeration of injection mold according to claim 1 cools down equipment, it is characterised in that：The two tanks (11)
Fitting position be equipped with sealing strip (112), be additionally provided on babinet (11) with sealing strip (112) matched groove (111), institute
Sealing strip (112) is stated to be placed in groove (111).
5. a kind of refrigeration of injection mold according to claim 1 cools down equipment, it is characterised in that：The injection channel
(32) there are 10 ° of inclinations angle with vertical plane for side wall.
6. a kind of refrigeration of injection mold according to claim 1 cools down equipment, it is characterised in that：The mold space
(4) internal box wall is equipped with 3 ° of demoulding oblique angle.
7. a kind of refrigeration of injection mold according to claim 1 cools down equipment, it is characterised in that：The protective shell (21)
Inner wall be equipped with grooving, the grooving can limit semiconductor chilling plate (22)；The inner wall ruler of the protective shell (21)
It is very little to be less than semiconductor chilling plate (22) size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721767018.XU CN207772351U (en) | 2017-12-18 | 2017-12-18 | A kind of refrigeration cooling equipment of injection mold |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721767018.XU CN207772351U (en) | 2017-12-18 | 2017-12-18 | A kind of refrigeration cooling equipment of injection mold |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207772351U true CN207772351U (en) | 2018-08-28 |
Family
ID=63226645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721767018.XU Expired - Fee Related CN207772351U (en) | 2017-12-18 | 2017-12-18 | A kind of refrigeration cooling equipment of injection mold |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207772351U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111873346A (en) * | 2020-07-26 | 2020-11-03 | 张霞 | A cooling device for an injection mold |
-
2017
- 2017-12-18 CN CN201721767018.XU patent/CN207772351U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111873346A (en) * | 2020-07-26 | 2020-11-03 | 张霞 | A cooling device for an injection mold |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190617 Address after: 300000 Second Floor of Office Building No. 10 Fuxin Road, Xianshuigu Town, Jinnan District, Tianjin Patentee after: HOSCIEN TECHNOLOGY (TIANJIN) CO.,LTD. Address before: 312500 Shop No. 1007, C5 Building, China Tea City, Xinchang County, Shaoxing City, Zhejiang Province Patentee before: XINCHANG SANTAI COMMERCE AND TRADE Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180828 Termination date: 20211218 |