CN207699509U - A kind of composite heat-conducting insulated rubber film - Google Patents
A kind of composite heat-conducting insulated rubber film Download PDFInfo
- Publication number
- CN207699509U CN207699509U CN201721557123.0U CN201721557123U CN207699509U CN 207699509 U CN207699509 U CN 207699509U CN 201721557123 U CN201721557123 U CN 201721557123U CN 207699509 U CN207699509 U CN 207699509U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- conducting
- adhesive layer
- insulated rubber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 14
- 229920001971 elastomer Polymers 0.000 title claims 7
- 239000010410 layer Substances 0.000 claims abstract description 87
- 239000012790 adhesive layer Substances 0.000 claims abstract description 28
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000002184 metal Substances 0.000 claims abstract description 26
- 239000011888 foil Substances 0.000 claims abstract description 19
- 239000000843 powder Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- 239000005011 phenolic resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000005030 aluminium foil Substances 0.000 claims 1
- 239000002313 adhesive film Substances 0.000 abstract description 12
- 239000000758 substrate Substances 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
本实用新型涉及一种复合导热绝缘胶膜，其特征在于：包括从上至下依次设置的第一离型膜、第一粘结层、第一导热层、金属箔、第二导热层、第二粘结层和第二离型膜，还包括若干个贯穿第一导热层、金属箔和第二导热层的通孔，所述第一粘结层和第二粘结层通过通孔相连接。本胶膜结构简单，导热性强，自身黏性好。
The utility model relates to a composite heat-conducting and insulating adhesive film, which is characterized in that it comprises a first release film, a first adhesive layer, a first heat-conducting layer, a metal foil, a second heat-conducting layer, a first The second adhesive layer and the second release film also include several through holes that run through the first heat conduction layer, the metal foil and the second heat conduction layer, and the first adhesive layer and the second adhesive layer are connected through the through holes . The film has simple structure, strong thermal conductivity and good self-adhesiveness.
Description
技术领域technical field
本实用新型涉及一种复合导热绝缘胶膜。The utility model relates to a composite heat-conducting and insulating adhesive film.
背景技术Background technique
导热绝缘胶膜是金属基覆铜板的核心材料，其设置于金属基覆铜板的金属基板层和铜箔层之间。通常将该导热绝缘胶膜热压贴合于金属基板层与铜箔层之间，得到金属基覆铜板。现有的导热绝缘胶膜由多种环氧树脂、酚醛树脂、丁腈橡胶及无机导热粉等材料组成。导热绝缘胶膜的树脂基材，在起到包覆导热粉的同时，还起到与金属基板层和铜箔层之间粘结的作用。导热粉起到导热的作用，其掺入量对导热绝缘胶膜的热导率有着决定性作用。但是，导热粉主要为氧化铝、氧化硅、氮化铝等无机物颗粒，其分散于树脂基材中，因极性的差别，会造成树脂基材的粘结性下降。因此，导热绝缘胶膜面临一个矛盾，一方面，需要较高的导热粉掺入量，以提高导热率；另一方面，导热粉掺入造成导热绝缘胶膜与金属基板层和铜箔层之间粘结性下降，对金属基覆铜板抗弯强度、抗压强度、剪切强度等性能带来不良影响。The thermally conductive insulating adhesive film is the core material of the metal-based copper-clad laminate, which is arranged between the metal substrate layer and the copper foil layer of the metal-based copper-clad laminate. Usually, the heat-conducting and insulating adhesive film is hot-press bonded between the metal substrate layer and the copper foil layer to obtain a metal-based copper-clad laminate. Existing heat-conducting and insulating adhesive films are composed of various materials such as epoxy resin, phenolic resin, nitrile rubber and inorganic heat-conducting powder. The resin base material of the heat-conducting and insulating adhesive film not only covers the heat-conducting powder, but also plays the role of bonding with the metal substrate layer and the copper foil layer. The heat conduction powder plays the role of heat conduction, and its doping amount has a decisive effect on the thermal conductivity of the heat conduction insulating film. However, the thermal conductive powder is mainly inorganic particles such as alumina, silicon oxide, aluminum nitride, etc., which are dispersed in the resin substrate, and the adhesion of the resin substrate will be reduced due to the difference in polarity. Therefore, the thermally conductive insulating film faces a contradiction. On the one hand, a higher amount of thermally conductive powder is required to increase the thermal conductivity; Decrease in adhesion between metal-based copper clad laminates will have adverse effects on the flexural strength, compressive strength, shear strength and other properties of metal-based copper clad laminates.
实用新型内容Utility model content
本实用新型针对上述现有技术存在的问题做出改进，即本实用新型所要解决的技术问题是提供一种复合导热绝缘胶膜，粘结性好，导热。The utility model makes improvements to the problems existing in the above-mentioned prior art, that is, the technical problem to be solved by the utility model is to provide a composite heat-conducting and insulating adhesive film with good adhesion and heat conduction.
为了解决上述技术问题，本实用新型的技术方案是：一种复合导热绝缘胶膜，包括从上至下依次设置的第一离型膜、第一粘结层、第一导热层、金属箔、第二导热层、第二粘结层和第二离型膜，还包括若干个贯穿第一导热层、金属箔和第二导热层的通孔，所述第一粘结层和第二粘结层通过通孔相连接。In order to solve the above-mentioned technical problems, the technical solution of the present invention is: a composite heat-conducting insulating adhesive film, comprising a first release film, a first bonding layer, a first heat-conducting layer, a metal foil, The second heat conduction layer, the second adhesive layer and the second release film also include a plurality of through holes passing through the first heat conduction layer, the metal foil and the second heat conduction layer, the first adhesive layer and the second adhesive Layers are connected by vias.
进一步的，第一粘结层、第一导热层、第二导热层和第二粘结层均由环氧树脂、酚醛树脂、丁腈橡胶及无机导热粉混合组成，所述第一导热层和第二导热层中的无机导热粉含量高于第一粘结层和第二粘结层。Further, the first bonding layer, the first heat conducting layer, the second heat conducting layer and the second bonding layer are all composed of epoxy resin, phenolic resin, nitrile rubber and inorganic heat conducting powder, and the first heat conducting layer and The content of inorganic heat-conducting powder in the second heat-conducting layer is higher than that of the first adhesive layer and the second adhesive layer.
进一步的，所述金属箔为高导热性的铜箔或铝箔。Further, the metal foil is copper foil or aluminum foil with high thermal conductivity.
进一步的，所述导热层的厚度大于第一粘结层和第二粘结层的厚度。Further, the thickness of the heat conducting layer is greater than the thickness of the first bonding layer and the second bonding layer.
进一步的，所述第一离型膜和第二离型膜的厚度相等，且小于第一粘结层、第一导热层、第二导热层和第二粘结层的厚度。Further, the first release film and the second release film have the same thickness and are smaller than the thicknesses of the first bonding layer, the first heat conducting layer, the second heat conducting layer and the second bonding layer.
进一步的，所述第一粘结层和第二粘结层厚度相等。Further, the thickness of the first bonding layer and the second bonding layer are equal.
与现有技术相比，本实用新型具有以下有益效果：第一粘结层和第二粘结层的无机导热粉含量低，与金属基板层和铜箔层之间粘结性强，导热层的无机导热粉含量高起到有效提高热导率的作用，导热层与第一粘结层和第二粘结层之间为基于相同树脂基材的粘结，也具有良好的粘结性，中间包含一层金属箔，大大提高了导热性能，并通过贯穿多层的通孔，通孔内填充粘结层的胶质物，使胶膜自身多层具有良好的粘性，不会轻易分离；本复合导热绝缘胶膜技术方案，将导热和粘结两个功能分开设置，在获得高热导率的同时，保证了复合导热绝缘胶膜与金属基板层和铜箔层之间粘结性。Compared with the prior art, the utility model has the following beneficial effects: the inorganic heat-conducting powder content of the first bonding layer and the second bonding layer is low, the adhesion between the metal substrate layer and the copper foil layer is strong, and the heat-conducting layer The high content of inorganic heat-conducting powder can effectively improve the thermal conductivity. The heat-conducting layer and the first bonding layer and the second bonding layer are bonded based on the same resin substrate, which also has good adhesion. A layer of metal foil is included in the middle, which greatly improves the thermal conductivity, and through the through-holes penetrating through multiple layers, the through-holes are filled with colloid of the adhesive layer, so that the multi-layers of the adhesive film itself have good viscosity and will not be easily separated; In this composite heat-conducting insulating adhesive film technical solution, the two functions of heat conduction and bonding are set separately, and while obtaining high thermal conductivity, the adhesion between the composite heat-conducting insulating adhesive film and the metal substrate layer and the copper foil layer is guaranteed.
下面结合附图和具体实施方式对本实用新型做进一步详细的说明。Below in conjunction with accompanying drawing and specific embodiment, the utility model is described in further detail.
附图说明Description of drawings
图1为本实用新型实施例的构造示意图。Fig. 1 is a structural schematic diagram of an embodiment of the utility model.
图中：1-第一离型膜，2-第一粘结层，3-第一导热层，4-金属箔，5-第二导热层，6-第二粘结层，7-第二离型膜，8-通孔。In the figure: 1-the first release film, 2-the first bonding layer, 3-the first heat conducting layer, 4-metal foil, 5-the second heat conducting layer, 6-the second bonding layer, 7-the second Release film, 8-through hole.
具体实施方式Detailed ways
实施例一：如图1所示，一种复合导热绝缘胶膜，包括从上至下依次设置的第一离型膜1、第一粘结层2、第一导热层3、金属箔4、第二导热层5、第二粘结层6和第二离型膜7，还包括若干个贯穿第一导热层、金属箔和第二导热层的通孔8，所述第一粘结层和第二粘结层通过通孔相连接。Embodiment 1: As shown in Figure 1, a composite heat-conducting insulating adhesive film includes a first release film 1, a first bonding layer 2, a first heat-conducting layer 3, a metal foil 4, The second heat conduction layer 5, the second adhesive layer 6 and the second release film 7 also include several through holes 8 that run through the first heat conduction layer, the metal foil and the second heat conduction layer, the first adhesive layer and the second heat conduction layer The second adhesive layer is connected through the through hole.
本实施例中，第一粘结层、第一导热层、第二导热层和第二粘结层均由环氧树脂、酚醛树脂、丁腈橡胶及无机导热粉混合组成，所述第一导热层和第二导热层中的无机导热粉含量高于第一粘结层和第二粘结层。In this embodiment, the first bonding layer, the first heat conducting layer, the second heat conducting layer and the second bonding layer are all composed of epoxy resin, phenolic resin, nitrile rubber and inorganic heat conducting powder, and the first heat conducting layer The content of inorganic heat-conducting powder in the layer and the second heat-conducting layer is higher than that in the first bonding layer and the second bonding layer.
本实施例中，所述金属箔为高导热性的铜箔或铝箔。In this embodiment, the metal foil is copper foil or aluminum foil with high thermal conductivity.
本实施例中，所述导热层的厚度大于第一粘结层和第二粘结层的厚度。In this embodiment, the thickness of the heat conducting layer is greater than the thickness of the first bonding layer and the second bonding layer.
本实施例中，所述第一离型膜和第二离型膜的厚度相等，且小于第一粘结层、第一导热层、第二导热层和第二粘结层的厚度。In this embodiment, the first release film and the second release film have the same thickness and are smaller than the thicknesses of the first bonding layer, the first heat conducting layer, the second heat conducting layer and the second bonding layer.
本实施例中，所述第一粘结层和第二粘结层厚度相等。In this embodiment, the thickness of the first bonding layer and the second bonding layer are equal.
通过贯穿第一导热层、金属箔和第二导热层的通孔，在涂抹粘结层时，粘结层的胶质会注入通孔内，不仅起到连接第一粘结层和第二粘结层的作用，同时，该些胶质黏性较大，注入通孔时，起到将第一导热层、金属箔和第二导热层相互粘结的作用，防止三者脱离。金属箔的存在大大提高了导热性。Through the through holes that run through the first heat conduction layer, the metal foil and the second heat conduction layer, when the adhesive layer is applied, the glue of the adhesive layer will be injected into the through holes, which not only connects the first adhesive layer and the second adhesive At the same time, these colloids are relatively viscous, and when injected into the through hole, they play the role of bonding the first heat-conducting layer, the metal foil and the second heat-conducting layer to each other to prevent the three from detaching. The presence of the metal foil greatly improves thermal conductivity.
以上所述仅为本实用新型的较佳实施例，凡依本实用新型申请专利范围所做的均等变化与修饰，皆应属本实用新型的涵盖范围。The above descriptions are only preferred embodiments of the present utility model, and all equivalent changes and modifications made according to the patent scope of the present utility model shall fall within the scope of the present utility model.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721557123.0U CN207699509U (en) | 2017-11-20 | 2017-11-20 | A kind of composite heat-conducting insulated rubber film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721557123.0U CN207699509U (en) | 2017-11-20 | 2017-11-20 | A kind of composite heat-conducting insulated rubber film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207699509U true CN207699509U (en) | 2018-08-07 |
Family
ID=63023119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721557123.0U Expired - Fee Related CN207699509U (en) | 2017-11-20 | 2017-11-20 | A kind of composite heat-conducting insulated rubber film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207699509U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109207113A (en) * | 2018-08-21 | 2019-01-15 | 安徽省鸣新材料科技有限公司 | A kind of high-strength sound insulation foam aluminium glue knot battenboard and its application |
| CN110591587A (en) * | 2019-09-25 | 2019-12-20 | 苏州盛达飞智能科技股份有限公司 | Insulating adhesive tape and using method |
| CN110643294A (en) * | 2019-09-25 | 2020-01-03 | 苏州盛达飞智能科技股份有限公司 | Preparation method of polytetrafluoroethylene adhesive tape |
-
2017
- 2017-11-20 CN CN201721557123.0U patent/CN207699509U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109207113A (en) * | 2018-08-21 | 2019-01-15 | 安徽省鸣新材料科技有限公司 | A kind of high-strength sound insulation foam aluminium glue knot battenboard and its application |
| CN110591587A (en) * | 2019-09-25 | 2019-12-20 | 苏州盛达飞智能科技股份有限公司 | Insulating adhesive tape and using method |
| CN110643294A (en) * | 2019-09-25 | 2020-01-03 | 苏州盛达飞智能科技股份有限公司 | Preparation method of polytetrafluoroethylene adhesive tape |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207699509U (en) | A kind of composite heat-conducting insulated rubber film | |
| CN205082059U (en) | heat dissipation circuit board | |
| CN207460589U (en) | A kind of graphite composite circuit board | |
| CN103402311B (en) | One buries capacity materials, preparation method and its usage | |
| JP2006005333A5 (en) | ||
| TWM461779U (en) | Composite cooling fin | |
| CN103722805B (en) | A kind of high-heat-conductionaluminum aluminum base copper clad board | |
| WO2019140770A1 (en) | Heat conducting sheet | |
| CN207011077U (en) | A kind of multilayer circuit board that can improve heat-sinking capability | |
| CN202503862U (en) | Thermally conductive aluminum film | |
| TW201517704A (en) | Flexible circuit board and method for manufacturing same | |
| CN204119718U (en) | A cooling module | |
| CN204151284U (en) | Heat conduction adhesive tape | |
| TWM420832U (en) | Rigid-flex double sided thermal conductivity substrate | |
| CN209955447U (en) | A copper clad laminate with high heat dissipation performance | |
| CN208353691U (en) | A kind of double-sided wiring board of perfect heat-dissipating | |
| CN202617509U (en) | Aluminum substrate having high heat-conducting performance and high heat-resisting performance | |
| CN111867230A (en) | Heat-conducting member embedded circuit board and its manufacturing method | |
| KR101910240B1 (en) | Sandwich type composite plate | |
| CN205385603U (en) | MEMS microphone | |
| CN205105454U (en) | Aluminium base circuit board of high heat dissipation single face | |
| JP5165859B2 (en) | Composite board | |
| CN107949157A (en) | A kind of double-sided wiring board of perfect heat-dissipating | |
| CN103260359B (en) | The manufacture method of the relative blind hole in the positive back side in flexible circuit board | |
| CN205124123U (en) | Copper -clad plate of high heat conduction copper of high proof voltage base |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180807 |