CN207671977U - A kind of conductive adhesive film and products thereof with metal high-bond - Google Patents
A kind of conductive adhesive film and products thereof with metal high-bond Download PDFInfo
- Publication number
- CN207671977U CN207671977U CN201720867005.3U CN201720867005U CN207671977U CN 207671977 U CN207671977 U CN 207671977U CN 201720867005 U CN201720867005 U CN 201720867005U CN 207671977 U CN207671977 U CN 207671977U
- Authority
- CN
- China
- Prior art keywords
- conductive adhesive
- layer
- bond
- parts
- adhesive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000002184 metal Substances 0.000 title claims abstract description 45
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 45
- 239000002313 adhesive film Substances 0.000 title claims abstract description 29
- 239000010410 layer Substances 0.000 claims abstract description 78
- 239000012790 adhesive layer Substances 0.000 claims abstract description 71
- 239000011241 protective layer Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000000843 powder Substances 0.000 claims description 49
- 241000555268 Dendroides Species 0.000 claims description 13
- 238000012856 packing Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 17
- 229920005989 resin Polymers 0.000 abstract description 15
- 239000011347 resin Substances 0.000 abstract description 15
- 230000006378 damage Effects 0.000 abstract description 4
- 238000013461 design Methods 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 31
- 239000000853 adhesive Substances 0.000 description 22
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 17
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 16
- 239000003795 chemical substances by application Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- 239000006087 Silane Coupling Agent Substances 0.000 description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 11
- 125000003700 epoxy group Chemical group 0.000 description 10
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 9
- 150000008065 acid anhydrides Chemical class 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 7
- 239000002041 carbon nanotube Substances 0.000 description 7
- 229910021393 carbon nanotube Inorganic materials 0.000 description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 7
- 238000007731 hot pressing Methods 0.000 description 7
- 239000004925 Acrylic resin Substances 0.000 description 6
- 229920000459 Nitrile rubber Polymers 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910052759 nickel Inorganic materials 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 229920006269 PPS film Polymers 0.000 description 4
- 238000010023 transfer printing Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000002318 adhesion promoter Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920005749 polyurethane resin Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000012779 reinforcing material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000012752 auxiliary agent Substances 0.000 description 2
- 230000037237 body shape Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- WDHYRUBXLGOLKR-UHFFFAOYSA-N phosphoric acid;prop-2-enoic acid Chemical compound OC(=O)C=C.OP(O)(O)=O WDHYRUBXLGOLKR-UHFFFAOYSA-N 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 241001232787 Epiphragma Species 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000344 molecularly imprinted polymer Polymers 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a kind of and metal high-bond conductive adhesive film and products thereof; including heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer, the heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer are sequentially fixedly linked.On the one hand the conductive adhesive film with metal high-bond allows product to carry out selective design for fitting base material, improves product applicability by the selection of the resin between several layers of conductive adhesive layers；On the other hand so that can merge into each other or be crosslinked between several layers of conductive adhesive layers, interiors of products stress is reduced, avoids the possibility of glue layer destruction.
Description
Technical field
The utility model is related to electronic product preparing technical fields, in particular to a kind of and metal high-bond
Conductive adhesive film and preparation method thereof is particularly related to metal reinforcement conductive adhesive film and products thereof in a kind of printed wiring board.
Background technology
Printed wiring board is material indispensable in electronic product, be widely used in computer and its peripheral equipment,
In communication product and consumer electrical product, and with consumer electrical product demand sustainable growth, for printed circuit board
Requirement be also growing day by day.
Printed wiring board includes mainly copper clad laminate (FCCL or CCL) and protection epiphragma or printing ink composition.Due to
Printed wiring board flexible is softer, and printed wiring board needs to increase intensity and electric conductivity at portion of terminal and particular component,
Generally by being realized using reinforcing material at the reinforcement position, common reinforcing material is steel disc, the FR4 etc. of stainless steel, in order to incite somebody to action
Connection (connection base material is mainly copper or plating nickel gold copper material) is realized between steel disc and printed wiring board, while being grounded performance,
It is mostly conductive adhesive currently on the market.But conductive adhesive exist between reinforcing material or base material peel strength it is low,
The problems such as shielding properties is poor, conducting resistance is unstable has seriously affected the performance of electronic product.
For the ground connection realized and shielding properties, the powder filled amount of existing conducting resinl all 60% or more even more
Height, which results in binding force between conducting resinl and base material and supporting material is inadequate, especially to the copper foil of plating nickel gold, due to gold
Surface free energy is very low, and conducting resinl is relatively low to its binding force, and peeling force declines more apparent after Reflow Soldering.
In the patent of Patent No. CN201120142801.3,201620449042.8 and CN201520832730.8,
Its structure is made of release film layer, conductive adhesive layer, metal layer, conductive adhesive layer and the release film layer being fixedly connected sequentially.By
Thin metal layer or the plating last layer coat of metal are added in conductive adhesive layer to improve shielding reduction powder additive amount while improve
With the binding force of base material；But it is due to internal low with metal interlevel binding force, while coefficient of thermal expansion is different between different materials, warp
It crosses after Reflow Soldering and the phenomenon that interlaminar separation inside conducting resinl easily occurs.
In view of this, special propose the utility model.
Utility model content
The first of the utility model is designed to provide a kind of and metal high-bond conductive adhesive film, to solve above-mentioned ask
Topic, the conductive adhesive film with metal high-bond select the resins such as modified epoxy, acrylic acid, polyurethane, polyester,
With high molecular weight, the rigid structure of high symmetry contains the high polar groups such as hydroxyl, carboxyl, aliphatic radical, by itself and conduction simultaneously
Powder, solvent, coupling agent, curing agent etc. are mixed evenly, and are re-introduced into the rubber containing the high polar group such as hydroxyl, carboxyl, aliphatic radical
The auxiliary agents such as glue and metal adhesion accelerating agent make the groups such as conducting resinl finished product and the hydroxyl of metal surface form fat key, with metal
Between have good binding force.By the selection to conductive adhesive layer conducting powder, the powder filled of conductive adhesive layer is on the one hand reduced
Amount so that combined more closely between product and metal；On the other hand still there is good electromagnetic shielding and earth-continuity effect.And
And by the selection of the resin between several layers of conductive adhesive layers, on the one hand allows product to carry out selectivity for fitting base material and set
Meter improves product applicability；On the other hand so that can merge into each other or be crosslinked between several layers of conductive adhesive layers, interiors of products is reduced
Stress avoids the possibility of glue layer destruction.
The second of the utility model is designed to provide a kind of preparation with the conductive adhesive film of metal high-bond
Method, this method are used using conventional mature technology so that the manufacturing process of the utility model is simply easily realized, convenient in work
It is promoted and applied in industry.
In order to realize that the above-mentioned purpose of the utility model, spy use following technical scheme：
A kind of conductive adhesive film with metal high-bond, including the shielding of heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl
Layer, the second conductive adhesive layer and release film protective layer, the heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielded layer, second are led
Electric glue-line and release film protective layer are sequentially fixedly linked.
Conductive adhesive film provided by the utility model with metal high-bond passes through the resin between several layers of conductive adhesive layers
On the one hand selection allows product to carry out selective design for fitting base material, improves product applicability；On the other hand make
It can merge into each other or be crosslinked between several layers of conductive adhesive layers, reduce interiors of products stress, avoid the possibility of glue layer destruction
Property.
Preferably, the heat-resisting press mold layer and the release film protective layer includes PET, PEN, PI, PBT, PPS film
One or more of modified films.
Preferably, the thickness of the heat-resisting press mold layer and the type film protective layer is 25-200 μm, more preferably 50-150 μ
m。
Preferably, the material that first conductive adhesive layer and second conductive adhesive layer include be selected from modified epoxy,
The combination of one or more of polyacrylic resin, modified rubber, polyester resin, polyurethane resin.
Preferably, conductive powder body, the conducting powder are dispersed in first conductive adhesive layer and second conductive adhesive layer
Body includes the combination of one or more of silver powder, silver-coated copper powder, copper powder, nickel powder or conductive carbon nanotube, the conductive powder body
Grain size be 2-30 μm, the shape of the conductive powder body is dendroid or threadiness.
Preferably, the thickness of first conductive adhesive layer and second conductive adhesive layer is 10-30 μm, more preferably 15-
25μm。
Preferably, the material of the material of the conducting resinl shielded layer and first conductive adhesive layer and second conductive adhesive layer
Matter is identical, close or be cross-linked with each other, and is dispersed with conductive powder body in the conducting resinl shielded layer, the conductive powder body include silver powder,
The combination of one or more of silver-coated copper powder, copper powder, nickel powder or conductive carbon nanotube.
Preferably, the thickness of the conducting resinl shielded layer is 5-30 μm, more preferably 10-20 μm.
Preferably, the grain size of the conductive powder body is 2-30 μm, and the shape of the conductive powder body is sheet.
A kind of conductive adhesive film product with metal high-bond, including conductive adhesive film above-mentioned with metal high-bond and
Outer packing, the conductive adhesive film with metal high-bond are packaged using outer packing.
Compared with prior art, the beneficial effects of the utility model are：
(1) the utility model is by selecting the resins such as modified epoxy, acrylic acid, polyurethane, polyester, with macromolecule
Amount, the rigid structure of high symmetry contain the high polar groups such as hydroxyl, carboxyl, aliphatic radical, by itself and conducting powder, solvent, idol simultaneously
Connection agent, curing agent etc. are mixed evenly, and are re-introduced into the rubber containing the high polar group such as hydroxyl, carboxyl, aliphatic radical and metal is attached
The auxiliary agents such as adhesion promoter make the groups such as conducting resinl finished product and the hydroxyl of metal surface form fat key, have between metal fine
Binding force.
(2) the utility model by the selection to conductive adhesive layer conducting powder, fill out by the powder on the one hand reducing conductive adhesive layer
Charge so that combined more closely between product and metal；On the other hand still there is good electromagnetic shielding and earth-continuity effect.
(3) on the one hand the utility model allows product for patch by the selection of the resin between several layers of conductive adhesive layers
It closes base material and carries out selective design, improve product applicability；On the other hand so that several layers of conductive adhesive layers between can merge into each other or
Crosslinking, reduces interiors of products stress, avoids the possibility of glue layer destruction.
Description of the drawings
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific implementation mode or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, other drawings may also be obtained based on these drawings.
Fig. 1 is the structural schematic diagram provided by the utility model with the conductive adhesive film of metal high-bond.
Reference numeral：
The first protection film layers of 1-；2- ink layers；The nonmetallic functional layers of 3-；
4- radio frequency gluing layers；5 second protection film layers.
Specific implementation mode
The technical solution of the utility model is clearly and completely retouched below in conjunction with the drawings and specific embodiments
It states, it will be appreciated by those skilled in the art that following described embodiment is the utility model a part of the embodiment, without
It is whole embodiment, is merely to illustrate the utility model, and is not construed as limitation the scope of the utility model.Based on this practicality
Embodiment in novel, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.The person that is not specified actual conditions in embodiment, according to normal condition or manufacturer
It is recommended that condition carry out.Reagents or instruments used without specified manufacturer is the routine that can be obtained by commercially available purchase
Product.
It is in the description of the present invention, it should be noted that term "center", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
The utility model and simplifying describes for ease of description, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for description purposes only, and are not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, can also be electrical connection；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, it can understand above-mentioned art with concrete condition
The concrete meaning of language in the present invention.
A kind of conductive adhesive film with metal high-bond of specific embodiment of the present invention, including heat-resisting press mold layer, the
One conductive adhesive layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer, the heat-resisting press mold layer, the first conducting resinl
Layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer are sequentially fixedly linked.
The drawings of the utility model institute is well bonded with the conductive adhesive film of metal high-bond tool.
Wherein, heat-resisting press mold layer is high molecular polymer film, mainly presses protection and carrying to make conducting resinl film layer aliquation
With can be one or more of modified films of PET, PEN, PI, PBT, PPS film, thickness is 25-200 microns, while film
On be coated with mould release and have silicone oil or non-silicone oil mould release so that protection film layer can be torn off after product hot pressing.
First conductive adhesive layer and the second conductive adhesive layer are by adhesive main body and the conducting powder group being distributed in adhesive main body
At, the material of conducting powder is the mixture of one or more of silver powder, silver-coated copper powder, copper powder, nickel powder or conductive carbon nanotube,
Adhesive main body be modified epoxy, polyacrylic resin, modified rubber, polyester resin, one kind in polyurethane resin or
The thickness of several mixtures, conducting resinl film layer is 10-30 μm.
Conducting resinl shielded layer is made of adhesive main body and the conducting powder being distributed in adhesive main body, the material of conducting powder
For the mixture of one or more of silver powder, silver-coated copper powder, copper powder, nickel powder or conductive carbon black, adhesive and conductive adhesive layer
Identical, the close or resin reacted that can be cross-linked with each other with it so that gluing interlayer good bonding strength, after Reflow Soldering also not
The thickness of the phenomenon that will appear internal interlaminar separation, conducting resinl shielded layer are 5-30 μm.
Release film protective layer is high molecular polymer film, mainly plays protection and carrying to conducting resinl film layer, can be with
For one or more of modified films of PET, PEN, PI, PBT, PPS film, thickness is 25-200 microns, while being coated on film
Mould release has silicone oil or non-silicone oil mould release so that product can be torn off, and be mainly pressed together on by way of hot pressing or transfer
On conductive adhesive layer.
In a kind of preferred embodiment of the utility model, heat-resisting press mold layer and the release film protective layer include height
Molecularly Imprinted Polymer film and mould release, the one or more of modifications for being preferably selected from PET, PEN, PI, PBT, PPS film are thin
Film, preferred mould release is selected from the one kind having in silicone oil mould release or non-silicone oil mould release.
In a kind of preferred embodiment of the utility model, the thickness of the heat-resisting press mold layer and the type film protective layer
Degree is 25-200 μm, more preferably 50-150 μm.
In a kind of preferred embodiment of the utility model, first conductive adhesive layer and second conductive adhesive layer
Including adhesive and the conductive powder body being dispersed in adhesive, it is furthermore preferred that adhesive is selected from modified epoxy, polypropylene
The combination of one or more of acid resin, modified rubber, polyester resin, polyurethane resin, it is furthermore preferred that the conductive powder body
Combination selected from one or more of silver powder, silver-coated copper powder, copper powder, nickel powder or conductive carbon nanotube.
In a kind of preferred embodiment of the utility model, the grain size of the conductive powder body is 2-30 μm, more preferably
Conductive powder body shape be dendroid or threadiness.
By the selection of conducting powder shape, reduce the additive amount of conducting powder so that conducting resinl largely becomes with metal
Point-like contacts, contact surface is smaller, increases its binding force with metal, while its ground connection performance is also preferable.
In a kind of preferred embodiment of the utility model, first conductive adhesive layer and second conductive adhesive layer
Thickness be 10-30 μm, more preferably 15-25 μm.
In a kind of preferred embodiment of the utility model, the conducting resinl shielded layer includes adhesive and is distributed in
Conductive powder body in adhesive, it is furthermore preferred that in institute's adhesive and first conductive adhesive layer and second conductive adhesive layer
Binder is identical, close or the reaction that is cross-linked with each other resin, it is furthermore preferred that the conductive powder body silver powder, silver-coated copper powder, copper
The mixture of one or more of powder, nickel powder or conductive carbon black.
In a kind of preferred embodiment of the utility model, the thickness is 5-30 μm, more preferably 10-20
μm。
In a kind of preferred embodiment of the utility model, the grain size of the conductive powder body is 2-30 μm, more preferably
Conductive powder body shape be sheet.
It is further preferred that the grain size of aforesaid conductive powder is 2-30 μm, shape is dendroid or threadiness, passes through conduction
The selection of powder shape reduces the additive amount of conducting powder so that conductive adhesive layer largely becomes point-like contacts with metal, contacts
Face is smaller, increases its binding force with metal, while its ground connection performance is also preferable.
A kind of a kind of conductive adhesive film product with metal high-bond of specific implementation mode of the utility model, including it is described
Conductive adhesive film with metal high-bond and outer packing, the conductive adhesive film with metal high-bond are sealed using outer packing
Dress.
In a kind of preferred embodiment of the utility model, the system with the conductive adhesive film of metal high-bond
Preparation Method includes the following steps：
By the first conductive adhesive layer hot pressing on heat-resisting press mold layer, conductive shielding layer is then coated on the first conductive adhesive layer
On, then the second conductive adhesive layer is coated on release film protective layer, it is pressed together on conducting resinl screen finally by the mode of hot-pressing transfer printing
Cover on layer to get.
Embodiment 1
By 65 parts of modified epoxies, 60 parts of dendroid conducting powders, 1 part of silane coupling agent, 15 parts of butanone solvents, 20 parts of ends
Carboxyl nitrile rubber, 1 part of celluosic resin, the special adhesive agent of 0.5 part of copper, 3 parts of acid anhydride type curing agent mixing are uniformly dispersed, and apply
It is distributed on heat-resisting press mold layer, is the first conductive adhesive layer.
By 65 parts of modified epoxies, 70 parts of sheets of conductive powder, 1 part of silane coupling agent, 25 parts of butanone solvents, 15 parts of flexibilities
Modified epoxy, 4 parts of acid anhydride type curing agent mixing are uniformly dispersed, and are coated on the first conductive adhesive layer, are conducting resinl shielded layer.
By 65 parts of modified epoxies, 60 parts of dendroid conducting powders, 1 part of silane coupling agent, 15 parts of butanone solvents, 20 parts of ends
Hydroxyl nitrile rubber, 1 part of celluosic resin, the special adhesive agent of 0.5 part of nickel, 2 parts of acid anhydride type curing agent mixing are uniformly dispersed, and apply
It is distributed on release film protective layer, is the second conductive adhesive layer on being pressed together on conducting resinl shielded layer by way of hot-pressing transfer printing.
The heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer
Thickness is followed successively by：50,20,15,20,35 microns.
Embodiment 2
By 65 parts of modified epoxies, 60 parts of dendroid conducting powders, 1 part of silane coupling agent, 15 parts of butanone solvents, 20 parts of ends
Carboxyl nitrile rubber, 1 part of celluosic resin, the special adhesive agent of 0.5 part of gold, 3 parts of acid anhydride type curing agent mixing are uniformly dispersed, and apply
It is distributed on heat-resisting press mold layer, is the first conductive adhesive layer.
By 110 parts acrylic resin modified, 70 parts of sheets of conductive powder, 1 part of silane coupling agent, 40 parts of butanone solvents, 15 parts
Flexible modified epoxy, 2 parts of modified epoxy class curing agent mixing are uniformly dispersed, and are coated on the first conductive adhesive layer, for conduction
Glue shielded layer.、
By 65 parts of modified epoxies, 60 parts of dendroid conducting powders, 1 part of silane coupling agent, 15 parts of butanone solvents, 20 parts of ends
Hydroxyl nitrile rubber, 1 part of celluosic resin, the special adhesive agent of 0.5 part of nickel, 2 parts of acid anhydride type curing agent mixing are uniformly dispersed, and apply
It is distributed in, is coated on release film protective layer, be second conductive on being pressed together on conducting resinl shielded layer by way of hot-pressing transfer printing
Glue-line.
The heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer
Thickness is followed successively by：50,20,20,20,35 microns.
Embodiment 3
By 80 parts acrylic resin modified, 50 parts of dendroid conducting powders, 5 parts of conductive blacks, 1 part of silane coupling agent, 15 parts
Butanone solvent, 2 parts of phosphate acrylic acid adhesion promoters, the special adhesive agent of 0.5 part of gold, 5 parts of modified epoxy class curing agent mixing
It is uniformly dispersed, is coated on heat-resisting press mold layer, be the first conductive adhesive layer.
By 110 parts acrylic resin modified, 60 parts of sheets of conductive powder, 6 parts of dendroid conducting powders, 1 part of silane coupling agent, 40
Part butanone solvent, 15 parts of flexible modified epoxies, 2 parts of modified epoxy class curing agent mixing are uniformly dispersed, and are coated on first and lead
It is conducting resinl shielded layer on electric glue-line.、
By 80 parts acrylic resin modified, 50 parts of dendroid conducting powders, 5 parts of conductive blacks, 1 part of silane coupling agent, 15 parts
Butanone solvent, 2 parts of phosphate acrylic acid adhesion promoters, the special adhesive agent of 0.5 part of nickel, 5 parts of modified epoxy class curing agent mixing
It is uniformly dispersed, is coated on conducting resinl shielded layer, be the second conductive adhesive layer.
The heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer
Thickness is followed successively by：50,20,20,20,35 microns.
Embodiment 4
By 65 parts of modified epoxies, 50 parts of dendroid conducting powders, 3 parts of carbon nanotubes, 1 part of silane coupling agent, 20 parts of fourths
Ketone solvent, 30 parts of end carboxyl nitrile rubbers, 1 part of celluosic resin, the special adhesive agent of 0.5 part of copper, 3 parts of acid anhydride type curing agent mixing
It is uniformly dispersed, is coated on heat-resisting press mold layer, be the first conductive adhesive layer.
By 65 parts of modified epoxies, 60 parts of sheets of conductive powder, 5 parts of carbon nanotubes, 1 part of silane coupling agent, 35 parts of butanone
Solvent, 15 parts of flexible modified epoxies, 4 parts of acid anhydride type curing agent mixing are uniformly dispersed, and are coated on the first conductive adhesive layer, are
Conducting resinl shielded layer.
By 65 parts of modified epoxies, 50 parts of dendroid conducting powders, 3 parts of carbon nanotubes, 1 part of silane coupling agent, 20 parts of fourths
Ketone solvent, 20 parts of terminal hydroxy group nitrile rubbers, 1 part of celluosic resin, the special adhesive agent of 0.5 part of nickel plating, 2 parts of acid anhydride type curing agents are mixed
Conjunction is uniformly dispersed, and is coated on release film protective layer, is the on being pressed together on conducting resinl shielded layer by way of hot-pressing transfer printing
Two conductive adhesive layers.
The heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielded layer, the second conductive adhesive layer and release film protective layer
Thickness is followed successively by：50,20,15,20,35 microns.
Comparative example 1：Toyochem TSC200.
Comparative example 2：Tatsuta CBF300.
Comparative example 3：TCF 4000.
Experimental example
1. ground resistance m Ω (apertures Φ 1.2mm)：
2. peel strength N/cm (90 ° and nickel plating steel disc)
3. peel strength N/cm (90 ° and plating nickel gold)
4. shield effectiveness dB (10MHz-10GHz)
It can be seen that from above-mentioned contrast test according to embodiment described in this patent, in resistance, peel strength and shield effectiveness
On have preferable effect, while improving some defects of the existing competing product of the same trade, there is more excellent comprehensive performance.
Although illustrate and describing the utility model with specific embodiment, the above various embodiments will be appreciated that
It is only to illustrate the technical solution of the utility model, rather than its limitations；It will be understood by those of ordinary skill in the art that：Not
In the case of the spirit and scope of the utility model, the technical solution recorded in foregoing embodiments can be repaiied
Change, equivalent replacement either is carried out to which part or all technical features；And these modifications or replacements, do not make corresponding skill
The essence of art scheme is detached from the range of various embodiments of the utility model technical solution；It is, therefore, intended that in appended claims
Include all these substitutions and modifications belonged in the scope of the utility model.
Claims (6)
1. a kind of and metal high-bond conductive adhesive film, which is characterized in that including heat-resisting press mold layer, the first conductive adhesive layer, lead
Electric glue shielded layer, the second conductive adhesive layer and release film protective layer, the heat-resisting press mold layer, the first conductive adhesive layer, conducting resinl shielding
Layer, the second conductive adhesive layer and release film protective layer are sequentially fixedly linked.
2. according to claim 1 with metal high-bond conductive adhesive film, which is characterized in that the heat-resisting press mold layer and
The thickness of the type film protective layer is 25-200 μm.
3. according to claim 1 and metal high-bond conductive adhesive film, which is characterized in that first conductive adhesive layer
Thickness with second conductive adhesive layer is 10-30 μm.
4. according to claim 1 and metal high-bond conductive adhesive film, which is characterized in that the conducting resinl shielding
Layer thickness is 5-30 μm.
5. according to claim 1 and metal high-bond conductive adhesive film, which is characterized in that the grain of the conductive powder body
Diameter is 2-30 μm, and the shape of the conductive powder body is sheet, dendroid or threadiness.
6. a kind of and metal high-bond conductive adhesive film product, which is characterized in that including claim 1-5 any one of them
Conductive adhesive film with metal high-bond and outer packing, the conductive adhesive film with metal high-bond are sealed using outer packing
Dress.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720867005.3U CN207671977U (en) | 2017-07-17 | 2017-07-17 | A kind of conductive adhesive film and products thereof with metal high-bond |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720867005.3U CN207671977U (en) | 2017-07-17 | 2017-07-17 | A kind of conductive adhesive film and products thereof with metal high-bond |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207671977U true CN207671977U (en) | 2018-07-31 |
Family
ID=62954072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720867005.3U Expired - Fee Related CN207671977U (en) | 2017-07-17 | 2017-07-17 | A kind of conductive adhesive film and products thereof with metal high-bond |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207671977U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114864572A (en) * | 2022-05-06 | 2022-08-05 | Tcl华星光电技术有限公司 | Display panel and display device |
-
2017
- 2017-07-17 CN CN201720867005.3U patent/CN207671977U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114864572A (en) * | 2022-05-06 | 2022-08-05 | Tcl华星光电技术有限公司 | Display panel and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107189708B (en) | A kind of conductive adhesive film with high metal binding force and preparation method thereof | |
| KR101189636B1 (en) | Planar antenna and method for manufacturing same | |
| WO2017104479A1 (en) | Thermosetting adhesive sheet, flexible printed-wiring board with reinforcement part, method for producing same, and electronic device | |
| JP4556936B2 (en) | Adhesive for electrode connection | |
| JP2001240816A (en) | Anisotropic conductive adhesive film | |
| JP2007091959A (en) | Anisotropic conductive adhesive | |
| KR101552976B1 (en) | An emi shield film and method for fabricating the same | |
| CN101681692A (en) | Electrically conductive particle, anisotropic conductive connection material, and method for production of electrically conductive particle | |
| JP2008094908A (en) | Adhesive for electrode connection | |
| KR20120106789A (en) | Anisotropic conductive film, united object, and process for producing united object | |
| CN106883786A (en) | A kind of preparation method of comprehensive thermal setting conductive glue | |
| CN207671977U (en) | A kind of conductive adhesive film and products thereof with metal high-bond | |
| CN110016302A (en) | Conductive adhesive compositions and the isotropism conductive film formed by it | |
| JP2002204052A (en) | Circuit connecting material and method for connecting circuit terminal using the same as well as connecting structure | |
| CN114830843B (en) | Conductive adhesive | |
| CN207201068U (en) | Electromagnetic shielding film and printed substrate | |
| JPH07105580B2 (en) | Flexible printed circuit board | |
| JP4110589B2 (en) | Circuit connection member and circuit board manufacturing method | |
| CN104371616A (en) | Preparation method of phenolic resin conductive adhesive | |
| JP6460419B2 (en) | Flexible printed wiring board with reinforcing portion, manufacturing method thereof, and electronic device | |
| JP2008308519A (en) | Adhesive for electrode connection | |
| JP7289993B2 (en) | conductive adhesive layer | |
| CN107613628A (en) | Electromagnetic wave shielding material | |
| TWI884347B (en) | Conductive adhesive layer | |
| CN110054996A (en) | Electric conductivity junction film and the electromagnetic shielding film for using the electric conductivity junction film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 Dongping Road, Bacheng Town, Suzhou City, Jiangsu Province, 399 Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 Dongping Road, Bacheng Town, Suzhou City, Jiangsu Province, 399 Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180731 |