CN207572600U - A kind of package casing for integrating low-and high-frequency connector - Google Patents
A kind of package casing for integrating low-and high-frequency connector Download PDFInfo
- Publication number
- CN207572600U CN207572600U CN201721371622.0U CN201721371622U CN207572600U CN 207572600 U CN207572600 U CN 207572600U CN 201721371622 U CN201721371622 U CN 201721371622U CN 207572600 U CN207572600 U CN 207572600U
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- CN
- China
- Prior art keywords
- frequency connector
- inner wire
- installation
- hole
- insulator
- Prior art date
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Links
- 238000009434 installation Methods 0.000 claims abstract description 23
- 239000012212 insulator Substances 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910000833 kovar Inorganic materials 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000010354 integration Effects 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 11
- 239000004020 conductor Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
The utility model discloses a kind of package casings for integrating low-and high-frequency connector, including outer cover body, inner wire and insulator, the outer cover body side wall is equipped with installation through-hole, the inner wire being coaxial therewith is provided in installation through-hole, insulator is connected between inner wire and installation through-hole, installation through-hole, inner wire and insulator form low-and high-frequency connector body；The utility model is reduced inside outer cover body to the requirement of welding temperature, improves integrally-built reliability.
Description
Technical field
The utility model belongs to microwave components technical field, is specifically related to outside a kind of encapsulation for integrating low-and high-frequency connector
Shell.
Background technology
With extensive use of the phased array system in the complete electronic sets such as radar and communication, development and production great quantity of small is needed
Change, high density and multifunction microwave component；The Micro-package technique of microwave components is to realize electronics miniaturization, lightweight, height
The important technology approach of the targets such as density three-dimensional interconnection structure, wide working band, high working frequency and high reliability；Micro-group fills skill
Art, it is simple for, need to set low-and high-frequency connector on package casing side wall, for signal transmission；In package casing
Portion carries out the assembling of chip by welding；In this process, it is related to multi-temperature gradient Welding Problems, i.e., inside package casing
Welding temperature will be less than the temperature tolerance of low-and high-frequency connector；And existing low-and high-frequency connector independently makes, low-and high-frequency connector
With inner wire, outer conductor and insulator, then outer conductor is bonded on package casing side wall so that low-and high-frequency connector
Temperature tolerance is low, greatly limits the welding temperature inside package casing, so as to increase the assembling difficulty of chip.
Invention content
In view of this, the purpose of this utility model is to provide a kind of package casing for integrating low-and high-frequency connector, pass through
Low-and high-frequency connector body with outer cover body is integrated, the temperature tolerance of low-and high-frequency connector body is improved, so as to reduce
To the requirement of welding temperature inside outer cover body, the assembling difficulty of chip is advantageously reduced.
In order to achieve the above object, a kind of package casing for integrating low-and high-frequency connector of the utility model, including shell sheet
Body, inner wire and insulator, the outer cover body side wall are equipped with installation through-hole, be provided in installation through-hole be coaxial therewith in lead
Body, is connected with insulator between inner wire and installation through-hole, installation through-hole, inner wire and insulator form low-and high-frequency connector sheet
Body.
Further, the insulator is ring glass piece, and inner circle side and inner wire sealing connect, outer round surface with
Installation through-hole sealing connection.
Further, the insulator is ring-shaped pottery piece, internal circular surfaces and inner wire soldering connection, outer round surface with
Installation through-hole soldering connection.
Further, the material of the outer cover body and inner wire is kovar alloy.
The beneficial effects of the utility model are：
1. a kind of package casing for integrating low-and high-frequency connector of the utility model has broken traditional yoke, low-and high-frequency is connected
It connects device ontology to integrate with outer cover body, avoids the secondary welding to low-and high-frequency connector body, so as to reduce shell
Requirement of the body interior to welding temperature advantageously reduces the assembling difficulty of chip；In addition to this, air-tightness failure is reduced
Risk.
2. inner wire described in a kind of package casing for integrating low-and high-frequency connector of the utility model by disposably sealing or
Person's soldering is fixed in installation through-hole, is avoided the thermal shock through heat-treated again, is conducive to improve integrally-built reliability；It is existing
Have in technology, low-and high-frequency connector independently makes, and inner wire needs to be sealed or be brazed under the high temperature conditions, to will be high
Low-frequency connector is assembled in package casing, needs to weld outer conductor under the high temperature conditions or be bonded on package casing, this
When, inner wire must the thermal shock through heat-treated again, cause its reliability reduction.
3. a kind of package casing for integrating low-and high-frequency connector of the utility model optimizes whole structure；The prior art
In, package casing must reserve the welding space of low-and high-frequency connector；And the utility model is by low-and high-frequency connector body and outside
Shell ontology Integration is integrated, and without reserved welding space, is conducive to integrally-built lightening development.
Description of the drawings
In order to make the purpose of this utility model, technical solution and advantageous effect clearer, the utility model provides as follows
Attached drawing illustrates：
Fig. 1 is a kind of structure diagram for the package casing for integrating low-and high-frequency connector of the utility model；
Reference numeral：1- outer cover bodies；2- inner wires；3- insulators.
Specific embodiment
Below in conjunction with attached drawing, the preferred embodiment of the utility model is described in detail.
As shown in Figure 1；A kind of package casing for integrating low-and high-frequency connector of the utility model, including outer cover body 1, interior leads
Body 2 and insulator 3；1 side wall of outer cover body is equipped with installation through-hole, is provided with the inner wire 2 being coaxial therewith in installation through-hole, inside leads
Insulator 3 is connected between body 2 and installation through-hole, installation through-hole, inner wire 2 and insulator 3 form low-and high-frequency connector body；
Here, insulator 3 selects ring glass piece, and dielectric constant is 3.9~4.2, and inner circle side is connected with the sealing of inner wire 2,
Its outer round surface is connected with installation through-hole sealing, and outer cover body 1 and the material of inner wire 2 are kovar alloy.
Experiment shows：The temperature tolerance of low-and high-frequency connector body is up to 700 DEG C described in present embodiment, greatly reduces
To the requirement of welding temperature inside outer cover body 1, the assembling difficulty of chip is advantageously reduced.
In addition to this, insulator 3 can also select ring-shaped pottery piece, internal circular surfaces and 2 soldering connection of inner wire, outside
Circular surfaces and installation through-hole soldering connection.
Finally illustrate, preferred embodiment above is merely intended for describing the technical solutions of the present application, but not for limiting the present application, to the greatest extent
Pipe has been described in detail the utility model by above preferred embodiment, but those skilled in the art should manage
Solution, can in the form and details make it various changes, without departing from the utility model claims book institute
The range of restriction.
Claims (4)
1. a kind of package casing for integrating low-and high-frequency connector, it is characterised in that：Including outer cover body, inner wire and insulator,
The outer cover body side wall is equipped with installation through-hole, and the inner wire being coaxial therewith is provided in installation through-hole, and inner wire is logical with installation
Insulator is connected between hole, installation through-hole, inner wire and insulator form low-and high-frequency connector body.
2. a kind of package casing for integrating low-and high-frequency connector as described in claim 1, it is characterised in that：The insulator is
Ring glass piece, inner circle side are connected with inner wire sealing, and outer round surface is connected with installation through-hole sealing.
3. a kind of package casing for integrating low-and high-frequency connector as described in claim 1, it is characterised in that：The insulator is
Ring-shaped pottery piece, internal circular surfaces and inner wire soldering connection, outer round surface and installation through-hole soldering connection.
4. such as a kind of package casing of integration low-and high-frequency connector of claims 1 to 3 any one of them, it is characterised in that：Institute
The material for stating outer cover body and inner wire is kovar alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721371622.0U CN207572600U (en) | 2017-10-23 | 2017-10-23 | A kind of package casing for integrating low-and high-frequency connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721371622.0U CN207572600U (en) | 2017-10-23 | 2017-10-23 | A kind of package casing for integrating low-and high-frequency connector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207572600U true CN207572600U (en) | 2018-07-03 |
Family
ID=62695989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721371622.0U Active CN207572600U (en) | 2017-10-23 | 2017-10-23 | A kind of package casing for integrating low-and high-frequency connector |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207572600U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107732533A (en) * | 2017-10-23 | 2018-02-23 | 苏州中航天成电子科技有限公司 | A kind of package casing for integrating low-and high-frequency connector |
-
2017
- 2017-10-23 CN CN201721371622.0U patent/CN207572600U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107732533A (en) * | 2017-10-23 | 2018-02-23 | 苏州中航天成电子科技有限公司 | A kind of package casing for integrating low-and high-frequency connector |
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