CN207476099U - a cooling system - Google Patents

Abstract

The utility model provides a kind of cooling system, and cooling system includes：Heat pipe evaporator, heat pipe condenser, refrigerant distribution module and at least one liquid cold plate；Liquid cold plate is contacted with each processor one-to-one correspondence of the server of data center；Heat pipe condenser receives and transmits vaporized refrigerant, and vaporized refrigerant is made to carry out heat exchange with natural cooling source to form liquid refrigerant and export；Liquid refrigerant is transmitted separately to each heat pipe evaporator and each liquid cold plate by refrigerant distribution module；Heat entrained by air is to form vaporized refrigerant in the liquid refrigerant absorption interior space that heat pipe evaporator receives it and transmits, and exports to heat pipe condenser；The liquid refrigerant that liquid cold plate receives it and transmits absorbs the heat entrained by the processor of corresponding contact to form vaporized refrigerant, and exports to heat pipe condenser.By the technical solution of the utility model, the operation that data center can be enable more stable.

Description

a cooling system

technical field

The utility model relates to the technical field of air conditioning, in particular to a cooling system.

Background technique

With the continuous development of computer application technology, the number and scale of data centers are also increasing. In order to save the power consumption of data centers, more and more data centers use natural cooling sources (such as water or air at lower temperatures) to The server nodes perform heat dissipation.

At present, heat pipe air conditioners are usually required when natural cooling sources are used to dissipate heat from each server node in a data center. The heat pipe air conditioner is usually composed of a heat pipe evaporator and a heat pipe condenser. The heat pipe evaporator can be installed in the indoor space where the data center is located, the heat pipe condenser can be installed in the outdoor environment, and the relatively high vapor refrigerant can be placed in the heat pipe condenser Exchange heat with a natural cold source (air or water at a lower temperature in the outdoor environment) to condense into a liquid state, and then enter the heat pipe evaporator, and the liquid refrigerant can absorb the heat carried by the air in the indoor space through the heat pipe evaporator, thereby Reduce the temperature of each server node in the data center; at the same time, the liquid refrigerant that absorbs heat can be evaporated into vapor refrigerant in the heat pipe evaporator, and then flow back to the heat pipe condenser.

However, the heat transfer resistance between the heat pipe evaporator and the air in the indoor space is relatively large, and for the data center, the heat dissipation requirements of the processors in each server are relatively high, and the heat dissipation requirements of other functional components such as power modules are relatively low. When the power of the processor is too high and the temperature is high, the heat pipe air conditioner cannot absorb the heat carried by each processor quickly and in large quantities, and cannot meet the heat dissipation requirements of the processor, resulting in the unstable operation of the data center.

Utility model content

The embodiment of the utility model provides a cooling system, which can make the data center run more stably.

In the first aspect, the embodiment of the utility model provides a cooling system, including:

At least one heat pipe evaporator, heat pipe condenser, refrigerant distribution module and at least one liquid-cooled cold plate; wherein,

The at least one liquid-cooled cold plate is in one-to-one contact with each processor of at least one server in the data center;

The heat pipe condenser is arranged in an outdoor environment, and the at least one heat pipe evaporator is arranged in an indoor space where the data center is located;

The heat pipe condenser is used to receive and transmit vapor refrigerant, so that the vapor refrigerant can exchange heat with a natural cooling source in the outdoor environment through the heat pipe condenser to form a liquid refrigerant, and output the liquid refrigerant;

The refrigerant distribution module is used to transfer the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators and each of the liquid-cooled cold plates;

Each of the heat pipe evaporators is used to transmit the liquid refrigerant received by it, so that the transmitted liquid refrigerant absorbs the heat carried by the air in the indoor space through the heat pipe evaporator to form a vapor refrigerant, and the formed refrigerant The vapor refrigerant is output to the heat pipe condenser;

Each of the liquid-cooled cold plates is used to transmit the liquid refrigerant received by it, so that the transmitted liquid refrigerant absorbs the heat carried by the corresponding contacting processor through the liquid-cooled cold plate to form a vapor refrigerant, And output the formed vapor refrigerant to the heat pipe condenser.

Preferably,

The refrigerant distribution module includes: a temperature acquisition unit, a determination unit, and a first control unit; wherein,

The temperature collection unit is used to collect temperature parameters of natural cold sources in the outdoor environment;

The determining unit is configured to determine the first refrigerant distribution coefficient according to each of the temperature parameters;

The first control unit is configured to transfer the first part of the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators according to the first refrigerant distribution coefficient, and transfer the second part of the output of the heat pipe condenser to Liquid refrigerant is delivered to each of the liquid-cooled cold plates.

Preferably,

The refrigerant distribution module includes: a power acquisition unit, a calculation unit and a second control unit; wherein,

The power collection unit is configured to collect the current power of each of the processors;

The calculation unit is configured to calculate the second refrigerant distribution coefficient according to the current power of each of the processors;

The second control unit is configured to transfer the third part of the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators according to the second refrigerant distribution coefficient, and transfer the fourth part of the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators. Part of the liquid refrigerant is delivered to each of the liquid-cooled cold plates.

Preferably,

Also includes: power plant; wherein,

The refrigerant distribution module is connected to each of the liquid-cooled cold plates through the power device;

The power device is used to drive the liquid refrigerant transported by the refrigerant distribution module to each of the liquid-cooled cold plates to enter each of the liquid-cooled cold plates.

Preferably,

A first distance between the heat pipe evaporator and a horizontal plane is smaller than a second distance between the heat pipe condenser and a horizontal plane.

In the second aspect, the embodiment of the present utility model provides a method for controlling any one of the heat dissipation systems in the first aspect, including:

Using the heat pipe condenser to receive and transmit the vapor refrigerant, so that the vapor refrigerant exchanges heat with the natural cooling source in the outdoor environment through the heat pipe condenser to form a liquid refrigerant, and output the liquid refrigerant;

Using the refrigerant distribution module to transfer the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators and each of the liquid-cooled cold plates;

Utilize each of the heat pipe evaporators to transmit the received liquid refrigerant, so that the transmitted liquid refrigerant passes through the heat pipe evaporator to absorb the heat carried by the air in the indoor space to form a vapor refrigerant, and refrigerate the formed vapor The agent is output to the heat pipe condenser;

Utilize each of the liquid-cooled cold plates to transmit the received liquid refrigerant, so that the transmitted liquid refrigerant absorbs the heat carried by the corresponding contacting processor through the liquid-cooled cold plate to form a liquid refrigerant, and the formed Liquid refrigerant is output to the heat pipe condenser.

Preferably,

When the refrigerant distribution module includes a temperature acquisition unit, a determination unit and a first control unit,

The use of the refrigerant distribution module to transfer the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators and each of the liquid-cooled cold plates includes:

Using the temperature collection unit to collect temperature parameters of natural cold sources in the outdoor environment;

Using the determination unit to determine the first refrigerant distribution coefficient according to each of the temperature parameters;

Utilize the first control unit to transmit the first part of the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators according to the first refrigerant distribution coefficient, and refrigerate the second part of the liquid refrigerant output from the heat pipe condenser Agents are delivered to each of the liquid-cooled cold plates.

Preferably,

When the refrigerant distribution module includes a power acquisition unit, a calculation unit and a second control unit,

The use of the refrigerant distribution module to transfer the liquid refrigerant output from the heat pipe condenser to the heat pipe evaporator and each of the liquid-cooled cold plates respectively includes:

Using the power collection unit to collect the current power of each of the processors;

using the calculation unit to calculate the second refrigerant distribution coefficient according to the current power of each of the processors;

Utilize the second control unit to transfer the third part of the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators according to the second refrigerant distribution coefficient, and transfer the fourth part of the liquid refrigerant output from the heat pipe condenser to Refrigerant is delivered to each of the liquid-cooled cold plates.

The embodiment of the utility model provides a heat dissipation system, the heat dissipation system is composed of at least one heat pipe evaporator, heat pipe condenser, refrigerant distribution module and at least one liquid-cooled cold plate, and each heat pipe evaporator is arranged in the indoor space where the data center is located , the heat pipe condenser is set in the outdoor environment, and the heat pipe condenser can exchange heat between the gaseous refrigerant it receives and the natural cold source (such as air or water at a lower temperature in the outdoor environment) to form a liquid refrigerant and output , the refrigerant distribution module can transfer a part of the liquid refrigerant output from the heat pipe condenser to each liquid-cooled cold plate, and transfer another part of the liquid refrigerant to the heat pipe evaporator; thus, on the one hand, the liquid refrigerant transmitted by each heat pipe evaporator The refrigerant can absorb the heat carried by the air in the indoor space to form a vapor refrigerant and output it to the heat pipe condenser to meet the heat dissipation requirements of functional components such as power modules in the data center; on the other hand, each liquid-cooled cold plate and at least the data center The processors of a server are in one-to-one contact, so that the corresponding heat transfer resistance between the liquid refrigerant transmitted in each liquid-cooled cold plate and each processor is relatively small, and the liquid refrigerant transmitted in each liquid-cooled cold plate The refrigerant can quickly and massively absorb the heat generated by the corresponding processors in contact with it to form a vapor refrigerant that flows back into the heat pipe condenser to ensure that the processor is kept at a lower temperature to meet the heat dissipation requirements of each processor and to make the data The center can run more stably.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are some embodiments of the present utility model. Those skilled in the art can also obtain other drawings based on these drawings without any creative work.

Fig. 1 is a structural diagram of a cooling system provided by an embodiment of the present invention;

Fig. 2 is a schematic structural diagram of another heat dissipation system provided by an embodiment of the present invention;

Fig. 3 is a schematic structural diagram of another heat dissipation system provided by an embodiment of the present invention;

Fig. 4 is a flow chart of a method for controlling a cooling system provided by an embodiment of the present invention.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the utility model more clear, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the utility model. Obviously, the described The embodiments are part of the embodiments of the present utility model, rather than all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work are all It belongs to the protection scope of the utility model.

As shown in Figure 1, the embodiment of the utility model provides a heat dissipation system, which is characterized in that it includes:

At least one heat pipe evaporator 101, heat pipe condenser 102, refrigerant distribution module 103 and at least one liquid-cooled cold plate 104; wherein,

The at least one liquid-cooled cold plate 104 is in one-to-one contact with each processor of at least one server in the data center;

The heat pipe condenser 102 is arranged in an outdoor environment, and the at least one heat pipe evaporator 101 is arranged in an indoor space where the data center is located;

The heat pipe condenser 102 is used to receive and transmit vapor refrigerant, so that the vapor refrigerant can exchange heat with the natural cold source in the outdoor environment through the heat pipe condenser 102 to form a liquid refrigerant, and output liquid refrigerant agent;

The refrigerant distribution module 103 is configured to transfer the liquid refrigerant output from the heat pipe condenser 102 to each of the heat pipe evaporators 101 and each of the liquid-cooled cold plates 104;

Each of the heat pipe evaporators 101 is used to transmit the liquid refrigerant received by it, so that the transmitted liquid refrigerant passes through the heat pipe evaporator 101 to absorb the heat carried by the air in the indoor space to form a vapor refrigerant, and The formed vapor refrigerant is output to the heat pipe condenser 102;

Each of the liquid-cooled cold plates 104 is used to transmit the liquid refrigerant received by it, so that the liquid refrigerant transmitted by it absorbs the heat carried by the corresponding contacting processor through the liquid-cooled cold plate 104 to form vapor refrigeration. refrigerant, and output the formed vapor refrigerant to the heat pipe condenser 102.

In the embodiment shown in Figure 1, the heat dissipation system is composed of at least one heat pipe evaporator, heat pipe condenser, refrigerant distribution module and at least one liquid-cooled cold plate. The condenser is installed in the outdoor environment, and the heat pipe condenser can exchange heat between the gaseous refrigerant it receives and the natural cold source (such as air or water at a lower temperature in the outdoor environment) to form a liquid refrigerant and output it, and distribute the refrigerant The module can transmit a part of the liquid refrigerant output from the heat pipe condenser to each liquid-cooled cold plate, and transmit another part of the liquid refrigerant to the heat pipe evaporator; thus, on the one hand, the liquid refrigerant transmitted by each heat pipe evaporator can absorb The heat carried by the air in the indoor space forms a vapor refrigerant and outputs it to the heat pipe condenser to meet the heat dissipation requirements of functional components such as power modules in the data center; on the other hand, each liquid-cooled cold plate and at least one server in the data center Each processor is in one-to-one contact, so that the corresponding heat transfer resistance between the liquid refrigerant transmitted in each liquid-cooled cold plate and each processor is relatively small, and the liquid refrigerant transmitted in each liquid-cooled cold plate can be Quickly and massively absorb the heat generated by the corresponding contacting processors to form a vapor refrigerant that flows back into the heat pipe condenser to ensure that the processors are kept at a lower temperature and meet the heat dissipation requirements of each processor, enabling the data center to be more efficient. for stable operation.

Based on the embodiment shown in Figure 1, in one embodiment of the present invention, as shown in Figure 2, the refrigerant distribution module 103 includes: a temperature acquisition unit 1031, a determination unit 1032, and a first control unit 1033; wherein,

The temperature collection unit 1031 is used to collect temperature parameters of natural cold sources in the outdoor environment;

The determining unit 1032 is configured to determine the first refrigerant distribution coefficient according to each of the temperature parameters;

The first control unit 1033 is configured to transmit the first part of the liquid refrigerant output from the heat pipe condenser 102 to each of the heat pipe evaporators 101 according to the first refrigerant distribution coefficient, and output the heat pipe condenser 102 The second part of the liquid refrigerant is delivered to each of the liquid-cooled cold plates 104 .

In the above-mentioned embodiments of the present invention, the first refrigerant distribution coefficient determined by the determining unit specifically refers to the volume of the second part of liquid refrigerant transferred to each liquid-cooled cold plate and the volume of the first part of liquid refrigerant transferred to the heat pipe evaporator. The first refrigerant coefficient can be directly proportional to the temperature parameter of the natural cooling source in the outdoor environment. When the flow rate of the liquid refrigerant output by the heat pipe condenser is constant, the cooling capacity carried in the liquid refrigerant output by the heat pipe condenser depends on the temperature parameters of the natural cooling source in the outdoor environment. When the temperature of the natural cooling source collected by the temperature acquisition unit The lower the parameter, the more cooling capacity is carried by the liquid refrigerant output by the heat pipe condenser, and only a small volume of liquid refrigerant is required to enter each liquid-cooled cold plate to meet the heat dissipation requirements of each processor. At this time, Then a smaller first refrigerant distribution coefficient can be determined, and the first control unit can control less liquid refrigerant to enter each liquid-cooled cold plate and more liquid refrigerant to enter the heat pipe according to the first refrigerant distribution coefficient. The evaporator ensures that while meeting the heat dissipation requirements of each processor, more liquid refrigerant is prevented from continuing to enter each liquid-cooled cold plate and wasting the cooling capacity it carries. More liquid refrigerant enters the heat pipe evaporator, which can make The temperature of the indoor space where the data center is located is lower, improving the comfort of the indoor space where the data center is located.

Based on the embodiment shown in Figure 1, in one embodiment of the present invention, as shown in Figure 3, the refrigerant distribution module 103 includes: a power collection unit 1034, a calculation unit 1035, and a second control unit 1036; wherein,

The power collection unit 1034 is configured to collect the current power of each of the processors;

The calculation unit 1035 is configured to calculate the second refrigerant distribution coefficient according to the current power of each of the processors;

The second control unit 1036 is configured to transmit the third part of the liquid refrigerant output from the heat pipe condenser 102 to each of the heat pipe evaporators 101 according to the second refrigerant distribution coefficient, and transfer the heat pipe condenser 102 The fourth part of the output liquid refrigerant is delivered to each of the liquid-cooled cold plates 104 .

In the above-mentioned embodiments of the present invention, the second refrigerant distribution coefficient specifically refers to the volume of the fourth part of liquid refrigerant transferred to each liquid-cooled cold plate and the volume of the third part of liquid refrigerant transferred to the heat pipe evaporator The ratio between the second refrigerant distribution coefficients may be proportional to the average value of the current power of each processor. Since the higher the power of the processor, the more heat it generates, correspondingly, more cooling capacity is needed to meet its heat dissipation requirements. Therefore, the heat pipe condenser can use the natural cold source of the outdoor environment to convert the refrigerant it receives into When cooling to the set temperature, the higher the current power of each processor collected by the power acquisition unit, the greater the second refrigerant distribution coefficient calculated by the calculation unit, indicating that more liquid refrigerant is required to meet the cooling requirements of each processor. demand, the second controller can control more liquid refrigerant to enter each liquid-cooled cold plate according to the second refrigerant distribution coefficient to meet the heat dissipation requirements of the processor; on the contrary, when the average value of the current power of each processor is smaller, The smaller the distribution coefficient of the second refrigerant, the second control unit can control less liquid refrigerant to enter each liquid-cooled cold plate to meet the heat dissipation requirements of each processor. At this time, control more liquid refrigerant to enter the heat pipe evaporator, which can To ensure that the heat dissipation requirements of each processor are met, more liquid refrigerant is prevented from continuing to enter each liquid-cooled cold plate and wasting the cooling capacity it carries. More liquid refrigerant enters the heat pipe evaporator, which can make the data center where The temperature of the indoor space is lower, and the comfort of the indoor space where the data center is located is improved.

Those skilled in the art should understand that, in actual business scenarios, for the refrigerant distribution module, the current temperature of the natural cooling source in the outdoor environment and the current power of each processor can also be combined to determine the flow rate of each liquid-cooled cold plate. The ratio between the volume of the fifth part of the liquid refrigerant and the volume of the sixth part of the liquid refrigerant entering each heat pipe evaporator is used as a refrigerant distribution coefficient, and according to the refrigerant distribution coefficient, it is used to enter each liquid-cooled cold plate and the volume (or flow rate) of the liquid refrigerant in each heat pipe evaporator is controlled.

Based on the embodiment shown in Figure 1, in one embodiment of the present invention, the heat dissipation system further includes: a power unit (not shown in the drawings); wherein, the refrigerant distribution module 103 passes through the power unit It is connected with each of the liquid-cooled cold plates 104 ; the power device is used to drive the liquid refrigerant transported by the refrigerant distribution module 103 to each of the liquid-cooled cold plates 104 to enter each of the liquid-cooled cold plates 104 .

In the above-mentioned embodiments of the present invention, since the diameter of the pipeline used to transmit the refrigerant in the liquid-cooled cold plate is relatively small, by setting a power device (such as a fluorine pump) between each liquid-cooled cold plate and the refrigerant distribution module ) to drive the liquid refrigerant so that the refrigerant can circulate in each liquid-cooled cold plate; at the same time, the power unit can be a variable frequency fluorine pump, which can be combined with the flow adjustment of part of the liquid refrigerant entering the power unit under the control of the refrigerant distribution module Frequency conversion fluorine pump frequency, the larger the flow rate, the higher the frequency, the smaller the flow rate, the lower the frequency, so as to save electric energy.

In an embodiment of the present invention, the first distance between the heat pipe evaporator 101 and the horizontal plane is smaller than the second distance between the heat pipe condenser 102 and the horizontal plane. It is not difficult to understand that when the first distance between the heat pipe evaporator and the horizontal plane is smaller than the second distance between the heat pipe condenser and the horizontal plane, the third distance between the refrigerant distribution module and the horizontal plane should be greater than the second distance and smaller than the first distance, In this way, part of the liquid refrigerant formed in the heat pipe condenser can be directly entered into each heat pipe evaporator through the refrigerant distribution module under the action of gravity, and no additional power device is required to drive part of the liquid refrigerant entering the heat pipe evaporator , to further save power.

Correspondingly, the vapor cooler formed in each heat pipe evaporator and each liquid-cooled cold plate can automatically rise to enter the heat pipe condenser.

Those skilled in the art should understand that when the data center deployed in the indoor space includes multiple server cabinets, and each server cabinet has a certain number of servers, each server can be arranged at intervals with at least one heat pipe evaporator.

As shown in Figure 4, the embodiment of the present invention provides a method for controlling the cooling system provided in any embodiment of the present invention, including:

Step 401, using the heat pipe condenser to receive and transmit vapor refrigerant, so that the vapor refrigerant exchanges heat with a natural cooling source in the outdoor environment through the heat pipe condenser to form a liquid refrigerant, and output the liquid refrigerant ;

Step 402, using the refrigerant distribution module to transfer the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators and each of the liquid-cooled cold plates;

Step 403, using each of the heat pipe evaporators to transmit the received liquid refrigerant, so that the transmitted liquid refrigerant passes through the heat pipe evaporator to absorb heat carried by the air in the indoor space to form a vapor refrigerant, and convert the formed refrigerant to The vapor refrigerant is output to the heat pipe condenser;

Step 404, using each of the liquid-cooled cold plates to transmit the received liquid refrigerant, so that the transmitted liquid refrigerant passes through the liquid-cooled cold plate to absorb the heat carried by the corresponding contacting processor to form a liquid refrigerant, and The formed liquid refrigerant is output to the heat pipe condenser.

In one embodiment of the present utility model, when the refrigerant distribution module includes a temperature acquisition unit, a determination unit and a first control unit,

The use of the refrigerant distribution module to transfer the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators and each of the liquid-cooled cold plates includes:

Using the temperature collection unit to collect temperature parameters of natural cold sources in the outdoor environment;

Using the determination unit to determine the first refrigerant distribution coefficient according to each of the temperature parameters;

Utilize the first control unit to transmit the first part of the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators according to the first refrigerant distribution coefficient, and refrigerate the second part of the liquid refrigerant output from the heat pipe condenser Agents are delivered to each of the liquid-cooled cold plates.

In one embodiment of the present utility model, when the refrigerant distribution module includes a power acquisition unit, a calculation unit and a second control unit,

The use of the refrigerant distribution module to transfer the liquid refrigerant output from the heat pipe condenser to the heat pipe evaporator and each of the liquid-cooled cold plates respectively includes:

Using the power collection unit to collect the current power of each of the processors;

using the calculation unit to calculate the second refrigerant distribution coefficient according to the current power of each of the processors;

Utilize the second control unit to transfer the third part of the liquid refrigerant output from the heat pipe condenser to each of the heat pipe evaporators according to the second refrigerant distribution coefficient, and transfer the fourth part of the liquid refrigerant output from the heat pipe condenser to Refrigerant is delivered to each of the liquid-cooled cold plates.

In the above-mentioned method embodiments, the content executed by controlling the refrigerant distribution module and other equipment is based on the same concept as the heat dissipation system provided by the present invention. For specific content, please refer to the description in the heat dissipation system provided in the foregoing embodiments of the present invention. I won't repeat them here.

In summary, each embodiment of the utility model has at least the following beneficial effects:

1. In an embodiment of the present utility model, the heat dissipation system is composed of at least one heat pipe evaporator, heat pipe condenser, refrigerant distribution module and at least one liquid-cooled cold plate. Each heat pipe evaporator is arranged in the indoor space where the data center is located. The heat pipe The condenser is set in the outdoor environment, and the heat pipe condenser can exchange heat between the gaseous refrigerant it receives and the natural cooling source (such as air or water at a lower temperature in the outdoor environment) to form a liquid refrigerant and output it. The distribution module can transfer part of the liquid refrigerant output from the heat pipe condenser to each liquid-cooled cold plate, and transfer another part of the liquid refrigerant to the heat pipe evaporator; thus, on the one hand, the liquid refrigerant transferred by each heat pipe evaporator can be Absorb the heat carried by the air in the indoor space to form a vapor refrigerant and output it to the heat pipe condenser to meet the heat dissipation requirements of functional components such as power modules in the data center; on the other hand, each liquid-cooled cold plate and at least one server in the data center Each of the processors is in one-to-one contact, so that the corresponding heat transfer resistance between the liquid refrigerant transmitted in each liquid-cooled cold plate and each processor is relatively small, and the liquid refrigerant transmitted in each liquid-cooled cold plate is relatively small. It can quickly and massively absorb the heat generated by the corresponding contacting processors to form a vapor refrigerant that flows back into the heat pipe condenser to ensure that the processors are maintained at a lower temperature and meet the heat dissipation requirements of each processor, enabling the data center to More stable operation.

2. In an embodiment of the present invention, the first refrigerant distribution coefficient determined by the determining unit specifically refers to the volume of the second part of liquid refrigerant transferred to each liquid-cooled cold plate and the volume of the first part transferred to the heat pipe evaporator The ratio between the volumes of liquid refrigerants, the first refrigerant coefficient may be directly proportional to the temperature parameter of the natural cooling source in the outdoor environment. When the flow rate of the liquid refrigerant output by the heat pipe condenser is constant, the cooling capacity carried in the liquid refrigerant output by the heat pipe condenser depends on the temperature parameters of the natural cooling source in the outdoor environment. When the temperature of the natural cooling source collected by the temperature acquisition unit The lower the parameter, the more cooling capacity is carried by the liquid refrigerant output by the heat pipe condenser, and only a small volume of liquid refrigerant is required to enter each liquid-cooled cold plate to meet the heat dissipation requirements of each processor. At this time, Then a smaller first refrigerant distribution coefficient can be determined, and the first control unit can control less liquid refrigerant to enter each liquid-cooled cold plate and more liquid refrigerant to enter the heat pipe according to the first refrigerant distribution coefficient. The evaporator ensures that while meeting the heat dissipation requirements of each processor, more liquid refrigerant is prevented from continuing to enter each liquid-cooled cold plate and wasting the cooling capacity it carries. More liquid refrigerant enters the heat pipe evaporator, which can make The temperature of the indoor space where the data center is located is lower, improving the comfort of the indoor space where the data center is located.

3. In an embodiment of the present utility model, the second refrigerant distribution coefficient specifically refers to the volume of the fourth part of liquid refrigerant transferred to each liquid-cooled cold plate and the third part of liquid refrigerant transferred to the heat pipe evaporator The ratio between the volumes of the second refrigerant distribution coefficient may be proportional to the average value of the current power of each processor. Since the higher the power of the processor, the more heat it generates, correspondingly, more cooling capacity is needed to meet its heat dissipation requirements. Therefore, the heat pipe condenser can use the natural cold source of the outdoor environment to convert the refrigerant it receives into When cooling to the set temperature, the higher the current power of each processor collected by the power acquisition unit, the greater the second refrigerant distribution coefficient calculated by the calculation unit, indicating that more liquid refrigerant is required to meet the cooling requirements of each processor. demand, the second controller can control more liquid refrigerant to enter each liquid-cooled cold plate according to the second refrigerant distribution coefficient to meet the heat dissipation requirements of the processor; on the contrary, when the average value of the current power of each processor is smaller, The smaller the distribution coefficient of the second refrigerant, the second control unit can control less liquid refrigerant to enter each liquid-cooled cold plate to meet the heat dissipation requirements of each processor. At this time, control more liquid refrigerant to enter the heat pipe evaporator, which can To ensure that the heat dissipation requirements of each processor are met, more liquid refrigerant is prevented from continuing to enter each liquid-cooled cold plate and wasting the cooling capacity it carries. More liquid refrigerant enters the heat pipe evaporator, which can make the data center where The temperature of the indoor space is lower, and the comfort of the indoor space where the data center is located is improved.

4. In one embodiment of the present invention, since the diameter of the pipeline used to transmit the refrigerant in the liquid-cooled cold plate is relatively small, a power device (for example, Fluorine pump) to drive the liquid refrigerant, so that the refrigerant can circulate in each liquid-cooled cold plate; at the same time, the power unit can be a variable frequency fluorine pump, which can be combined with part of the liquid refrigerant entering the power unit under the control of the refrigerant distribution module. The flow rate adjusts the frequency of the variable frequency fluorine pump. The larger the flow rate, the higher the frequency, and the smaller the flow rate, the lower the frequency, thereby saving electric energy.

5. In an embodiment of the present invention, when the first distance between the heat pipe evaporator and the horizontal plane is smaller than the second distance between the heat pipe condenser and the horizontal plane, the third distance between the refrigerant distribution module and the horizontal plane should be greater than the second distance and less than the first distance, so that part of the liquid refrigerant formed in the heat pipe condenser can pass through the refrigerant distribution module and directly enter each heat pipe evaporator under the action of gravity, without requiring additional power devices for the part entering the heat pipe evaporator Driven by liquid refrigerant, further saving electric energy.

It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is a relationship between these entities or operations. There is no such actual relationship or sequence. Furthermore, the term "comprises", "comprises" or any other variation thereof is intended to cover a non-exclusive inclusion such that a process, method, article, or apparatus comprising a set of elements includes not only those elements, but also includes elements not expressly listed. other elements of or also include elements inherent in such a process, method, article, or device. Without further limitations, an element defined by the phrase "comprising a "..." does not exclude the presence of additional same elements in the process, method, article or apparatus comprising said element.

Finally, it should be noted that the above descriptions are only preferred embodiments of the utility model, and are only used to illustrate the technical solution of the utility model, and are not used to limit the protection scope of the utility model. All modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present utility model are included in the protection scope of the present utility model.

Claims (5)

1. A heat dissipation system, comprising:

the system comprises at least one heat pipe evaporator, a heat pipe condenser, a refrigerant distribution module and at least one liquid cooling plate; wherein,

the at least one liquid cold plate is in one-to-one corresponding contact with each processor of at least one server of the data center;

the heat pipe condenser is arranged in an outdoor environment, and the at least one heat pipe evaporator is arranged in an indoor space where the data center is located;

the heat pipe condenser is used for receiving and transmitting the vapor refrigerant, so that the vapor refrigerant exchanges heat with a natural cold source in the outdoor environment through the heat pipe condenser to form a liquid refrigerant, and the liquid refrigerant is output;

the refrigerant distribution module is used for respectively transmitting the liquid refrigerants output by the heat pipe condensers to the heat pipe evaporators and the liquid cold plates;

each heat pipe evaporator is used for transmitting the received liquid refrigerant, enabling the transmitted liquid refrigerant to absorb heat carried by air in the indoor space through the heat pipe evaporator to form vapor refrigerant, and outputting the formed vapor refrigerant to the heat pipe condenser;

each liquid cooling cold plate is used for transmitting the received liquid refrigerant, so that the transmitted liquid refrigerant absorbs the heat carried by the processor correspondingly contacted through the liquid cooling cold plates to form a vapor refrigerant, and the formed vapor refrigerant is output to the heat pipe condenser.

2. The heat dissipating system of claim 1,

the refrigerant distribution module comprises: the device comprises a temperature acquisition unit, a determination unit and a first control unit; wherein,

the temperature acquisition unit is used for acquiring temperature parameters of a natural cold source in an outdoor environment;

the determining unit is used for determining a first refrigerant distribution coefficient according to each temperature parameter;

the first control unit is used for transmitting the first part of liquid refrigerant output by the heat pipe condenser to each heat pipe evaporator according to the first refrigerant distribution coefficient, and transmitting the second part of liquid refrigerant output by the heat pipe condenser to each liquid cooling cold plate.

3. The heat dissipating system of claim 1,

the refrigerant distribution module comprises: the device comprises a power acquisition unit, a calculation unit and a second control unit; wherein,

the power acquisition unit is used for acquiring the current power of each processor;

the computing unit is used for computing a second refrigerant distribution coefficient according to the current power of each processor;

the second control unit is configured to transmit a third portion of the liquid refrigerant output by the heat pipe condenser to each heat pipe evaporator according to the second refrigerant distribution coefficient, and transmit a fourth portion of the liquid refrigerant output by the heat pipe condenser to each liquid cooling cold plate.

4. The heat dissipating system of claim 1,

further comprising: a power plant; wherein,

the refrigerant distribution module is connected with each liquid cooling plate through the power device;

the power device is used for driving the liquid refrigerant transmitted to each liquid cooling plate by the refrigerant distribution module to enter each liquid cooling plate.

5. The heat dissipating system of any one of claims 1 to 4,

a first distance between the heat pipe evaporator and a horizontal plane is less than a second distance between the heat pipe condenser and the horizontal plane.