CN207458943U - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN207458943U CN207458943U CN201721451879.7U CN201721451879U CN207458943U CN 207458943 U CN207458943 U CN 207458943U CN 201721451879 U CN201721451879 U CN 201721451879U CN 207458943 U CN207458943 U CN 207458943U
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- adhesive layer
- sensitive chip
- circuit board
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Abstract
The utility model is related to a kind of camera module and its photosensory assemblies.The photosensory assembly, including：Circuit board；Sensitive chip is connected on circuit board, and sensitive chip includes photosensitive surface；First adhesive layer, between sensitive chip and circuit board；Second adhesive layer, the material of the second adhesive layer is different from the first adhesive layer, and the second adhesive layer includes Bonded Ring, and Bonded Ring surround the first adhesive layer between sensitive chip and circuit board；Packaging body, encapsulated moulding is on circuit board and covering part photosensitive surface.In above-mentioned photosensory assembly, circuit board and sensitive chip are connected using the first different adhesive layer of material and the second adhesive layer, the stress that the injection region of sensitive chip is subject to non-injection region can be balanced, so as to balanced entire packaging body stress distribution, reduce the stress difference in injection region and non-injection region, and then promote the reliability of above-mentioned photosensory assembly namely sensitive chip is avoided to heave warpage, promote the quality of above-mentioned photosensory assembly.
Description
Technical field
The utility model is related to camera technology field, more particularly to a kind of camera module and its photosensory assembly.
Background technology
As shown in Figure 1, traditional camera module generally includes photosensory assembly 10 and lens assembly (not shown), photosensory assembly
10 include circuit board 11, sensitive chip 12, adhesive layer 13, conductor wire 14 and packaging body 15.Sensitive chip 12 passes through adhesive layer
13 are fixedly connected with circuit board 11, and sensitive chip 12 is electrically connected by conductor wire 14 with circuit board 11.Using what is be molded
Mode (molding processing procedures) forms packaging body 15, and the edge of sensitive chip 12 and conductor wire 14 is caused to be packaged in packaging body 15
It is interior.Lens assembly is arranged on the one end of packaging body 15 away from circuit board 11.
Since the fringe region of sensitive chip 12 is injection region, the central area of sensitive chip 12 is non-injection region,
The high temperature and pressure of molding processing procedures can cause the fringe region of sensitive chip 12, and there are stress differences with central area.
Utility model content
Based on this, it is necessary to provide a kind of injection region that can balance sensitive chip and the camera shooting of the stress in non-injection region
Module and its photosensory assembly.
A kind of photosensory assembly, including：
Circuit board；
Sensitive chip, is connected to the circuit board, and the sensitive chip includes photosensitive surface；
First adhesive layer, between the sensitive chip and the circuit board；
Second adhesive layer, the material of second adhesive layer is different from first adhesive layer, the second adhesive layer bag
Bonded Ring is included, the Bonded Ring surround first adhesive layer between the sensitive chip and the circuit board；And
Packaging body, encapsulated moulding is in photosensitive surface on the circuit board and described in covering part.
In above-mentioned photosensory assembly, circuit board and sensitive chip are connected using the different adhesive layer of material and Bonded Ring,
The stress that the injection region of sensitive chip is subject to non-injection region can be balanced, thus balanced entire packaging body stress distribution,
The stress difference in injection region and non-injection region is reduced, and then promotes the reliability of above-mentioned photosensory assembly namely avoids photosensitive core
Piece heaves warpage, promotes the quality of above-mentioned photosensory assembly.
In one of the embodiments, the second adhesive layer material is arbitrary in epoxy resin, silica gel and acrylic acid
It is a kind of.The material of second adhesive layer is any one in epoxy resin, silica gel and acrylic acid, in packaging body high temperature molding
In processing procedure, the second adhesive layer is not affected by high temperatures generation deformation, and sensitive chip is avoided to heave warpage, promotes the matter of photosensory assembly
Amount.
In one of the embodiments, the sensitive chip further includes the connection surface opposite with the photosensitive surface, institute
State 2%~90% of the area of connection surface described in cohesive ring cover.The area for bonding ring cover connection surface is too small, it is impossible to very
The stress that the injection region of good balance sensitive chip is subject to non-injection region, and since the second adhesive flows into photosensitive core
There is resistance between piece and circuit board, if the area for bonding ring cover connection surface is too big, the manufacture difficulty increase of Bonded Ring,
Summary sets the 2%~90% of the area for bonding ring cover connection surface.
In one of the embodiments, first adhesive layer covers the 10%~95% of the area of the connection surface.
The area of first adhesive layer covering connection surface coordinates with bonding the area of ring cover connection surface, ensures sensitive chip and circuit
Plate securely connects.When the area of the first adhesive layer covering connection surface is minimized (10%), ring cover connection surface is bonded
When area is maximized (90%), at this point, connection surface is completely capped, sensitive chip can be securely connected with circuit board；When
When the area of first adhesive layer covering connection surface is maximized (95%), it also can guarantee that sensitive chip securely connects with circuit board
It connects, and when the area for bonding ring cover connection surface is minimized (2%), at this point, between Bonded Ring and the first adhesive layer
There may be gap, gap can further balance the stress that the injection region of sensitive chip is subject to non-injection region.
In one of the embodiments, the area of connection surface described in the cohesive ring cover is covered with first adhesive layer
Cover the area 80~100% that the sum of area of the connection surface is the connection surface.So, it can be ensured that sensitive chip with
Circuit board securely connects.
In one of the embodiments, the lateral wall of the Bonded Ring and madial wall be smaller than be equal to 6.5mm.Due to
Second adhesive, which flows into, has resistance, if the width of Bonded Ring is excessive, the making of Bonded Ring between sensitive chip and circuit board
Difficulty increases.In order to simplify manufacture craft, the width of Bonded Ring is set to be less than or equal to 6.5mm.
In one of the embodiments, second adhesive layer further includes the bonding cylinder on the circuit board, described
It bonds cylinder to connect the Bonded Ring and close the side wall of the sensitive chip, the appearance of the packaging body covering cohesive cylinder
Face.Packaging body is directly connected with the side wall of sensitive chip, and the stress that encapsulation generates can be caused to directly act on sensitive chip
On.Cylinder is bonded by setting, and to bond the side wall of cylinder covering sensitive chip and the lateral wall of Bonded Ring, it can be to avoid envelope
Dress body is directly contacted with the side wall of sensitive chip, and the stress so as to which encapsulation is avoided to generate is directly acted on sensitive chip.
In one of the embodiments, the photosensory assembly further includes conductor wire, and the circuit board is equipped with the first solder joint,
The sensitive chip is equipped with the second solder joint, and the both ends of the conductor wire connect respectively with first solder joint and second solder joint
It connects, first solder joint is located in the cohesive cylinder.First solder joint is directly connected with packaging body, and encapsulation can be caused to generate
Stress directly acts on the junction of the first solder joint and conductor wire, and conductor wire and the first solder joint is caused to disconnect, is electrically connected
The problem of bad.It bonds cylinder and closes the first solder joint, can directly be contacted to avoid packaging body with the first solder joint, so as to effectively keep away
Exempt from the situation that conductor wire and the first solder joint disconnect occur.
In one of the embodiments, photosensitive surface, second solder joint are located at institute described in the cohesive cylinder covering part
It states in cohesive cylinder.Second solder joint is directly connected with packaging body, and the stress that encapsulation generates can be caused to directly act on the second weldering
The junction of point and conductor wire causes conductor wire and the second solder joint to disconnect, and occurs being electrically connected the problem of bad.Bond cylinder closing
Second solder joint can directly contact to avoid packaging body with the second solder joint, so as to effectively avoid the occurrence of conductor wire and the second weldering
The situation that point disconnects.
A kind of camera module, including：
Above-mentioned photosensory assembly；And
Lens assembly, the lens assembly are arranged on the one end of the packaging body away from the circuit board.
Description of the drawings
Fig. 1 is the structure diagram of traditional photosensory assembly；
Fig. 2 is the structure diagram of the photosensory assembly of one embodiment of the utility model；
Fig. 3 is the structure diagram of the right end of the photosensory assembly in Fig. 2；
Fig. 4 is the structure diagram of the photosensory assembly of another embodiment of the utility model；
Fig. 5 is the structure diagram of the right end of the photosensory assembly in Fig. 4；
Fig. 6 is the structure diagram of the right end of the photosensory assembly of another embodiment of the utility model.
Specific embodiment
Below in conjunction with the accompanying drawings and camera module and its photosensory assembly is further described in specific embodiment.
As shown in Figures 2 and 3, the camera module of an embodiment includes photosensory assembly 20 and lens assembly (not shown).
Photosensory assembly 20 includes circuit board 100, sensitive chip 200, the first adhesive layer 300, the second adhesive layer 400, conductor wire 500 and envelope
Fill body 600.
Sensitive chip 200 is electrically connected on circuit board 100.Sensitive chip 200 include photosensitive surface 202 and with photosensitive table
The opposite connection surface 204 in face 202.First adhesive layer 300 and the second adhesive layer 400 are arranged on sensitive chip 200 and circuit board
Between 100, the second adhesive layer 400 includes 410 namely first adhesive layer 300 of Bonded Ring and Bonded Ring 410 and is arranged on connection surface
Between 204 and circuit board 100, so that sensitive chip 200 is fixedly connected with circuit board 100.During first adhesive layer 300 is located at
Between position, Bonded Ring 410 is set around the first adhesive layer 300, and Bonded Ring 410 is different from the material of the first adhesive layer 300.
In present embodiment, the material of the second adhesive layer 400 is any one in epoxy resin, silica gel and acrylic acid, in packaging body
In 600 high temperature molding processing procedures, the second adhesive layer 400 is not affected by high temperatures generation deformation, and sensitive chip 200 is avoided to heave and is stuck up
Song promotes the quality of photosensory assembly 20.
Circuit board 100 is equipped with the first solder joint (not shown), and sensitive chip 200 is equipped with the second solder joint (not shown), leads
The both ends of electric wire 500 are connected respectively with the first solder joint and the second solder joint, so that sensitive chip 200 is electrically connected with circuit board 100
It connects.
For 600 encapsulated moulding of packaging body on circuit board 100 and around sensitive chip 200,600 enclosure portion of packaging body is photosensitive
Surface 202.Wherein, 600 enclosure portion photosensitive surface 202 of packaging body, when molding processing procedures form packaging body 600, fringe region
Photosensitive surface 202 for injection region, and the photosensitive surface 202 of central area be non-injection region.Lens assembly is arranged on encapsulation
On the one end of body 600 away from circuit board 100.
As shown in Figure 1, in the photosensory assembly 10 of traditional camera module, due to circuit board 11, sensitive chip 12 and envelope
Fill the differences such as hardness number, shrinking percentage of body 15, the high temperature and pressure of molding processing procedures can cause the injection region of sensitive chip 12 with
Non- injection region causes sensitive chip 12 to heave warpage there are stress difference.It please refers to Fig.3, in above-mentioned photosensory assembly 20, adopts
Circuit board 100 and sensitive chip 200 are connected with the first different adhesive layer 300 of material and the second adhesive layer 400, can be balanced
The stress that the injection region of sensitive chip 200 is subject to non-injection region, so as to 600 stress distribution of balanced entire packaging body, drop
The stress difference in low injection region and non-injection region, and then promote the reliability of above-mentioned photosensory assembly 20 namely avoid photosensitive core
Piece 12 heaves warpage, promotes the quality of above-mentioned photosensory assembly 20.
Specifically, in the present embodiment, when making above-mentioned photosensory assembly 20, first by the first adhesive applicating in circuit
The central area of plate 100 or sensitive chip 200 forms the first adhesive layer.Again so that the second adhesive with mobility flows into
Between circuit board 100 and sensitive chip 200, and form the second adhesive layer.The first adhesive layer of final curing is to form the first bonding
Layer 300, while cure the second adhesive layer to form the second adhesive layer 400, i.e. Bonded Ring 410.In the present embodiment, it is solid simultaneously
Change the first adhesive layer and the second adhesive layer, it is possible to reduce making step.It is appreciated that in other embodiments, can first it consolidate
Change the first adhesive layer to form the first adhesive layer 300, then the second adhesive layer, the second glue of final curing are formed using the second adhesive
Adhesion coating is to form Bonded Ring 410.In this way, preformed first adhesive layer 300 can cause circuit board 100 and sensitive chip
200 position is fixed, and can effectively be avoided, in the step of forming the second adhesive layer, the phase of circuit board 100 and sensitive chip 200
Position is changed.Specifically, in the present embodiment, the mobility of the second adhesive is more than or equal to the flowing of the first adhesive
Property, the viscosity of the second adhesive is more than the viscosity of the first adhesive, and the thixotropic index of the second adhesive is more than the first adhesive
Thixotropic index, the elasticity modulus of Bonded Ring 410 are more than the elasticity modulus of the first adhesive layer 300.
Further, in the present embodiment, Bonded Ring 410 covers the 2%~90% of the area of connection surface 204.It bonds
The area that ring 410 covers connection surface 204 is too small, it is impossible to the injection region of balance sensitive chip 200 and non-injection area well
The stress that domain is subject to, and since the second adhesive flows into there is resistance between sensitive chip 200 and circuit board 100, if viscous
The area that knot ring 410 covers connection surface 204 is too big, and the manufacture difficulty increase of Bonded Ring 410, summary sets Bonded Ring
The 2%~90% of the area of 410 covering connection surfaces 204.Preferably, in the present embodiment, Bonded Ring 410 covers connection table
The 5%~50% of the area in face 204.Specifically, in the present embodiment, Bonded Ring 410 covers the area of connection surface 204
10%.
Further, in the present embodiment, the 10%~95% of the area of the first adhesive layer 300 covering connection surface 204.
The area that the area of first adhesive layer 300 covering connection surface 204 covers connection surface 204 with Bonded Ring 410 coordinates, and ensures sense
Optical chip 200 is securely connected with circuit board 100.When the area of the first adhesive layer 300 covering connection surface 204 is minimized
(10%), when the area of the covering of Bonded Ring 410 connection surface 204 is maximized (90%), at this point, the quilt completely of connection surface 204
Covering, sensitive chip 200 can be securely connected with circuit board 100；When the area of the first adhesive layer 300 covering connection surface 204
When being maximized (95%), it also can guarantee that sensitive chip 200 is securely connected with circuit board 100, and when the covering of Bonded Ring 410 connects
When connecing the area on surface 204 and being minimized (2%), at this point, there may be between 410 and first adhesive layer 300 of Bonded Ring certain
Gap 402, gap 402 can further balance the stress that the injection region of sensitive chip 200 is subject to non-injection region.
Further, in the present embodiment, the area of the covering of Bonded Ring 410 connection surface 204 is covered with the first adhesive layer 300
The sum of area of lid connection surface 204 is the area 80~100% of connection surface 204.
Further, in the present embodiment, the spacing of the lateral wall of the Bonded Ring 410 and madial wall (width of Bonded Ring 410
Degree) it is less than or equal to 6.5mm.Since the second adhesive flows into there is resistance between sensitive chip 200 and circuit board 100, if viscous
The width of knot ring 410 is excessive, the manufacture difficulty increase of Bonded Ring 410.In order to simplify manufacture craft, the width of Bonded Ring 410 is set
Degree is less than or equal to 6.5mm.Preferably, the spacing of the lateral wall of Bonded Ring 410 and madial wall is 0.1~0.5mm.Specifically, exist
In present embodiment, the lateral wall of Bonded Ring 410 and the spacing of madial wall are 0.3mm.
Further, in the present embodiment, the lateral wall of Bonded Ring 410 is flushed with the side wall of sensitive chip 200.In this way,
More conducively balance the stress that the injection region of sensitive chip 200 is subject to non-injection region.
As shown in Figures 4 to 6, the second adhesive layer 400 further includes the bonding cylinder 420 on circuit board 100, bonds cylinder
The 420 connections Bonded Ring 410 simultaneously closes the side wall of sensitive chip 200.At this point, the covering of packaging body 600 bonds the appearance of cylinder 420
While face, covering part photosensitive surface 202 is gone back.Packaging body 600 is directly connected with the side wall of sensitive chip 200, can be led
The stress that encapsulation generates is caused to directly act on sensitive chip 200.Cylinder 420 is bonded by setting, and so that bonding cylinder 420 closes
The side wall of sensitive chip 200 and the lateral wall of Bonded Ring 410, can be to avoid side of the packaging body 600 directly with sensitive chip 200
Wall contacts, and the stress so as to which encapsulation is avoided to generate is directly acted on sensitive chip 200.
Further, in the present embodiment, the material for bonding cylinder 420 is identical with the material of Bonded Ring 410.In this way, it is convenient for
It makes and bonds cylinder 420, simplify manufacture craft.In the present embodiment, while gluing ring is formed, existed using the second adhesive
Gluing cylinder, the side wall of gluing cylinder closing sensitive chip 200 and the lateral wall of gluing ring are formed on circuit board.Namely bond cylinder
420 are integrally formed with Bonded Ring 410.
Further, in the present embodiment, the first solder joint, which is located at, bonds in cylinder 420 namely conductor wire 500 and circuit board
One end of 100 connections, which is located at, to be bonded in cylinder 420.First solder joint is directly connected with packaging body 600, and encapsulation can be caused to generate
Stress directly acts on the junction of the first solder joint and conductor wire 500, and 500 and first solder joint of conductor wire is caused to disconnect, and electricity occurs
The problem of property bad connection.It bonds cylinder 420 and closes the first solder joint, can directly be contacted to avoid packaging body 600 with the first solder joint, from
And it is possible to prevente effectively from there is the situation of 500 and first solder joint of conductor wire disconnection.
Further, in the present embodiment, the top for bonding cylinder 420 is flushed with photosensitive surface 202.Due to the second adhesive
With mobility, the top for bonding cylinder 420 is flushed with photosensitive surface 202, it is possible to prevente effectively from the second adhesive is towards photosensitive table
The middle part flowing in face 202, pollutes photosensitive surface 202.
Further, in the present embodiment, the outer surface 422 for bonding cylinder 420 is the cambered surface of evagination.In this way, it can increase
Bond the connection area of cylinder 420 and packaging body 600 so that bond cylinder 420 and be securely connected with packaging body 600.
As shown in fig. 6, in other embodiments, the top for bonding cylinder 420 protrudes from photosensitive surface 202, bonds cylinder 420
Enclosure portion photosensitive surface 202, at this point, the second solder joint is located in bonding cylinder 420 namely conductor wire 500 connects with sensitive chip 200
The one end connect, which is located at, to be bonded in cylinder 420.Second solder joint is directly connected with packaging body 600, the stress that encapsulation can be caused to generate
The junction of the second solder joint and conductor wire 500 is directly acted on, 500 and second solder joint of conductor wire is caused to disconnect, appearance electrically connects
Connect the problem of bad.It bonds cylinder 420 and closes the second solder joint, can directly be contacted to avoid packaging body 600 with the second solder joint, so as to
Effectively to avoid the occurrence of the situation of 500 and second solder joint of conductor wire disconnection.
In the present embodiment, a kind of production method of photosensory assembly is also provided, is included the following steps：
Step S810, provides circuit board and sensitive chip, and sensitive chip includes photosensitive surface and opposite with photosensitive surface
Connection surface.
Step S820 provides the first adhesive, and the first adhesive layer is formed in circuit board and sensitive chip.
In the present embodiment, the 10%~95% of the area of the first adhesive layer covering connection surface.
Step S830 provides material second adhesive different from the first adhesive so that the second adhesive flows into circuit
Between plate and sensitive chip, and form the second adhesive layer.
In the present embodiment, the 2%~90% of the area of the second adhesive layer covering connection surface.Forming the second gluing
While layer (gluing ring), gluing cylinder, gluing cylinder connection gluing ring and sense of closure are formed using the second adhesive on circuit boards
The side wall of optical chip.
Step S840 cures the first adhesive layer to form the first adhesive layer, while cures the second adhesive layer to form second
Adhesive layer.
In the present embodiment, the first adhesive layer, the second adhesive layer cylinder cure simultaneously, and the second adhesive layer is included by gluing ring
The Bonded Ring being formed by curing and the bonding cylinder being formed by curing by gluing cylinder.It is appreciated that in other embodiments, the first gluing
Layer can cure before the second adhesive layer is formed.
Step S850, molding form packaging body, and packaging body encapsulated moulding is on circuit board and covering part photosensitive surface.
In the present embodiment, when forming packaging body, packaging body close simultaneously cohesive cylinder outer surface and part it is photosensitive
Surface.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the utility model, and description is more specific and detailed,
But therefore it can not be interpreted as the limitation to utility model patent scope.It should be pointed out that the common skill for this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The scope of protection of the utility model.Therefore, the protection domain of the utility model patent should be determined by the appended claims.
Claims (10)
1. a kind of photosensory assembly, which is characterized in that including：
Circuit board；
Sensitive chip, is connected to the circuit board, and the sensitive chip includes photosensitive surface；
First adhesive layer, between the sensitive chip and the circuit board；
Second adhesive layer, the material of second adhesive layer is different from first adhesive layer, and second adhesive layer includes viscous
Ring is tied, the Bonded Ring surround first adhesive layer between the sensitive chip and the circuit board；And
Packaging body, encapsulated moulding is in photosensitive surface on the circuit board and described in covering part.
2. photosensory assembly according to claim 1, which is characterized in that the material of second adhesive layer for epoxy resin,
Silica gel or acrylic acid.
3. photosensory assembly according to claim 1, which is characterized in that the sensitive chip further includes and the photosensitive surface
Opposite connection surface, the 2%~90% of the area of connection surface described in the cohesive ring cover.
4. photosensory assembly according to claim 3, which is characterized in that first adhesive layer covers the connection surface
The 10%~95% of area.
5. photosensory assembly according to claim 4, which is characterized in that the area of connection surface described in the cohesive ring cover
The area 80~100% that the sum of area of the connection surface is the connection surface is covered with first adhesive layer.
6. photosensory assembly according to claim 1, which is characterized in that the lateral wall of the Bonded Ring and the spacing of madial wall
Less than or equal to 6.5mm.
7. photosensory assembly according to claim 1, which is characterized in that second adhesive layer is further included positioned at the circuit
Bonding cylinder on plate, the bonding cylinder connect the Bonded Ring and close the side wall of the sensitive chip, the packaging body covering
The outer surface of the bonding cylinder.
8. photosensory assembly according to claim 7, which is characterized in that the photosensory assembly further includes conductor wire, the electricity
Road plate is equipped with the first solder joint, and the sensitive chip is equipped with the second solder joint, and the both ends of the conductor wire are respectively with described first
Solder joint and second solder joint connection, first solder joint are located in the cohesive cylinder.
9. photosensory assembly according to claim 8, which is characterized in that photosensitive surface described in the bonding cylinder covering part,
Second solder joint is located in the cohesive cylinder.
10. a kind of camera module, which is characterized in that including：
Photosensory assembly as claimed in any one of claims 1-9 wherein；And
Lens assembly, the lens assembly are arranged on the one end of the packaging body away from the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721451879.7U CN207458943U (en) | 2017-11-03 | 2017-11-03 | Camera module and its photosensory assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721451879.7U CN207458943U (en) | 2017-11-03 | 2017-11-03 | Camera module and its photosensory assembly |
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| Publication Number | Publication Date |
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| CN207458943U true CN207458943U (en) | 2018-06-05 |
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| CN201721451879.7U Active CN207458943U (en) | 2017-11-03 | 2017-11-03 | Camera module and its photosensory assembly |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399037A (en) * | 2019-08-15 | 2021-02-23 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and manufacturing method thereof |
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2017
- 2017-11-03 CN CN201721451879.7U patent/CN207458943U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112399037A (en) * | 2019-08-15 | 2021-02-23 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and manufacturing method thereof |
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Effective date of registration: 20180604 Address after: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Co-patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Patentee after: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) Co.,Ltd. Address before: 330013 Nanchang, Jiangxi economic and Technological Development Zone, east of lilac Road, north of Longtan canal. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
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Address after: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee after: Guangzhou delta Imaging Technology Co.,Ltd. Patentee after: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. Address before: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee before: O-FILM IMAGE TECHNOLOGY (GUANGZHOU) Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |
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Effective date of registration: 20210629 Address after: 330096 no.1404, Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi Jinghao optics Co.,Ltd. Address before: 510000 Shenzhou Road, science and Technology Town, Guangzhou high tech Industrial Development Zone, Guangdong 7 Patentee before: Guangzhou delta Imaging Technology Co.,Ltd. Patentee before: NANCHANG OFILM OPTICAL-ELECTRONIC TECH Co.,Ltd. |