CN207375986U - Non-base adhesive processing and assembly device - Google Patents

Abstract

The utility model discloses a no substrate glues processing assembly device. The device includes a transmission, transmission includes branch and last branch, be equipped with compounding machine and die cutting machine in proper order on the branch down, go up and be equipped with engraver and exhaust machine in proper order on the branch, the branch down with the end of going up the branch all is connected to a tool on, wherein transmission is used for transmission assembly. The utility model provides a processing assembly device combines product structural characteristic, will not have substrate glue and need laminating going on compositely of rubberizing, then processes the subassembly as the substrate, has realized the automatic on-line production of the equipment of subassembly and gluey and processing, has solved not having substrate glue because of easy excessive glue and the problem that is difficult to process of deformation, has not only saved manpower and materials, has still improved the efficiency of processing and manufacturing.

Description

Non-base adhesive processing and assembly device

technical field

The utility model relates to the field of material processing, in particular to a substrate-free glue processing and assembling device.

Background technique

Non-substrate adhesive is a kind of adhesive tape directly coated and pressed by acrylic adhesive. It has excellent adhesion effect, excellent anti-shedding and waterproof performance, good processability, good temperature resistance, dimensional stability, heat resistance Stability, good chemical stability, good initial tack and stickiness, can be applied to a wider temperature range and harsh environments and other characteristics, as a component connection material, it has been widely manufactured and used in precision electronic products such as mobile phones.

However, the non-substrate adhesive has no base material and has strong fluidity. While having the above advantages, it also has the characteristics of being difficult to process. If the non-substrate adhesive is processed by using a punching machine and other equipment according to the traditional method, it is very easy. Glue overflow and deformation will occur, resulting in poor processing effect or even failure. At present, there is no way to perform independent high-quality processing of substrate-free adhesives.

Utility model content

In order to solve the above problems, the utility model provides a substrate-free glue processing and assembling device.

According to one aspect of the present invention, there is provided a substrate-free adhesive processing and assembly device, which includes a transmission device, the transmission device includes a lower branch and an upper branch, and the lower branch is provided with a compound machine and a punching machine in sequence , the upper branch is provided with an engraving machine and a waste discharger in turn, and the ends of the lower branch and the upper branch are connected to a jig, wherein the transmission device is used for the transmission assembly.

The processing and assembling device in the utility model combines the structural characteristics of the product to combine the non-substrate glue and the components that need to be glued, and then process the components as the base material, realizing the automatic in-line production of the assembly and processing of components and glue , It solves the problem that the non-substrate adhesive is difficult to process due to easy overflow and deformation, saves manpower and material resources, and improves the efficiency of processing and manufacturing.

In some embodiments, the component is a stencil. From this, it is possible to determine the component to be machined, which may also be some other suitable part.

In some embodiments, the laminating machine is used for compounding a layer of lower adhesive layer on the bottom surface of the component, and the jig is used for disposing a layer of upper adhesive layer on the top surface of the component, and the lower The adhesive layer and/or the gluing layer are substrate-free adhesives. Thereby, the upper and lower adhesive layers composed of base material-free adhesive can be pasted on the components respectively.

In some embodiments, a layer of PET film is further provided above the glue layer. Thus, the sizing layer can be combined with the stencil by cutting the PET film.

In some embodiments, the total thickness of the assembly, the subbing layer, the subbing layer and the PET film is 0.46 mm. From this, the thickness of the processed component and glue can be determined, explaining the reason why the upper and lower layers of glue need to be processed separately.

In some embodiments, an engraving mold is provided on the engraving machine. Thus, the glue used for the glued layer can be cut.

Description of drawings

Fig. 1 is the schematic diagram of the non-substrate glue processing and assembling device of one embodiment of the present invention;

FIG. 2 is a structural diagram of various stages of the assembly shown in FIG. 1 .

Detailed ways

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Fig. 1 schematically shows a substrate-free adhesive processing and assembling device according to an embodiment of the present invention, Fig. 2 is the structure of each stage of the assembly, wherein 2 (a) is the structure after the assembly is combined with the lower glue layer 21, 2(b) is the structure after compounding the glue layer 22 of the module. As shown in Figure 1-2, the processing and assembly device has a transmission device 1, which is used to drive the component 2 to be processed, so that the component 2 passes through other equipment to compound a layer of lower glue layer 21 on its bottom surface, And compound one deck glue layer 22 on its top surface, wherein, the component 2 in the present embodiment is a steel mesh, at least one of the lower glue layer 21 and the upper glue layer 22 is no substrate glue, and the processing and assembling device also It can be used to process other kinds of suitable components.

During the processing, a layer of PET film 23 will also be arranged on the top of the upper glue layer 22, and the total thickness of the assembly 2, the lower glue layer 21, the upper glue layer 22 and the PET film 23 has reached 0.46mm. If the shape is processed after combining them, it is likely to cause glue overflow due to excessive thickness. For this reason, the transmission device 1 can be divided into two branches, ie, the lower branch 12 and the upper branch 11 , which are used to process the lower glue layer 21 and the upper glue layer 22 respectively, and then compound them on the component 2 .

The lower branch 12 of the transmission device 1 is used to process the lower rubber layer 21 on the bottom surface of the component 2. If a machine such as a punching machine 4 is used to process the rubber layer composed of no base glue alone, it will easily cause glue overflow and deformation. Therefore, the lower glue layer 21 can be compounded on the component 2 first, and then the component 2 is used as the base material for processing.

Therefore, the compound machine 3 and the punching machine 4 are arranged on the lower branch 12, and the jig 7 is connected at the end. During processing, the component 2 is placed on the lower branch 12, and the component 2 will be transmitted to the compound machine 3, and a layer of lower glue layer 21 will be compounded on the bottom surface of the component 2 by the compound machine 3, and then the component 2 will be transferred to the punching machine. On the machine 4, use the punching machine 4 to process the component 2 and the lower rubber layer 21 into the required shape, and then transfer it to the jig 7 for blanking processing. Wherein, what the punching machine 4 processes is the composition of the component 2 and the lower glue layer 21, not a separate glue layer, thus avoiding the problem of glue overflow and deformation easily caused by the non-substrate glue during processing.

The upper branch 11 of the transmission device 1 is used to process the glue layer 22 on the top surface of the assembly 2, and the upper branch 11 is provided with an engraving machine 5 and a waste discharge machine 6, and a jig 7 is connected at the end. During processing, the glue used for the glue layer 22 is placed on the upper branch 11, the engraving machine 5 is provided with an engraving mold 51, and the engraving machine 5 can be used to cut the glue placed on its engraving mold 51 into sections; Drive to the waste discharge machine 6, operate the waste discharge machine 6 to process the glue into the shape required by the component 2, which is the glue layer 22; finally transfer the glue layer 22 to the jig 7, and the jig 7 is equipped with PET film 23, use jig 7 to arrange one layer of PET film 23 on the top of glue layer 22, then cut off the glue layer 22 with PET film 23 to be provided with lower glue layer 21 after blanking. On the component 2, thus, the lower glue layer 21 and the upper glue layer 22 are respectively processed into the required shape and compositely assembled on the component 2, so it is not necessary to process the component 2 provided with two layers of glue layers, avoiding the It will easily cause the problem of overflow glue due to the excessive thickness. After assembly, the assembly 2 can be driven out of the drive 1 and collected.

The non-substrate adhesive processing and assembling device in the utility model combines the structural characteristics of the product, composites the non-substrate adhesive and the components that need to be glued, and then processes the components as the base material, realizing the assembly and processing of components and glue Automatic in-line production solves the problem that the non-substrate adhesive is difficult to process due to overflow and deformation, and also avoids the problem of overflow due to excessive thickness when processing components with two layers of adhesive , not only saves manpower and material resources, but also improves the efficiency of processing and manufacturing.

What have been described above are only some embodiments of the present utility model. For those skilled in the art, without departing from the inventive concept of the present utility model, some modifications and improvements can be made, and these all belong to the protection scope of the present utility model.

Claims (8)

1. process assembling device without base material glue, it is characterised in that：Including a transmission device (1), the transmission device (1) includes Inferior division (11) and top set (12), are equipped with compounding machine (3) and bicker (4) on the inferior division (11) successively, described upper to divide It props up and is equipped with engraving machine (5) and device for removing waste (6) on (12) successively, the end of the inferior division (11) and the top set (12) connects It is connected on a gauge (7), wherein the transmission device (1) is used for transmission component (2).

2. no base material glue processing assembling device according to claim 1, it is characterised in that：The component (2) is steel mesh.

3. no base material glue processing assembling device according to claim 2, it is characterised in that：The compounding machine (3) be used for Compound one layer of lower glue layer (21) on the bottom surface of the component (2).

4. no base material glue processing assembling device according to claim 3, it is characterised in that：The gauge (7) is used for institute State one layer of upper glue layer (22) of setting on the top surface of component (2).

5. no base material glue processing assembling device according to claim 4, it is characterised in that：The lower glue layer (21) and/or The upper glue layer (22) is no base material glue.

6. no base material glue processing assembling device according to claim 4, it is characterised in that：The top of the upper glue layer (22) It is additionally provided with one layer of PET film (23).

7. no base material glue processing assembling device according to claim 6, it is characterised in that：The component (2), the lower glue The overall thickness of layer (21), the upper glue layer (22) and the PET film (23) is 0.46mm.

8. no base material glue processing assembling device according to claim 1, it is characterised in that：The engraving machine (5) is equipped with Engraved die (51).