CN207305245U - A kind of temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage - Google Patents
A kind of temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage Download PDFInfo
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- CN207305245U CN207305245U CN201721278396.1U CN201721278396U CN207305245U CN 207305245 U CN207305245 U CN 207305245U CN 201721278396 U CN201721278396 U CN 201721278396U CN 207305245 U CN207305245 U CN 207305245U
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Abstract
The utility model provides a kind of temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage, and the program, which includes, expands hot plate, thermal interfacial material, TEC cooling pieces, phase-change cold-storage device and peripheral cooling device；The lower surface of phase-change cold-storage device is connected by thermal interfacial material with peripheral cooling device；The upper surface of phase-change cold-storage device is connected by thermal interfacial material with the lower surface of TEC cooling pieces；The upper surface of TEC cooling pieces is connected by thermal interfacial material with expanding the lower surface of hot plate；The upper surface of expansion hot plate is by thermal interfacial material with treating that heat dissipating electronic devices are connected.The program realizes the extract real-time of high-power waste heat during electronic device work using solid wall heat transfer, and no pump drives fluid circuit, and volume scale is small；Evade vibration, the EMC problems of Liao Bengqu mechanisms introducing；The security reliability that no enclosed fluid circuit triggers reduces problem；Zoned temperature control, the different temperature requirements of applicable same equipment difference heat load are realized by varying TEC cooling piece arrangements.
Description
Technical field
The utility model relates to freezing by change of state field, especially a kind of temperature control of thermoelectric cooling composite phase-change cold-storage is cold
But device.
Background technology
It is also extensive with the lifting of the high-power electronic device/equipment performances such as laser, radar, the energy, its application environment
Extension, more and more motor platforms, including aircraft, automobile, steamer etc. propose equipped demand to such powerful device.
The operation platform that these independence are strong, using flexible degree is high, application environment is more harsh, equipment volume, weight, electromechanical hot interface
Limited be subject to very stringent, precise temperature control cooling technology becomes one of key factor for restricting the lifting of equipment performance.
Temperature-controlled precision requires electronic device high, that thermic load is small to use semiconductor thermoelectric refrigeration technology (TEC) more, utilizes P
Type semiconductor element and N-type semiconductor element connect into thermocouple, are turned using DC power supply by the caused temperature difference and heat
Move, realize refrigeration.The technical pattern is simple, pollution-free without refrigerant, starts soon, and control is flexible, in weightless and overweight state
It can work down.But the technology refrigerating efficiency is low, power consumption is high, refrigerating capacity increase with environment temperature and cooling piece cold-end temperature difference and
Reduce, be not suitable for that variation of ambient temperature scope is big, the exclusive environment of volume power consumption.
Temperature-controlled precision requires electronic device high, that thermic load is big, more at present cold using compressor vaporization cycle and liquid
But technology with the same time meet electronic device temperature control and hot dissipation requirement.Vapor compression refrigeration is in reply high heat flux density electricity
There is great potentiality and application prospect on the heat dissipation problem of sub- chip and power original paper.The technology refrigerating capacity depends on compressor
System cold, is not suitable for momentary high power heat-releasing apparatus, meanwhile, function loss-rate is compressed under hot environment to be reduced, power consumption increase,
It is not suitable for the exclusive application conditions of energy consumption.
Under border and the exclusive application conditions of energy consumption, for the high-power electronic device of intermittent operation mode,
It is more at present that temperature control and hot dissipation are realized using cold-storage combination pump drive liquid cooling technology.
Rini companies of the U.S. cool down thermal management technology scheme in real time using phase change cold-storage technical substitution, by laser short-term operation
The waste heat of generation is temporarily stored within cold-storage device, and in laser system, standby period again excludes waste heat for a long time.The skill
Art realizes the slow dissipation of waste heat using the intermittent phase, requirement of the work phase to real-time hot dissipation is reduced, suitable for momentary high power
Heat-releasing apparatus application.But the technology takes hot link to rely on pump drive formula fluid circuit, it is big to face volume scale during engineer application,
The problems such as security, poor reliability and executing agency's electromagnetic compatibility, vibration, it is multiplied with electronic device/plant capacity, its
Engineering application is restricted.
Utility model content
The purpose of this utility model, aiming at the deficiency present in the prior art, and it is compound to provide a kind of thermoelectric cooling
The temperature-controlled cooling device and its temperature control method of phase change cold-storage, the program are big during realizing electronic device work using solid wall heat transfer
The extract real-time of power waste heat, no pump drive fluid circuit, and volume scale is small；Evade the vibration of Liao Bengqu mechanisms introducing, EMC is asked
Topic；The security reliability that no enclosed fluid circuit triggers reduces problem；Temperature-controlled cooling device and heat source integrated design, are easy to
Engineering is amplified；Accurate temperature control is realized by TEC cooling pieces, temperature-controlled precision is high；By varying TEC cooling pieces quantity and phase-change material
Total amount, the electronic device of applicable difference thermic load；Zoned temperature control is realized by varying TEC cooling piece arrangements, it is applicable
The different temperature requirements of same equipment difference heat load.
This programme is achieved by the following technical measures：
A kind of temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage, includes and expands hot plate, thermal interfacial material, TEC systems
Cold, phase-change cold-storage device and peripheral cooling device；The lower surface of phase-change cold-storage device passes through thermal interfacial material and peripheral cooling device
Connection；The upper surface of phase-change cold-storage device is connected by thermal interfacial material with the lower surface of TEC cooling pieces；The upper table of TEC cooling pieces
Face is connected by thermal interfacial material with expanding the lower surface of hot plate；Expand the upper surface of hot plate by thermal interfacial material and treat radiating electronic
Device connects.
As the preferred of this programme：Filling phase-change material in phase-change cold-storage device；Phase-change material is led by peripheral cooling device
Heat realizes the mushy stage transformation of phase-change material.
As the preferred of this programme：Peripheral cooling device is air-cooled or liquid-cooling heat radiator.
As the preferred of this programme：The quantity of TEC cooling pieces is multi-disc, and the gap between each TEC cooling pieces is filled with
Heat preserving and insulating material.
A kind of temperature control method of the temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage, includes step：
A, before starting first, start peripheral refrigeration plant, to the phase change material temperature lowering in phase-change cold-storage device, phase-change material by
Liquid phase cooling solidification is solid phase；
B, in electronic device working stage, peripheral refrigeration plant is stopped, the waste heat that electronic device produces is even by expanding hot plate
Change, waste heat is conducted to being absorbed by phase-change material in phase-change cold-storage device, and phase-change material heat absorption is changed into liquid phase from solid phase；TEC cooling pieces
Work is powered up, adjusts the control temperature requirement that electrical power realizes electronic device in real time；
C, in electronic device working interval, peripheral refrigeration plant is opened, by peripheral refrigeration plant by phase-change cold-storage device
Interior phase change material temperature lowering, phase-change material are solidified as solid phase by liquid phase, and waste heat passes through peripheral refrigeration plant dissipation to outside atmosphere
In.
As the preferred of this programme：The latent heat of phase change of phase-change material is more than or equal to 100kJ/kg.
As the preferred of this programme：Phase-change material solid-liquid phase change temperature is less than the control temperature of electronic device.
As the preferred of this programme：State in step a, augmentation of heat transfer material is filled with phase-change cold-storage device；Described strengthen passes
The thermal conductivity factor of hot material is 20w/m ﹒ K~300W/m ﹒ K.
As the preferred of this programme：The adding amount of phase-change material is according to formulaCalculating, wherein Q is single cold storage capacity,
Δ H is phase-change material latent heat of phase change.
As the preferred of this programme：Peripheral cooling device refrigerating capacity is calculated according to formula：Wherein, WlIt is negative for heat
Lotus；twFor the electronic device working time；tp：The electronic device work interval time.
The beneficial effect of this programme can learn that the program realizes electricity using solid wall heat transfer according to the narration to such scheme
The extract real-time of high-power waste heat, no pump drive fluid circuit during sub- device work, and volume scale is small；Evade Liao Bengqu mechanisms to draw
The vibration that enters, EMC problems；The security reliability that no enclosed fluid circuit triggers reduces problem；Temperature-controlled cooling device and heat source
Integrated design, is easy to engineering amplification；Accurate temperature control is realized by TEC cooling pieces, temperature-controlled precision is high；Freeze by varying TEC
Piece quantity and phase-change material total amount, the electronic device of applicable difference thermic load；Realized by varying TEC cooling pieces arrangement
Zoned temperature control, the different temperature requirements of applicable same equipment difference heat load.
It can be seen from the above that the utility model is compared with prior art, there is substantive distinguishing features and progress, its beneficial effect implemented
Fruit is also obvious.
Brief description of the drawings
Fig. 1 is a kind of structure diagram of embodiment of the utility model.
Fig. 2 is the structure diagram of the utility model another kind embodiment.
Fig. 3 is the structure diagram of the utility model another kind embodiment.
In figure, 1 is electronic device, and 2 be TEC cooling pieces, and 3 be heat preserving and insulating material, and 4 is expand hot plate, and 5 be hot interface material
Material, 6 be phase-change cold-storage device, and 7 be peripheral cooling device, and 8 be heat dissipation cold plate, and 9 be hot dissipation circuit.
Embodiment
All features disclosed in this specification, or disclosed all methods or during the step of, except mutually exclusive
Feature and/or step beyond, can combine in any way.
Any feature disclosed in this specification (including any accessory claim, summary and attached drawing), except non-specifically chatting
State, can be replaced by other alternative features that are equivalent or have similar purpose.I.e., unless specifically stated, each feature
It is an example in a series of equivalent or similar characteristics.
Embodiment 1
Selection heat source is 6 ceramic heating flakes, and single ceramic heating plate thermic load 85W, amounts to 510W, apparent size 30mm
×30mm.Expand hot plate and use flat-plate heat pipe, apparent size 300mm × 125mm.TEC cooling pieces select 9500-241-100B refrigeration
Piece, 6, TEC cooling pieces circuit is connected by the way of series connection.Ceramic heating flake is connected by heat-conducting glue with expanding hot plate, expands heat
Plate is connected by heat-conducting glue with TEC cooling pieces, and TEC cooling pieces are connected by heat-conducting glue with phase-change cold-storage device, heat-conducting glue heat conduction system
Number 5w/m ﹒ K；Phase-change cold-storage device augmentation of heat transfer material uses foamy graphite, and phase-change material uses hexadecane, transformation temperature 18
DEG C, latent heat of phase change 200kJ/kg, phase-change material loading 350g；Peripheral cooling device uses air-cooled liquid chillers, refrigerating capacity
1000W, peripheral cooling device are connected with phase-change cold-storage device by hot dissipation circuit, and heat dissipation cold plate is located at phase-change cold-storage device bottom,
Heat-conducting glue, heat-conducting glue thermal conductivity factor 5W/m ﹒ K are applied between heat dissipation cold plate and phase-change cold-storage device.
Before starting first, start peripheral cooling device, cooling temperature is set as 5 DEG C, by the phase transformation material in phase-change cold-storage device
Material cooling is solidified as solid phase by liquid phase, and when phase-change material temperature is less than 16 DEG C, phase transformation terminates, and closes peripheral cooling device.TEC systems
Cold power-up, setting 22 DEG C of temperature of control；The disposable instantaneous herk thermic load 510W of ceramic heating flake, according to ceramic heating flake with
Expand the temperature change that hot plate contacts hot interface, adjust TEC cooling piece electrical power in real time；Waste heat is transferred to phase transformation by heat transfer and stores
In cooler, it is liquid phase that phase-change material heat absorption is melted by solid phase, and when phase-change material temperature is higher than 20 DEG C, phase transformation terminates.When working total
Long 112s, working stage ceramic heating flake contact 21.8 DEG C~22.3 DEG C of the temperature at hot interface with expanding hot plate.
Operated through the present embodiment, the hot interface temperature control of heat source stream time 112s, TEC power consumption 100W, TEC cooling piece
21.8 DEG C~22.3 DEG C of scope processed, temperature-controlled precision are better than ± 0.5 DEG C.
Embodiment 2
Substantially the same manner as Example 1, difference is that expanding hot plate uses aluminium alloy base plate, apparent size 300mm ×
125mm。
Before starting first, start peripheral cooling device, cooling temperature is set as 5 DEG C, by the phase transformation material in phase-change cold-storage device
Material cooling is solidified as solid phase by liquid phase, and when phase-change material temperature is less than 16 DEG C, phase transformation terminates, and closes peripheral cooling device.TEC systems
Cold power-up, setting 22 DEG C of temperature of control；The disposable instantaneous herk thermic load 510W of ceramic heating flake, according to ceramic heating flake with
Expand the temperature change that hot plate contacts hot interface, adjust TEC cooling piece electrical power in real time；Waste heat is transferred to phase transformation by heat transfer and stores
In cooler, it is liquid phase that phase-change material heat absorption is melted by solid phase, and when phase-change material temperature is higher than 20 DEG C, phase transformation terminates.When working total
Long 108s, working stage ceramic heating flake contact 21.6 DEG C~22.4 DEG C of the temperature at hot interface with expanding hot plate.
Operated through the present embodiment, heat source stream time 108s, TEC power consumption 100W, hot interface temperature control range
21.6 DEG C~22.5 DEG C, temperature-controlled precision is better than ± 0.5 DEG C.
Embodiment 3
Selection heat source is electric heating tube heat source, and heating load 500W, electric heating tube apparent size Φ 8mm × 140mm, are heated
Load 500W；Expand hot plate and use flat-plate heat pipe, apparent size 200mm × 125mm；Electric heating tube heat source passes through heat-conducting silicone grease and aluminium
Alloy expands the connection of hot housing, and aluminium alloy expands hot housing and be connected by heat-conducting silicone grease with expanding hot plate, expansion hot plate by heat-conducting silicone grease and
TEC cooling pieces connect, and TEC cooling pieces are connected by heat-conducting silicone grease with phase-change cold-storage device, heat-conducting silicone grease thermal conductivity factor 3W/m ﹒ K；Aluminium
Alloy expands hot housing apparent size 150mm (L) × 80mm (W) × 32mm (H), and aluminium alloy expands hot housing by heat-conducting silicone grease with expanding
Hot plate connects, heat-conducting glue thermal conductivity factor 3W/m ﹒ K.Phase-change cold-storage device augmentation of heat transfer material uses foamy graphite, and phase-change material uses
Hexadecane, transformation temperature are 18 DEG C, latent heat of phase change 200kJ/kg, phase-change material loading 400g；Peripheral cooling device uses wind
Cold type handpiece Water Chilling Units, refrigerating capacity 1000W, peripheral cooling device are connected with phase-change cold-storage device by hot dissipation circuit, heat dissipation cold plate
Positioned at phase-change cold-storage device bottom, heat-conducting silicone grease, heat-conducting silicone grease thermal conductivity factor 3W/m ﹒ K are applied between heat dissipation cold plate and phase-change cold-storage device.
Before starting first, start peripheral cooling device, cooling temperature is set as 5 DEG C, by the phase transformation material in phase-change cold-storage device
Material cooling is solidified as solid phase by liquid phase, and when phase-change material temperature is less than 16 DEG C, phase transformation terminates, and closes peripheral cooling device.TEC systems
Cold power-up, setting 22 DEG C of temperature of control；The disposable instantaneous herk thermic load 500W of electric heating tube, expands hot housing according to aluminium alloy
Temperature change with expanding the hot interface of hot plate, adjusts TEC cooling piece electrical power in real time；Waste heat is transferred to phase change cold-storage by heat transfer
In device, it is liquid phase that phase-change material heat absorption is melted by solid phase, and when phase-change material temperature is higher than 20 DEG C, phase transformation terminates.Work total duration
125s, working stage ceramic heating flake contact 21.8 DEG C~22.3 DEG C of the temperature at hot interface with expanding hot plate.
Operated through the present embodiment, heat source stream time 125s, TEC power consumption 100W, hot interface temperature control range
21.8 DEG C~22.3 DEG C, temperature-controlled precision is better than ± 0.5 DEG C.
Embodiment 4
Substantially the same manner as Example 1, difference one is that expanding hot plate uses aluminium alloy base plate, apparent size 200mm ×
125mm；Difference two is that aluminium alloy expands hot housing apparent size 150mm (L) × 30mm (W) × 28mm (H).
Before starting first, start peripheral cooling device, cooling temperature is set as 5 DEG C, by the phase transformation material in phase-change cold-storage device
Material cooling is solidified as solid phase by liquid phase, and when phase-change material temperature is less than 16 DEG C, phase transformation terminates, and closes peripheral cooling device.TEC systems
Cold power-up, setting 20 DEG C of temperature of control；The disposable instantaneous herk thermic load 500W of electric heating tube, expands hot housing according to aluminium alloy
The temperature change of bottom surface, adjusts TEC cooling piece electrical power in real time；Waste heat is transferred in phase-change cold-storage device by heat transfer, phase transformation
It is liquid phase that material heat absorption is melted by solid phase, and when phase-change material temperature is higher than 20 DEG C, phase transformation terminates.Work total duration 120s, work
Stage ceramic heating flake contacts 21.3 DEG C~22.6 DEG C of the temperature at hot interface with expanding hot plate.
Operated through the present embodiment, heat source stream time 120s, TEC power consumption 100W, hot interface temperature control range
21.8 DEG C~22.4 DEG C, temperature-controlled precision is better than ± 1 DEG C.
The utility model is not limited to foregoing embodiment.The utility model expands to any in this specification
The new feature of middle disclosure or any new combination, and disclose any new method or process the step of or any new group
Close.
Claims (4)
1. a kind of temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage, it is characterized in that：Include and expand hot plate, hot interface material
Material, TEC cooling pieces, phase-change cold-storage device and peripheral cooling device；The lower surface of the phase-change cold-storage device by thermal interfacial material with
Peripheral cooling device connection；The upper surface of the phase-change cold-storage device is connected by thermal interfacial material with the lower surface of TEC cooling pieces；
The upper surface of the TEC cooling pieces is connected by thermal interfacial material with expanding the lower surface of hot plate；The upper surface for expanding hot plate leads to
Thermal interfacial material is crossed with treating that heat dissipating electronic devices are connected.
2. a kind of temperature-controlled cooling device according to claim 1, it is characterized in that：Filling phase transformation material in the phase-change cold-storage device
Material；The phase-change material realizes that the mushy stage of phase-change material changes by peripheral cooling device heat conduction.
3. a kind of temperature-controlled cooling device according to claim 1, it is characterized in that：The periphery cooling device is air-cooled or liquid
Cooling and radiation device.
4. a kind of temperature-controlled cooling device according to claim 1, it is characterized in that：The quantity of the TEC cooling pieces is multi-disc,
Gap between each TEC cooling pieces is filled with heat preserving and insulating material.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721278396.1U CN207305245U (en) | 2017-09-30 | 2017-09-30 | A kind of temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721278396.1U CN207305245U (en) | 2017-09-30 | 2017-09-30 | A kind of temperature-controlled cooling device of thermoelectric cooling composite phase-change cold-storage |
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| CN207305245U true CN207305245U (en) | 2018-05-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454813A (en) * | 2017-09-30 | 2017-12-08 | 中国工程物理研究院应用电子学研究所 | A kind of temperature-controlled cooling device and its temperature control method of thermoelectric cooling composite phase-change cold-storage |
-
2017
- 2017-09-30 CN CN201721278396.1U patent/CN207305245U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107454813A (en) * | 2017-09-30 | 2017-12-08 | 中国工程物理研究院应用电子学研究所 | A kind of temperature-controlled cooling device and its temperature control method of thermoelectric cooling composite phase-change cold-storage |
| CN107454813B (en) * | 2017-09-30 | 2023-05-23 | 中国工程物理研究院应用电子学研究所 | Temperature control cooling device and temperature control method for thermoelectric refrigeration composite phase change cold accumulation |
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