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CN207298426U - LED circuit board and LED bracket - Google Patents

LED circuit board and LED bracket Download PDF

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Publication number
CN207298426U
CN207298426U CN201721200468.0U CN201721200468U CN207298426U CN 207298426 U CN207298426 U CN 207298426U CN 201721200468 U CN201721200468 U CN 201721200468U CN 207298426 U CN207298426 U CN 207298426U
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conducting wire
wire
led
circuit board
bottom plate
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叶逢新
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Abstract

the utility model provides a L ED circuit board and L ED support belongs to L ED lamp technical field the L ED support includes the bottom plate, follow on the bottom plate the vertical direction of bottom plate is provided with power cord, first wire and second wire, through first wire with the second wire becomes on Z type setting and the bottom plate, first wire is equipped with a plurality of first electrically conductive regions of arranging in proper order, the second wire is equipped with and arranges a plurality of second electrically conductive regions in proper order, and every first electrically conductive region forms the installation region who is used for placing the L ED chip with every second electrically conductive region, first wire with the second wire is in through setting up installation region's L ED chip cluster is parallelly connected to make the installation of L ED chip simpler, also the laminating of easier L ED chip can effectively save L ED space circuit board, the structure is more stable.

Description

LED线路板及LED支架LED circuit board and LED bracket

技术领域technical field

本实用新型涉及LED灯技术领域,具体而言,涉及一种LED线路板及LED支架。The utility model relates to the technical field of LED lamps, in particular to an LED circuit board and an LED bracket.

背景技术Background technique

LED(LightEmittingDiode),发光二极管,是一种固态的半导体器件,它可以直接把电转化为光。LED的心脏是一个半导体的晶片,晶片的一端附在一个支架上,一端是负极,另一端连接电源的正极,使整个晶片被环氧树脂封装起来。半导体晶片由两部分组成,一部分是P型半导体,在它里面空穴占主导地位,另一端是N型半导体,在这边主要是电子。但这两种半导体连接起来的时候,它们之间就形成一个“P-N结”。当电流通过导线作用于这个晶片的时候,电子就会被推向P区,在P区里电子跟空穴复合,然后就会以光子的形式发出能量,这就是LED发光的原理。而光的波长也就是光的颜色,是由形成P-N结的材料决定的。LED (Light Emitting Diode), light emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When electric current acts on this chip by wire time, electron will be pushed to P district, and in P district, electron is with hole recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is. And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.

现有的LED线路板都是采用两条平行的导线,通常二者之间的间距比较大,需要将LED芯片安装于该两条导线之间,而LED芯片通常比较小,这种方法一方面使得LED芯片焊接很困难,而且也不便于LED芯片的贴合,另一方面,线路板的面积会比较大。Existing LED circuit boards use two parallel wires, and the distance between them is usually relatively large. It is necessary to install the LED chip between the two wires, and the LED chip is usually relatively small. On the one hand, this method This makes soldering of the LED chips very difficult, and it is also inconvenient to attach the LED chips. On the other hand, the area of the circuit board will be relatively large.

实用新型内容Utility model content

本实用新型的目的在于提供一种LED线路板及LED支架,其能够改善上述问题。The purpose of this utility model is to provide an LED circuit board and an LED bracket, which can improve the above problems.

本实用新型的实施例是这样实现的:Embodiments of the utility model are achieved in that:

一种LED线路板,包括底板,所述底板上沿所述底板的垂直方向设置有电源线、第一导线以及第二导线,所述电源线的一端与驱动电源连接,所述第一导线的一端与所述驱动电源连接,所述第二导线的一端与所述电源线的另一端连接,所述第一导线、所述第二导线与所述电源线之间形成回路;所述第一导线与所述第二导线均成Z型设置,所述第一导线设有依次排列的多个第一导电区域,所述第二导线设有依次排列多个第二导电区域,每个第一导电区域与每个第二导电区域形成用于放置LED芯片的安装区域,所述第一导线与所述第二导线通过设置在所述安装区域的LED芯片串并联。An LED circuit board, comprising a bottom plate, on which a power line, a first lead and a second lead are arranged on the bottom plate along the vertical direction of the bottom plate, one end of the power line is connected to a driving power supply, and the first lead is One end is connected to the driving power supply, one end of the second wire is connected to the other end of the power line, and a loop is formed between the first wire, the second wire and the power line; the first Both the wire and the second wire are arranged in a Z shape, the first wire is provided with a plurality of first conductive regions arranged in sequence, and the second wire is provided with a plurality of second conductive regions arranged in sequence, and each first The conductive area and each second conductive area form an installation area for placing LED chips, and the first wire and the second wire are connected in parallel through the LED chip strings arranged in the installation area.

在本实用新型较佳的实施例中,所述底板上还设有独立电源线,所述独立电源线与所述第二导线连接。In a preferred embodiment of the present utility model, an independent power line is further provided on the bottom plate, and the independent power line is connected to the second wire.

在本实用新型较佳的实施例中,所述安装区域按预设距离依次设置在所述底板上。In a preferred embodiment of the present utility model, the installation areas are sequentially arranged on the bottom plate according to a preset distance.

在本实用新型较佳的实施例中,所述电源线的一端与所述驱动电源的负极连接,所述第一导线的一端与所述驱动电源的正极连接。In a preferred embodiment of the present invention, one end of the power line is connected to the negative pole of the driving power supply, and one end of the first wire is connected to the positive pole of the driving power supply.

在本实用新型较佳的实施例中,所述电源线的一端与所述驱动电源的正极连接,所述第一导线的一端与所述驱动电源的负极连接。In a preferred embodiment of the present invention, one end of the power line is connected to the positive pole of the driving power supply, and one end of the first wire is connected to the negative pole of the driving power supply.

在本实用新型较佳的实施例中,所述底板的一端还设有第一金属端子和第二金属端子,所述第一金属端子的一端与所述驱动电源的正极连接,所述第一金属端子的另一端与所述电源线连接,所述第二金属端子的一端与所述驱动电源的负极连接,所述第二金属端子的另一端与所述第一导线的一端连接。In a preferred embodiment of the present invention, one end of the base plate is further provided with a first metal terminal and a second metal terminal, one end of the first metal terminal is connected to the positive pole of the drive power supply, and the first The other end of the metal terminal is connected to the power line, one end of the second metal terminal is connected to the negative pole of the driving power supply, and the other end of the second metal terminal is connected to one end of the first wire.

在本实用新型较佳的实施例中,所述LED芯片包覆有荧光胶体。In a preferred embodiment of the present invention, the LED chip is coated with fluorescent colloid.

在本实用新型较佳的实施例中,所述底板上还设有散热件,所述第一导线和所述第二导线均设有散热区,所述散热件均与所述散热区连接。In a preferred embodiment of the present utility model, the bottom plate is further provided with a heat dissipation element, the first wire and the second wire are provided with a heat dissipation area, and the heat dissipation elements are connected to the heat dissipation area.

在本实用新型较佳的实施例中,所述散热区内的所述第一导线和所述第二导线设有凸出的弧形。In a preferred embodiment of the present invention, the first wire and the second wire in the heat dissipation area are provided with a protruding arc.

一种LED支架,所述LED支架包括多条LED线路板,所述多条LED线路板沿所述LED支架垂直方向依次设置。An LED bracket, the LED bracket includes a plurality of LED circuit boards, and the plurality of LED circuit boards are arranged in sequence along the vertical direction of the LED bracket.

本实用新型实施例的有益效果是:The beneficial effects of the utility model embodiment are:

本实用新型实施例提供一种LED线路板及LED支架,通过所述第一导线与所述第二导线成Z型设置与底板上,所述第一导线设有依次排列的多个第一导电区域,所述第二导线设有依次排列多个第二导电区域,每个第一导电区域与每个第二导电区域形成用于放置LED芯片的安装区域,所述第一导线与所述第二导线通过设置在所述安装区域的LED芯片串并联,从而使得LED芯片的安装更简单,也更容易LED芯片的贴合,可以有效节省LED线路板空间,结构更稳定。The embodiment of the utility model provides an LED circuit board and an LED bracket. The first wire and the second wire are arranged on the base plate in a Z shape, and the first wire is provided with a plurality of first conductive wires arranged in sequence. area, the second wire is provided with a plurality of second conductive areas arranged in sequence, each first conductive area and each second conductive area form an installation area for placing LED chips, and the first wire and the first conductive area The two wires are connected in series and parallel through the LED chips arranged in the installation area, so that the installation of the LED chips is simpler and the bonding of the LED chips is easier, which can effectively save the space of the LED circuit board and have a more stable structure.

附图说明Description of drawings

为了更清楚地说明本实用新型实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本实用新型的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following drawings will be briefly introduced in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention. Therefore, it should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained according to these drawings without creative work.

图1为本实用新型实施例提供的一种LED线路板的结构示意图;Fig. 1 is a schematic structural diagram of an LED circuit board provided by an embodiment of the present invention;

图2为本实用新型实施例提供的另一种LED线路板的结构示意图;Fig. 2 is a schematic structural diagram of another LED circuit board provided by the embodiment of the present invention;

图3为本实用新型实施例提供的又一种LED线路板的结构示意图;Fig. 3 is a schematic structural diagram of another LED circuit board provided by the embodiment of the present invention;

图4为本实用新型实施例提供的一种LED支架的结构示意图。Fig. 4 is a schematic structural diagram of an LED bracket provided by an embodiment of the present invention.

图标:200-LED支架;100-LED线路板;110-底板;120-电源线;130-第一导线;132-第一导电区域;140-第二导线;142-第二导电区域;150-LED芯片;160-独立电源线;170-第一金属端子;180-第二金属端子;190-散热区;192-弧形。Icon: 200-LED bracket; 100-LED circuit board; 110-base plate; 120-power line; 130-first wire; 132-first conductive area; 140-second wire; LED chip; 160-independent power line; 170-first metal terminal; 180-second metal terminal; 190-radiation area; 192-arc.

具体实施方式Detailed ways

为使本实用新型实施例的目的、技术方案和优点更加清楚,下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本实用新型一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本实用新型实施例的组件可以以各种不同的配置来布置和设计。In order to make the purpose, technical solutions and advantages of the embodiments of the utility model more clear, the technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the utility model. Obviously, the described The embodiments are some embodiments of the present utility model, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the figures herein may be arranged and designed in a variety of different configurations.

因此,以下对在附图中提供的本实用新型的实施例的详细描述并非旨在限制要求保护的本实用新型的范围,而是仅仅表示本实用新型的选定实施例。基于本实用新型中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.

应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。It should be noted that like numerals and letters denote similar items in the following figures, therefore, once an item is defined in one figure, it does not require further definition and explanation in subsequent figures.

在本实用新型的描述中,需要说明的是,术语“垂直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该实用新型产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本实用新型和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本实用新型的限制。此外,术语“第一”、“第二”、“第三”等仅用于区分描述,而不能理解为指示或暗示相对重要性。In the description of the present utility model, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "horizontal", "inner", "outer" etc. is based on the orientation or positional relationship shown in the drawings, or is The usual orientation or positional relationship of the utility model product in use is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and operation, and therefore cannot be construed as a limitation of the utility model. In addition, the terms "first", "second", "third", etc. are only used for distinguishing descriptions, and should not be construed as indicating or implying relative importance.

此外,术语“水平”、“竖直”、“悬垂”等术语并不表示要求部件绝对水平或悬垂,而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平,并不是表示该结构一定要完全水平,而是可以稍微倾斜。In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are absolutely horizontal or overhanging, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal than "vertical", and it does not mean that the structure must be completely horizontal, but can be slightly inclined.

在本实用新型的描述中,还需要说明的是,除非另有明确的规定和限定,术语“设置”、“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本实用新型中的具体含义。In the description of the present utility model, it should also be noted that, unless otherwise specified and limited, the terms "setting", "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection , can also be detachably connected, or integrally connected; can be mechanically connected, can also be electrically connected; can be directly connected, can also be indirectly connected through an intermediary, and can be internal communication between two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations.

本实用新型的其他特征和优点将在随后的说明书阐述,并且,部分地从说明书中变得显而易见,或者通过实施本实用新型实施例而了解。本实用新型的目的和其他优点可通过在所写的说明书、权利要求书、以及附图中所特别指出的结构来实现和获得。Other features and advantages of the present invention will be set forth in the following description, and partly become apparent from the description, or can be understood by implementing the embodiments of the present invention. The objectives and other advantages of the utility model will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

请参照图1,图1为本实用新型实施例提供的一种LED线路板100的结构示意图,所述LED线路板100包括底板110,所述底板110上沿所述底板110的垂直方向设置有电源线120、第一导线130以及第二导线140,所述电源线120的一端与驱动电源(图未示出)连接,所述电源线120的另一端连接所述第一导线130或所述第二导线140,所述驱动电源、所述第一导线130、所述第二导线140与所述电源线120之间形成回路。Please refer to FIG. 1. FIG. 1 is a schematic structural diagram of an LED circuit board 100 provided by an embodiment of the present invention. The LED circuit board 100 includes a base plate 110, and the base plate 110 is provided with A power line 120, a first wire 130 and a second wire 140, one end of the power line 120 is connected to a driving power supply (not shown), and the other end of the power line 120 is connected to the first wire 130 or the A loop is formed between the second wire 140 , the driving power supply, the first wire 130 , the second wire 140 and the power wire 120 .

具体地,所述第一导线130与所述第二导线140均成Z型设置,所述第一导线130设有依次排列的多个第一导电区域132,所述第二导线140设有依次排列多个第二导电区域142,每个第一导电区域132与每个第二导电区域142形成用于放置LED芯片150的安装区域,所述第一导线130与所述第二导线140通过设置在所述安装区域的LED芯片150串并联。Specifically, the first conductive wire 130 and the second conductive wire 140 are arranged in a Z shape, the first conductive wire 130 is provided with a plurality of first conductive regions 132 arranged in sequence, and the second conductive wire 140 is provided with a plurality of first conductive regions 132 arranged in sequence. A plurality of second conductive regions 142 are arranged, and each first conductive region 132 and each second conductive region 142 form an installation area for placing the LED chip 150, and the first wire 130 and the second wire 140 are arranged by The LED chips 150 in the mounting area are connected in series and parallel.

其中,第一导线130和第二导线140采用Z型,可以使得LED芯片150之间形成串并联,可以有效节省LED线路板100空间,结构更稳定。Wherein, the first wire 130 and the second wire 140 adopt a Z shape, which can form a series-parallel connection between the LED chips 150 , can effectively save the space of the LED circuit board 100 , and have a more stable structure.

第一导电区域132和第二导电区域142均涂覆有导电层,LED芯片150安装在安装区域,从而可以将第一导线130与第二导线140串并联,从而可以减少驱动电源的供电电流,有效降低LED线路板100的能耗。Both the first conductive area 132 and the second conductive area 142 are coated with a conductive layer, and the LED chip 150 is installed in the installation area, so that the first wire 130 and the second wire 140 can be connected in series and parallel, thereby reducing the supply current of the driving power supply, The energy consumption of the LED circuit board 100 is effectively reduced.

所述第一导电区域132和所述第二导电区域142为互相朝向凸出的矩形区域,可以便于LED芯片150的安装,另外,为了节省LED线路板100的空间,可以将安装区域内的所述第一导电区域132和所述第二导电区域142交错排列。The first conductive area 132 and the second conductive area 142 are rectangular areas protruding toward each other, which can facilitate the installation of the LED chip 150. In addition, in order to save the space of the LED circuit board 100, all the LED chips in the installation area can be placed The first conductive regions 132 and the second conductive regions 142 are alternately arranged.

所述驱动电源采用LED恒流驱动电源,是把电源供应转换为特定的电压电流以驱动LED发光的电压转换器,其可以随LED正向压降值变化而改变电压的恒定电流源。The drive power supply adopts LED constant current drive power supply, which is a voltage converter that converts the power supply into a specific voltage and current to drive the LED to emit light. It is a constant current source that can change the voltage as the forward voltage drop value of the LED changes.

作为一种方式,所述电源线120的一端与所述驱动电源的负极连接,所述第一导线130的一端与所述驱动电源的正极连接,所述第二导线140的一端与所述电源线120的另一端连接,或者,所述电源线120的一端与所述驱动电源的正极连接,所述第一导线130的一端与所述驱动电源的负极连接,所述第二导线140的一端与所述电源线120的另一端连接,由此,驱动电源、电源线120、第一导线130和第二导线140可形成串并联回路,从而驱动电源可驱动安装在安装区域的LED芯片150发光。As a method, one end of the power line 120 is connected to the negative pole of the driving power supply, one end of the first wire 130 is connected to the positive pole of the driving power supply, and one end of the second wire 140 is connected to the power supply The other end of the line 120 is connected, or, one end of the power line 120 is connected to the positive pole of the driving power supply, one end of the first wire 130 is connected to the negative pole of the driving power supply, and one end of the second wire 140 Connect with the other end of the power line 120, so that the driving power, the power line 120, the first wire 130 and the second wire 140 can form a series-parallel circuit, so that the driving power can drive the LED chip 150 installed in the installation area to emit light .

请参照图2,图2为本实用新型实施例提供的另一种LED线路板100的结构示意图,所述底板110上还设有独立电源线160,所述独立电源线160与所述第二导线140连接,在通过一个电源控制器对所述LED线路板100供电时,如果单端供电,则只需将驱动电源的正负极连接至电源线120和第一导线130即可,如果双端供电,则需要独立电源线160将另一端的电流引至具有电源控制器的一端。Please refer to Fig. 2, Fig. 2 is a schematic structural diagram of another LED circuit board 100 provided by the embodiment of the present invention, the base plate 110 is also provided with an independent power line 160, and the independent power line 160 is connected to the second The wire 140 is connected. When a power controller is used to supply power to the LED circuit board 100, if the power supply is single-ended, it is only necessary to connect the positive and negative poles of the driving power to the power wire 120 and the first wire 130. If the terminal is powered, an independent power line 160 is required to lead the current of the other terminal to the terminal with the power controller.

所述底板110为金属板,所述电源线120、所述第一导线130、所述第二导线140和独立电源线160的结构为金属板整体一次成型,加工的方式可以是冲压,也可以是轮毂辊压,金属板的材质为任意导电的金属或其合金。The bottom plate 110 is a metal plate, the structure of the power line 120, the first lead 130, the second lead 140 and the independent power line 160 is a metal plate integrally formed at one time, and the processing method can be stamping or It is hub rolling, and the material of the metal plate is any conductive metal or its alloy.

为了更加便于节省LED线路板100的空间,每个第一导电区域132和每个第二导电区域142可以紧密交错进行排列,其可以将两根导线之间的间距更小,不影响LED芯片150的安装,也极大了节省了LED线路板100的空间。In order to save the space of the LED circuit board 100 more conveniently, each first conductive region 132 and each second conductive region 142 can be closely interlaced and arranged, which can make the distance between the two wires smaller without affecting the LED chip 150. The installation also greatly saves the space of the LED circuit board 100.

其中,在所述第一导线130和所述第二导线140之间会安装LED芯片150,而LED芯片150通常比较小,为了更好地焊接或贴合LED芯片150,所述第一导电区域132为第一导线130向所第二导线140方向凸出的导电区域,所述第二导电区域142为所述第二导线140向所述第一导线130方向凸出的导电区域,从而LED芯片150可以安装在第一导线130和第二导线140之间的间隙中,增加了LED线路板100结构的稳定性。其中,第一导电区域132和第二导电区域142可以为凸出的三角形,节省了导电区域导电层的涂覆,与矩形的导电区域相比,更便于LED芯片150的贴合。Wherein, the LED chip 150 is installed between the first wire 130 and the second wire 140, and the LED chip 150 is usually relatively small. In order to better weld or bond the LED chip 150, the first conductive area 132 is the conductive area where the first wire 130 protrudes toward the direction of the second wire 140, and the second conductive area 142 is the conductive area where the second wire 140 protrudes toward the direction of the first wire 130, so that the LED chip 150 can be installed in the gap between the first wire 130 and the second wire 140 , which increases the structural stability of the LED circuit board 100 . Wherein, the first conductive region 132 and the second conductive region 142 can be protruding triangles, saving the coating of the conductive layer of the conductive region, and compared with the rectangular conductive region, it is more convenient for the bonding of the LED chip 150 .

为了不影响LED芯片150在发光情况,如果LED芯片150之间的距离太密集则很可能导致整个光线太强,或者对LED芯片150的安装也有一定的障碍,太密集也很可能会造成短路的情况,所以,可以在底板110上的安装区域按预设距离依次设置,例如可以每隔2cm的预设距离设置安装区域。In order not to affect the light emitting conditions of the LED chips 150, if the distance between the LED chips 150 is too dense, the entire light may be too strong, or there may be certain obstacles to the installation of the LED chips 150, and too dense may cause a short circuit. Therefore, the installation areas on the bottom plate 110 can be set in sequence according to preset distances, for example, the installation areas can be set at intervals of 2 cm.

请参照图3,图3为本实用新型实施例提供的又一种LED线路板100的结构示意图,所述底板110的一端还设有第一金属端子170和第二金属端子180,所述第一金属端子170的一端与所述驱动电源的正极连接,所述第一金属端子170的另一端与所述电源线120连接,所述第二金属端子180的一端与所述驱动电源的负极连接,所述第二金属端子180的另一端与所述第一导线130或所述第二导线140的一端连接。Please refer to Fig. 3, Fig. 3 is a schematic structural diagram of another LED circuit board 100 provided by the embodiment of the present utility model, one end of the bottom board 110 is also provided with a first metal terminal 170 and a second metal terminal 180, the first One end of a metal terminal 170 is connected to the positive pole of the driving power supply, the other end of the first metal terminal 170 is connected to the power line 120, and one end of the second metal terminal 180 is connected to the negative pole of the driving power supply. , the other end of the second metal terminal 180 is connected to one end of the first wire 130 or the second wire 140 .

所述第一金属端子170可以通过焊接或其他方式与所述驱动电源和所述电源线120连接,所述第二金属端子180也可以通过焊接的方式或其他方式与驱动电源和所述第一导线130的一端相连。The first metal terminal 170 can be connected to the driving power supply and the power line 120 by welding or other methods, and the second metal terminal 180 can also be connected to the driving power supply and the first metal terminal 180 by welding or other methods. One end of the wire 130 is connected.

所述LED芯片150包覆有荧光胶体(图未示出),所述荧光胶体可以为含有不同浓度荧光粉的环氧树脂、或硅胶、或硅树胶,其用于将LED芯片150发出的光呈现出不同的颜色。The LED chip 150 is coated with a fluorescent colloid (not shown in the figure), which can be epoxy resin, silica gel, or silica gel containing different concentrations of phosphor powder, which is used to convert the light emitted by the LED chip 150 Shown in different colors.

该LED线路板100上的多个LED芯片150可以为相同发光色的芯片或不同发光色的芯片,例如,第一个LED芯片150为红色或其他单色发光色的芯片,第二个LED芯片150蓝色发光色的芯片,其他的LED芯片150也可根据需要间隔设置成不同发光色的芯片。A plurality of LED chips 150 on the LED circuit board 100 can be chips of the same luminous color or chips of different luminous colors, for example, the first LED chip 150 is a chip of red or other monochromatic luminous colors, and the second LED chip 150 chips with blue luminous color, and other LED chips 150 can also be arranged as chips with different luminous colors at intervals as required.

LED芯片150在发光的过程中会产生大量的热量,为了能及时更快将所述热量散发出去,所述第一导线130和所述第二导线140均设有散热区190,而仅仅通过散热区190将热量散发到空气中或与其接触的其它介质中往往是不够的,有时需要将散热区190连接到其他散热部件上,以更快地散发热量,所以,所述底板110上还可以设有散热件(图未示出),所述散热件均与所述散热区190连接。The LED chip 150 will generate a lot of heat in the process of emitting light. In order to dissipate the heat in time and faster, the first wire 130 and the second wire 140 are provided with a heat dissipation area 190, and only by heat dissipation It is often not enough for the area 190 to dissipate heat into the air or other media in contact with it. Sometimes it is necessary to connect the heat dissipation area 190 to other heat dissipation components to dissipate heat faster. Therefore, the base plate 110 can also be provided with There are heat dissipation elements (not shown in the figure), and the heat dissipation elements are all connected to the heat dissipation area 190 .

所述散热区190内的所述第一导线130和所述第二导线140设有凸出的弧形192,以贴合到所述的散热件上,同时,由于第一导线130和第二导线140的材质为金属,其导热性能较好,并且可以直接焊接到散热件上,而不需要通过绝缘层贴合到散热件上。The first wire 130 and the second wire 140 in the heat dissipation area 190 are provided with a protruding arc 192 to fit onto the heat sink. At the same time, due to the first wire 130 and the second wire The wire 140 is made of metal, which has good thermal conductivity, and can be directly welded to the heat sink instead of being bonded to the heat sink through an insulating layer.

作为一种方式,所述凸出的弧形192底部形状被设置为平直状,设置为平直状的散热区190内的第一导线130和第二导线140的凸出的弧形192焊接或贴合到散热件上时其接触面积更大,导热效果更好,同时不仅能通过散热件散热,其本身也可直接将热量散发到空气中或与其接触的其他介质中。As a method, the bottom shape of the protruding arc 192 is set to be straight, and the protruding arc 192 of the first wire 130 and the second wire 140 in the straight heat dissipation area 190 are welded. Or when it is attached to the heat sink, its contact area is larger and the heat conduction effect is better. At the same time, it can not only dissipate heat through the heat sink, but also directly dissipate heat into the air or other media in contact with it.

请参照图4,图4为本实用新型实施例提供的一种LED支架200的结构示意图,所述LED支架200包括多条上述的LED线路板100,所述多条LED线路板100沿所述LED支架200垂直方向依次设置。Please refer to Fig. 4, Fig. 4 is a schematic structural diagram of an LED bracket 200 provided by an embodiment of the present invention, the LED bracket 200 includes a plurality of LED circuit boards 100 described above, and The LED brackets 200 are arranged in sequence in the vertical direction.

所述LED支架200为金属板一次成型,可一次性形成多条LED线路板100,有效提高了LED线路板100的生产量。The LED bracket 200 is formed from a metal plate at one time, and can form multiple LED circuit boards 100 at one time, which effectively improves the production capacity of the LED circuit boards 100 .

综上所述,本实用新型实施例提供一种LED线路板100及LED支架200,通过所述第一导线130与所述第二导线140成Z型设置与底板110上,所述第一导线130设有依次排列的多个第一导电区域132,所述第二导线140设有依次排列多个第二导电区域142,每个第一导电区域132与每个第二导电区域142形成用于放置LED芯片150的安装区域,所述第一导线130与所述第二导线140通过设置在所述安装区域的LED芯片150串并联,从而使得LED芯片150的安装更简单,也更容易LED芯片150的贴合,可以有效节省LED线路板100空间,结构更稳定。In summary, the embodiment of the present utility model provides an LED circuit board 100 and an LED bracket 200, through which the first wire 130 and the second wire 140 are arranged in a Z-shape on the bottom plate 110, and the first wire 130 is provided with a plurality of first conductive regions 132 arranged in sequence, and the second wire 140 is provided with a plurality of second conductive regions 142 arranged in sequence, and each first conductive region 132 is formed with each second conductive region 142 for The installation area where the LED chip 150 is placed, the first wire 130 and the second wire 140 are connected in series and parallel through the LED chip 150 arranged in the installation area, so that the installation of the LED chip 150 is simpler and easier. The bonding of 150 can effectively save the space of LED circuit board 100, and the structure is more stable.

以上所述仅为本实用新型的优选实施例而已,并不用于限制本实用新型,对于本领域的技术人员来说,本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本实用新型的保护范围之内。The above descriptions are only preferred embodiments of the utility model, and are not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present utility model shall be included in the protection scope of the present utility model.

Claims (10)

1. a kind of LED circuit board, it is characterised in that including bottom plate, be provided with the bottom plate along the vertical direction of the bottom plate Power cord, the first conducting wire and the second conducting wire, one end of the power cord are connected with driving power, the other end of the power cord Connect first conducting wire or second conducting wire, the driving power, first conducting wire, second conducting wire and the electricity It is formed into a loop between the line of source;
First conducting wire is spaced setting with second conducting wire into Z-type, and first conducting wire is equipped with what is be arranged in order Multiple first conductive regions, second conducting wire are equipped with and are arranged in order multiple second conductive regions, each first conductive region with Each second conductive region forms the installation region for being used for placing LED chip, and first conducting wire passes through with second conducting wire It is arranged on the LED chip connection in series-parallel of the installation region.
2. LED circuit board according to claim 1, it is characterised in that independent current source line is additionally provided with the bottom plate, it is described Independent current source line is connected with second conducting wire.
3. LED circuit board according to claim 2, it is characterised in that the installation region is set gradually by pre-determined distance On the bottom plate.
4. LED circuit board according to claim 3, it is characterised in that one end of the power cord and the driving power Anode connection, one end of first conducting wire is connected with the cathode of the driving power.
5. according to the LED circuit board described in any claim in claim 1-4, it is characterised in that one end of the power cord with The cathode connection of the driving power, one end of first conducting wire is connected with the anode of the driving power.
6. LED circuit board according to claim 5, it is characterised in that one end of the bottom plate is additionally provided with the first metal end Son and the second metal terminal, one end of the first metal end are connected with the cathode of the driving power, first metal The other end of terminal is connected with the power cord, and one end of second metal terminal is connected with the anode of the driving power, The other end of second metal terminal is connected with one end of first conducting wire or second conducting wire.
7. LED circuit board according to claim 6, it is characterised in that the LED chip is coated with fluorescent colloid.
8. LED circuit board according to claim 7, it is characterised in that it is additionally provided with radiating piece on the bottom plate, described first Conducting wire and second conducting wire are equipped with radiating area, and the radiating piece is connected with the radiating area.
9. LED circuit board according to claim 8, it is characterised in that first conducting wire and institute in the radiating area State the arc that the second conducting wire is equipped with protrusion.
10. a kind of LED support, it is characterised in that the LED support includes any LED line roads of a plurality of claim 1-9 Plate, a plurality of LED circuit board are set gradually along the LED support vertical direction.
CN201721200468.0U 2017-09-18 2017-09-18 LED circuit board and LED bracket Active CN207298426U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107477381A (en) * 2017-09-18 2017-12-15 叶逢新 LED circuit board and LED support

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107477381A (en) * 2017-09-18 2017-12-15 叶逢新 LED circuit board and LED support

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