CN207284000U - A kind of switching power circuit plate sealing structure - Google Patents
A kind of switching power circuit plate sealing structure Download PDFInfo
- Publication number
- CN207284000U CN207284000U CN201721306849.7U CN201721306849U CN207284000U CN 207284000 U CN207284000 U CN 207284000U CN 201721306849 U CN201721306849 U CN 201721306849U CN 207284000 U CN207284000 U CN 207284000U
- Authority
- CN
- China
- Prior art keywords
- main casing
- circuit board
- lead
- cover plate
- upper cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000007789 sealing Methods 0.000 title claims abstract description 30
- 239000004593 Epoxy Substances 0.000 claims abstract description 23
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000000565 sealant Substances 0.000 claims abstract description 20
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 20
- 239000010703 silicon Substances 0.000 claims abstract description 20
- 239000000853 adhesive Substances 0.000 claims abstract description 19
- 230000001070 adhesive effect Effects 0.000 claims abstract description 19
- 238000004382 potting Methods 0.000 claims abstract description 19
- 238000005266 casting Methods 0.000 claims abstract description 8
- 239000003292 glue Substances 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006335 epoxy glue Polymers 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Abstract
It the utility model is related to a kind of switching power circuit plate sealing structure, including circuit board, output lead, main casing, organic silicon potting adhesive, epoxy pouring sealant and upper cover plate, the circuit board is installed in the main casing, the organic silicon potting adhesive is potted in the upper and lower surface of the circuit board, the epoxy pouring sealant is potted in the upper surface of the organic silicon potting adhesive, the side wall of the main casing is equipped with the first lead notch, the upper cover plate includes sealing strip and middle lug boss, the sealing strip is equipped with the second lead notch, the first lead notch and the second lead notch, which coordinate, is inlaid with elastic wire set；The utility model can make circuit board have preferable thermal diffusivity, epoxy pouring sealant firm can be bonded with shell and output lead, it is not easy to crack, with good sealing water resistance, effectively conducting wire can be prevented to be pulled at the same time and cause casting glue to be disengaged with conducting wire, further increase sealing waterproof ability.
Description
Technical field
A kind of switching power circuit plate sealing structure is the utility model is related to, belongs to technical field of electronic products.
Background technology
In order to make electronic product waterproof dust-proof, improve the performance and used life of product, be required for electronic product into
Row sealing, prevents the circuit board in electronic product from influencing product normal work because of water inlet or other materials.Some undersea detections
Also needed to Deng electronic product with excursion diving ability, so needing that its circuit board is fully sealed using fluid sealant, prevent water
Cause power-fail into short circuit is caused.The casting glue used at present has the material such as bi-component organosilicon, polyurethane, epoxy
Material, since polyurethane has certain toxicity in embedding, we only use bi-component organosilicon and epoxy pouring sealant at present.Epoxy glue
Cohesive force is strong, but poor thermal conductivity, while can produce stress to elements on circuit board when curing so that and pad has disengagement risk,
Analysis or maintenance can not be disassembled at the same time.And organic silica gel heat conduction is good, unstressed but bonding force difference, with shell, input and output lead
Bonding place is easy to crack, be easy to cause water and enters inside embedding, in addition organosilicon embedding is easily divested from circuit board, maintenance side
Just.It is all to want to improve power supply product power density, it is necessary to have thermal conductive resin, by power source internal transformer, power semiconductor
Heat Deng generation maximizes and is transferred to case surface and is distributed, and silica gel is preferred at this time, but wants to encapsulate solid and reliable, epoxy
It is exactly only choosing.
The content of the invention
To solve problems of the prior art, the utility model provides a kind of switching power circuit plate sealing knot
Structure.Concrete technical scheme is as follows：
A kind of switching power circuit plate sealing structure, including circuit board, output lead, main casing, organic silicon potting adhesive, ring
Oxygen casting glue and upper cover plate, the circuit board are installed in the main casing, and the organic silicon potting adhesive is potted in the circuit
The upper and lower surface of plate, the epoxy pouring sealant are potted in the upper surface of the organic silicon potting adhesive, the main casing
Side wall is equipped with the first lead notch, and the upper cover plate includes sealing strip and middle lug boss, and the sealing strip is equipped with the
Two lead notches, the first lead notch and the second lead notch, which coordinate, is inlaid with elastic wire set, the elastic wire set
To be set on the output lead, the elastic wire set is molded by cylindrical structure and round estrade structural integrity, described
Elastic wire is put on equipped with through hole.
Preferably, the lug boss surface bonding of the upper cover plate connects the epoxy pouring sealant.
Preferably, the side wall of the main casing is equipped with the first threaded hole, and the sealing strip of the upper cover plate, which is equipped with, to be corresponded to
With the second threaded hole of the first threaded hole.
Preferably, the output lead is connected with the upper through hole interference fit of elastic wire set.
The beneficial effects of the utility model are：The circuit board of the utility model high frequency switch power is filled using organosilicon first
Sealing is potted sealing, reuses the upper surface that epoxy pouring sealant is potted in organic silicon potting adhesive, and organic silicon potting adhesive has
Heat conduction is good, stressless advantage so that can effectively it radiate to case surface with the circuit board that organic silicon potting adhesive directly contacts,
Pad is not easy to disengage；Epoxy pouring sealant firm can be bonded with shell, output lead at the same time, not easy to crack, effectively be avoided
Water enters inside embedding；In addition, when conducting wire is subject to external pull, the round estrade structure division of elastic wire set is by outside
Pulling force effect extrudes wire guide inner wall and shrinks, and conducting wire is further fixed, effectively conducting wire can be prevented to be pulled and make
Disengaged into casting glue and conducting wire；
Further, the crowning bonding connection epoxy pouring sealant among upper cover plate, realizes that main casing is bonded as with upper cover plate
One is overall, and void space is smaller between upper cover plate and main casing, avoids a large amount of water into epoxy pouring sealant in main casing and upper
Potential danger between cover board, further enhancing the overall tightness and water proofing property of circuit board.
Brief description of the drawings
Fig. 1 is the global sections structure diagram at the utility model wire guide position；
Fig. 2 is the structure diagram of the utility model main casing；
Fig. 3 is the structure diagram of the utility model upper cover plate；
Fig. 4 is the structure diagram of the utility model elastic wire set.
Embodiment
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the utility model provides a kind of switching power circuit plate sealing structure, bag
Circuit board 3, output lead 6, main casing 1, organic silicon potting adhesive 4, epoxy pouring sealant 5 and upper cover plate 2 are included, the circuit board 3 is pacified
In the main casing 1, the organic silicon potting adhesive 4 is potted in the upper and lower surface of the circuit board 3, the epoxy
Casting glue 5 is potted in the upper surface 4 of the organic silicon potting adhesive, and the side wall of the main casing 1 is equipped with the first lead notch 8,
The upper cover plate 2 includes sealing strip 202 and middle lug boss 201, and the sealing strip 202 is equipped with the second lead notch 9, institute
State the first lead notch 8 and the cooperation of the second lead notch 9 is inlaid with elastic wire set 7, the elastic wire covers 7 to be set in
On the output lead 6, the elastic wire set 7 is integrally formed by cylindrical structure 701 and round estrade structure 702, the bullet
Property wire sleeve is equipped with through hole 703.
In above-mentioned technical proposal, elastic wire set 7 is made of elastomeric materials, and during implementation, circuit board 3 is put into master first
In housing 1, and tidy is carried out to output lead, then by output lead 6 through the through hole 703 on elastic wire set 7, and
It is fixed in the first lead notch 8 that elastic wire set 7 is embedded on main casing 1, one end of output lead is drawn main casing 1
Outside；Deployed organic silicon potting adhesive 4 is poured onto in main casing 1 afterwards, and is filled in upper surface and the following table of circuit board 3
Epoxy pouring sealant 5, when organic silicon potting adhesive 4 will cure completion, is potted in the upper surface 4 of organic silicon potting adhesive by face；Most
After cover upper cover plate 2,201 surface of intermediate projections portion of upper cover plate 2 contacts and bonds epoxy pouring sealant 5,2 sealing strip of upper cover plate
The just corresponding first lead notch 8 of the second lead notch 9 on 202 coordinates the fixation for completing elastic wire set 7.
In above-mentioned technical proposal, organic silicon potting adhesive 4 directly contacts circuit board 3, and the heat on circuit board 3 can be by having
Machine silicon casting glue 4 is transferred to main casing 1 and distributes, and 5 cementability of epoxy pouring sealant is good, intensity is high, can be with 1 inner wall of main casing and defeated
Go out the sealing of lead close adhesion, can effectively prevent water from entering circuit board；Since elastic wire set 7 is cylindrical structure and round platform
The molding rubber material of body structural integrity is made, and drives elastic wire set 7 to be displaced outwardly when conducting wire is subject to external pull,
The round estrade structure 702 of elastic wire set 7 is acted on extruding wire guide inner wall by external broach and shunk at this time, and conducting wire is further pressed
Fasten, simultaneously because elastic wire set 7 round estrade structure 702 outside diameter it is increasing and mechanical prevent elastic wire set to
Outer movement, effectively prevents conducting wire from significantly being pulled and causes casting glue to be disengaged with conducting wire.
201 surface bonding of lug boss of the upper cover plate 2 connects the epoxy pouring sealant 5, that is, realizes main casing 1 and upper cover
The bonding of plate 2 is integral, and void space is smaller between upper cover plate and main casing, is avoided a large amount of water and is filled into epoxy in main casing
Between sealing 5 and upper cover plate 2, the overall tightness and water proofing property of circuit board further enhancing.
The side wall of the main casing 1 is equipped with the first threaded hole 10, and the sealing strip 202 of the upper cover plate 2, which is equipped with, to be corresponded to
With the second threaded hole 11 of the first threaded hole 10, the first threaded hole 10 and 11 quantity of the second threaded hole are 4 in the present embodiment, energy
Enough firmly connection main casing 1 and upper cover plate 2.
The interference fit of through hole 703 on the output lead 6 and the elastic wire set 7 connects so that output lead 6 with
Frictional force increase between through hole 703, output lead 6 are difficult to be twitched, and the output lead 6 avoided in main casing 1 is pulled
And tear organic silicon potting adhesive 4 and epoxy pouring sealant 5.
The embodiment of the utility model is described in detail above, but the content is only the preferable of the utility model
Embodiment, it is impossible to be construed as limiting the scope of the utility model, all impartial changes made according to the scope of the utility model
Change and improvement etc., should all still belong within the utility model covering scope.
Claims (4)
1. a kind of switching power circuit plate sealing structure, it is characterised in that including circuit board, output lead, main casing, organosilicon
Casting glue, epoxy pouring sealant and upper cover plate, the circuit board are installed in the main casing, and the organic silicon potting adhesive is potted in
The upper and lower surface of the circuit board, the epoxy pouring sealant is potted in the upper surface of the organic silicon potting adhesive, described
The side wall of main casing is equipped with the first lead notch, and the upper cover plate includes sealing strip and middle lug boss, the sealing strip
The second lead notch is equipped with, the first lead notch and the second lead notch, which coordinate, is inlaid with elastic wire set, the bullet
Property wire sleeve to be set on the output lead, the elastic wire set by cylindrical structure and round estrade structural integrity into
Type, the elastic wire are put on equipped with through hole.
A kind of 2. switching power circuit plate sealing structure according to claim 1, it is characterised in that the upper cover plate it is convex
Play portion's surface bonding and connect the epoxy pouring sealant.
A kind of 3. switching power circuit plate sealing structure according to claim 1, it is characterised in that the side of the main casing
Wall is equipped with the first threaded hole, and the sealing strip of the upper cover plate is equipped with corresponding the second threaded hole with the first threaded hole.
A kind of 4. switching power circuit plate sealing structure according to claim 1, it is characterised in that the output lead with
The upper through hole interference fit connection of elastic wire set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721306849.7U CN207284000U (en) | 2017-10-11 | 2017-10-11 | A kind of switching power circuit plate sealing structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721306849.7U CN207284000U (en) | 2017-10-11 | 2017-10-11 | A kind of switching power circuit plate sealing structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207284000U true CN207284000U (en) | 2018-04-27 |
Family
ID=61987797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721306849.7U Active CN207284000U (en) | 2017-10-11 | 2017-10-11 | A kind of switching power circuit plate sealing structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207284000U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429433A (en) * | 2018-05-18 | 2018-08-21 | 湖州旭源电气科技有限公司 | A kind of Switching Power Supply shatter-resistant shell |
| CN111954405A (en) * | 2019-05-17 | 2020-11-17 | 和硕联合科技股份有限公司 | Electronic device and its casing structure |
| CN112371939A (en) * | 2020-10-28 | 2021-02-19 | 西安建筑科技大学 | Power-off protection device of centrifugal casting machine |
| CN114340244A (en) * | 2020-09-29 | 2022-04-12 | Oppo广东移动通信有限公司 | Electronic device and assembling method thereof |
-
2017
- 2017-10-11 CN CN201721306849.7U patent/CN207284000U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429433A (en) * | 2018-05-18 | 2018-08-21 | 湖州旭源电气科技有限公司 | A kind of Switching Power Supply shatter-resistant shell |
| CN111954405A (en) * | 2019-05-17 | 2020-11-17 | 和硕联合科技股份有限公司 | Electronic device and its casing structure |
| CN114340244A (en) * | 2020-09-29 | 2022-04-12 | Oppo广东移动通信有限公司 | Electronic device and assembling method thereof |
| CN114340244B (en) * | 2020-09-29 | 2023-11-07 | Oppo广东移动通信有限公司 | Electronic equipment and methods of assembling the same |
| CN112371939A (en) * | 2020-10-28 | 2021-02-19 | 西安建筑科技大学 | Power-off protection device of centrifugal casting machine |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |