CN207198781U - Laptop heat-dissipation system - Google Patents
Laptop heat-dissipation system Download PDFInfo
- Publication number
- CN207198781U CN207198781U CN201721120250.4U CN201721120250U CN207198781U CN 207198781 U CN207198781 U CN 207198781U CN 201721120250 U CN201721120250 U CN 201721120250U CN 207198781 U CN207198781 U CN 207198781U
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- CN
- China
- Prior art keywords
- heat
- radiating
- air
- conducting
- out passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000009434 installation Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 4
- 239000002994 raw material Substances 0.000 abstract description 4
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 230000000295 complement effect Effects 0.000 abstract description 3
- 238000012546 transfer Methods 0.000 abstract description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of laptop heat-dissipation system, including：Radiating subassembly, the radiating subassembly include heat-conducting part, turning point and the radiating part of integrated molding, and the end of the heat-conducting part is brought into close contact on the inside of the upper surface of heat-conducting patch, the radiating part and is fixed on the periphery of radiator fan；The end of the heat-conducting part is provided with airscoop shroud, and the side of the radiating part is provided with exhaust outlet.The utility model radiating subassembly is designed using hollow structure, save raw material, reduce overall weight, pass through the conductive fluid in the heat conduction sap cavity in radiating subassembly, heat transfer efficiency can be greatly improved, by air-out passage, airscoop shroud can be utilized by the heat absorption on heat-conducting patch, and discharged by radiator fan, further strengthen radiating effect；Air-flow in air-out passage can form complementary cooling structure with the conductive fluid in heat conduction sap cavity, substantially increase radiating rate.
Description
Technical field
The utility model belongs to notebook computer radiating device technical field, and in particular to a kind of laptop heat-dissipation system.
Background technology
Notebook computer is also known as notes type, portable or kneetop computer, is a kind of small-sized, portable PC, generally
1-3 kilograms of weight.Its development trend is that volume is less and less, and weight is more and more lighter, and function is powerful all the more.Picture Netbook,
The net book being exactly commonly called as, the main distinction with PC are that its Portable belt is convenient, referred to as " PC ".For notebook computer,
Performance is with portable sex resistance, radiating as the factor of most critical, laptop heat-dissipation is always the bottle in notebook core technology
Neck.Sometimes notebook computer can baffled marvellous deadlock, it is general that to be exactly that system temperature is too high cause.
The metallic copper of the pure entity structure of cooling system generally use in existing notebook is radiated, and not only increases pen
Remember this weight, with the gradual enhancing of notebook function, the metallic copper heat conduction of single structure, thermal diffusivity can not increasingly meet
The demand of laptop heat-dissipation.
Utility model content
The purpose of this utility model is to provide a kind of laptop heat-dissipation system, to solve what is proposed in above-mentioned background technology
Problem.
To achieve the above object, the utility model provides following technical scheme：A kind of laptop heat-dissipation system, including：
Radiating subassembly, the radiating subassembly include heat-conducting part, turning point and the radiating part of integrated molding, the heat-conducting part
End be brought into close contact in the upper surface of heat-conducting patch, be simultaneously fixed on the inside of the radiating part on the periphery of radiator fan；
The end of the heat-conducting part is provided with airscoop shroud, and the side of the radiating part is provided with exhaust outlet, the radiating subassembly
Inside be hollow structure, be provided with dividing plate in the hollow structure, the side of the dividing plate is heat conduction sap cavity, the dividing plate it is another
Side is air-out passage.
Preferably, one end of the air-out passage connects with airscoop shroud, towards scattered on the air-out passage in the radiating part
The side of Hot-air fan is provided with air outlet.
Preferably, the both sides of the radiator fan are provided with installation foot.
Technique effect of the present utility model and advantage：
1st, radiating subassembly is designed using hollow structure, saves raw material, is reduced overall weight, is passed through the heat conduction in radiating subassembly
Conductive fluid in sap cavity, heat transfer efficiency can be greatly improved, by air-out passage, airscoop shroud can be utilized by heat-conducting patch
Heat absorption, and discharged by radiator fan, further strengthen radiating effect；
2nd, the air-flow in air-out passage can form complementary cooling structure, i.e. air-out passage with the conductive fluid in heat conduction sap cavity
In heat when being more than heat conduction sap cavity, air-out passage can be cooled by the conductive fluid of conductive fluid intracavitary, works as conductive fluid
When heat in chamber is more than air-out passage, heat conduction sap cavity can be cooled by the air-flow in air-out passage, greatly improved
Radiating rate.
Brief description of the drawings
Fig. 1 is overlooking the structure diagram of the present utility model；
Fig. 2 is A-A cross-sectional views in Fig. 1 of the present utility model.
In figure：1 heat-conducting patch, 2 heat-conducting parts, 3 turning points, 4 radiating parts, 5 radiator fans, 6 installation feet, 7 exhaust outlets, 8 are entered
Gas hood, 9 radiating subassemblies, 10 heat conduction sap cavities, 11 air-out passages, 12 air outlets, 13 dividing plates.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describing, it is clear that described embodiment is only the utility model part of the embodiment, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment obtained, belong to the scope of the utility model protection.
The utility model provides as shown in Figure 1-2, a kind of laptop heat-dissipation system, including：
Radiating subassembly 9, the radiating subassembly 9 includes heat-conducting part 2, turning point 3 and the radiating part 4 of integrated molding, described
The end of heat-conducting part 2 is brought into close contact to be made in the upper surface of heat-conducting patch 1, radiating subassembly 9 using heat-conducting metal copper, thermal conductivity
It is good, the heat-conducting part 2 of turning point 3 is formed by torsion wherein between heat-conducting part 2 and radiating part 4 and is horizontally disposed with, notebook can be saved
Interior uses space, and radiating part 4 is annular in shape, and vertical with heat-conducting part 2, and the inner side of radiating part 4 is simultaneously fixed on radiator fan 5
On periphery, heat can be blown out using radiator fan 5, improve radiating rate；The inside of the radiating subassembly 9 is hollow knot
Structure, the overall weight of radiating subassembly 9 can be substantially reduced, save raw material, dividing plate 13, the dividing plate are provided with the hollow structure
13 side is heat conduction sap cavity 10, and heat conduction sap cavity 10 is sealing structure, is marked with conductive fluid inside it, can greatly improve heat conduction effect
Rate；Wherein the shape of heat-conducting part 2 can be adjusted according to computer-internal structure, but avoid damage to heat conduction sap cavity 10
The patency of sealing and air-out passage 11.
The opposite side of the dividing plate 13 is air-out passage 11, and the end of the heat-conducting part 2 is provided with airscoop shroud 8, described to dissipate
The side in hot portion 4 is provided with exhaust outlet 7, and one end of the air-out passage 11 connects with airscoop shroud 8, the air-out in the radiating part 4
Air outlet 12 is provided with towards the side of radiator fan 5 on passage 11, can be sucked when radiator fan 5 rotates by airscoop shroud 8
Heat on heat-conducting patch 1, accelerate radiating rate on heat-conducting patch 1, heat at exhaust outlet 7 by radiator fan 5 through discharging, together
When, air-flow in air-out passage 11 by when, complementary cooling structure can be formed with heat conduction sap cavity 10, i.e., in air-out passage 11
When heat is more than heat conduction sap cavity 10, air-out passage 11 can be cooled by the conductive fluid in heat conduction sap cavity 10, work as heat conduction
When heat in sap cavity 10 is more than air-out passage 11, heat conduction sap cavity 10 can be dropped by the air-flow in air-out passage 11
Temperature, substantially increase radiating rate.
The both sides of the radiator fan 5 are provided with installation foot 6, in that context it may be convenient to are installed radiator fan 5.
Specifically, in use, heat-conducting part 2 is suitably bent, and the fitting of heat-conducting patch 1 is fixed in computer needs to radiate
Position, radiating subassembly 9 using hollow structure design, save raw material, reduce overall weight, pass through the heat conduction in radiating subassembly 9
Conductive fluid in sap cavity 10, heat transfer efficiency can be greatly improved, by air-out passage 11, can be pasted heat conduction using airscoop shroud 8
Heat absorption on piece 1, and discharged by radiator fan 5, further strengthen radiating effect.
Finally it should be noted that：Preferred embodiment of the present utility model is the foregoing is only, is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Progress equivalent substitution, all within the spirit and principles of the utility model, any modification, equivalent substitution and improvements made etc.,
It should be included within the scope of protection of the utility model.
Claims (3)
- A kind of 1. laptop heat-dissipation system, it is characterised in that including：Radiating subassembly (9), the radiating subassembly (9) include heat-conducting part (2), turning point (3) and the radiating part of integrated molding (4), the end of the heat-conducting part (2) is brought into close contact on the inside of the upper surface of heat-conducting patch (1), the radiating part (4) and fixed On the periphery of radiator fan (5)；The end of the heat-conducting part (2) is provided with airscoop shroud (8), and the side of the radiating part (4) is provided with exhaust outlet (7), described The inside of radiating subassembly (9) is hollow structure, and dividing plate (13) is provided with the hollow structure, and the side of the dividing plate (13) is to lead Hydrothermal solution chamber (10), the opposite side of the dividing plate (13) is air-out passage (11).
- A kind of 2. laptop heat-dissipation system according to claim 1, it is characterised in that：One end of the air-out passage (11) Connected with airscoop shroud (8), air-out is provided with towards the side of radiator fan (5) on the air-out passage (11) in the radiating part (4) Mouth (12).
- A kind of 3. laptop heat-dissipation system according to claim 1, it is characterised in that：The both sides of the radiator fan (5) Provided with installation foot (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721120250.4U CN207198781U (en) | 2017-09-04 | 2017-09-04 | Laptop heat-dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721120250.4U CN207198781U (en) | 2017-09-04 | 2017-09-04 | Laptop heat-dissipation system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207198781U true CN207198781U (en) | 2018-04-06 |
Family
ID=61790700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721120250.4U Expired - Fee Related CN207198781U (en) | 2017-09-04 | 2017-09-04 | Laptop heat-dissipation system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207198781U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110502085A (en) * | 2019-08-23 | 2019-11-26 | 陕西中医药大学 | A high-performance computer CPU radiator |
-
2017
- 2017-09-04 CN CN201721120250.4U patent/CN207198781U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110502085A (en) * | 2019-08-23 | 2019-11-26 | 陕西中医药大学 | A high-performance computer CPU radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180406 Termination date: 20180904 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |