CN207165608U - A kind of LED encapsulating structure on automobile - Google Patents

Abstract

The utility model discloses a kind of LED encapsulating structure on automobile, including shell, first substrate and second substrate, first substrate is arranged on outer casing bottom, first substrate is provided with two inverted T shaped support columns, support column includes base and the connecting rod being arranged on base, second substrate is provided with two mounting holes, connecting rod is passed from the mounting hole of second substrate so that second substrate is arranged on the base of support base, first substrate, endless all standing first substrate is respectively provided with second substrate, the light-emitting area of second substrate, light-emitting area is provided with multiple LED chips, fluorescent glue is coated with LED chip.LED encapsulating structure of the present utility model improves the luminosity of LED while LED package dimension is reduced；That reduces substrate uses space；The utility model can improve the stability of LED package and the radiating effect of LED.

Description

A kind of LED encapsulating structure on automobile

Technical field

It the utility model is related to illuminating lamp technical field, particularly a kind of LED encapsulating structure on automobile.

Background technology

LED (Light Emitting Diode) is with its small volume, long lifespan, energy consumption are low, vibration resistance, start the time soon with And the advantage such as environmental protection, have become a new generation automotive luminaire technology first choice.Recently as semi-conducting material and packaging technology Progress, the luminous flux of high-power White LED obtained further raising, and applications of the LED in automotive lighting field is also gradually expanded Greatly, by high-mount stop lamp to rear combination lamp, then automobile front till now, which reflects a kind of inevitable trend：LED is in vapour Traditional incandescent lamp and halogen tungsten lamp will gradually be substituted in car lamp applications, turn into " forth generation " light source of automotive lighting.

There is the advantage of many uniquenesses as the light source of car headlamp using LED, except almost without startup time and low electricity What pressure zone came

Outside electrical safety, long lifespan, particularly it forms a light fixture by several LED, makes the profile of light fixture have pole Big is plastic

Property, it can be fused in the Hyundai Motor design concept of renewal, to create new vehicle, meet user individual Demand provides superior technique basis and material guarantee.LED is with its small volume, long lifespan, energy consumption are low, vibration resistance, starts the time The advantage such as fast has become the first choice of young mobile light source technology.

Light emitting diode (Light Emitting Diode, LED) is a kind of can to convert electrical energy into consolidating for visible ray The semiconductor devices of state, it is widely used in display screen, traffic signal, display light source, lamps for vehicle, LED backlights, photograph Mingguang City Yuan Deng fields.In recent years, as the continuous breakthrough of great power LED technology, application field constantly expand, largely entered Part dedicated illumination field, automotive lighting are one of main application fields；But high-brightness LED is mainly used in vapour at present Tail-light, signal lamp and room light, are not commonly used for car headlamp.One of main cause is exactly vehicle front lighting beacon light Accurate harsh and use environment is severe, and the packing forms of great power LED all can not in optical property or hot property at present Meet the Special use demand of car headlamp.LED encapsulation at present is increasingly intended to minimize, but support plate space is limited, When encapsulating more chips or chip, the size of support plate will become big, and whole LED element size also can become big therewith.

The content of the invention

Technical problem to be solved in the utility model is overcome the deficiencies in the prior art and provides and a kind of be used for automobile LED encapsulating structure, LED encapsulating structure of the present utility model improves LED while LED package dimension is reduced The luminosity of lamp.

The utility model uses following technical scheme to solve above-mentioned technical problem：

According to the utility model proposes a kind of LED encapsulating structure on automobile, including shell, first substrate and Second substrate, first substrate are arranged on outer casing bottom, and first substrate is provided with two inverted T shaped support columns, and support column includes base With the connecting rod being arranged on base, second substrate is provided with two mounting holes, and connecting rod passes from the mounting hole of second substrate So that second substrate is arranged on the base of support base, endless all standing first is respectively provided with first substrate, second substrate The light-emitting area of substrate, second substrate, light-emitting area are provided with multiple LED chips, fluorescent glue are coated with LED chip.

As a kind of further prioritization scheme of LED encapsulating structure on automobile described in the utility model, support The diameter of the base of post is more than the diameter of second substrate upper installing hole.

As a kind of further prioritization scheme of LED encapsulating structure on automobile described in the utility model, support Post is welded on first substrate.

As a kind of further prioritization scheme of LED encapsulating structure on automobile described in the utility model, first Substrate is provided with heat dissipation element, and heat dissipation element is connected with the LED chip on first substrate.

As a kind of further prioritization scheme of LED encapsulating structure on automobile described in the utility model, second Substrate is provided with heat dissipation element, and heat dissipation element is connected with the LED chip on first substrate.

The utility model compared with prior art, has following technique effect using above technical scheme：

（1）LED encapsulating structure of the present utility model improves LED lamps while LED package dimension is reduced Luminosity；That reduces substrate uses space；

（2）The utility model can improve the stability of LED package and the radiating effect of LED lamps.

Brief description of the drawings

Fig. 1 is structural representation of the present utility model.

Reference in figure is construed to：1- shells, 2- first substrates, 3- second substrates, the inverted T shaped support columns of 4-, 5- bottoms Seat, 6- connecting rods, 7-LED chips, 8- fluorescent glues.

Embodiment

The technical solution of the utility model is described in further detail below in conjunction with the accompanying drawings：

As shown in figure 1, a kind of LED encapsulating structure on automobile, including shell 1, first substrate 2 and second substrate 3, first substrate is arranged on outer casing bottom, and first substrate is provided with two inverted T shaped support columns 4, and support column includes base 5 and set Connecting rod 6 on base, second substrate are provided with two mounting holes, and connecting rod is passed from the mounting hole of second substrate so that Two substrates are arranged on the base of support base, and endless all standing first substrate, the are respectively provided with first substrate, second substrate The light-emitting area of two substrates, light-emitting area are provided with multiple LED chips 7, fluorescent glue 8 are coated with LED chip.

The diameter of the base of support column is more than the diameter of second substrate upper installing hole.Support column is welded to first substrate On.

First substrate is provided with heat dissipation element, and heat dissipation element is connected with the LED chip on first substrate.Set on second substrate There is heat dissipation element, heat dissipation element is connected with the LED chip on first substrate.

The base of support column can provide enough Area of bearing for second substrate, enable second substrate and first substrate It is securely fixed in encapsulating structure of the present utility model, the diameter of the base of support column can be than the mounting hole of second substrate The big 0.2mm of diameter.The setting of the base of support column, which can allow, a certain distance between first substrate and second substrate, this away from From setting it is contemplated that the thickness of first substrate upper element and the camber etc. of bonding line, need at least according to practical experience Reserve 0.6 mm.

The utility model uses above technical scheme compared with prior art in summary, has following technique effect：（1） LED encapsulating structure of the present utility model improves the luminosity of LED lamps while LED package dimension is reduced；Subtract Few substrate uses space；（2）The utility model can improve the stability of LED package and the radiating effect of LED lamps.

Above content is to combine specific preferred embodiment further detailed description of the utility model, it is impossible to Assert that specific implementation of the present utility model is confined to these explanations.For the ordinary skill of the utility model art For personnel, without departing from the concept of the premise utility, some simple deductions can also be made or substituted, should all be regarded To belong to the scope of protection of the utility model.

Claims (5)

1. A kind of 1. LED encapsulating structure on automobile, it is characterised in that including shell, first substrate and second substrate, the One substrate is arranged on outer casing bottom, and first substrate is provided with two inverted T shaped support columns, and support column includes base and is arranged on base On connecting rod, second substrate is provided with two mounting holes, and connecting rod is passed from the mounting hole of second substrate so that second substrate It is arranged on the base of support base, endless all standing first substrate, second substrate is respectively provided with first substrate, second substrate Light-emitting area, light-emitting area is provided with multiple LED chips, fluorescent glue is coated with LED chip.
2. A kind of 2. LED encapsulating structure on automobile according to claim 1, it is characterised in that the bottom of support column The diameter of seat is more than the diameter of second substrate upper installing hole.
3. 3. a kind of LED encapsulating structure on automobile according to claim 1, it is characterised in that support column is weldering Connect on the first substrate.
4. 4. a kind of LED encapsulating structure on automobile according to claim 1, it is characterised in that on first substrate Provided with heat dissipation element, heat dissipation element is connected with the LED chip on first substrate.
5. 5. a kind of LED encapsulating structure on automobile according to claim 1, it is characterised in that on second substrate Provided with heat dissipation element, heat dissipation element is connected with the LED chip on first substrate.