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CN206961808U - 硅片清洗工装 - Google Patents

硅片清洗工装 Download PDF

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Publication number
CN206961808U
CN206961808U CN201720856685.9U CN201720856685U CN206961808U CN 206961808 U CN206961808 U CN 206961808U CN 201720856685 U CN201720856685 U CN 201720856685U CN 206961808 U CN206961808 U CN 206961808U
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silicon chip
fix bar
chip according
cleaning frock
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龙永灯
陈贤刚
杨苗
郁操
张津燕
徐希翔
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Deyun Chuangxin Beijing Technology Co ltd
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Beijing Juntai Innovation Technology Co Ltd
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Priority to US16/033,349 priority patent/US20190019916A1/en
Priority to PCT/CN2018/095408 priority patent/WO2019011291A1/zh
Priority to EP18183306.2A priority patent/EP3428960A3/en
Priority to KR2020180003230U priority patent/KR20190000208U/ko
Priority to JP2018002676U priority patent/JP3218170U/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/137—Batch treatment of the devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G1/00—Storing articles, individually or in orderly arrangement, in warehouses or magazines
    • B65G1/02—Storage devices
    • B65G1/04—Storage devices mechanical
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Packaging Frangible Articles (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

本实用新型公开了一种硅片清洗工装，其中，包括：一对固定板；上部固定杆，所述上部固定杆的两端分别与一个固定板固定连接；所述上部固定杆上设置有多个用于对硅片的第一端进行限位的限位柱；所述限位柱包括圆柱状的主体和半球状的端头；下部固定杆，所述下部固定杆的两端分别与一个固定板固定连接。本实用新型提供的硅片的清洗工装通过设置限位柱的形状为主体是圆柱状，且包括半球状的端头，由此避免了对硅片的划伤。与现有技术相比，提高了产品良率。

Description

硅片清洗工装
技术领域
本实用新型涉及太阳能电池制造过程中的工装，尤其涉及一种硅片的清洗工装。
背景技术
以硅为基底所生产的太阳能电池(如常规电池、HJT电池、IBC电池、PERL电池、HBC和PERC电池)，其结构都含有晶体硅。硅片钝化前，硅片清洗、制绒、干燥制程中的硅片产品良率是保障电池整个生产线成本降低、成品良率的基础；硅片表面的清洁度的提高，也是保障电池片效率提高的必备前提。因此过程中，承载硅片的工具的设计和选用尤为重要。
现有技术中，量产晶硅生产线上用制绒、清洗的承片花篮上设置有硅片限位杆，该硅片限位杆处多为齿状，在硅片的取放时，硅片表面易被齿状的尖端划伤，从而影响后续制程，造成低效和外观不良。
现有技术中的承片花篮上还设置有支撑杆，支撑杆若设计不当，易造成硅片制绒、硅片清洗、硅片干燥的死区，如硅片边缘部分出现制绒不良、清洗不良或留下水迹的现象。
实用新型内容
本实用新型的目的是提供一种硅片的清洗工装，以解决现有技术中的问题，避免硅片被划伤，提高产品良率。
本实用新型提供了一种硅片的清洗工装，其中，包括：
一对固定板；
上部固定杆，所述上部固定杆的两端分别与一个固定板固定连接；所述上部固定杆上设置有多个限位柱；所述限位柱包括圆柱状的主体和半球状的端头；
下部固定杆，所述下部固定杆的两端分别与一个固定板固定连接。
如上所述的硅片的清洗工装，其中，优选的是，所述下部固定杆上设置有多个用于对硅片的第二端进行限位的限位槽。
如上所述的硅片的清洗工装，其中，优选的是，所述下部固定杆包括横板和竖直固定在所述横板上的一对卡板，所述卡板之间形成所述限位槽。
如上所述的硅片的清洗工装，其中，优选的是，所述下部固定杆包括板体和多个限位凸起，多个所述限位凸起设置在所述板体上，相邻限位凸起之间形成所述限位槽。
如上所述的硅片的清洗工装，其中，优选的是，所述限位凸起为半圆柱体状。
如上所述的硅片的清洗工装，其中，优选的是，所述板体上对应每个所述限位槽的位置均设置有溢流孔。
如上所述的硅片的清洗工装，其中，优选的是，所述上部固定杆上设置有1-300个所述限位柱。
如上所述的硅片的清洗工装，其中，优选的是，所述固定板上设置有对流孔。
如上所述的硅片的清洗工装，其中，优选的是，所述固定板上设置有工具卡槽。
本实用新型提供的硅片的清洗工装通过设置限位柱的形状为主体是圆柱状，且包括半球状的端头，由此避免了对硅片的划伤。与现有技术相比，提高了产品良率。
附图说明
图1为本实用新型实施例提供的硅片的清洗工装的结构俯视图；
图2为图1中的A处放大图。
附图标记说明：
1-固定板 11-工具卡槽 2-上部固定杆 21-限位柱 3-下部固定杆 31-限位槽32-限位凸起 33-溢流孔 4-对流孔
具体实施方式
下面详细描述本实用新型的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本实用新型，而不能解释为对本实用新型的限制。
图1为本实用新型实施例提供的硅片的清洗工装的结构俯视图，图2为图1中的A处放大图。
如图1所示，本实用新型实施例提供了一种硅片的清洗工装，包括一对固定板1，用作支撑结构，还包括上部固定杆2和下部固定杆3。上部固定杆2和下部固定杆3均可以是成对的设置，其形状均可以是圆柱体状。
同时参照图1和图2，其中，每个上部固定杆2的两端分别与一个固定板1固定连接；每个上部固定杆2上设置有多个用于对硅片的第一端进行限位的限位柱21；限位柱21包括圆柱状的主体和半球状的端头。每个下部固定杆3的两端分别与一个固定板1固定连接。限位柱21的数量是多个，本实施例中，根据清洗工装的整体尺寸，可以设置限位柱21的数量是1-300个。
在对硅片进行清洗时，硅片的第二端放置在下部固定杆3上，优选的是，每个下部固定杆3上均设置有多个用于对硅片的第二端进行限位的限位槽31，如此，可将硅片的第二端放置在限位槽31中，再将硅片的第一端放置在相邻的限位柱21之间。由于限位柱21的形状为主体是圆柱状，且包括半球状的端头，由此避免了对硅片的划伤。与现有技术相比，提高了产品良率。
限位槽31的结构有多种形式，一种实现方式是，下部固定杆3包括横板和竖直固定在横板上的一对卡板，卡板之间形成上述限位槽。参照图2，作为一种优选的实现方式，可以通过设置多个限位凸起32来形成上述限位槽31，具体地，限位槽31是在圆柱体状的下部固定杆3上进行开槽，形成多个限位凸起32和限位槽31。限位槽31的长度小于或等于圆柱体的直径，限位槽31的深度小于或等于圆柱体的半径，最低为5mm。下部固定杆3包括板体和多个限位凸起32，多个限位凸起32设置在板体上，相邻限位凸起32之间形成上述限位槽31。
为了进一步避免硅片被划伤，优选地设置上述限位凸起32为半圆柱状，可以理解的是，限位凸起32也可以是其他形状，只要在其上设置倒圆角，即可以避免硅片的划伤。
在上述实施例的基础上，本实用新型实施例提供的硅片的清洗工装中，板体上对应每个限位槽31的位置均设置有溢流孔33。溢流孔33的设置能够增强液体、气体的流动，减少硅片在清洗、制绒、干燥出现死区，而导致硅片洁净度不良的现象。同时工艺步骤完成后，提取工装可以避免限位槽积液，加速溶液的排除。而且，当硅片随着该清洗工装放入清洗溶液中时，溶液通过溢流孔33产生气泡，使得溶液中空气流通到放置硅片的限位槽31处，硅片在限位槽31中左右摆动，与现有技术中硅片为静止状态相比，避免了产生清洗工装(或清洗花篮)痕迹的现象。
继续参照图1，进一步地，固定板1上设置有对流孔4，以加强液体、气体的流动，提高溶液、气体的均匀性，有利于提高清洗、制绒、干燥效果。
进一步地，固定板1上设置有工具卡槽11，该工具卡槽11设置在固定板1的上端，以方便提取该清洗工装。
以上依据图式所示的实施例详细说明了本实用新型的构造、特征及作用效果，以上所述仅为本实用新型的较佳实施例，但本实用新型不以图面所示限定实施范围，凡是依照本实用新型的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本实用新型的保护范围内。

Claims (9)

1.一种硅片的清洗工装，其特征在于，包括：
一对固定板；
上部固定杆，所述上部固定杆的两端分别与一个固定板固定连接；所述上部固定杆上设置有多个限位柱；所述限位柱包括圆柱状的主体和半球状的端头；
下部固定杆，所述下部固定杆的两端分别与一个固定板固定连接。
2.根据权利要求1所述的硅片的清洗工装，其特征在于，所述下部固定杆上设置有多个限位槽。
3.根据权利要求2所述的硅片的清洗工装，其特征在于，所述下部固定杆包括横板和竖直固定在所述横板上的一对卡板，所述卡板之间形成所述限位槽。
4.根据权利要求2所述的硅片的清洗工装，其特征在于，所述下部固定杆包括板体和多个限位凸起，多个所述限位凸起设置在所述板体上，相邻限位凸起之间形成所述限位槽。
5.根据权利要求4所述的硅片的清洗工装，其特征在于，所述限位凸起为半圆柱体状。
6.根据权利要求4所述的硅片的清洗工装，其特征在于，所述板体上对应每个所述限位槽的位置均设置有溢流孔。
7.根据权利要求1-6任一项所述的硅片的清洗工装，其特征在于，所述上部固定杆上设置有1-300个所述限位柱。
8.根据权利要求1-6任一项所述的硅片的清洗工装，其特征在于，所述固定板上设置有对流孔。
9.根据权利要求1-6任一项所述的硅片的清洗工装，其特征在于，所述固定板上设置有工具卡槽。
CN201720856685.9U 2017-07-14 2017-07-14 硅片清洗工装 Expired - Fee Related CN206961808U (zh)

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Application Number Priority Date Filing Date Title
CN201720856685.9U CN206961808U (zh) 2017-07-14 2017-07-14 硅片清洗工装
US16/033,349 US20190019916A1 (en) 2017-07-14 2018-07-12 Wafer supporting apparatus
PCT/CN2018/095408 WO2019011291A1 (zh) 2017-07-14 2018-07-12 硅片的承载装置
EP18183306.2A EP3428960A3 (en) 2017-07-14 2018-07-13 Wafer supporting apparatus
KR2020180003230U KR20190000208U (ko) 2017-07-14 2018-07-13 실리콘 웨이퍼 탑재장치
JP2018002676U JP3218170U (ja) 2017-07-14 2018-07-13 シリコンウエハーの載置装置

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CN108899293A (zh) * 2018-07-06 2018-11-27 天长市百盛半导体科技有限公司 一种防清洁死角的太阳能电池晶体硅清洗装置
WO2019011291A1 (zh) * 2017-07-14 2019-01-17 君泰创新（北京）科技有限公司 硅片的承载装置
CN109768007A (zh) * 2019-01-14 2019-05-17 江西展宇新能源股份有限公司 一种放置硅片的花篮装置
CN110034056A (zh) * 2019-05-16 2019-07-19 通威太阳能（安徽）有限公司 一种防止硅片粘连的慢提拉槽体结构
CN111933559A (zh) * 2020-08-28 2020-11-13 江苏润阳悦达光伏科技有限公司 一种减少硅片接触印记的湿法花篮
CN113182244A (zh) * 2021-03-29 2021-07-30 江苏亚电科技有限公司 光伏硅片清洗方法
CN113257725A (zh) * 2021-03-29 2021-08-13 无锡亚电智能装备有限公司 一种具有清洗功能的半导体晶圆盒
CN113257658A (zh) * 2021-03-29 2021-08-13 无锡亚电智能装备有限公司 一种半导体晶圆晶清洗方法
CN113257950A (zh) * 2021-03-29 2021-08-13 江苏亚电科技有限公司 一种带有清洗功能的光伏硅片的运输篮
CN114721231A (zh) * 2022-04-17 2022-07-08 江苏晟驰微电子有限公司 一种用于光刻版清洗的工装夹具

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CN113182244A (zh) * 2021-03-29 2021-07-30 江苏亚电科技有限公司 光伏硅片清洗方法
CN113257658B (zh) * 2021-03-29 2024-01-30 无锡亚电智能装备有限公司 一种半导体晶圆清洗方法
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