CN206505945U - A new type of LED light - Google Patents
A new type of LED light Download PDFInfo
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- CN206505945U CN206505945U CN201720091513.7U CN201720091513U CN206505945U CN 206505945 U CN206505945 U CN 206505945U CN 201720091513 U CN201720091513 U CN 201720091513U CN 206505945 U CN206505945 U CN 206505945U
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- 230000001681 protective effect Effects 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 26
- 239000003292 glue Substances 0.000 claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 5
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
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- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- TXKMVPPZCYKFAC-UHFFFAOYSA-N disulfur monoxide Inorganic materials O=S=S TXKMVPPZCYKFAC-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
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Abstract
本实用新型提供一种新型LED灯,包括LED发光芯片和导热封装件,所述导热封装件上设有封装腔,所述LED发光芯片设于所述封装腔内,所述LED发光芯片与导热封装件之间填充有导热透明且无荧光材料的封装胶,所述导热封装件上设有用于罩住LED发光芯片的导光件,所述导光件为荧光灯罩和/或防护灯罩,本实用新型将荧光材料从封装胶中取走,避免了LED发光芯片电光转换时所发出的热量被被封装胶上的荧光材料覆盖,从而提高了LED发光芯片的散热性能和使用寿命。
The utility model provides a novel LED lamp, comprising an LED light-emitting chip and a heat-conducting package, wherein the heat-conducting package is provided with a package cavity, the LED light-emitting chip is arranged in the package cavity, a heat-conducting transparent package glue without fluorescent material is filled between the LED light-emitting chip and the heat-conducting package, the heat-conducting package is provided with a light guide for covering the LED light-emitting chip, the light guide is a fluorescent lampshade and/or a protective lampshade, and the utility model removes the fluorescent material from the package glue, thereby avoiding that the heat generated by the LED light-emitting chip during electro-optical conversion is covered by the fluorescent material on the package glue, thereby improving the heat dissipation performance and service life of the LED light-emitting chip.
Description
【技术领域】【Technical field】
本实用新型涉及照明灯具领域,尤其是一种新型LED灯。The utility model relates to the field of lighting fixtures, in particular to a novel LED lamp.
【背景技术】【Background technique】
LED光源是一种基于P-N结电致发光原理制成的半导体发光器件,具有电光转换效率高,使用寿命长,环保节能,体积小等优点。其具有高效节能的优势,使其在各种照明领域得到应用并已取代传统照明光源,LED光源通常是由单色LED芯片在电场的激励下,能产生固有的光色或多种LED芯片混合发岀来的光颜色,如在LED芯片上涂覆特定的荧光粉封装胶会获得所需的光颜色,由于在LED芯片上涂覆特定荧光粉封装胶,来取得所需光色的封装方式简单,成本低,使其在LED照明行业得到广泛应用,如用氮化镓(GaN)来产生光,一般在电磁谱固定波段范围发射蓝光,在其LED芯片上面涂覆黄色YAG荧光粉封装胶或黄色TAG荧光粉封装胶以使蓝光激发获得白光,用来照明等用途,又如红光芯片、黄光芯片、黄绿光芯片、蓝光芯片、绿光芯片在原有波段范围发射,在其LED芯片上灌封透明封装胶或荧光粉封装胶,以使其发岀各自原有的光颜色,实际生产LED照明灯通常的方法是根据色温,照度等要求选择LED光源,而为了不让LED光源产生眩光和保护LED光源,通常在LED灯板上方加一灯罩,LED光源照射在灯罩上透过灯罩会使灯光更柔和,灯具防护更安全。LED light source is a semiconductor light-emitting device based on the principle of P-N junction electroluminescence. It has the advantages of high electro-optical conversion efficiency, long service life, environmental protection and energy saving, and small size. It has the advantages of high efficiency and energy saving, so it has been applied in various lighting fields and has replaced traditional lighting sources. LED light sources are usually composed of single-color LED chips under the excitation of an electric field, which can produce inherent light colors or a mixture of multiple LED chips. The color of light emitted, such as coating a specific phosphor encapsulant on the LED chip will obtain the required light color, because the LED chip is coated with a specific phosphor encapsulant to obtain the required light color packaging method Simple and low cost, it is widely used in the LED lighting industry. For example, gallium nitride (GaN) is used to generate light, which generally emits blue light in a fixed band of the electromagnetic spectrum, and yellow YAG phosphor packaging glue is coated on the LED chip. Or yellow TAG phosphor encapsulation glue to excite blue light to obtain white light for lighting and other purposes, such as red light chip, yellow light chip, yellow-green light chip, blue light chip, green light chip emitting in the original band range, on its LED chip Potting transparent encapsulant or phosphor encapsulant to make them emit their original light colors. The usual method of actual production of LED lighting is to select the LED light source according to the requirements of color temperature and illuminance, and in order not to let the LED light source produce glare And to protect the LED light source, a lampshade is usually added above the LED lamp board. The LED light source shines on the lampshade and passes through the lampshade to make the light softer and the protection of the lamps is safer.
晶元级LED封装技术(Wafer levelpackage,WLP)等被发明并被投入到工业生产中,该技术能有效提升封装质量及效率,降低封装成 本,但是,该技术对封装后的LED芯片的电光转换始终还存在温度影响,从而影响LED光源的寿命。Wafer level packaging technology (Wafer levelpackage, WLP) was invented and put into industrial production. This technology can effectively improve packaging quality and efficiency, and reduce packaging cost. There is always also a temperature influence, which affects the lifetime of the LED light source.
【实用新型内容】【Content of utility model】
本实用新型要解决的技术问题是提供散热好和寿命长的一种新型LED灯。The technical problem to be solved by the utility model is to provide a new type of LED lamp with good heat dissipation and long service life.
本实用新型的目的是这样实现的:The purpose of this utility model is achieved in that:
一种新型LED灯,包括LED发光芯片和导热封装件,所述导热封装件上设有封装腔,所述LED发光芯片设于所述封装腔内,所述LED发光芯片与导热封装件之间填充有导热透明且无荧光材料的封装胶,所述导热封装件上设有用于罩住LED发光芯片的导光件。A new type of LED lamp, comprising an LED light-emitting chip and a heat-conducting package, the heat-conducting package is provided with a package cavity, the LED light-emitting chip is arranged in the package cavity, and the gap between the LED light-emitting chip and the heat-conducting package is The heat-conducting package is filled with transparent heat-conducting and non-fluorescent material, and the heat-conducting package is provided with a light guide for covering the LED light-emitting chip.
将荧光材料从封装胶中取走,避免了LED发光芯片电光转换时所发出的热量被封装胶上的荧光材料覆盖,从而提高了LED发光芯片的散热性能和使用寿命。The fluorescent material is removed from the encapsulation glue, which prevents the heat emitted by the LED light-emitting chip from being covered by the fluorescent material on the encapsulation glue, thereby improving the heat dissipation performance and service life of the LED light-emitting chip.
如上所述的一种新型LED灯,所述导光件包括荧光灯罩,所述导热封装件底部设有第一支撑板,所述荧光灯罩设于所述第一支撑板上且将所述导热封装件罩于其内,荧光灯罩可进一步地对LED发光芯片发出的光进行折射和透射。In the above-mentioned novel LED lamp, the light guide includes a fluorescent lampshade, a first support plate is provided at the bottom of the heat-conducting package, and the fluorescent lampshade is arranged on the first support plate and conducts the heat conduction The package is covered inside, and the fluorescent lamp cover can further refract and transmit the light emitted by the LED light-emitting chip.
如上所述的一种新型LED灯,所述导光件包括添加有荧光材料的防护灯罩,所述导热封装件底部设有第二支撑板,所述第二支撑板底部固定设有灯座,所述防护灯罩设于所述灯座上且将所述导热封装件罩于其内,LED发光芯片发出的光辐射至防护灯罩上,激发荧光材料从而发出所需要的光色。In the above-mentioned novel LED lamp, the light guide includes a protective lampshade added with fluorescent material, the bottom of the heat-conducting package is provided with a second support plate, and the bottom of the second support plate is fixed with a lamp holder, The protective lampshade is arranged on the lamp holder and covers the heat-conducting package inside, the light emitted by the LED light-emitting chip radiates to the protective lampshade, and excites the fluorescent material to emit the required light color.
如上所述的一种新型LED灯,所述导光件还包括防护灯罩,所述第一支撑板底部设有第二支撑板,所述第二支撑板底部固定设有灯座,所述防护灯罩设于所述灯座上且将所述荧光灯罩罩于其内,防护灯罩对荧光灯罩折射和透射出来的光更进一步地进行折射和透射。In the above new type of LED lamp, the light guide also includes a protective lampshade, the bottom of the first support plate is provided with a second support plate, the bottom of the second support plate is fixed with a lamp holder, and the protection The lampshade is arranged on the lamp base and covers the fluorescent lampshade inside, and the protective lampshade further refracts and transmits the light refracted and transmitted by the fluorescent lampshade.
如上所述的一种新型LED灯,所述荧光灯罩和/或防护灯罩上添加有荧光材料,LED发光芯片所发出的光辐射至荧光灯罩和/或防护灯罩上时,激发其上的荧光材料,从而发出所需要的光色。A new type of LED lamp as described above, fluorescent material is added to the fluorescent lampshade and/or protective lampshade, when the light emitted by the LED light-emitting chip radiates onto the fluorescent lampshade and/or protective lampshade, the fluorescent material on it is excited , so as to emit the desired light color.
如上所述的一种新型LED灯,所述荧光灯罩包括盖体,所述盖体底部设有连接部,所述盖体包括设于所述盖体外表面的球形弧面部和设于所述盖体内表面的平面部和斜面部,所述荧光材料添加至所述平面部和斜面部上,LED发光芯片发出的光在平面部、斜面部和球形弧面部上发生折射透射,扩大了发光角度。According to a new type of LED lamp as described above, the fluorescent lampshade includes a cover body, the bottom of the cover body is provided with a connecting part, and the cover body includes a spherical arc surface provided on the outer surface of the cover body and a The fluorescent material is added to the planar part and inclined part of the surface of the body, and the light emitted by the LED light-emitting chip is refracted and transmitted on the planar part, inclined part and spherical arcuate part, expanding the light-emitting angle.
如上所述的一种新型LED灯,所述防护灯罩呈圆球型,LED发光芯片发出的光在呈圆球型的防护灯罩上发生折射透射,扩大了发光角度。In the above-mentioned novel LED lamp, the protective lampshade is spherical, and the light emitted by the LED light-emitting chip is refracted and transmitted on the spherical protective lampshade, thereby enlarging the luminous angle.
【附图说明】【Description of drawings】
下面结合附图对本实用新型的具体实施方式作进一步详细说明,其中:Below in conjunction with accompanying drawing, the specific embodiment of the present utility model is described in further detail, wherein:
图1为本实用新型第三实施例的剖视示意图;Fig. 1 is the schematic cross-sectional view of the third embodiment of the utility model;
图2为本实用新型第一实施例的剖视示意图;Fig. 2 is a schematic cross-sectional view of the first embodiment of the utility model;
图3为本实用新型第二实施例的剖视示意图;3 is a schematic cross-sectional view of a second embodiment of the present invention;
图4为本实用新型所述LED芯片和所述导热封装件装配的剖视示 意图;Fig. 4 is the sectional schematic diagram of LED chip described in the utility model and described heat-conducting package assembly;
图5为本实用新型所述荧光灯罩的剖视示意图;Fig. 5 is a schematic cross-sectional view of the fluorescent lampshade of the present invention;
图6为本实用新型所述防护灯罩的剖视示意图Fig. 6 is a schematic cross-sectional view of the protective lampshade described in the present invention
【具体实施方式】【detailed description】
本实用新型一种新型LED灯的第一实施例如图2所示,包括LED发光芯片1和导热封装件2,如图4所示,导热封装件2上设有封装腔21,LED发光芯片1设于封装腔21内,LED发光芯片1底部设有接线柱11,封装腔21上设有与接线柱11电接触连接的支承触点22,LED发光芯片1与导热封装件2之间填充有导热透明且无荧光材料的封装胶5,导热封装件2上设有用于罩住LED发光芯片1的导光件9,导光件9包括添加有荧光材料的荧光灯罩3,导热封装件2底部设有第一支撑板6,荧光灯罩3设于第一支撑板6上且将导热封装件2罩于其内,如图5所示,荧光灯罩3包括盖体31,盖体31底部设有连接部(32),盖体31包括设于盖体31外表面的球形弧面部311和设于盖体31内表面的平面部312和斜面部313,荧光材料添加至平面部312和斜面部313上。The first embodiment of a novel LED lamp of the present utility model is shown in FIG. Set in the package cavity 21, the bottom of the LED light-emitting chip 1 is provided with a terminal post 11, and the package cavity 21 is provided with a support contact 22 electrically connected to the terminal post 11, and the space between the LED light-emitting chip 1 and the heat-conducting package 2 is filled with Heat-conducting transparent encapsulant 5 without fluorescent material. The heat-conducting package 2 is provided with a light guide 9 for covering the LED light-emitting chip 1. The light guide 9 includes a fluorescent lamp cover 3 added with fluorescent material. The bottom of the heat-conducting package 2 is A first support plate 6 is provided, and the fluorescent lamp cover 3 is arranged on the first support plate 6 and covers the heat-conducting package 2 therein. As shown in FIG. 5 , the fluorescent lamp cover 3 includes a cover body 31, and Connecting portion (32), the cover body 31 includes a spherical arc surface portion 311 provided on the outer surface of the cover body 31 and a planar portion 312 and an inclined portion 313 arranged on the inner surface of the cover body 31, and the fluorescent material is added to the planar portion 312 and the inclined portion 313 superior.
本实用新型一种新型LED灯的第二实施例如图3所示,其与第一实施例的主要区别在于导光件9包括添加有荧光材料的防护灯罩4而不包括荧光灯罩3,且导热封装件2底部设有第二支撑板7,第二支撑板7底部固定设有灯座8,防护灯罩4设于灯座8上且将导热封装件2罩于其内,如图6所示,防护灯罩4呈圆球型。The second embodiment of a new type of LED lamp of the present utility model is shown in Figure 3. The main difference between it and the first embodiment is that the light guide member 9 includes a protective lampshade 4 added with a fluorescent material instead of a fluorescent lampshade 3, and conducts heat The bottom of the package 2 is provided with a second support plate 7, the bottom of the second support plate 7 is fixed with a lamp holder 8, and the protective lampshade 4 is arranged on the lamp holder 8 and covers the heat-conducting package 2 therein, as shown in FIG. 6 , the protective lampshade 4 is spherical.
本实用新型一种新型LED灯的第三实施例如图1所示,其与第一 实施例和第二实施例的主要区别在于导光件9同时包括荧光灯罩3和防护灯罩4,且第一支撑板6设在第二支撑板7上,防护灯罩4设于灯座8上且将荧光灯罩3罩于其内,荧光灯罩3和/或防护灯罩4上添加有荧光材料。The third embodiment of a new LED lamp of the present utility model is shown in Fig. 1, and its main difference from the first embodiment and the second embodiment is that the light guide 9 includes a fluorescent lampshade 3 and a protective lampshade 4 at the same time, and the first The support plate 6 is arranged on the second support plate 7 , the protective lampshade 4 is arranged on the lamp holder 8 and covers the fluorescent lampshade 3 therein, and fluorescent material is added on the fluorescent lampshade 3 and/or the protective lampshade 4 .
以上三种实施例中的荧光材料为硫化物、硫氧化物、氮化物、或氮氧化物的黄、绿或红光荧光粉。The fluorescent material in the above three embodiments is yellow, green or red fluorescent powder of sulfide, sulfur oxide, nitride, or nitrogen oxide.
以本实用新型第三实施例中荧光灯罩3和防护灯罩4上均添加有荧光材料的情况为例,本实用新型使用时,LED发光芯片1所发出的光通过在封装胶5上发生折射和透射而辐射至荧光灯罩3上,因为LED发光芯片1置于封装腔21内,所以此时的发光角度仅有180°,并且其光色没有发生改变,光辐射至荧光灯罩3上后激发荧光材料发光,此时光色发生改变,例如LED发光芯片1发出的是蓝光,而在荧光灯罩3上的荧光材料为黄色荧光粉,则透过荧光灯罩3进一步发出的光的光色为白光,而且,通过荧光灯罩3上的平面部312、斜面部313和球形弧面部311的进一步折射和透射,发光角度可大于180°,通过荧光灯罩3进一步发出的光随后又辐射至防护灯罩4上,从而激发防护灯罩4上的荧光材料,进一步地提高了光亮度,而且,由于防护灯罩4呈圆球型,光在防护灯罩4上再进一步折射和透射,而发光角度被进一步扩大,从而在不影响LED发光芯片1的散热和寿命的前提下,使得发光角度足够大,并且光亮度足够亮,而且,置换不同颜色荧光材料的荧光灯罩3和/或防护灯罩4可以使发出来的光的光色发生改变,从而得到预期的发光颜色。Taking the case where fluorescent material is added to both the fluorescent lampshade 3 and the protective lampshade 4 in the third embodiment of the present utility model as an example, when the utility model is used, the light emitted by the LED light-emitting chip 1 passes through the encapsulating glue 5 through refraction and It transmits and radiates onto the fluorescent lampshade 3, because the LED light-emitting chip 1 is placed in the packaging cavity 21, so the light-emitting angle at this time is only 180°, and its light color does not change, and the light irradiates onto the fluorescent lampshade 3 to excite fluorescence The material emits light, and the light color changes at this time. For example, what the LED light-emitting chip 1 emits is blue light, and the fluorescent material on the fluorescent lamp cover 3 is yellow phosphor powder, and the light color of the light emitted further through the fluorescent lamp cover 3 is white light, and , through the further refraction and transmission of the flat part 312, inclined part 313 and spherical arc part 311 on the fluorescent lamp cover 3, the luminous angle can be greater than 180°, and the light further emitted by the fluorescent lamp cover 3 is then radiated to the protective lamp cover 4, so that The fluorescent material on the protective lampshade 4 is excited to further improve the luminance. Moreover, because the protective lampshade 4 is spherical, the light is further refracted and transmitted on the protective lampshade 4, and the luminous angle is further expanded, thus without affecting Under the premise of the heat dissipation and life of the LED light-emitting chip 1, the luminous angle is large enough, and the luminance is bright enough, and the fluorescent lampshade 3 and/or the protective lampshade 4 of the replacement fluorescent material of different colors can make the light color of the light emitted changes to obtain the desired luminous color.
Claims (7)
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