CN206497882U - Nano metal substrate for ultra fine-line FPC and COF material - Google Patents
Nano metal substrate for ultra fine-line FPC and COF material Download PDFInfo
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- CN206497882U CN206497882U CN201720125606.7U CN201720125606U CN206497882U CN 206497882 U CN206497882 U CN 206497882U CN 201720125606 U CN201720125606 U CN 201720125606U CN 206497882 U CN206497882 U CN 206497882U
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 98
- 239000002184 metal Substances 0.000 title claims abstract description 98
- 239000000758 substrate Substances 0.000 title claims abstract description 37
- 239000000463 material Substances 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 97
- 239000004642 Polyimide Substances 0.000 claims abstract description 43
- 229920001721 polyimide Polymers 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 21
- 239000010949 copper Substances 0.000 claims abstract description 21
- 230000003746 surface roughness Effects 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000011889 copper foil Substances 0.000 claims description 75
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 49
- 229910052759 nickel Inorganic materials 0.000 claims description 25
- 229910052709 silver Inorganic materials 0.000 claims description 16
- 239000004332 silver Substances 0.000 claims description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 238000005275 alloying Methods 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 150000002815 nickel Chemical class 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 15
- 230000003628 erosive effect Effects 0.000 abstract description 4
- 238000005530 etching Methods 0.000 abstract description 4
- 238000011161 development Methods 0.000 abstract description 3
- 230000037427 ion transport Effects 0.000 abstract description 3
- 239000003153 chemical reaction reagent Substances 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 4
- 235000019592 roughness Nutrition 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
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- 230000008901 benefit Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000011143 downstream manufacturing Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
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- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of nano metal substrate for ultra fine-line FPC and COF material; including polyimide layer, the ultrathin nanometer metal level and protection film layer of the polyimide layer at least one side are formed at, the ultrathin nanometer metal level is between the polyimide layer and the protection film layer；The thickness of the polyimide layer is 5 50um；The thickness of the ultrathin nanometer metal level is 0.09 0.8um；The thickness of the protection film layer is 6 60um；The polyimide layer is polyimide layer of the surface roughness between 80 800nm；The ultrathin nanometer metal level is sputtered layer or electrodeposited coating.The utility model has splendid resistance to ion transport, dimensional stability, resistance to chemical reagents, heat resisting and adhesion；Suitable for laser processing, it is adaptable to processing blind hole by laser/micropore, and pin hole is not likely to produce, is adapted to fine rule road etching, is difficult lateral erosion；The utility model is designed using Nanometer Copper, meets the demand of substrate graph thinning development.
Description
Technical field
The utility model belongs to electric substrate technical field, more particularly to a kind of to be used for ultra fine-line FPC and COF material
Nano metal substrate.
Background technology
FPC (Flexible Printed Circuit), i.e. flexible printed circuit board, are commonly called as " soft board ", with it is light, thin,
Short, small the advantages of, it is widely adopted in the small-sized electronic products such as mobile phone, digital camera, digital camera, and COF (Chip
On Film, chip on film encapsulation) technology is to make encapsulation chip carrier by chip and flexible PCB electricity with flexible PCB
The technology that road is combined.As electronic product tends to microminaturization development, FPC or COF flexible PCBs are functionally required to more
Developing direction that is powerful and tending to high frequency, high density and graph thinning.
Flexibility coat copper plate is the baseplate material of FPC or COF processing, and the high density of flexibility coat copper plate, the performance of graph thinning
It is largely dependent on the processing technology of thin copper foil part.
Processing of the current substrate manufacturer to thin copper foil part mainly uses two class methods：One is sputtering method/copper-plating method, and two are
Carrier copper foil method.
Sputtering method/copper-plating method, using PI (polyimides) films as base material, alloy of the sputter containing chromium is used as intermediary on PI films
Layer, then sputter copper metal are crystal seed layer, and then electro-coppering thickens layers of copper.But general PI film surface roughnesses are in 10-20nm,
Adhesion is not good, it is necessary to be surface-treated to PI films with plasma-based or short wavelength ultraviolet, but the PI films after processing are to follow-up
Heat treatment requirements are high, and otherwise adhesion deterioration is peeled off；Further, since the surface of PI films has certain roughness, in very thin copper
Surface easily produces pin hole when paper tinsel is electroplated；And the thin copper foil that this method is made often results in etching in COF or FPC etch process
Not exclusively, circuit root residual minim obtains the problem of chromium metal can cause Ion transfer, and influences fine rule road COF or FPC
Quality.
And carrier copper foil method, although carrier layer protects copper foil not injured, pressure wound, but may be difficult to peel off when peeling off, and makes
Into processing difficulties, and the stress-retained copper foil that easily causes when peeling off is deformed and the change of size harmomegathus, in addition, extra thin copper foil price
It is expensive and be difficult to obtain, add extra thin copper foil processing and be difficult, so existing copper thickness is difficult to be less than less than 6 μm.
Utility model content
The utility model is mainly solving the technical problems that provide a kind of nanometer for ultra fine-line FPC and COF material
Metal substrate, with splendid resistance to ion transport, dimensional stability, resistance to chemical reagents, heat resisting and adhesion；It is applicable
In laser processing, it is adaptable to processing blind hole by laser/micropore, and pin hole is not likely to produce, is adapted to fine rule road etching, is difficult lateral erosion；This
Utility model is designed using Nanometer Copper, meets the demand of substrate graph thinning development.
In order to solve the above technical problems, the technical scheme that the utility model is used is：There is provided a kind of for superfine wire
The nano metal substrate of road FPC and COF material, including polyimide layer, it is formed at the super of the polyimide layer at least one side
Thin nano metal layer and protection film layer, the ultrathin nanometer metal level between the polyimide layer and the protection film layer it
Between；
The thickness of the polyimide layer is 5-50um；
The thickness of the ultrathin nanometer metal level is 0.09-0.8um；
The thickness of the protection film layer is 6-60um；
The polyimide layer is polyimide layer of the surface roughness between 80-800nm；
The ultrathin nanometer metal level is sputtered layer or electrodeposited coating.
Further say, the nano metal substrate is by polyimide layer, is formed at the polyimide layer any surface
Ultrathin nanometer metal level and the one side nano metal substrate that is constituted of protection film layer.
Further say, the nano metal substrate be by polyimide layer, to be formed at the polyimide layer two-sided
The double-face nanometer metal substrate that ultrathin nanometer metal level and protection film layer are constituted.
Further say, the thickness of the polyimide layer is 25-50um, and the thickness of the ultrathin nanometer metal level is
0.09-0.2um, the thickness of the protection film layer is 28-60um.
Further say, the ultrathin nanometer metal level is the multilayer that copper foil layer or copper foil layer are constituted with another metal level
Alloying metal layer, another metal level refers to silver layer, nickel dam, layers of chrome, palladium layers, aluminium lamination, titanium layer, layers of copper, molybdenum layer, indium layer, platinum
At least one of layer and layer gold, wherein, the thickness of the copper foil layer is 0.09-0.2um, and the thickness of another metal level is
0.005-0.015um。
Further say, the ultrathin nanometer metal level is one kind in following six kinds of structures：
First, a Rotating fields：It is made up of individual layer copper foil layer, the thickness of the copper foil layer is 0.1-0.2um；
2nd, two stacking structure：It is made up of copper foil layer and the nickel dam for being formed at copper foil layer any surface, the thickness of the copper foil layer
Spend for 0.09-0.15um, the thickness of the nickel dam is 0.005-0.015um；
3rd, two stacking structure：It is made up of copper foil layer and the silver layer for being formed at copper foil layer any surface, the thickness of the copper foil layer
For 0.09-0.15um, the thickness of the silver layer is 0.005-0.015um；
4th, three stacking structure：By copper foil layer and it is formed at and the laminated nickel dam of copper foil and is formed at copper foil layer another side
Silver layer is constituted, and the thickness of the copper foil layer is 0.09-0.15um, and the thickness of the nickel dam and the silver layer is respectively 0.005-
0.015um；
5th, three stacking structure：It is made up of copper foil layer and the nickel dam for being respectively formed in copper foil layer two sides, the thickness of the copper foil layer
Spend for 0.09-0.15um, the thickness of nickel dam is respectively 0.005-0.015um described in two sides；
6th, three stacking structure：By copper foil layer and it is formed at and the laminated layers of copper of copper foil and is formed at copper foil layer another side
Nickel dam is constituted, and the thickness of the copper foil layer is 0.09-0.15um, and the thickness of the layers of copper and the nickel dam is respectively 0.005-
0.015um。
Further say, the protection film layer is carrier layer, the carrier layer is by pet layer (poly terephthalic acid second
Diester) and be formed at the low adhesion layer on a surface of the pet layer and constitute, the carrier layer passes through the low adhesion layer
The ultrathin nanometer layer on surface of metal is covered on, wherein, the thickness of the pet layer is 23-50um, the thickness of the low adhesion layer
For 5-10um.
Further say, the protection film layer is photopolymer layer, the photopolymer layer includes photosensitive resin layer and light-transmissive film layer, institute
State the one side covering light-transmissive film layer of photosensitive resin layer and another side is covered on the ultrathin nanometer layer on surface of metal.
The beneficial effects of the utility model at least have it is following some：
First, because polyimide layer of the present utility model uses PI of the surface roughness between 80-800nm
Film, the PI films are a kind of PI resins of process roughening treatment, can increase the adhesion with metal alloy, and its surface coarsening
Processing also passes through surface corona or plasma-based processing, can be lifted surface can, increase polyimide layer and ultrathin nanometer metal level it
Between adhesion；
2nd, the utility model ultrathin nanometer metal level includes the multilayer alloying metal that copper foil layer is constituted with another metal level
Layer, the resistance to ion transport being designed with beneficial to raising nano metal substrate of alloy-layer, improves the graph thinning of FPC or COF materials
Quality and insulating properties；
3rd, protection film layer of the present utility model can select carrier layer or photopolymer layer, and carrier film or dry film are suitable for half
Addition process technique, the slim highdensity graph thinning line requirements of the more applicable FPC or COF materials of technology of semi-additive process；And carry
Body film and dry film can protect not injured, pressure wound and the oxidation before FPC or the addition processing procedures of COF half of ultrathin nanometer metal level；
When protection film layer selects carrier layer, carrier layer is made up of pet layer and low adhesion layer, and carrier layer passes through low
Adhesion layer is covered on ultrathin nanometer layer on surface of metal, and PET temperature tolerance is in 180-220, and DEG C heat resisting is good；Low adhesion layer
Off-type force be only 1-5g, therefore carrier layer is easily stripped, and does not easily cause the viscous glutinous copper particle of nano metal substrate after stripping
In in carrier film, the small ultrathin nanometer metal level that do not result in of residual stress is deformed during stripping, and the dimensional stability of substrate is not influenceed,
Be conducive to use and the lifting yield of Downstream processing；
When protection film layer selects photopolymer layer, photopolymer layer includes photosensitive resin layer and light-transmissive film layer, the one of photosensitive resin layer
Face covers light-transmissive film layer and another side is covered on ultrathin nanometer layer on surface of metal, by ultraviolet irradiation, in photosensitive resin layer
Part resin crosslinks curing reaction, forms a kind of material of stabilization and is attached in plate face, then develop, demoulding, needed for producing
Circuit, thus it is high using dry film imaging reliability, it is possible to reduce Downstream processing process, it is allowed to be directly used in the erosion of exposure imaging circuit
Carve, be advantageously implemented mechanization and automation；
4th, when low adhesion layer selects high temperature resistant silicon glue adhesion layer or acrylic acid adhesion layer, its adherence is splendid, and high temperature is high
The wet lower interface with ultrathin nanometer metal level will not delamination/separate；
5th, nano metal substrate of the present utility model will not be crimped, and dimensional stability is excellent, be adapted to laser processing,
Suitable for micropore/blind hole and the requirement of any hole shape；And multiple sputter or multi-layer plating alloy are used, plating aspect copper is uniform, no
Pin hole is also easy to produce, is adapted to fine rule road etching, is difficult lateral erosion；
6th, the thickness of ultrathin nanometer metal level of the present utility model be 0.1-0.2um, line width/line-spacing can to 15/15um,
Even 10/10um or lower line requirements, the graph thinning that the design of Nanometer Copper meets FPC or COF substrates is required.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model embodiment (by taking double-face nanometer metal substrate as an example)；
Fig. 2 is the structural representation of the utility model carrier layer；
Fig. 3 is the structural representation of the utility model photopolymer layer；
Fig. 4 is the first schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 5 is second of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 6 is the third schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 7 is the 4th kind of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 8 is the 5th kind of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
Fig. 9 is the 6th kind of schematic diagram in six kinds of structures of the utility model ultrathin nanometer metal level；
The mark of each part is as follows in accompanying drawing：
100- polyimide layers；
200- ultrathin nanometer metal levels；
201- copper foil layers, 202- nickel dams, 203- silver layers, 204- layers of copper；
300- protection film layers；
301-PET layers, the low adhesion layers of 302-, 303- photosensitive resin layers and 304- light-transmissive film layers.
Embodiment
Preferred embodiment of the present utility model is described in detail below in conjunction with the accompanying drawings, so that advantage of the present utility model
It can be easier to be readily appreciated by one skilled in the art with feature, so as to make protection domain of the present utility model apparent clear and definite
Define.
Embodiment：A kind of nano metal substrate for ultra fine-line FPC and COF material, the utility model includes polyamides
Imine layer 100, the ultrathin nanometer metal level 200 and protection film layer 300 for being formed at least one side of polyimide layer 100, institute
Ultrathin nanometer metal level 200 is stated between the polyimide layer 100 and the protection film layer 300；
The thickness of the polyimide layer 100 is 5-50um；
The thickness of the ultrathin nanometer metal level 200 is 0.09-0.8um；
The thickness of the protection film layer 300 is 6-60um；
The polyimide layer 100 is polyimide layer of the surface roughness between 80-800nm.The utility model
Polyimide layer is using roughness in 80-800nm PI films, and optimization is between 80-400nm, the roughness of general PI films
For 10-20nm, adhesion is not good, the PI films are a kind of PI resins of process roughening treatment, can increase and be connect with metal alloy
Put forth effort, and the PI films also pass through surface corona or plasma-based processing, can lift surface energy, and increase polyimide layer is received with ultra-thin
The adhesion of rice metal level.
The ultrathin nanometer metal level 200 is sputtered layer or electrodeposited coating.
The nano metal substrate is by polyimide layer 100, is formed at the ultra-thin of any surface of polyimide layer 100
The one side nano metal substrate that nano metal layer 200 and protection film layer 300 are constituted.
As shown in figure 1, in the present embodiment, the nano metal substrate is by polyimide layer 100, is formed at described gather
The double-face nanometer metal substrate that the two-sided ultrathin nanometer metal level 200 of imide layer 100 and protection film layer 300 are constituted.
The thickness of the polyimide layer 100 is 25-50um, and the thickness of the ultrathin nanometer metal level 200 is 0.09-
0.2um, the thickness of the protection film layer 300 is 28-60um.
The ultrathin nanometer metal level 200 be copper foil layer 201 or copper foil layer 201 with another metal level constitute it is how laminated
Gold metal layer, another metal level refers to silver layer, nickel dam, layers of chrome, palladium layers, aluminium lamination, titanium layer, layers of copper, molybdenum layer, indium layer, platinum layer
At least one of with layer gold, wherein, the thickness of the copper foil layer 201 is 0.09-0.2um, the thickness of another metal level
For 0.005-0.015um.
The ultrathin nanometer metal level 200 is one kind in following six kinds of structures：
First, a Rotating fields：As shown in figure 4, being made up of individual layer copper foil layer 201, the thickness of the copper foil layer 201 is 0.1-
0.2um；
2nd, two stacking structure：As shown in figure 5, be made up of copper foil layer 201 and the nickel dam 202 for being formed at copper foil layer any surface,
The thickness of the copper foil layer 201 is 0.09-0.15um, and the thickness of the nickel dam 202 is 0.005-0.015um；
3rd, two stacking structure：As shown in fig. 6, be made up of copper foil layer 201 and the silver layer 203 for being formed at copper foil layer any surface,
The thickness of the copper foil layer 201 is 0.09-0.15um, and the thickness of the silver layer 203 is 0.005-0.015um；
4th, three stacking structure：As shown in fig. 7, by copper foil layer 201 and being formed at the laminated nickel dam 202 of copper foil and being formed
Constituted in the silver layer 203 of copper foil layer another side, the thickness of the copper foil layer 201 is 0.09-0.15um, the nickel dam 202 and institute
State the thickness respectively 0.005-0.015um of silver layer 203；
5th, three stacking structure：As shown in figure 8, by copper foil layer 201 and being respectively formed in the structure of nickel dam 202 on copper foil layer two sides
Into the thickness of the copper foil layer 201 is 0.09-0.15um, and the thickness of nickel dam 202 is respectively 0.005-0.015um described in two sides；
6th, three stacking structure：As shown in figure 9, by copper foil layer 201 and being formed at the laminated layers of copper 204 of copper foil and being formed
Constituted in the nickel dam 202 of copper foil layer another side, the thickness of the copper foil layer 201 is 0.09-0.15um, the layers of copper 204 and institute
State the thickness respectively 0.005-0.015um of nickel dam 202.
As shown in Fig. 2 the protection film layer 300 is carrier layer, the carrier layer is by pet layer 301 and is formed at
The low adhesion layer 302 on one surface of the pet layer 301 is constituted, and the carrier layer is covered on by the low adhesion layer 302
The surface of ultrathin nanometer metal level 200, wherein, the thickness of the pet layer 301 is 23-50um, the low adhesion layer 302
Thickness is 5-10um, and the off-type force of the low adhesion layer 302 is 1-5g.
When low adhesion layer selects high temperature resistant silicon glue adhesion layer or acrylic acid adhesion layer, its adherence is splendid, hot and humid
Under, will not delamination/separate with the interface of ultrathin nanometer metal level.
As shown in figure 3, the protection film layer 300 is photopolymer layer, the photopolymer layer includes photosensitive resin layer 303 and light-transmissive film
Layer 304, the one side of the photosensitive resin layer 303 covers the light-transmissive film layer 304 and another side is covered on the ultrathin nanometer gold
Belong to the surface of layer 200.
Protection film layer of the present utility model can select carrier layer or photopolymer layer, and carrier film or dry film are suitable for half addition
Method technique, the slim highdensity graph thinning line requirements of the more applicable FPC or COF materials of technology of semi-additive process.
Embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited, it is every
The equivalent structure transformation made using the utility model specification and accompanying drawing content, or directly or indirectly it is used in other correlations
Technical field, is similarly included in scope of patent protection of the present utility model.
Claims (8)
1. a kind of nano metal substrate for ultra fine-line FPC and COF material, it is characterised in that：Including polyimide layer, shape
The ultrathin nanometer metal level and protection film layer of polyimide layer at least one side described in Cheng Yu, the ultrathin nanometer metal level is between institute
State between polyimide layer and the protection film layer；
The thickness of the polyimide layer is 5-50um；
The thickness of the ultrathin nanometer metal level is 0.09-0.8um；
The thickness of the protection film layer is 6-60um；
The polyimide layer is polyimide layer of the surface roughness between 80-800nm；
The ultrathin nanometer metal level is sputtered layer or electrodeposited coating.
2. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute
Stating nano metal substrate is by polyimide layer, is formed at ultrathin nanometer metal level and the protection of the polyimide layer any surface
The one side nano metal substrate that film layer is constituted.
3. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute
Stating nano metal substrate is by polyimide layer, is formed at the polyimide layer two-sided ultrathin nanometer metal level and diaphragm
The double-face nanometer metal substrate that layer is constituted.
4. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute
The thickness for stating polyimide layer is 25-50um, and the thickness of the ultrathin nanometer metal level is 0.09-0.2um, the protection film layer
Thickness be 28-60um.
5. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute
It is the multilayer alloying metal layer that copper foil layer or copper foil layer are constituted with another metal level, another gold to state ultrathin nanometer metal level
Category layer refers at least one of silver layer, nickel dam, layers of chrome, palladium layers, aluminium lamination, titanium layer, layers of copper, molybdenum layer, indium layer, platinum layer and layer gold,
Wherein, the thickness of the copper foil layer is 0.09-0.2um, and the thickness of another metal level is 0.005-0.015um.
6. the nano metal substrate according to claim 5 for ultra fine-line FPC and COF material, it is characterised in that：Institute
It is one kind in following six kinds of structures to state ultrathin nanometer metal level：
First, a Rotating fields：It is made up of individual layer copper foil layer, the thickness of the copper foil layer is 0.1-0.2um；
2nd, two stacking structure：It is made up of copper foil layer and the nickel dam for being formed at copper foil layer any surface, the thickness of the copper foil layer is
0.09-0.15um, the thickness of the nickel dam is 0.005-0.015um；
3rd, two stacking structure：It is made up of copper foil layer and the silver layer for being formed at copper foil layer any surface, the thickness of the copper foil layer is
0.09-0.15um, the thickness of the silver layer is 0.005-0.015um；
4th, three stacking structure：By copper foil layer and it is formed at and the laminated nickel dam of copper foil and is formed at the silver layer of copper foil layer another side
Constitute, the thickness of the copper foil layer is 0.09-0.15um, the thickness of the nickel dam and the silver layer is respectively 0.005-
0.015um；
5th, three stacking structure：It is made up of copper foil layer and the nickel dam for being respectively formed in copper foil layer two sides, the thickness of the copper foil layer is
0.09-0.15um, the thickness of nickel dam is respectively 0.005-0.015um described in two sides；
6th, three stacking structure：By copper foil layer and it is formed at and the laminated layers of copper of copper foil and is formed at the nickel dam of copper foil layer another side
Constitute, the thickness of the copper foil layer is 0.09-0.15um, the thickness of the layers of copper and the nickel dam is respectively 0.005-
0.015um。
7. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute
It is carrier layer to state protection film layer, and the carrier layer is by pet layer and is formed at the low of surface of the pet layer and sticks together
Layer is constituted, and the carrier layer is covered on the ultrathin nanometer layer on surface of metal by the low adhesion layer, wherein, the PET
The thickness of layer is 23-50um, and the thickness of the low adhesion layer is 5-10um.
8. the nano metal substrate according to claim 1 for ultra fine-line FPC and COF material, it is characterised in that：Institute
It is photopolymer layer to state protection film layer, and the photopolymer layer includes photosensitive resin layer and light-transmissive film layer, and the one side of the photosensitive resin layer is covered
Cover the light-transmissive film layer and another side is covered on the ultrathin nanometer layer on surface of metal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720125606.7U CN206497882U (en) | 2017-02-13 | 2017-02-13 | Nano metal substrate for ultra fine-line FPC and COF material |
| TW106133369A TWI655095B (en) | 2017-02-13 | 2017-09-28 | Nano metal substrate for FPC and COF materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720125606.7U CN206497882U (en) | 2017-02-13 | 2017-02-13 | Nano metal substrate for ultra fine-line FPC and COF material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206497882U true CN206497882U (en) | 2017-09-15 |
Family
ID=59804597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720125606.7U Active CN206497882U (en) | 2017-02-13 | 2017-02-13 | Nano metal substrate for ultra fine-line FPC and COF material |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN206497882U (en) |
| TW (1) | TWI655095B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107602899A (en) * | 2017-09-21 | 2018-01-19 | 珠海市创元电子材料有限公司 | A kind of polyimide film, its manufacture method and application |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825212A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | Ultra-thin cover film of LED high reflectivity and preparation method thereof |
| CN112153800A (en) * | 2019-06-27 | 2020-12-29 | 昆山雅森电子材料科技有限公司 | A kind of double-layer covering film with high reflection performance and preparation method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2013183632A1 (en) * | 2012-06-07 | 2016-02-01 | タツタ電線株式会社 | Shield film and shield printed wiring board |
-
2017
- 2017-02-13 CN CN201720125606.7U patent/CN206497882U/en active Active
- 2017-09-28 TW TW106133369A patent/TWI655095B/en active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107602899A (en) * | 2017-09-21 | 2018-01-19 | 珠海市创元电子材料有限公司 | A kind of polyimide film, its manufacture method and application |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI655095B (en) | 2019-04-01 |
| TW201829171A (en) | 2018-08-16 |
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