CN206411571U - Storage module for installing multiple M.2 SSDs - Google Patents
Storage module for installing multiple M.2 SSDs Download PDFInfo
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Abstract
Description
技术领域technical field
本实用新型是关于一种安装多个M.2固态硬盘的储存模块。The utility model relates to a storage module equipped with a plurality of M.2 solid-state hard disks.
背景技术Background technique
现今个人电脑的主机板上设有PCIe(Peripheral Component InterconnectExpress)连接器。PCIe多层协定的规范是为了提升电脑内部总线的传输速度。因此,PCIe连接器适用于高速的数据存取。此外,已知的M.2(Next Generation Form Factor,NGFF)固态硬盘采用PCIe NVMe(Non-Volatile Memory express) 接口,其传输速度快、体积小又省电,已经普及的使用于笔记型电脑及平板内。目前有些高阶桌上型电脑主机也会内建一个M.2固态硬盘的母插槽,如果没有内建也可以使用市面上的M.2转PCIe的板卡,但这些仅适用于服务器的单一应用目前新的物联网及大数据中心都需要多个储存应用。因此,如何能扩展 M.2固态硬盘的多个应用,是本领域所属技术人员所面对的问题。A PCIe (Peripheral Component Interconnect Express) connector is provided on a motherboard of a personal computer today. The specification of the PCIe multilayer protocol is to increase the transmission speed of the computer's internal bus. Therefore, the PCIe connector is suitable for high-speed data access. In addition, the known M.2 (Next Generation Form Factor, NGFF) solid state drive adopts PCIe NVMe (Non-Volatile Memory express) interface, which has fast transmission speed, small size and power saving, and has been widely used in notebook computers and inside the tablet. At present, some high-end desktop computer hosts also have a built-in M.2 SSD female slot. If there is no built-in M.2 to PCIe board card on the market, these are only applicable to servers. Single Application The current new Internet of Things and big data centers require multiple storage applications. Therefore, how to expand multiple applications of M.2 solid-state drives is a problem faced by those skilled in the art.
实用新型内容Utility model content
有鉴于此,本实用新型的一目的在于提出安装多个M.2固态硬盘的储存模块。In view of this, an object of the present invention is to provide a storage module for installing a plurality of M.2 solid-state hard disks.
为了达到上述目的,依据本实用新型的一实施方式,一种安装多个M.2 (NextGeneration Form Factor,NGFF)固态硬盘的储存模块包含支架、至少一电路组件以及多个M.2固态硬盘。电路组件沿一方向固接于支架。电路组件包含多个电路模块以及一个电源连接器。电路模块彼此依序电性连接。每一电路模块包含电路板、M.2母插槽以及信号连接器。电路板固接于支架。M.2母插槽固接于电路板。信号连接器电性连接电路板,且位于支架外。电源连接器电性连接电路模块中所对应的一者的电路板。M.2固态硬盘分别插接于电路模块的M.2母插槽。In order to achieve the above object, according to an embodiment of the present invention, a storage module for installing a plurality of M.2 (NextGeneration Form Factor, NGFF) solid-state hard disks includes a bracket, at least one circuit assembly and a plurality of M.2 solid-state hard disks. The circuit assembly is fixedly connected to the support along one direction. The circuit assembly contains multiple circuit modules and a power connector. The circuit modules are electrically connected to each other in sequence. Each circuit module includes a circuit board, an M.2 female slot and a signal connector. The circuit board is fixed on the bracket. The M.2 female slot is fixed on the circuit board. The signal connector is electrically connected to the circuit board and is located outside the bracket. The power connector is electrically connected to the circuit board of a corresponding one of the circuit modules. The M.2 solid-state drives are respectively plugged into the M.2 female slots of the circuit module.
依据本实用新型的一实施方式,前述的电路组件包含两个电路模块。每一电路模块包含电源接脚组件。在每一电路模块中,电源接脚组件固接于电路板。电路模块中的一者的电源接脚组件电性耦接电路模块中的另一者的电路板。According to an embodiment of the present invention, the aforementioned circuit assembly includes two circuit modules. Each circuit module includes a power pin component. In each circuit module, the power pin assembly is fixedly connected to the circuit board. The power pin assembly of one of the circuit modules is electrically coupled to the circuit board of the other circuit module.
依据本实用新型的一实施方式,前述的电路组件包含三个电路模块以及一个电源连接线。电源连接线固接于对应的两个电路板。每一电路模块包含电源接脚组件。在每一电路模块中,电源接脚组件固接于电路板。电路模块中的两相邻者中的一者的电源接脚组件电性耦接两相邻者中的另一者的电路板。电路模块中的一剩余者的电路板与两相邻者中的一对应者的电路板彼此通过电源连接线而电性耦接。According to an embodiment of the present invention, the aforementioned circuit assembly includes three circuit modules and a power connection wire. The power connection wires are fixedly connected to the corresponding two circuit boards. Each circuit module includes a power pin component. In each circuit module, the power pin assembly is fixedly connected to the circuit board. The power pin assembly of one of the two adjacent ones of the circuit modules is electrically coupled to the circuit board of the other of the two adjacent ones. The circuit board of a remaining one of the circuit modules is electrically coupled with the circuit board of a corresponding one of the two adjacent ones through the power connection line.
依据本实用新型的一实施方式,前述的电路组件包含沿前述的方向并排的两对电路模块以及一个电源连接线。电源连接线固接于对应的两个电路板。每一电路模块包含电源接脚组件。在每一电路模块中,电源接脚组件固接于电路板。在任一对电路模块中,电路模块中的一者的电源接脚组件电性耦接电路模块中另一者的电路板。电路模块排列于中央的两者的电路板通过电源连接线而彼此电性耦接。According to an embodiment of the present invention, the aforementioned circuit assembly includes two pairs of circuit modules arranged side by side along the aforementioned direction and a power connection wire. The power connection wires are fixedly connected to the corresponding two circuit boards. Each circuit module includes a power pin component. In each circuit module, the power pin assembly is fixedly connected to the circuit board. In any pair of circuit modules, the power pin assembly of one of the circuit modules is electrically coupled to the circuit board of the other circuit module. The two circuit boards with the circuit modules arranged in the center are electrically coupled to each other through power connection lines.
依据本实用新型的一实施方式,前述的支架具有位于一端的多个第一卡扣部与位于相对的另一端的多个第一锁固部,且每一电路板具有位于一端的第二卡扣部与位于相对的另一端的第二锁固部。第二锁固部与第一卡扣部中所对应的一者相互锁固,且第二卡扣部与第一卡扣部中所对应的一者相互卡合。According to an embodiment of the present invention, the aforementioned bracket has a plurality of first buckle parts at one end and a plurality of first locking parts at the opposite end, and each circuit board has a second clip at one end. The buckle part and the second locking part at the opposite end. The second locking part and the corresponding one of the first buckling parts are mutually locked, and the second locking part and the corresponding one of the first buckling parts are mutually locked.
依据本实用新型的一实施方式,前述的电路板具有至少一固定孔。固定孔与该路模块中的M.2母插槽中对应的一者之间具有一距离。前述距离实质上为42mm、60mm、80mm或110mm,且配置以锁固M.2固态硬盘。According to an embodiment of the present invention, the aforementioned circuit board has at least one fixing hole. There is a distance between the fixing hole and the corresponding one of the M.2 female slots in the module. The aforementioned distance is substantially 42mm, 60mm, 80mm or 110mm, and is configured to lock the M.2 solid state drive.
依据本实用新型的一实施方式,前述的电路组件中的电路板是分别垂直于支架的底面,且彼此相互平行。According to an embodiment of the present invention, the circuit boards in the aforementioned circuit assembly are respectively perpendicular to the bottom surface of the bracket and parallel to each other.
依据本实用新型的一实施方式,前述的支架具有一宽度,且配置以锁固于个人电脑机壳的5.25英寸光盘机标准槽或3.5英寸硬盘标准槽。前述的宽度的方向是相同于电路组件所排列的方向,且实质上为5.25英寸或3.5英寸。According to an embodiment of the present invention, the aforesaid bracket has a width and is configured to be locked in a standard slot of a 5.25-inch optical disk drive or a standard slot of a 3.5-inch hard disk of a personal computer case. The aforementioned width direction is the same as the direction in which the circuit components are arranged, and is substantially 5.25 inches or 3.5 inches.
依据本实用新型的一实施方式,前述的每一电路模块的M.2母插槽是支持PCIe(Peripheral Component Interconnect Express)规格的固态硬盘或SATA (SerialAdvanced Technology Attachment)规格的固态硬盘。According to an embodiment of the present invention, the M.2 female slot of each circuit module mentioned above is a solid-state hard disk supporting PCIe (Peripheral Component Interconnect Express) specification or SATA (Serial Advanced Technology Attachment) specification solid-state hard disk.
依据本实用新型的一实施方式,前述的每一电路模块还包含信号连接线。信号连接线是电性连接信号连接器与电路板。信号连接器为SFF(Small Form Factor)-8643、SFF-8639或OcuLink。信号连接线为PCIe连接线。According to an embodiment of the present invention, each of the aforementioned circuit modules further includes a signal connection line. The signal connecting wire is to electrically connect the signal connector and the circuit board. The signal connector is SFF (Small Form Factor)-8643, SFF-8639 or OcuLink. The signal connection line is a PCIe connection line.
依据本实用新型的一实施方式,前述的每一电路模块还包含另一连接器。前述的每一电路模块还包含信号连接线。信号连接线是电性连接信号连接器与电路板。信号连接器为SATA连接器。信号连接线为SATA连接线。According to an embodiment of the present invention, each of the aforementioned circuit modules further includes another connector. Each of the aforesaid circuit modules also includes a signal connecting wire. The signal connecting wire is to electrically connect the signal connector and the circuit board. The signal connector is a SATA connector. The signal cable is a SATA cable.
综上所述,本揭露的安装多个M.2固态硬盘的储存模块可将多个M.2固态硬盘从单个电路板的型式转换为3.5英寸硬盘型式或5.25英寸光盘机型式。因此,有助于将M.2固态硬盘结合到现有的电脑机箱中。因此,在前述结构下可降低储存模块的制作成本。再者,由于储存模块可包含至少一个电路组件,且一个电路组件可包含两个以上的电路模块。一个电源连接器可供应电力给多个电路模块。在前述的结构配置下,储存模块的结构配置可被简化,并可视实际需求而模块化电路组件的形式。因此,前述结构可更降低储存模块的制作成本,并可更扩充M.2固态硬盘的放置数量。To sum up, the disclosed storage module equipped with multiple M.2 solid-state drives can convert multiple M.2 solid-state drives from a single circuit board type to a 3.5-inch hard disk type or a 5.25-inch optical disk drive type. Hence, it helps to incorporate M.2 SSDs into existing computer cases. Therefore, the manufacturing cost of the storage module can be reduced under the aforementioned structure. Furthermore, since the storage module may include at least one circuit component, and one circuit component may include more than two circuit modules. One power connector can supply power to multiple circuit modules. Under the aforementioned structural configuration, the structural configuration of the storage module can be simplified, and the form of the circuit assembly can be modularized according to actual needs. Therefore, the aforementioned structure can further reduce the manufacturing cost of the storage module, and can further expand the placement quantity of the M.2 solid-state hard disk.
附图说明Description of drawings
为让本实用新型的上述和其他目的、特征、优点与实施例能更明显易懂,所附附图的说明如下:In order to make the above and other purposes, features, advantages and embodiments of the present invention more obvious and understandable, the accompanying drawings are described as follows:
图1绘示根据本实用新型一实施方式的安装多个M.2(Next Generation FormFactor,NGFF)固态硬盘的储存模块的立体图;Fig. 1 depicts a perspective view of a storage module equipped with multiple M.2 (Next Generation Form Factor, NGFF) solid state drives according to an embodiment of the present invention;
图2绘示根据本实用新型一实施方式的电路组件的立体图,其中前述的电路组件包含两个电路模块;2 shows a perspective view of a circuit assembly according to an embodiment of the present invention, wherein the aforementioned circuit assembly includes two circuit modules;
图3绘示根据本实用新型另一实施方式的电路组件的立体图,其中前述的电路组件包含三个电路模块;3 shows a perspective view of a circuit assembly according to another embodiment of the present invention, wherein the aforementioned circuit assembly includes three circuit modules;
图4绘示根据本实用新型再一实施方式的电路组件的立体图,其中前述的电路组件包含四个电路模块;4 shows a perspective view of a circuit assembly according to another embodiment of the present invention, wherein the aforementioned circuit assembly includes four circuit modules;
图5绘示根据本实用新型另一实施方式的安装多个M.2固态硬盘的储存模块的立体图;FIG. 5 shows a perspective view of a storage module with multiple M.2 solid-state drives installed according to another embodiment of the present invention;
图6绘示根据本实用新型再一实施方式的安装多个M.2固态硬盘的储存模块的立体图。FIG. 6 is a perspective view of a storage module installed with multiple M.2 solid state drives according to still another embodiment of the present invention.
具体实施方式detailed description
以下将以附图揭露本实用新型的多个实施方式,为明确说明起见,许多实务上的细节将在以下叙述中一并说明。然而,应了解到,这些实务上的细节不应用以限制本实用新型。也就是说,在本实用新型部分实施方式中,这些实务上的细节是非必要的。此外,为简化附图起见,一些已知惯用的结构与元件在附图中将以简单示意的方式绘示。A number of implementations of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the invention. That is to say, in some embodiments of the present utility model, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings.
关于本文中所使用的用词“实质上(substantially)”应大体上意味在给定值或范围的百分之二十以内,较佳是在百分之十以内,而更佳地则是百分之五以内。文中若无明确说明,其所提及的数值皆视作为近似值,即如“实质上”所表示的误差或范围。As used herein, the term "substantially" shall generally mean within twenty percent, preferably within ten percent, and more preferably one hundred percent of a given value or range Within five-fifths. If there is no explicit statement in the text, the values mentioned are regarded as approximate values, that is, the error or range expressed by "substantially".
请参照图1。图1绘示根据本实用新型一实施方式的安装多个M.2(NextGeneration Form Factor,NGFF)固态硬盘的储存模块1的立体图。如图所示,于本实施方式中,储存模块1包含支架10、三个电路组件12(即,一个电路组件 12a以及两个电路组件12b)以及多个M.2固态硬盘14(绘示为8个)。以下将详细介绍各元件的结构、功能以及各元件之间的连接关系。Please refer to Figure 1. FIG. 1 shows a perspective view of a storage module 1 installed with multiple M.2 (NextGeneration Form Factor, NGFF) solid state disks according to an embodiment of the present invention. As shown in the figure, in this embodiment, the storage module 1 includes a bracket 10, three circuit components 12 (ie, one circuit component 12a and two circuit components 12b) and a plurality of M.2 solid state drives 14 (shown as 8). The structure and function of each component and the connection relationship between each component will be introduced in detail below.
如图1所示,储存模块1的支架10包含底面10a以及相对的两个侧壁10b。底面10a及侧壁10b共同形成容置空间10c。多个电路组件12(一个电路组件 12a以及两个电路组件12b)至少部分位于容置空间10c中,且分别沿方向D1 固接于支架10。此外,支架10具有宽度W1,并配置以锁固于个人电脑机壳的5.25英寸光盘机标准槽。前述的宽度W1的方向是相同于电路组件12所排列的方向D1,且实质上为5.25英寸。于本实施方式中,电路组件12包含多个电路模块120以及一个电源连接器122。电源连接器122电性连接电路模块 120中所对应的一者的电路板1200。于电路组件12中的电路模块120彼此依序电性连接。举例来说,请参照图2及图3。图2及图3分别绘示根据本实用新型一实施方式的电路组件12a及12b的立体图,其中电路组件12a包含两个电路模块120,而电路组件12b包含三个电路模块120。As shown in FIG. 1 , the frame 10 of the storage module 1 includes a bottom surface 10 a and two opposite side walls 10 b. The bottom surface 10a and the side wall 10b jointly form an accommodating space 10c. A plurality of circuit components 12 (one circuit component 12a and two circuit components 12b) are at least partially located in the accommodating space 10c, and are respectively fixed to the bracket 10 along the direction D1. In addition, the bracket 10 has a width W1 and is configured to be locked in a standard slot of a 5.25-inch optical disc drive of a personal computer case. The direction of the aforementioned width W1 is the same as the direction D1 in which the circuit components 12 are arranged, and is substantially 5.25 inches. In this embodiment, the circuit assembly 12 includes a plurality of circuit modules 120 and a power connector 122 . The power connector 122 is electrically connected to the circuit board 1200 of a corresponding one of the circuit modules 120. The circuit modules 120 in the circuit assembly 12 are electrically connected to each other in sequence. For example, please refer to FIG. 2 and FIG. 3 . 2 and 3 are perspective views of circuit components 12 a and 12 b according to an embodiment of the present invention, wherein the circuit component 12 a includes two circuit modules 120 , and the circuit component 12 b includes three circuit modules 120 .
如图2所示,于本实施方式中,每一电路模块120包含一个电路板1200、一个M.2母插槽1202以及一个信号连接器1204。电路板1200固接于支架10(见图1)。M.2母插槽1202固接于电路板1200,且支持PCIe(Peripheral Component Interconnect Express)规格或SATA(Serial Advanced Technology Attachment)规格的固态硬盘。M.2固态硬盘14分别插接于电路模块120的M.2母插槽1202(见图1)。As shown in FIG. 2 , in this embodiment, each circuit module 120 includes a circuit board 1200 , an M.2 female slot 1202 and a signal connector 1204 . The circuit board 1200 is fixed on the bracket 10 (see FIG. 1 ). The M.2 female slot 1202 is fixedly connected to the circuit board 1200 and supports PCIe (Peripheral Component Interconnect Express) specification or SATA (Serial Advanced Technology Attachment) specification solid state disk. The M.2 solid-state disks 14 are respectively plugged into the M.2 female slots 1202 of the circuit module 120 (see FIG. 1 ).
于图2中,信号连接器1204电性连接电路板1200,位于支架10外(见图 1),且为SFF(Small Form Factor)-8643。于其他实施方式中,信号连接器1204 也可为SFF-8639或QcuLink,但本揭露不以前述连接器的形式为限。进一步来说,电路模块120还含包信号连接线1209。信号连接线1209是电性连接信号连接器1204与电路板1200,且为PCIe连接线,但本揭露不以此为限。于其他实施方式中,信号连接器1204可为SATA连接器。信号连接线1209可为 SATA连接线。In FIG. 2, the signal connector 1204 is electrically connected to the circuit board 1200, located outside the bracket 10 (see FIG. 1), and is SFF (Small Form Factor)-8643. In other implementations, the signal connector 1204 can also be SFF-8639 or QcuLink, but the present disclosure is not limited to the form of the aforementioned connector. Further, the circuit module 120 also includes a signal connection line 1209 . The signal connection line 1209 is electrically connected to the signal connector 1204 and the circuit board 1200 and is a PCIe connection line, but the present disclosure is not limited thereto. In other implementations, the signal connector 1204 can be a SATA connector. The signal connection line 1209 can be a SATA connection line.
此外,电路组件12a的电源连接器122电性连接电路模块120中所对应的一者的电路板1200。于本实施方式中,电源连接器122电性连接于电路板 1200a。可选地,于其他实施方式中,电源连接器122可电性连接于电路板 1200b。In addition, the power connector 122 of the circuit assembly 12 a is electrically connected to the circuit board 1200 of a corresponding one of the circuit modules 120 . In this embodiment, the power connector 122 is electrically connected to the circuit board 1200a. Optionally, in other embodiments, the power connector 122 can be electrically connected to the circuit board 1200b.
于图2中,电路组件12a包含两个电路模块120。每一电路模块120包含电源接脚组件1206。在每一电路模块120中,电源接脚组件1206固接于电路板1200。两个电路模块120中的一者的电源接脚组件1206电性耦接电路模块 120中的另一者的电路板1200。也就是说,固接于电路板1200a的电源接脚组件1206电性耦接电路板1200b。相对地,于本实施方式中,固接于电路板1200b 的电源接脚组件(图未示)亦电性耦接电路板1200a。In FIG. 2 , the circuit assembly 12 a includes two circuit modules 120 . Each circuit module 120 includes a power pin assembly 1206 . In each circuit module 120 , the power pin assembly 1206 is fixedly connected to the circuit board 1200 . The power pin assembly 1206 of one of the two circuit modules 120 is electrically coupled to the circuit board 1200 of the other circuit module 120 . That is to say, the power pin assembly 1206 fixed on the circuit board 1200a is electrically coupled to the circuit board 1200b. In contrast, in this embodiment, the power pin assembly (not shown) fixed on the circuit board 1200b is also electrically coupled to the circuit board 1200a.
于图3中,电路组件12b包含三个电路模块120以及一个电源连接线1208。三个电路模块120中的两相邻者中的一者的电源接脚组件1206电性耦接两相邻者中的另一者的电路板1200。于本实施方式的三个电路模块120中,电路板1200c与电路板1200d之间的距离是小于电路板1200d与电路板1200e之间的距离。也就是说,固接于电路板1200c的电源接脚组件1206电性耦接电路板1200d。相对地,于本实施方式中,固接于电路板1200d的电源接脚组件(图未示)亦电性耦接电路板1200c。此外,电路模块120中电路板1200e与电路板 1200d彼此通过电源连接线1208而电性耦接。于本实施方式中,电源连接线 1208固接于电路板1200d与电路板1200e之间。In FIG. 3 , the circuit assembly 12 b includes three circuit modules 120 and a power connection line 1208 . The power pin assembly 1206 of one of the two adjacent ones of the three circuit modules 120 is electrically coupled to the circuit board 1200 of the other of the two adjacent ones. In the three circuit modules 120 of this embodiment, the distance between the circuit board 1200c and the circuit board 1200d is smaller than the distance between the circuit board 1200d and the circuit board 1200e. That is to say, the power pin assembly 1206 fixed on the circuit board 1200c is electrically coupled to the circuit board 1200d. In contrast, in this embodiment, the power pin assembly (not shown) fixed on the circuit board 1200d is also electrically coupled to the circuit board 1200c. In addition, the circuit board 1200e and the circuit board 1200d in the circuit module 120 are electrically coupled to each other through the power connection line 1208 . In this embodiment, the power connection wire 1208 is fixedly connected between the circuit board 1200d and the circuit board 1200e.
可选地,于其他实施方式中,电源连接线1208可固接电路板1200c与电路板1200e或可依据实际需求选择性的配置电源连接线1208或电源接脚组件1206。此外,于图3中,电路组件12b的电源连接器122电性连接电路模块 120中所对应的一者的电路板1200。于本实施方式中,电源连接器122电性连接于电路板1200c。于实际应用中,可依据需求弹性的配置电源连接器122。Optionally, in other embodiments, the power connection line 1208 can be fixedly connected to the circuit board 1200c and the circuit board 1200e, or the power connection line 1208 or the power pin assembly 1206 can be selectively configured according to actual needs. In addition, in FIG. 3 , the power connector 122 of the circuit assembly 12b is electrically connected to the circuit board 1200 of a corresponding one of the circuit modules 120 . In this embodiment, the power connector 122 is electrically connected to the circuit board 1200c. In practical applications, the power connector 122 can be flexibly configured according to requirements.
借此,由于储存模块1可包含至少一个电路组件12,且一个电路组件12 可包含两个以上的电路模块120。一个电源连接器122可供应电力给多个电路模块120。在前述的结构配置下,储存模块1的结构配置可被简化,并可视实际需求而模块化电路组件12的形式。因此,前述结构可降低储存模块1的制作成本,储存模块1可结合到现有的电脑机箱的5.25英寸光盘机标准槽中,且M.2固态硬盘14的放置数量可更扩充于支架10中。Therefore, since the storage module 1 may include at least one circuit assembly 12 , and one circuit assembly 12 may include more than two circuit modules 120 . One power connector 122 can supply power to multiple circuit modules 120 . Under the aforementioned structural configuration, the structural configuration of the storage module 1 can be simplified, and the form of the circuit assembly 12 can be modularized according to actual needs. Therefore, the aforesaid structure can reduce the production cost of the storage module 1, the storage module 1 can be combined in the standard slot of the 5.25-inch CD drive of the existing computer case, and the placement quantity of the M.2 solid-state hard disk 14 can be further expanded in the bracket 10 .
请参照回图1。于本实施方式中,支架10具有位于一端的卡扣部100与位于相对的另一端的第一锁固部102。此外,电路板1200具有位于一端的第二卡扣部1203与位于相对的另一端的第二锁固部1205(见图2)。于前述结构配置下,电路板1200的第二锁固部1205与支架10的第一锁固部102相互锁固,而电路板1200的第二卡扣部1203与支架10的第一卡扣部100相互卡合。然而,本揭露不以前述结合方式为限,只要能将电路板1200固定于支架10 的结构皆能应用于本揭露。Please refer back to Figure 1. In this embodiment, the bracket 10 has a locking portion 100 at one end and a first locking portion 102 at the opposite end. In addition, the circuit board 1200 has a second locking portion 1203 at one end and a second locking portion 1205 at the opposite end (see FIG. 2 ). Under the aforementioned structural configuration, the second locking portion 1205 of the circuit board 1200 and the first locking portion 102 of the bracket 10 are locked to each other, and the second locking portion 1203 of the circuit board 1200 and the first locking portion of the bracket 10 100 snap together. However, the present disclosure is not limited to the aforementioned combination methods, as long as the structure that can fix the circuit board 1200 to the bracket 10 can be applied to the present disclosure.
详细来说,电路板1200的第二卡扣部1203包含卡扣颈部1203a以及卡扣凸部1203b,且电路板1200本体、扣颈部1203a及卡扣凸部1203b共同定义出卡扣凹口1203c(见图2)。支架10的第一卡扣部100为第一凸部,此第一凸部的外型和第二卡扣部1203的卡扣凹口1203c相契合。In detail, the second buckle part 1203 of the circuit board 1200 includes a buckle neck 1203a and a buckle protrusion 1203b, and the body of the circuit board 1200, the buckle neck 1203a and the buckle protrusion 1203b together define a buckle notch 1203c (see FIG. 2). The first locking portion 100 of the bracket 10 is a first convex portion, and the shape of the first convex portion fits with the locking notch 1203c of the second locking portion 1203 .
在组装电路板1200至支架10上时,通过先将电路板1200的第二卡扣部 1203扣合于支架10的第一卡扣部100。接着,再将第二锁固部1205与第一锁固部102相互锁固,即可完成电路板1200的组装。借此,电路板1200可稳定地固定于支架10上,且电路板1200与支架10的结合方式可被简化。When assembling the circuit board 1200 on the bracket 10, the second buckle part 1203 of the circuit board 1200 is fastened to the first buckle part 100 of the bracket 10 first. Then, the second locking part 1205 and the first locking part 102 are locked to each other, and the assembly of the circuit board 1200 can be completed. Thereby, the circuit board 1200 can be stably fixed on the bracket 10 , and the combination of the circuit board 1200 and the bracket 10 can be simplified.
此外,由于电路板1200与支架10的一端是通过卡扣的方式结合,且电路板1200的第二卡扣部1203包含卡扣颈部1203a以及卡扣凸部1203b。因此,当储存模块1受到外力时,可通过卡扣颈部1203a以及卡扣凸部1203b对第二卡扣部1203的限位,以使得电路板1200的本体不会因为储存模块1受到外力而晃动或移位。此外,第二卡扣部1203的卡扣凸部1203b位于卡扣凹口1203c 外侧,因而可确保储存模块1受到外力时,电路板1200的第二卡扣部1203 可被限制于第一锁固部102的卡扣凹口1203c中,而不会使得电路板1200脱离支架10的第一锁固部102。再者,第二卡扣部1203是对称地形成于电路板 1200上,因而使用者也可反置电路组件12,通过另一侧的第二卡扣部1203 而将电路板1200锁固于支架10。In addition, since the circuit board 1200 is combined with one end of the bracket 10 through buckling, and the second buckling portion 1203 of the circuit board 1200 includes a buckling neck 1203 a and a buckling convex portion 1203 b. Therefore, when the storage module 1 is subjected to an external force, the second buckling portion 1203 can be limited by the buckling neck 1203a and the buckling convex portion 1203b, so that the body of the circuit board 1200 will not be damaged by the storage module 1 being subjected to an external force. Shake or shift. In addition, the buckling protrusion 1203b of the second buckling part 1203 is located outside the buckling notch 1203c, thus ensuring that when the storage module 1 is subjected to an external force, the second buckling part 1203 of the circuit board 1200 can be limited to the first locking position. The locking notch 1203c of the part 102 will not cause the circuit board 1200 to disengage from the first locking part 102 of the bracket 10 . Moreover, the second buckle portion 1203 is symmetrically formed on the circuit board 1200, so the user can also turn the circuit assembly 12 upside down, and lock the circuit board 1200 to the bracket through the second buckle portion 1203 on the other side. 10.
如图1所示,于本实施方式中,电路板1200具有多个固定孔1207。电路板1200的固定孔1207与M.2母插槽1202之间具有距离L。前述的距离实质上为42mm、60mm、80mm或110mm,且配置以锁固M.2固态硬盘1202。借此,不同规格的M.2固态硬盘1202插接于M.2母插槽1202,并通过固定孔 1207而固定于电路板1200上,以加强储存模块1于结构上的强度。As shown in FIG. 1 , in this embodiment, the circuit board 1200 has a plurality of fixing holes 1207 . There is a distance L between the fixing hole 1207 of the circuit board 1200 and the M.2 female slot 1202 . The aforementioned distance is substantially 42 mm, 60 mm, 80 mm or 110 mm, and is configured to lock the M.2 solid state drive 1202 . In this way, the M.2 solid-state drives 1202 of different specifications are plugged into the M.2 female slots 1202 and fixed on the circuit board 1200 through the fixing holes 1207 to enhance the structural strength of the storage module 1 .
于本实施方式中,电路板1200是垂直于支架10的底面10a,且彼此相互平行。通过前述结构配置可充分的利用支架10的空间,并助于扩充M.2固态硬盘1202于架10中的放置数量。In this embodiment, the circuit boards 1200 are perpendicular to the bottom surface 10 a of the bracket 10 and parallel to each other. Through the aforementioned structural configuration, the space of the rack 10 can be fully utilized, and it is helpful to expand the number of M.2 solid state drives 1202 placed in the rack 10 .
请参照图5。图5绘示根据本实用新型另一实施方式的安装多个M.2固态硬盘的储存模块2的立体图。如图所示,于本实施方式中,储存模块2包含支架20、两个电路组件12(即,一个电路组件12a以及一个电路组件12c)以及多个M.2固态硬盘14(绘示为6个)。这些元件的结构、功能以及各元件之间的连接关系皆与图1所示的实施方式大致相同,因此可参照前述相关说明,在此不再赘述。Please refer to Figure 5. FIG. 5 shows a perspective view of a storage module 2 installed with multiple M.2 solid state drives according to another embodiment of the present invention. As shown in the figure, in this embodiment, the storage module 2 includes a bracket 20, two circuit components 12 (that is, one circuit component 12a and one circuit component 12c) and a plurality of M.2 solid state drives 14 (shown as 6 indivual). The structure, function and connection relationship between these components are substantially the same as those of the embodiment shown in FIG. 1 , so reference can be made to the above-mentioned related descriptions, and details will not be repeated here.
在此要说明的是,本实施方式与图1所示的实施方式的差异的处,在于本实施方式中支架20具有宽度W2,且配置以锁固于个人电脑机壳的3.5英寸硬盘标准槽。前述的宽度W2的方向是相同于电路组件12所排列的方向,且实质上为3.5英寸。此外,于本实施方式中,两个电路组件12中包含一个电路组件12c,且储存模块2包含6个M.2固态硬盘14。举例来说,请参照图4。图4绘示根据本实用新型再一实施方式的电路组件12c的立体图,其中前述的电路组件12c包含四个电路模块120。It should be noted here that the difference between this embodiment and the embodiment shown in FIG. 1 is that in this embodiment, the bracket 20 has a width W2, and is configured to be locked in a standard slot of a 3.5-inch hard disk of a personal computer casing. . The direction of the aforementioned width W2 is the same as the direction in which the circuit components 12 are arranged, and is substantially 3.5 inches. In addition, in this embodiment, the two circuit assemblies 12 include one circuit assembly 12c, and the storage module 2 includes six M.2 solid state disks 14 . For example, please refer to Figure 4. FIG. 4 is a perspective view of a circuit assembly 12c according to yet another embodiment of the present invention, wherein the aforementioned circuit assembly 12c includes four circuit modules 120 .
如图4所示,于本实施方式中,电路组件12c包含沿前述的方向D1并排的两对电路模块120以及一个电源连接线1208。每一电路模块120包含电源接脚组件1206。在每一电路模块120中,电源接脚组件1206固接于电路板 1200。详细来说,于两对电路模块120中,固接于电路板1200f的电源接脚组件1206电性耦接电路板1200g,而固接于电路板1200h的电源接脚组件1206 电性耦接电路板1200i。相对地,于本实施方式中,固接于电路板1200f的电源接脚组件1206亦电性耦接电路板1200g,而固接于电路板1200h的电源接脚组件1206亦电性耦接电路板1200i。此外,电路模块120排列于中央的两者的电路板1200g以及电路板1200h是通过电源连接线1208而彼此电性耦接。于本实施方式中,电源连接线1208固接于电路板1200g与电路板1200h之间。As shown in FIG. 4 , in this embodiment, the circuit assembly 12 c includes two pairs of circuit modules 120 arranged side by side along the aforementioned direction D1 and a power connection line 1208 . Each circuit module 120 includes a power pin assembly 1206 . In each circuit module 120, the power pin assembly 1206 is fixed on the circuit board 1200. Specifically, among the two pairs of circuit modules 120, the power pin assembly 1206 fixed on the circuit board 1200f is electrically coupled to the circuit board 1200g, and the power pin assembly 1206 fixed on the circuit board 1200h is electrically coupled to the circuit Board 1200i. In contrast, in this embodiment, the power pin assembly 1206 fixed on the circuit board 1200f is also electrically coupled to the circuit board 1200g, and the power pin assembly 1206 fixed on the circuit board 1200h is also electrically coupled to the circuit board 1200i. In addition, the circuit boards 1200g and 1200h of the two circuit modules 120 arranged in the center are electrically coupled to each other through the power connection line 1208 . In this embodiment, the power connection wire 1208 is fixedly connected between the circuit board 1200g and the circuit board 1200h.
再者,于图4中,电路组件12c的电源连接器122电性连接电路模块120 中所对应的一者的电路板1200。于本实施方式中,电源连接器122电性连接于电路板1200f。于实际应用中,可依据需求弹性的配置电源连接器122。借此,一个电源连接器122可供应电力给多个电路模块120,因而储存模块2的结构配置可被简化,并可视实际需求而模块化电路组件12的形式。因此,前述结构可降低储存模块2的制作成本,储存模块2可结合到现有的电脑机箱的3.5英寸硬盘标准槽中,且M.2固态硬盘14的放置数量可更扩充于支架20中。Moreover, in FIG. 4 , the power connector 122 of the circuit assembly 12 c is electrically connected to the circuit board 1200 of a corresponding one of the circuit modules 120 . In this embodiment, the power connector 122 is electrically connected to the circuit board 1200f. In practical applications, the power connector 122 can be flexibly configured according to requirements. In this way, one power connector 122 can supply power to multiple circuit modules 120 , so the structural configuration of the storage module 2 can be simplified, and the form of the circuit components 12 can be modularized according to actual needs. Therefore, the aforementioned structure can reduce the production cost of the storage module 2 , the storage module 2 can be combined into the standard 3.5-inch hard disk slot of an existing computer case, and the number of M.
请参照图6。图6绘示根据本实用新型再一实施方式的安装多个M.2固态硬盘的储存模块3的立体图。如图所示,于本实施方式中,储存模块3包含支架30以及三个电路组件32。此外,为了详细说明本实施方式,于图6中省略绘示M.2固态硬盘。这些元件的结构、功能以及各元件之间的连接关系皆与图1所示的实施方式大致相同,因此可参照前述相关说明,在此不再赘述。Please refer to Figure 6. FIG. 6 shows a perspective view of a storage module 3 installed with a plurality of M.2 solid-state drives according to still another embodiment of the present invention. As shown in the figure, in this embodiment, the storage module 3 includes a bracket 30 and three circuit components 32 . In addition, in order to describe this embodiment in detail, the M.2 solid state disk is omitted in FIG. 6 . The structure, function and connection relationship between these components are substantially the same as those of the embodiment shown in FIG. 1 , so reference can be made to the above-mentioned related descriptions, and details will not be repeated here.
在此要说明的是,本实施方式与图1所示的实施方式的差异的处,在于本实施方式中,支架30的一端具有第一通孔302,而相对的另一端包含锁固支架300(绘示为四个)。锁固支架300包含至少一固定臂3000(绘示为两个),且固定臂3000具有第二通孔3002。锁固支架300通过位于支架30的底面30a 的第三通孔304而锁固于支架30。此外,于电路组件32中,电路模块320的电路板3200的一端具有第二凸部3202。因此,本实施方式以支架30以及电路板3200分别取代如图1所示的支架10以及电路板1200。It should be noted here that the difference between this embodiment and the embodiment shown in FIG. 1 is that in this embodiment, one end of the bracket 30 has a first through hole 302, and the opposite end includes a locking bracket 300 (shown as four). The locking bracket 300 includes at least one fixing arm 3000 (two are shown), and the fixing arm 3000 has a second through hole 3002 . The locking bracket 300 is locked to the bracket 30 through the third through hole 304 located on the bottom surface 30 a of the bracket 30 . In addition, in the circuit assembly 32 , one end of the circuit board 3200 of the circuit module 320 has a second protrusion 3202 . Therefore, in this embodiment, the bracket 10 and the circuit board 1200 shown in FIG. 1 are respectively replaced by the bracket 30 and the circuit board 3200 .
于图6中,电路板3200的第二凸部3202与支架30的第一通孔302相互嵌合。M.2固态硬盘1202(图未示)的一端插接于电路模块320的M.2母插槽 1202,而另一端通过锁固支架300的第二通孔3002而固定于支架30。进一步来说,支架30的底面30a上沿着方向D2具有多个第三通孔304。通过将锁固支架300锁固于不同的第三通孔304,锁固支架300的第二通孔3002与M.2 母插槽1202之间可具有不同的距离。因此,通过前述的结构配置,具有不同规格的M.2固态硬盘1202(图未示)皆可通过锁固于适当的第三通孔304的锁固支架300以及M.2母插槽1202而固定于储存模块3。In FIG. 6 , the second protrusion 3202 of the circuit board 3200 is fitted into the first through hole 302 of the bracket 30 . One end of the M.2 solid state drive 1202 (not shown in the figure) is plugged into the M.2 female slot 1202 of the circuit module 320 , and the other end is fixed to the bracket 30 through the second through hole 3002 of the locking bracket 300 . Further, the bottom surface 30a of the bracket 30 has a plurality of third through holes 304 along the direction D2. By locking the locking bracket 300 to different third through holes 304 , the distance between the second through hole 3002 of the locking bracket 300 and the M.2 female slot 1202 can be different. Therefore, through the foregoing structural configuration, M.2 solid-state drives 1202 (not shown) with different specifications can all be locked into the appropriate third through hole 304 through the locking bracket 300 and the M.2 female slot 1202. fixed on the storage module 3.
在组装电路板3200至支架30上时,通过先将电路板3200的第二凸部3202 嵌合于支架30的第一通孔302。接着,将M.2固态硬盘(图未示)的一端插接于电路模块320的M.2母插槽1202。接着,再将M.2固态硬盘的另一端通过锁固支架300的第二通孔3002而固定于支架30,即可完成电路板3200及M.2 固态硬盘的组装。借此,电路板3200及M.2固态硬盘可稳定地固定于支架30 上,且可简化电路板3200及M.2固态硬盘1202与支架10的结合方式。When assembling the circuit board 3200 on the bracket 30 , the second protrusion 3202 of the circuit board 3200 is fitted into the first through hole 302 of the bracket 30 . Next, plug one end of the M.2 solid state drive (not shown) into the M.2 female slot 1202 of the circuit module 320 . Next, fix the other end of the M.2 solid state drive to the bracket 30 through the second through hole 3002 of the locking bracket 300 , and then complete the assembly of the circuit board 3200 and the M.2 solid state drive. In this way, the circuit board 3200 and the M.2 solid state disk can be stably fixed on the bracket 30 , and the combination of the circuit board 3200 and the M.2 solid state disk 1202 with the bracket 10 can be simplified.
由以上对于本实用新型的具体实施方式的详述,可以明显地看出,本揭露的安装多个M.2固态硬盘的储存模块可将多个M.2固态硬盘从单个电路板的型式转换为3.5英寸硬盘型式或5.25英寸光盘机型式。因此,有助于将M.2 固态硬盘结合到现有的电脑机箱中。因此,在前述结构下可降低储存模块的制作成本。再者,由于储存模块可包含至少一个电路组件,且一个电路组件可包含两个以上的电路模块。一个电源连接器可供应电力给多个电路模块。在前述的结构配置下,储存模块的结构配置可被简化,并可视实际需求而模块化电路组件的形式。因此,前述结构可更降低储存模块的制作成本,并可更扩充M.2 固态硬盘的放置数量。From the above detailed description of the specific implementation of the utility model, it can be clearly seen that the storage module installed with multiple M.2 solid-state hard disks in the present disclosure can convert multiple M.2 solid-state hard disks from a single circuit board type It is a 3.5-inch hard drive type or a 5.25-inch CD-ROM drive type. Therefore, it is helpful to incorporate M.2 SSDs into existing computer cases. Therefore, the manufacturing cost of the storage module can be reduced under the aforementioned structure. Furthermore, since the storage module may include at least one circuit component, and one circuit component may include more than two circuit modules. One power connector can supply power to multiple circuit modules. Under the aforementioned structural configuration, the structural configuration of the storage module can be simplified, and the form of the circuit assembly can be modularized according to actual needs. Therefore, the aforementioned structure can further reduce the manufacturing cost of the storage module, and can further expand the placement quantity of the M.2 solid state disk.
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CN108536630A (en) * | 2018-04-02 | 2018-09-14 | 郑州云海信息技术有限公司 | A kind of 1U rack-mount servers PCIE M.2 plug assembly |
US11209882B2 (en) | 2019-07-31 | 2021-12-28 | Microsoft Technology Licensing, Llc | Mechanical selection of power consumption indicator by form factor |
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CN108536630A (en) * | 2018-04-02 | 2018-09-14 | 郑州云海信息技术有限公司 | A kind of 1U rack-mount servers PCIE M.2 plug assembly |
US11209882B2 (en) | 2019-07-31 | 2021-12-28 | Microsoft Technology Licensing, Llc | Mechanical selection of power consumption indicator by form factor |
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