CN206363341U - A kind of fingerprint induction installation for reducing size - Google Patents
A kind of fingerprint induction installation for reducing size Download PDFInfo
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- CN206363341U CN206363341U CN201621407030.5U CN201621407030U CN206363341U CN 206363341 U CN206363341 U CN 206363341U CN 201621407030 U CN201621407030 U CN 201621407030U CN 206363341 U CN206363341 U CN 206363341U
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- fingerprint induction
- contact pads
- induction installation
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- 230000006698 induction Effects 0.000 title claims abstract description 42
- 238000009434 installation Methods 0.000 title claims abstract description 23
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
- 239000002184 metal Substances 0.000 claims abstract description 35
- 239000011521 glass Substances 0.000 claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000003292 glue Substances 0.000 claims abstract description 7
- 239000004020 conductor Substances 0.000 claims abstract description 3
- 230000004888 barrier function Effects 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000003491 array Methods 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 35
- 230000009467 reduction Effects 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 molybdenum niobium-aluminium neodymium-molybdenum niobium Chemical compound 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
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- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A kind of fingerprint induction installation for reducing size, including glass substrate and driving chip, driving chip is cemented on the first face of glass substrate by anisotropy conductiving glue, first face of glass substrate is additionally provided with including first electrode, the fingerprint induction zone of second electrode, first electrode is connected to end pad by the first lead, second electrode is connected to intermediate contact pads by the second lead, end pad, intermediate contact pads are connected by the conductive material in anisotropy conductiving glue with the leg of driving chip bottom, wherein, first lead is divided into the first bottom lead and the first top lead, respectively by bottom metal layers, metal layer at top is graphically formed, and stagger successively, first bottom lead, first top lead can be with mutually nested in the gap of other side, so that the overall width of the first lead significantly reduces, so as to reduce the area of glass substrate.
Description
Technical field
The utility model is related to a kind of fingerprint induction installation, more particularly to a kind of fingerprint induction installation for reducing size.
Background technology
Fingerprint induction installation, which is typically provided, can sense the fingerprint induction zone of fingerprint.Fingerprint sensing dress based on capacitance principle
Put, its fingerprint induction zone be typically provided multiple difference in the first direction, second direction extension and it is interlaced formed sensing matrix
First electrode, second electrode, when finger is pressed against on fingerprint induction zone, it becomes possible to according to first electrode, in matrix
Two interelectrode capacitance variations realize the sensing and imaging of fingerprint.
In traditional fingerprint induction installation, fingerprint induction zone is typically set directly on chip, due to fingerprint induction zone
Need to be designed to big as finger contact area, therefore, the area of chip is also required to set larger, thereby increases chip
Wafer consumption, cause its cost to be difficult to reduce.
In order to solve the above problems, as shown in Figure 1, it is thus proposed that fingerprint induction zone 01 is arranged on glass substrate 02,
And driving chip 03 is bundled in the design on the glass substrate 02, its fingerprint induction zone 01 is separated from each other with driving chip 03, no
It is big as contact area when needing to press the area design of driving chip 03 with finger, the crystalline substance thus, it is possible to reduce its consumption
Circle, reduces cost.
However, because the quantity of electrode 04 in fingerprint induction zone 01 is very more, and due to the figure of film layer on glass substrate 02
Shape craft precision is not high, and as many, Fig. 1 is merely for the quantity of lead 05 and electrode 04 of first electrode, second electrode to chip
Signal is used, and actually the quantity of lead 04 is more much more than shown in Fig. 1, in addition, the gap between the width and lead 04 of lead 04
Also it is difficult to reduce, the overall width of lead 04 will necessarily be very big so that the area of glass substrate 02 has to be designed to compare
Greatly, application of this fingerprint induction installation in many light and handy terminals, such as mobile phone is limited.
Further, because the width of wire ends 06 also is difficult to reduction, it requires that driving chip 03 also has corresponding width
Leg area so that the size of driving chip 03 is also difficult to further reduction, therefore, compared to traditional fingerprint induction installation,
The current this fingerprint induction installation based on glass substrate 02, the effect that it saves chip area is not obvious.
The content of the invention
The technical problems to be solved in the utility model is to provide a kind of fingerprint induction installation for reducing size, this reduction chi
Very little fingerprint induction installation can reduce the area of glass substrate.The technical scheme of use is as follows：
A kind of fingerprint induction installation for reducing size, including glass substrate and driving chip, driving chip is by each to different
Property conducting resinl is cemented on the first face of glass substrate, and the first face of glass substrate is additionally provided with fingerprint induction zone, fingerprint induction zone
Including multiple first electrodes extended in a first direction and multiple second electrodes extended in a second direction, first electrode, second
Electrode is interlaced to constitute capacitive fingerprint induction arrays, and first electrode is connected to end pad, end by the first lead
The position of pad is corresponding with the two ends of driving chip, and second electrode is connected to intermediate contact pads, intermediate contact pads by the second lead
Position it is corresponding with the upper side edge of driving chip, end pad, intermediate contact pads pass through the conduction in anisotropy conductiving glue
Thing is connected with the leg of driving chip bottom, it is characterized in that：Bottom metal layers, insulation are disposed with the glass substrate
Layer and metal layer at top, the first electrode, second electrode are graphically formed by bottom metal layers and metal layer at top respectively；Institute
State the first lead and be divided into the first bottom lead and the first top lead, the first bottom lead is graphically formed by bottom metal layers,
First top lead is graphically formed by metal layer at top, and the first top lead passes through the perforate on insulating barrier and first electrode
One end is connected, and the first bottom lead, the first top lead stagger successively.
By the way that the first lead is divided into the first bottom lead and the first top lead, respectively by the bottom metal of different layers
Layer, metal layer at top are graphically formed, and the first bottom lead, the first top lead is staggered successively, and so, the first bottom is drawn
Line, the first top lead can be with mutually nested in the gap of other side, can not in the first bottom lead, the first top lead width
In the case of reduction so that the overall width of the first lead significantly reduces, so as to reduce the area of glass substrate.
Glass substrate can be the sheet glass between 0.1~2.0mm；Fingerprint induction arrays are by first electrode, second electrode
Staggeredly form, in general, first electrode, second electrode are arranged to be mutually perpendicular to so that fingerprint induction arrays are shaped as
Square, first electrode, second electrode may be designed as vertical bar shape or based on vertical bar shape deformation (such as edge be sawtooth vertical bar
Shape), gap is left between it so that there is variable mutual capacitance between first electrode, second electrode, the variable mutual capacitance is in finger
Line convex portion is reduced when close, thus can cause signal transmission change by the mutual capacitance change between first electrode, second electrode
To detect the presence of fingerprint convex portion, and realize by the detection of complete matrix the imaging of fingerprint.First electrode, second electrode difference
It is connected by the first lead, the second lead with end pad, intermediate contact pads, and pad then passes through leading in anisotropy conductiving glue
Electric thing, such as conductive gold spacer are connected to the leg of driving chip bottom.
Driving chip is the driving chip that capacitance type fingerprint can be driven to sense matrix, and such as each first electrode can be sent out successively
Electric signal, the chip of correspondence electrical signal detection is carried out to second electrode.
Above-mentioned bottom metal layers, insulating barrier and metal layer at top can be successively set on the first face of glass substrate, bottom
Metal level can be made with metal layer at top using the preferable single or multiple lift metal of electric conductivity, metal alloy, typically, such as
" molybdenum niobium-aluminium neodymium-molybdenum niobium " three-layer alloy structure fabrication is formed, and first needed for it can be formed using patterned ways such as photoetching is electric
Pole, second electrode, end pad, intermediate contact pads, the first lead, the second lead.Insulating barrier can using silica, silicon nitride or
It is that resin bed makes, figure or perforate needed for being formed using photoetching or visualization way, such as through hole.
In addition, foregoing circuit body structure surface can also cover certain protective layer, and such as ink protective layer, resin are protected
Layer, the surface of pad can also cover certain conductive oxide film layer, such as indium tin oxide layer, to be to realize protection against oxidation.
As preferred scheme of the present utility model, the overlapping portion of the first adjacent bottom lead and the first top lead
Divide 1/3 less than or equal to line width.The width of the first lead is further reduced, while adjacent first bottom portion lead, the can be reduced
Interference between one top lead, this is a relatively reasonable value.
As preferred scheme of the present utility model, the end pad includes the first end pad and second being arranged side by side
End pad, first end pad is connected with the first top lead, and the second end pad is connected with the first bottom lead.Tool
For body, the first end pad in outside can be produced on the top (being separated with insulating barrier) of the first bottom lead, in the inside
The second end pad passed through under first end pad, thereby reduce the width that end pad takes, the width of chip
Also it can further reduce, compared to prior art, can so be effectively saved chip area.
As preferred scheme of the present utility model, second lead is divided into the second bottom lead and the second top lead,
Second bottom lead is graphically formed by bottom metal layers, and the second top lead is graphically formed by metal layer at top, the second top
Portion's lead is connected by the perforate on insulating barrier with one end of second electrode, and the second bottom lead, the second top lead are successively
Stagger.Second lead is divided into the second bottom lead and the second top lead, respectively by the bottom metal layers of different layers, top-gold
Category layer pattern is formed, and the second bottom lead, the second top lead is staggered successively, so, the second bottom lead, the second top
Portion's lead can be with mutually nested in the gap of other side, the feelings that can not reduce in the second bottom lead, the second top lead width
Under condition so that the overall width of the second lead significantly reduces, so as to reduce the area of glass substrate.
As the further preferred scheme of the utility model, the second adjacent bottom lead and the second top lead
Lap is less than or equal to the 1/3 of line width.The width of the second lead is further reduced, is drawn while adjacent second bottom can be reduced
Interference between line, the second top lead, this is a relatively reasonable value.
As the further preferred scheme of the utility model, the intermediate contact pads include the first intermediate contact pads being arranged side by side
With the second intermediate contact pads, the first intermediate contact pads are connected with the second top lead, the second intermediate contact pads and the second bottom lead phase
Connection.Specifically, the first intermediate contact pads in outside can be produced on the top (being separated with insulating barrier) of the second bottom lead, place
The second intermediate contact pads in the inside are passed through under the first intermediate contact pads, thereby reduce the width of intermediate contact pads occupancy, chip
Width also can further reduce, compared to prior art, can so be effectively saved chip area.
As preferred scheme of the present utility model, the thickness of the insulating barrier is more than the first lead or the second wire widths
1/10.The thickness of insulating barrier is more than the 1/10 of the first lead or the second wire widths, the interference between adjacent legs is reduced.
As the further preferred scheme of the utility model, the insulating barrier is a patterned resin bed.Using resin
Layer can realize larger thickness, efficiently reduce the interference between adjacent legs as insulating barrier.
As the further preferred scheme of the utility model, the width of first lead and/or the second lead is 8~15
Micron, the thickness of the insulating barrier is 1~5 micron.
The utility model compared with prior art, has the following advantages that：
By the way that the first lead is divided into the first bottom lead and the first top lead, respectively by the bottom metal of different layers
Layer, metal layer at top are graphically formed, and the first bottom lead, the first top lead is staggered successively, and so, the first bottom is drawn
Line, the first top lead can be with mutually nested in the gap of other side, can not in the first bottom lead, the first top lead width
In the case of reduction so that the overall width of the first lead significantly reduces, so that reduce the area of glass substrate, in addition,
In the case where end pad, intermediate contact pads are set into two rows, it is also possible that the end portion width of driving chip significantly subtracts
It is small so that the area of driving chip is smaller, the consumption of chip die is greatly reduced, manufacturing cost is reduced.
Brief description of the drawings
Fig. 1 is the structural representation of fingerprint identification module in the prior art；
Fig. 2 is the structural representation of the utility model embodiment one；
Fig. 3 is the connection diagram of the first lead and first electrode in the utility model embodiment one；
Fig. 4 is the connection diagram of the second lead and second electrode in the utility model embodiment one；
Fig. 5 is the structural representation of the utility model embodiment two；
Fig. 6 is the medial end portions pad of utility model embodiment two, the schematic diagram of intermediate contact pads two rows of setting；
Fig. 7 is part sectioned views of the Fig. 6 along A-A.
Embodiment
It is described further below in conjunction with the accompanying drawings with preferred embodiment of the present utility model.
Embodiment one
As shown in Fig. 2 this fingerprint induction installation for reducing size, including glass substrate 1 and driving chip 2, drive core
Piece 2 is cemented on the first face of glass substrate 1 by anisotropy conductiving glue, and the first face of glass substrate 1 is additionally provided with fingerprint sense
Answer area 3, fingerprint induction zone 3 include multiple first electrodes 301 extended in a first direction and it is multiple extend in a second direction the
Two electrodes 302, first electrode 301, second electrode 302 are interlaced to constitute capacitive fingerprint induction arrays, first electrode 301
End pad 5 is connected to by the first lead 4, the position of end pad 5 is corresponding with the two ends of driving chip 2, second electrode
302 are connected to intermediate contact pads 7 by the second lead 6, and the position of intermediate contact pads 7 is corresponding with the upper side edge of driving chip 2, end
Pad 5, intermediate contact pads 7 are connected by the conductive material in anisotropy conductiving glue with the leg of the bottom of driving chip 2.
As shown in Figure 3, Figure 4, above-mentioned first electrode 301, second electrode 302, the first lead 4, the specific of the second lead 6 set
Meter mode is：Bottom metal layers, insulating barrier and metal layer at top, first electrode 301, second are disposed with glass substrate 1
Electrode 302 is graphically formed by bottom metal layers and metal layer at top respectively；First 4 points of lead is the He of the first bottom lead 401
First top lead 402, the first bottom lead 401 is graphically formed by bottom metal layers, and the first top lead 402 is by top-gold
Category layer pattern is formed, and the first top lead 402 is connected by the perforate 8 on insulating barrier with one end of first electrode 301, the
One bottom lead 401, the first top lead 402 stagger successively, adjacent the first bottom lead 401 and the first top lead 402
Lap 9 be equal to line width 1/4（Can less than 1/3）；Second 6 points of lead is the second bottom lead 601 and the second top
Portion's lead 602, the second bottom lead 601 is graphically formed by bottom metal layers, and the second top lead 602 is by metal layer at top figure
Shape is formed, and the second top lead 602 is connected by the perforate 8 on insulating barrier with one end of second electrode 302, the second bottom
Lead 601, the second top lead 602 stagger successively, adjacent the second bottom lead 601 and the second top lead 602 it is overlapping
Part 10 is equal to the 1/4 of line width（Can less than 1/3）.
Above-mentioned insulating barrier is a patterned resin bed, and the width of the first lead 4 and/or the second lead 6 is 10 microns（8
~15 microns can）, the thickness of insulating barrier is 3 microns（1~5 micron can）.
Embodiment two
As shown in Fig. 5, Fig. 6, Fig. 7, other parts with the identical of embodiment one in the case of, it is differed only in：End
Portion's pad 5 includes the first end pad 501 and the second end pad 502 being arranged side by side, and first end pad 501 and first is pushed up
Portion's lead 402 is connected, and the second end pad 502 is connected with the first bottom lead 401；Intermediate contact pads 7 include being arranged side by side
The first intermediate contact pads 701 and the second intermediate contact pads 702, the first intermediate contact pads 701 are connected with the second top lead 602,
Two intermediate contact pads 702 are connected with the second bottom lead 601, in addition, wherein label 11 is insulating barrier, label 12 is protective layer.
Furthermore, it is necessary to illustrate, the specific embodiment described in this specification, its each several part title etc. can not
Together, the equivalent or simple change that all construction, feature and principles according to described in the utility model inventional idea are done, is included in this
In the protection domain of utility model patent.The utility model person of ordinary skill in the field can be to described specific reality
Example is applied to make various modifications or supplement or substitute using similar mode, without departing from structure of the present utility model or
Surmount scope defined in the claims, protection domain of the present utility model all should be belonged to.
Claims (9)
1. a kind of fingerprint induction installation for reducing size, including glass substrate and driving chip, driving chip pass through anisotropy
Conducting resinl is cemented on the first face of glass substrate, and the first face of glass substrate is additionally provided with fingerprint induction zone, fingerprint induction zone bag
Include multiple first electrodes extended in a first direction and multiple second electrodes extended in a second direction, first electrode, the second electricity
Extremely interlaced to constitute capacitive fingerprint induction arrays, first electrode is connected to end pad, end weldering by the first lead
The position of disk is corresponding with the two ends of driving chip, and second electrode is connected to intermediate contact pads by the second lead, intermediate contact pads
Position is corresponding with the upper side edge of driving chip, and end pad, intermediate contact pads pass through the conductive material in anisotropy conductiving glue
It is connected with the leg of driving chip bottom, it is characterized in that：Bottom metal layers, insulating barrier are disposed with the glass substrate
And metal layer at top, the first electrode, second electrode are graphically formed by bottom metal layers and metal layer at top respectively；It is described
First lead is divided into the first bottom lead and the first top lead, and the first bottom lead is graphically formed by bottom metal layers, the
One top lead is graphically formed by metal layer at top, and the first top lead passes through the perforate and the one of first electrode on insulating barrier
End is connected, and the first bottom lead, the first top lead stagger successively.
2. fingerprint induction installation as claimed in claim 1, it is characterized in that：The first adjacent bottom lead and the first top
The lap of lead is less than or equal to the 1/3 of line width.
3. fingerprint induction installation as claimed in claim 1, it is characterized in that：The end pad includes the first end being arranged side by side
Portion's pad and the second end pad, first end pad are connected with the first top lead, the second end pad and the first bottom
Lead is connected.
4. fingerprint induction installation as claimed in claim 1, it is characterized in that：Second lead is divided into the second bottom lead and
Two top leads, the second bottom lead is graphically formed by bottom metal layers, and the second top lead is graphical by metal layer at top
Form, the second top lead is connected by the perforate on insulating barrier with one end of second electrode, the second bottom lead, the second top
Portion's lead staggers successively.
5. fingerprint induction installation as claimed in claim 4, it is characterized in that：The second adjacent bottom lead and the second top
The lap of lead is less than or equal to the 1/3 of line width.
6. fingerprint induction installation as claimed in claim 4, it is characterized in that：The intermediate contact pads include be arranged side by side first in
Between pad and the second intermediate contact pads, the first intermediate contact pads are connected with the second top lead, the second intermediate contact pads and the second bottom
Lead is connected.
7. fingerprint induction installation as claimed in claim 1, it is characterized in that：The thickness of the insulating barrier is more than the first lead or the
The 1/10 of two wire widths.
8. fingerprint induction installation as claimed in claim 7, it is characterized in that：The insulating barrier is a patterned resin bed.
9. fingerprint induction installation as claimed in claim 7, it is characterized in that：The width of first lead and/or the second lead
For 8~15 microns, the thickness of the insulating barrier is 1~5 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621407030.5U CN206363341U (en) | 2016-12-21 | 2016-12-21 | A kind of fingerprint induction installation for reducing size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621407030.5U CN206363341U (en) | 2016-12-21 | 2016-12-21 | A kind of fingerprint induction installation for reducing size |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206363341U true CN206363341U (en) | 2017-07-28 |
Family
ID=59373943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621407030.5U Active CN206363341U (en) | 2016-12-21 | 2016-12-21 | A kind of fingerprint induction installation for reducing size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206363341U (en) |
-
2016
- 2016-12-21 CN CN201621407030.5U patent/CN206363341U/en active Active
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