CN206330693U - Pressure sensor and the electronic equipment with the pressure sensor - Google Patents
Pressure sensor and the electronic equipment with the pressure sensor Download PDFInfo
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- CN206330693U CN206330693U CN201621398482.1U CN201621398482U CN206330693U CN 206330693 U CN206330693 U CN 206330693U CN 201621398482 U CN201621398482 U CN 201621398482U CN 206330693 U CN206330693 U CN 206330693U
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- pressure sensor
- line layer
- insulating barrier
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- layer
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Abstract
The utility model belongs to pressure sensitive technical field, more particularly to pressure sensor and the electronic equipment with the pressure sensor.In opening up the first breach on the first insulating barrier being folded between first line layer and the second line layer, and the electrical connection of first line layer and the second line layer is realized using the first conductor, realize that the wire jumper of circuit is handled.Strain inductive reactance can be arranged on base material with other elements, can also be arranged on the second line layer so that many strain inductive reactances and complicated circuit can be arranged on thin film, pressure measurement accuracy is improved, realized more multi-functional.The pressure sensor and electronic devices structure with the pressure sensor are compact, easy to produce and use.
Description
Technical field
The utility model belongs to pressure sensitive technical field, more particularly to pressure sensor and with the pressure sensor
Electronic equipment.
Background technology
, there is partial pressure sensor, such as resistance strain gage type, capacitive sensing type, Piezoelectric in current industry.
These pressure sensors are to form pressure sensor in itself by complicated circuit design and structure design.Existing pressure
Force snesor, when arranging complicated circuit, compares space-consuming in structure, make with in-convenience in use.
Utility model content
The purpose of this utility model is to provide a kind of pressure sensor, it is intended to solve existing pressure sensor multiple in arrangement
Compare during strays road in structure space-consuming and make with in-convenience in use technical problem.
The utility model is achieved in that a kind of pressure sensor, including base material, the strain of setting on the substrate
Inductive reactance, printing on the substrate and with the strain inductive reactance first line that electrically connect layer, be printed on institute successively
First line layer is stated departing from the first insulating barrier and the second line layer on the side of the base material, first insulating barrier is opened up
Have the first breach, first indentation, there be provided with for make that the first line layer electrically connects with second line layer the
One conductor.
Further, also including being printed on second line layer departing from the second insulation on the side of the base material
Layer.
Further, also including being printed on second insulating barrier departing from the tertiary circuit on the side of the base material
Layer, second insulating barrier offers the second breach, second breach be provided with for make second line layer with it is described
Second conductor of tertiary circuit layer electrical connection.
Further, also including being printed on the tertiary circuit layer departing from the 3rd insulation on the side of the base material
Layer.
Further, the strain inductive reactance is the resistance of printing shaping, printing shaping and has pressure sensitive performance
Polymer coating or sinter molding Piezoelectric Ceramic Coatings.
Further, the quantity of the strain inductive reactance is at least one.
Further, the base material is PET film, PI films or flexible PCB.
Further, the first line layer is silver layer or layers of copper.
Further, first insulating barrier is insulating oil layer of ink.
Another object of the present utility model is to provide a kind of electronic equipment, including pressure sensor.
The utility model has the technical effect that relative to prior art：In be folded in first line layer with the second line layer it
Between the first insulating barrier on open up the first breach, and being electrically connected for first line layer and the second line layer is realized using the first conductor
Connect, realize the wire jumper processing of circuit.Strain inductive reactance can be arranged on base material with other elements, can also be arranged on second
On line layer so that many strain inductive reactances and complicated circuit can be arranged on thin film, pressure measxurement is improved accurate
Degree, is realized more multi-functional.The pressure sensor and electronic devices structure with the pressure sensor are compact, make and user
Just.
Brief description of the drawings
Fig. 1 is the structural representation for the pressure sensor that the utility model embodiment is provided.
Embodiment
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only to explain
The utility model, is not used to limit the utility model.
Referring to Fig. 1, the pressure sensor that the utility model embodiment is provided, including base material 11, be arranged on base material 11
Strain inductive reactance 12, be printed on base material 11 and with strain inductive reactance 12 first line that electrically connect layer 13, print successively
Brush the first insulating barrier 14 and the second line layer 15 on 13 side departing from base material 11 of first line layer, the first insulating barrier 14
Offer and be provided with the first breach 141, the first breach 141 for making what first line layer 13 was electrically connected with the second line layer 15
First conductor 16.
The first breach is opened up in being folded on first line layer 13 and second the first insulating barrier 14 between line layer 15
141, and use the first conductor 16 to realize the electrical connection of first line layer 13 and the second line layer 15, realize at the wire jumper of circuit
Reason.Strain inductive reactance 12 can be arranged on base material 11 with other elements, can also be arranged on the second line layer 15 so that
Many strain inductive reactances 12 and complicated circuit can be arranged on thin film, pressure measurement accuracy is improved, realizes more
Function.The pressure sensor structure is compact, easy to produce and use.
Specifically, strain inductive reactance 12 take shape on base material 11 solidify after printing first line layer 13, first line
Layer 13 is to connect each strain inductive reactance 12.
Further, also including being printed on the second line layer 15 departing from the second insulating barrier 17 on the side of base material 11.
Pressure sensor is allowed to realize insulation.
Further, also including being printed on the second insulating barrier 17 departing from the tertiary circuit layer 18 on the side of base material 11,
Second insulating barrier 17 offers the second breach 171, and the second breach 171 is provided with for making the second line layer 15 and tertiary circuit layer
Second conductor 19 of 18 electrical connections.Similarly, it can continue to set multiple line layers and insulating barrier, and offer in insulating barrier scarce
Mouthful, breach is positioned over using conductor and two neighboring line layer is electrically connected to both ends of by conductor, two neighboring circuit is realized
The electrical connection of layer.
Further, also including being printed on tertiary circuit layer 18 departing from the 3rd insulating barrier 110 on the side of base material 11.
Pressure sensor is allowed to realize insulation.
Further, strain inductive reactance 12 is the resistance of printing shaping, printing shaping and has pressure sensitive performance
The Piezoelectric Ceramic Coatings of polymer coating or sinter molding.Above-mentioned strain inductive reactance 12 can change resistance according to deformation.
Further, the quantity of strain inductive reactance 12 is at least one.Configuration strain inductive reactance 12, forms predetermined on demand
Circuit.
Further, base material 11 is PET film (high temperature resistance polyester film), PI films (Kapton) or flexible circuit
Plate.Above-mentioned base material 11 could be used for support strain inductive reactance 12.It is to be appreciated that base material 11 can also be other films.
Further, first line layer 13 is silver layer or layers of copper.After strain inductive reactance 12 is set up, First Line is printed
Road floor 13, to connect strain inductive reactance 12 and built-up circuit, first line layer 13 can be using silver paste or other are printable
Conductive material makes.
Further, the first insulating barrier 14 is insulating oil layer of ink.After printing first line layer 13, the first insulation is republished
Layer 14, first line layer 13 and rear sandwich circuit to be insulated, the insulating barrier can use the UV dielectric inks can also can for other
The insulating materials of printing makes.
The second line layer 15, the second insulating barrier 17, tertiary circuit layer 18 can be republished on this basis, until circuit institute
Need.The first insulating barrier 14, the second insulating barrier 17 between the 13, second line layer 15 of first line layer, tertiary circuit layer 18 are worked as
In, the first breach 141, the second breach 171 can be correspondingly arranged, i.e., does not print the part of insulation, the part can will be different
Connected between line layer, constitute a complicated line system.It is to be appreciated that strain inductive reactance 12 and other elements
It can also be arranged on tertiary circuit 18 or other line layer of layer.
The electronic equipment that the utility model embodiment is provided, including pressure sensor.
The first breach is opened up in being folded on first line layer 13 and second the first insulating barrier 14 between line layer 15
141, and use the first conductor 16 to realize the electrical connection of first line layer 13 and the second line layer 15, realize at the wire jumper of circuit
Reason.Strain inductive reactance 12 can be arranged on base material 11 with other elements, can also be arranged on the second line layer 15 so that
Many strain inductive reactances 12 and complicated circuit can be arranged on thin film, pressure measurement accuracy is improved, realizes more
Function.Electronic devices structure with the pressure sensor is compact, easy to produce and use.
Preferred embodiment of the present utility model is these are only, it is all in this practicality not to limit the utility model
Any modification, equivalent and improvement made within new spirit and principle etc., should be included in guarantor of the present utility model
Within the scope of shield.
Claims (10)
1. a kind of pressure sensor, it is characterised in that：Including base material, strain inductive reactance on the substrate, printing are set
The first line layer that electrically connect on the substrate and with the strain inductive reactance, the first line layer back of the body is printed on successively
From in the first insulating barrier and the second line layer on the side of the base material, first insulating barrier offers the first breach, institute
State the first indentation, there and be provided with the first conductor for making first line layer be electrically connected with second line layer.
2. pressure sensor as claimed in claim 1, it is characterised in that：Also include be printed on second line layer departing from
The second insulating barrier on the side of the base material.
3. pressure sensor as claimed in claim 2, it is characterised in that：Also include be printed on second insulating barrier departing from
Tertiary circuit layer on the side of the base material, second insulating barrier offers the second breach, and second breach is provided with
For the second conductor for making second line layer be electrically connected with tertiary circuit layer.
4. pressure sensor as claimed in claim 3, it is characterised in that：Also include being printed on tertiary circuit layer departing from
The 3rd insulating barrier on the side of the base material.
5. the pressure sensor as described in any one of Claims 1-4, it is characterised in that：The strain inductive reactance is printing
The resistance of shaping, printing are molded and the polymer coating with pressure sensitive performance or the Piezoelectric Ceramic Coatings of sinter molding.
6. the pressure sensor as described in any one of Claims 1-4, it is characterised in that：The quantity of the strain inductive reactance
At least one.
7. the pressure sensor as described in any one of Claims 1-4, it is characterised in that：The base material be PET film, PI films or
Person's flexible PCB.
8. the pressure sensor as described in any one of Claims 1-4, it is characterised in that：First line layer for silver layer or
Layers of copper.
9. the pressure sensor as described in any one of Claims 1-4, it is characterised in that：First insulating barrier is insulating oil
Layer of ink.
10. a kind of electronic equipment, it is characterised in that：Including the pressure sensor as described in any one of claim 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621398482.1U CN206330693U (en) | 2016-12-19 | 2016-12-19 | Pressure sensor and the electronic equipment with the pressure sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621398482.1U CN206330693U (en) | 2016-12-19 | 2016-12-19 | Pressure sensor and the electronic equipment with the pressure sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206330693U true CN206330693U (en) | 2017-07-14 |
Family
ID=59290348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621398482.1U Active CN206330693U (en) | 2016-12-19 | 2016-12-19 | Pressure sensor and the electronic equipment with the pressure sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206330693U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108814553A (en) * | 2018-04-20 | 2018-11-16 | 佛山市长郡科技有限公司 | A kind of health regaining auxiliary device |
| CN110859621A (en) * | 2019-12-08 | 2020-03-06 | 北京积水潭医院 | Flexible chip signal collector and intelligent prosthesis |
| CN111130528A (en) * | 2020-02-10 | 2020-05-08 | 芯海科技（深圳）股份有限公司 | Pressure sensor module and electronic equipment |
| WO2020124476A1 (en) * | 2018-12-20 | 2020-06-25 | 深圳纽迪瑞科技开发有限公司 | Pressure sensor and electronic terminal |
| CN112985652A (en) * | 2019-12-17 | 2021-06-18 | 北京钛方科技有限责任公司 | Strain gauge and preparation method and installation method thereof |
| WO2022047739A1 (en) * | 2020-09-04 | 2022-03-10 | 深圳纽迪瑞科技开发有限公司 | Beam pressure sensor, pressure sensing apparatus, and electronic device |
-
2016
- 2016-12-19 CN CN201621398482.1U patent/CN206330693U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108814553A (en) * | 2018-04-20 | 2018-11-16 | 佛山市长郡科技有限公司 | A kind of health regaining auxiliary device |
| WO2020124476A1 (en) * | 2018-12-20 | 2020-06-25 | 深圳纽迪瑞科技开发有限公司 | Pressure sensor and electronic terminal |
| CN113242965A (en) * | 2018-12-20 | 2021-08-10 | 深圳纽迪瑞科技开发有限公司 | Pressure sensor and electronic terminal |
| CN113242965B (en) * | 2018-12-20 | 2022-10-14 | 深圳纽迪瑞科技开发有限公司 | Pressure sensor and electronic terminal |
| US11965788B2 (en) | 2018-12-20 | 2024-04-23 | Shenzhen New Degree Technology Co., Ltd. | Pressure sensor and electronic terminal |
| CN110859621A (en) * | 2019-12-08 | 2020-03-06 | 北京积水潭医院 | Flexible chip signal collector and intelligent prosthesis |
| CN112985652A (en) * | 2019-12-17 | 2021-06-18 | 北京钛方科技有限责任公司 | Strain gauge and preparation method and installation method thereof |
| CN112985652B (en) * | 2019-12-17 | 2023-11-28 | 北京钛方科技有限责任公司 | Strain gauge, preparation method thereof and mounting method thereof |
| CN111130528A (en) * | 2020-02-10 | 2020-05-08 | 芯海科技（深圳）股份有限公司 | Pressure sensor module and electronic equipment |
| WO2022047739A1 (en) * | 2020-09-04 | 2022-03-10 | 深圳纽迪瑞科技开发有限公司 | Beam pressure sensor, pressure sensing apparatus, and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Pressure sensor and have this pressure sensor's electronic equipment Effective date of registration: 20180601 Granted publication date: 20170714 Pledgee: Silicon Valley Bank Co.,Ltd. Pledgor: SHENZHEN NEW DEGREE TECHNOLOGY Co.,Ltd. Registration number: 2018310000027 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200703 Granted publication date: 20170714 Pledgee: Silicon Valley Bank Co.,Ltd. Pledgor: SHENZHEN NEW DEGREE TECHNOLOGY Co.,Ltd. Registration number: 2018310000027 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Pressure sensor and have this pressure sensor's electronic equipment Effective date of registration: 20200706 Granted publication date: 20170714 Pledgee: Silicon Valley Bank Co.,Ltd. Pledgor: SHENZHEN NEW DEGREE TECHNOLOGY Co.,Ltd. Registration number: Y2020310000035 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20231109 Granted publication date: 20170714 Pledgee: Silicon Valley Bank Co.,Ltd. Pledgor: SHENZHEN NEW DEGREE TECHNOLOGY Co.,Ltd. Registration number: Y2020310000035 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |